Sorting device for semiconductor parts
By designing limiting and guiding components, the problems of semiconductor parts colliding with the frame and having difficulty entering the secondary conveyor belt in the sorting device are solved, thus achieving stable sorting and efficient transport of semiconductor parts.
Patent Information
- Application Number
- CN202422141917.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-02
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2034-09-02
AI Technical Summary
In existing semiconductor component sorting devices, semiconductor components are prone to impacting the inner wall of the frame when moving on the main conveyor belt, and they have difficulty entering smoothly when the width of the secondary conveyor belt is insufficient, resulting in low sorting efficiency.
The design employs a limiting component and a guiding component. The limiting component uses a ramp structure to prevent the semiconductor parts from moving on the main conveyor belt, while the guiding component uses a roller structure to guide the semiconductor parts, ensuring that they accurately enter the secondary conveyor belt.
This effectively prevents semiconductor components from moving on the main conveyor belt, avoids collisions with the inner wall of the rack, and ensures their smooth entry into the secondary conveyor belt, thus improving sorting efficiency and accuracy.
Smart Images
Figure CN223543504U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of sorting device technology, and in particular to a sorting device for semiconductor parts. Background Technology
[0002] Semiconductors are materials whose conductivity at room temperature is between that of conductors and insulators. Semiconductor components are electronic parts whose conductivity is between that of good conductors and insulators. They utilize the special electrical properties of semiconductor materials to perform specific functions. Semiconductor components are the basic units that make up semiconductor equipment, directly determining the reliability and stability of the equipment. They are a key element supporting innovation in the semiconductor industry. During the production of semiconductor equipment, sorting devices are needed to inspect and sort semiconductor components.
[0003] For example, the utility model disclosed in CN216857444U discloses a semiconductor component sorting device, which identifies semiconductor components by setting up a camera recognition device, controls the sorter to make the servo motor drive the threaded rod to rotate, the threaded rod drives the slider to move horizontally along the threaded rod and the guide rod, thereby causing the slider to drive the moving rod to move, the moving rod drives the push plate to push the semiconductor component to the secondary conveyor belt, and the secondary conveyor belt transports the semiconductor component to a designated location for sorting.
[0004] The existing technology still has the following problems when used:
[0005] During the movement of the semiconductor component by the pusher plate of the device, the semiconductor component always moves on the top surface of the main conveyor belt. Therefore, the width of the secondary conveyor belt needs to be greater than the width of the semiconductor component. If the main conveyor belt is too fast or the width of the secondary conveyor belt is too narrow, the semiconductor component is prone to hitting the inner wall of the frame and will have difficulty entering the top surface of the secondary conveyor belt. Utility Model Content
[0006] In order to overcome the shortcomings of the prior art, the present invention provides a sorting device for semiconductor parts to solve the technical problems mentioned in the background.
[0007] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a sorting device for semiconductor parts, comprising a first conveyor belt, a second conveyor belt and a pusher plate, wherein a first baffle is provided on the side of the first conveyor belt and a pusher plate is provided above the top surface of the first conveyor belt;
[0008] A limiting component is disposed on the side of the first conveyor belt. The limiting component can prevent the semiconductor component from moving with the rotation of the first conveyor belt during the pusher plate pushing the semiconductor component.
[0009] The guide assembly is disposed on both the front and rear sides of the second conveyor belt, and the guide assembly can guide the semiconductor parts on the top surface of the second conveyor belt;
[0010] The mounting bracket is installed above the top surface of the first conveyor belt, and the mounting bracket can facilitate the movement of semiconductor components from the top surface of the first conveyor belt to the top surface of the first baffle.
[0011] As a preferred embodiment of this utility model, symmetrical first baffles are provided on the left and right sides of the first conveyor belt, and symmetrical second baffles are provided on the front and rear sides of the second conveyor belt. The top surface of the first baffle is fixedly connected to the mounting frame. A servo motor is fixedly installed on the outer side of the mounting frame. The output end of the servo motor passes through the mounting frame and is rotatably connected to the mounting frame. A threaded rod is fixedly provided at the end of the output end of the servo motor. The other end of the threaded rod is rotatably connected to the mounting frame through a bearing. A movable plate is threadedly connected to the outer side of the threaded rod. A guide rod is fixedly provided between the inner walls of the left and right sides of the mounting frame. The guide rod passes through the movable plate and is slidably connected to the movable plate. The side of the movable plate near the second conveyor belt is fixedly connected to a push plate. A camera recognition device is fixedly installed on the inner wall of the mounting frame.
[0012] As a preferred technical solution of this utility model, the limiting component includes a connecting plate, a push rod, a first return spring, a fixed plate, a base plate, a first inclined plate, a second inclined plate, and a third inclined plate. The connecting plate is fixedly disposed on the front of the moving plate, the push rod is fixedly disposed on the front of the connecting plate, the base plate is fixedly disposed on the outer side of the first baffle, the fixed plate is fixedly disposed on the top surface of the base plate, the first return spring is fixedly disposed on the side of the fixed plate, the first inclined plate is hinged to the top surface of the base plate, and the second and third inclined plates are fixedly disposed on the side of the first inclined plate.
[0013] In a preferred embodiment of this utility model, the end of the first reset spring away from the fixed plate is fixedly connected to the first inclined plate, and the second inclined plate is fixedly connected to the third inclined plate.
[0014] As a preferred technical solution of this utility model, the guide assembly includes a support plate, a sleeve, a roller, a U-shaped plate, a fixed shaft, and a second return spring. The support plate is fixedly arranged on the side of the second baffle, and multiple sleeves are fixedly arranged on the top surface of the support plate. A U-shaped plate is slidably connected to the inner wall of the sleeve. A second return spring is fixedly arranged on the outer side of the U-shaped plate. A fixed shaft is fixedly arranged between the top and bottom surfaces of the inner side of the U-shaped plate, and a roller is rotatably connected to the outer side of the fixed shaft.
[0015] As a preferred embodiment of this utility model, the top and bottom surfaces of the roller are rotatably connected to the U-shaped plate, and the end of the second return spring away from the U-shaped plate is fixedly connected to the inner wall of the sleeve.
[0016] Compared with the prior art, the beneficial effects that this utility model can achieve are:
[0017] This invention utilizes a limiting component. When the camera recognizes the desired semiconductor component, it causes the moving plate to move, which in turn moves the pusher plate to push the semiconductor component. Simultaneously, the moving plate moves the connecting plate and the push rod. The push rod moves and contacts the second inclined plate, causing the first, second, and third inclined plates to rotate rapidly and come close to the top surface of the first conveyor belt. This blocks the semiconductor component, preventing it from continuing to move with the rotation of the first conveyor belt. This facilitates the pusher plate pushing the semiconductor component into the top surface of the second conveyor belt. Furthermore, by providing a guiding component, when the semiconductor component moves with the rotation of the second conveyor belt, if it is deviated due to external influences, it will contact the roller and cause the roller, U-shaped plate, and fixed axial sleeve to move internally. The second return spring is then contracted, pushing the U-shaped plate outward, thus moving the semiconductor component back to its original direction. The roller rotates as the semiconductor component moves when it contacts it. The guiding component can guide the semiconductor component without affecting its movement, preventing significant deviations. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the main structure of this utility model;
[0019] Figure 2 This is a schematic diagram of the main view structure of this utility model;
[0020] Figure 3 This is a top view sectional structural diagram of the present invention;
[0021] Figure 4 This is a schematic diagram of the structure of the present invention from the right side view.
[0022] Figure 5 This is a top view sectional structural diagram of the housing of this utility model;
[0023] The components are: 1. First conveyor belt; 2. First baffle; 3. Second conveyor belt; 4. Second baffle; 5. Mounting bracket; 6. Servo motor; 7. Threaded rod; 8. Guide rod; 9. Moving plate; 10. Push plate; 11. Connecting plate; 12. Push rod; 13. First return spring; 14. Fixed plate; 15. Base plate; 16. First inclined plate; 17. Second inclined plate; 18. Third inclined plate; 19. Camera recognition device; 20. Support plate; 21. Housing; 22. Roller; 23. U-shaped plate; 24. Fixed shaft; 25. Second return spring. Detailed Implementation
[0024] To make the technical means, creative features, and achieved objectives and effects of this utility model easier to understand, the present utility model is further described below with reference to specific embodiments. However, the following embodiments are merely preferred embodiments of this utility model and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments described in the implementation are all within the protection scope of this utility model without creative effort.
[0025] Example
[0026] Please refer to Figures 1-4 As shown, this utility model provides a semiconductor component sorting device, including a first conveyor belt 1, a second conveyor belt 3, and a pusher plate 10. The second conveyor belt 3 is arranged on the side of the first conveyor belt 1, and the top surfaces of the first conveyor belt 1 and the second conveyor belt 3 are located on the same horizontal plane. Symmetrical first baffles 2 are arranged on the left and right sides of the first conveyor belt 1, and the first conveyor belt 1 is installed between the first baffles 2. Symmetrical second baffles 4 are arranged on the front and rear sides of the second conveyor belt 3, and the second conveyor belt 3 is installed between the second baffles 4. The side of the first baffle 2 is fixedly connected to the second baffle 4. A mounting frame 5 is fixedly arranged on the top surface of the first baffle 2. The front left and right sides of the mounting frame 5 are respectively provided with a first slot and a second slot. The second slot can facilitate the movement of semiconductor components from the top surface of the first conveyor belt 1 to the top surface of the first baffle 2. A pusher plate 10 is arranged above the top surface of the first conveyor belt 1.
[0027] like Figures 1-4 As shown, a servo motor 6 is fixedly mounted on the outside of the mounting frame 5. The output end of the servo motor 6 passes through the mounting frame 5 and is rotatably connected to the mounting frame 5. A threaded rod 7 is fixedly provided at the end of the output end of the servo motor 6. A movable plate 9 is threadedly connected to the outside of the threaded rod 7. The side of the movable plate 9 near the second conveyor belt 3 is fixedly connected to the push plate 10. A guide rod 8 is fixedly provided between the inner walls of the left and right sides of the mounting frame 5. The guide rod 8 passes through the movable plate 9 and is slidably connected to the movable plate 9. The end of the threaded rod 7 away from the servo motor 6 is rotatably connected to the mounting frame 5 through a bearing. A camera recognition device 19 is fixedly mounted on the inner wall of the mounting frame 5. The camera recognition device 19 can recognize the required semiconductor parts. A control panel is installed on the outer wall of the first baffle 2. The control panel is electrically connected to the servo motor 6 and the camera recognition device 19 respectively. When the camera recognition device 19 recognizes the required semiconductor parts, it sends an electrical signal to the control panel. The control panel controls the servo motor 6 to drive the threaded rod 7 to rotate. With the cooperation of the guide rod 8, the movable plate 9 can move left and right along the surface of the threaded rod 7 and the guide rod 8, thereby driving the push plate 10 to move and pushing the semiconductor parts to move.
[0028] like Figures 1-4As shown, a limiting assembly is provided on the side of the first conveyor belt 1. The limiting assembly consists of a connecting plate 11, a push rod 12, a first return spring 13, a fixing plate 14, a base plate 15, a first inclined plate 16, a second inclined plate 17, and a third inclined plate 18. The connecting plate 11 is fixedly mounted on the front of the moving plate 9, and the push rod 12 is fixedly mounted on the front of the connecting plate 11. The first slot allows the connecting plate 11 and the push rod 12 to move left and right easily. The base plate 15 is fixedly mounted on the outer side of the first baffle 2, and the fixing plate 14 is fixedly mounted on the top surface of the base plate 15. The first return spring 13 is fixedly mounted on the side of the fixing plate 14, and the other end of the first return spring 13 is fixedly connected to the first inclined plate 16. A first inclined plate 16 is hinged to the top surface of the base plate 15. A second inclined plate 17 and a third inclined plate 18 are fixedly disposed on the side of the first inclined plate 16. The second inclined plate 17 and the third inclined plate 18 are fixedly connected. The cross-sectional shape of the first inclined plate 16, the second inclined plate 17, and the third inclined plate 18 are all approximately right-angled triangles. The right-angled sides and hypotenuses of the first inclined plate 16 and the third inclined plate 18 are one-to-one and parallel to each other. The side surfaces of the first inclined plate 16, the second inclined plate 17, and the third inclined plate 18 are respectively provided with a first inclined surface, a second inclined surface, and a third inclined surface. When the camera recognition device 19 fails to recognize the semiconductor component, the first inclined plate 16, the second inclined plate 17, and the third inclined plate 18 are subjected to a first reset spring. When the spring 13 is pulled, the push rod 12 remains in a vertical position and does not contact the first inclined plate 16. When the first inclined plate 16, the second inclined plate 17, and the third inclined plate 18 sway left and right due to external influences, the first inclined plate 16 and the second inclined plate 17 never contact the push rod 12, thereby reducing the impact on the first conveyor belt 1 transporting semiconductor parts. When the camera recognition device 19 identifies the required semiconductor part and moves the moving plate 9 to drive the push plate 10 to push the semiconductor part, the moving plate 9 moves the connecting plate 11 and the push rod 12 at the same time. The push rod 12 moves and contacts the second inclined surface of the second inclined plate 17, which can drive the first inclined plate 16, the second inclined plate 17, and the third inclined plate 18. 18 rotates rapidly and approaches the top surface of the first conveyor belt 1, thereby blocking the semiconductor component and preventing it from continuing to move with the rotation of the first conveyor belt 1. This facilitates the pusher plate 10 to push the semiconductor component into the top surface of the second conveyor belt 3. When the first inclined surface of the first inclined plate 16 is parallel to the top surface of the first conveyor belt 1, the pusher 12 just disengages from the first inclined surface of the second inclined plate 17 and begins to contact the third inclined surface of the third inclined plate 18. The third inclined surface of the third inclined plate 18 is also parallel to the top surface of the first conveyor belt 1. The pusher plate 10 continues to move, causing the pusher 12 to slide on the surface of the third inclined surface. The first inclined plate 16, the second inclined plate 17, and the third inclined plate 18 no longer continue to rotate.
[0029] like Figures 1-5As shown, guide components are provided on the front and rear sides of the second conveyor belt 3. The guide components consist of a support plate 20, a housing 21, rollers 22, a U-shaped plate 23, a fixed shaft 24, and a second return spring 25. The support plate 20 is fixedly installed on the side of the second baffle 4. Multiple housings 21 are fixedly installed on the top surface of the support plate 20. U-shaped plates 23 are slidably connected to the inner wall of the housings 21. The second return spring 25 is fixedly installed on the outer side of the U-shaped plate 23. The other end of the second return spring 25 is fixedly connected to the inner wall of the housing 21. A fixed shaft 24 is fixedly installed between the top and bottom surfaces of the inner side of the U-shaped plate 23. Rollers 22 are rotatably connected to the outer side of the fixed shaft 24. The top and bottom surfaces of the rollers 22 are both connected to the U-shaped plate 23. When the semiconductor component moves with the rotation of the second conveyor belt 3, if the semiconductor component is deviated due to external influences, it will contact the roller 22 and drive the roller 22, U-shaped plate 23 and fixed shaft 24 to move into the housing 21. The second return spring 25 is contracted and pushes the U-shaped plate 23 outward, thereby driving the semiconductor component to move back to its original direction. When the roller 22 contacts the semiconductor component, it rotates with the movement of the semiconductor component, so it will not affect the movement of the semiconductor component with the rotation of the second conveyor belt 3. The guide assembly can guide the semiconductor component without affecting its movement, thus avoiding a large deviation of the semiconductor component.
[0030] Specific working principle:
[0031] In use, the first conveyor belt 1 rotates to transport semiconductor components. When the camera recognition device 19 identifies the required semiconductor component, it sends an electrical signal to the control panel. The control panel controls the servo motor 6 to drive the threaded rod 7 to rotate, which, in conjunction with the guide rod 8, causes the moving plate 9 to move left and right along the surfaces of the threaded rod 7 and the guide rod 8. This, in turn, causes the push plate 10 to move and push the semiconductor component. Simultaneously, the moving plate 9 moves the connecting plate 11 and the push rod 12. When the push rod 12 moves and contacts the second inclined surface of the second inclined plate 17, it causes the first inclined plate 16, the second inclined plate 17, and the third inclined plate 18 to rotate rapidly and come close to the top surface of the first conveyor belt 1, thereby blocking the semiconductor component. To prevent the semiconductor components from continuing to move with the rotation of the first conveyor belt 1, the pusher plate 10 pushes the semiconductor components into the top surface of the second conveyor belt 3. When the first inclined surface of the first inclined plate 16 is parallel to the top surface of the first conveyor belt 1, the pusher 12 just disengages from the first inclined surface of the second inclined plate 17 and begins to contact the third inclined surface of the third inclined plate 18. The third inclined surface of the third inclined plate 18 is also parallel to the top surface of the first conveyor belt 1. The pusher plate 10 continues to move, causing the pusher 12 to slide on the surface of the third inclined surface. The first inclined plate 16, the second inclined plate 17 and the third inclined plate 18 no longer continue to rotate until the semiconductor components move from the top surface of the first conveyor belt 1 along the second empty slot to the top surface of the second conveyor belt 3, thus realizing the sorting of the semiconductor components.
[0032] When the semiconductor component moves with the rotation of the second conveyor belt 3, if the semiconductor component is deviated due to external influence, it will contact the roller 22 and drive the roller 22, U-shaped plate 23 and fixed shaft 24 to move into the housing 21. The second return spring 25 is contracted and pushes the U-shaped plate 23 to move outward, thereby driving the semiconductor component to move back to its original direction. When the roller 22 contacts the semiconductor component, it rotates with the movement of the semiconductor component, so it will not affect the movement of the semiconductor component with the rotation of the second conveyor belt 3. The guide assembly can guide the semiconductor component without affecting its movement, thus avoiding a large deviation of the semiconductor component.
[0033] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A semiconductor component sorting device, comprising a first conveyor belt (1), a second conveyor belt (3), and a pusher plate (10), wherein a first baffle (2) is provided on the side of the first conveyor belt (1), and a pusher plate (10) is provided above the top surface of the first conveyor belt (1), characterized in that: A limiting component is provided on the side of the first conveyor belt (1). The limiting component can prevent the semiconductor component from moving with the rotation of the first conveyor belt (1) during the push plate (10) pushing the semiconductor component. The guide assembly is located on both the front and rear sides of the second conveyor belt (3). The guide assembly can guide the semiconductor parts on the top surface of the second conveyor belt (3). Mounting bracket (5) is installed above the top surface of the first conveyor belt (1). The mounting bracket (5) facilitates the movement of semiconductor components from the top surface of the first conveyor belt (1) to the top surface of the first baffle (2).
2. The semiconductor component sorting device according to claim 1, characterized in that: The first conveyor belt (1) is provided with symmetrical first baffles (2) on the left and right sides, and the second conveyor belt (3) is provided with symmetrical second baffles (4) on the front and rear sides. The top surface of the first baffle (2) is fixedly connected to the mounting frame (5). A servo motor (6) is fixedly installed on the outside of the mounting frame (5). The output end of the servo motor (6) passes through the mounting frame (5) and is rotatably connected to the mounting frame (5). A threaded rod (7) is fixedly provided at the end of the output end of the servo motor (6). The other end of the threaded rod (7) is rotatably connected to the mounting frame (5) through a bearing. A movable plate (9) is threadedly connected to the outside of the threaded rod (7). A guide rod (8) is fixedly provided between the inner walls of the left and right sides of the mounting frame (5). The guide rod (8) passes through the movable plate (9) and is slidably connected to the movable plate (9). The side of the movable plate (9) near the second conveyor belt (3) is fixedly connected to the push plate (10). A camera recognition device (19) is fixedly installed on the inner wall of the mounting frame (5).
3. The semiconductor component sorting device according to claim 2, characterized in that: The limiting assembly includes a connecting plate (11), a push rod (12), a first reset spring (13), a fixing plate (14), a base plate (15), a first inclined plate (16), a second inclined plate (17), and a third inclined plate (18). The connecting plate (11) is fixedly mounted on the front of the moving plate (9). The push rod (12) is fixedly mounted on the front of the connecting plate (11). The base plate (15) is fixedly mounted on the outer side of the first baffle (2). The fixing plate (14) is fixedly mounted on the top surface of the base plate (15). The first reset spring (13) is fixedly mounted on the side of the fixing plate (14). The first inclined plate (16) is hinged to the top surface of the base plate (15). The second inclined plate (17) and the third inclined plate (18) are fixedly mounted on the side of the first inclined plate (16).
4. A semiconductor component sorting device according to claim 3, characterized in that: The end of the first reset spring (13) away from the fixed plate (14) is fixedly connected to the first inclined plate (16), and the second inclined plate (17) is fixedly connected to the third inclined plate (18).
5. A semiconductor component sorting device according to claim 2, characterized in that: The guide assembly includes a support plate (20), a housing (21), a roller (22), a U-shaped plate (23), a fixed shaft (24), and a second return spring (25). The support plate (20) is fixedly installed on the side of the second baffle (4). Multiple housings (21) are fixedly installed on the top surface of the support plate (20). The U-shaped plate (23) is slidably connected to the inner wall of the housing (21). The second return spring (25) is fixedly installed on the outer side of the U-shaped plate (23). The fixed shaft (24) is fixedly installed between the top and bottom surfaces of the inner side of the U-shaped plate (23). The roller (22) is rotatably connected to the outer side of the fixed shaft (24).
6. A semiconductor component sorting device according to claim 5, characterized in that: The top and bottom surfaces of the roller (22) are rotatably connected to the U-shaped plate (23), and the end of the second return spring (25) away from the U-shaped plate (23) is fixedly connected to the inner wall of the sleeve (21).