Wafer grinding equipment

Abstract

The utility model discloses wafer grinding equipment, which relates to the technical field of grinding equipment and comprises a mounting seat, a grinding groove is arranged on the upper surface of the mounting seat, three placing grooves arranged in a circumferential array are arranged on the inner bottom wall of the grinding groove, and a lifting mechanism and a fixing mechanism are respectively arranged in the placing grooves. And the lifting mechanism comprises a mounting groove formed in the inner bottom wall of the placement groove, a top plate is arranged in the mounting groove, a transmission cavity is formed in a shell of the mounting base, and three columnar grooves penetrating into the three placement grooves are formed in the inner top wall of the transmission cavity. According to the wafer grinding equipment disclosed by the utility model, through the arrangement of the lifting mechanism, the servo motor drives the large gear to rotate at a slow speed, and the rotation of the large gear drives the three lead screws to rotate through the small gear at the same time, so that the threaded cylinder drives the top plate to move upwards through the rotation of the lead screws, and a wafer in the placement groove is pushed out from the interior of the placement groove; and convenience is provided for wafer discharging work of the device, and the practicability of the device is improved.

Description

Technical Field

[0001] This utility model relates to the field of grinding equipment technology, and in particular to a wafer grinding equipment. Background Technology

[0002] A wafer is a silicon wafer used in the fabrication of silicon semiconductor integrated circuits. It is called a wafer because of its circular shape. During the manufacturing process, wafers need to be ground and polished using grinding equipment.

[0003] Patent document CN113352228B discloses a wafer polishing apparatus, including an upper polishing disk, a lower polishing disk, and a carrier disk. The upper and lower polishing disks are arranged opposite to each other, and first polishing pads are respectively disposed on the opposite surfaces of the upper and lower polishing disks. The carrier disk is disposed between the upper and lower polishing disks and has a receiving hole for accommodating the wafer to be polished. The polishing apparatus also includes a washer and a second polishing pad. The washer is disposed within the receiving hole, is annular, and its outer wall abuts against the inner wall of the receiving hole. The second polishing pad is annular, is disposed within the receiving hole, and its outer wall abuts against the inner wall of the washer. This invention, by providing a washer and a second polishing pad on the carrier disk, avoids direct contact between the wafer located in the receiving hole and the carrier disk. Simultaneously, it provides a certain buffering effect, helping to protect the wafer and reduce the possibility of wafer damage.

[0004] The above-mentioned scheme lacks an auxiliary lifting mechanism in the receiving hole used to hold the wafer, which makes it inconvenient to remove the wafer from the receiving hole after grinding and polishing, causing inconvenience to the wafer unloading process. Utility Model Content

[0005] This utility model discloses a wafer grinding equipment, which aims to solve the technical problem that existing grinding equipment lacks the ability to lift wafers and assist in material discharge.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A wafer grinding apparatus includes a mounting base, a grinding groove is formed on the upper surface of the mounting base, and three placement grooves arranged in a circumferential array are formed on the inner bottom wall of the grinding groove. A lifting mechanism and a fixing mechanism are respectively provided inside the placement grooves.

[0008] The lifting mechanism includes an installation groove formed in the bottom wall of the placement groove, a top plate is provided inside the installation groove, a transmission cavity is provided inside the housing of the mounting base, and three columnar grooves are formed in the inner top wall of the transmission cavity, which respectively penetrate into the three placement grooves. A lead screw extending into the columnar groove is rotatably connected to the inner bottom wall of the transmission cavity, and a threaded cylinder is threadedly connected to the surface of the lead screw. The upper end of the threaded cylinder is fixedly connected to the lower surface of the top plate.

[0009] In a preferred embodiment, the surface of the threaded cylinder is provided with a guide slider, and the inner wall of the columnar groove is provided with a guide groove for the guide slider to slide.

[0010] By setting a guide slider, the threaded cylinder can move up and down in a directional manner through the rotation of the lead screw under the guidance of the guide slider.

[0011] In a preferred embodiment, a servo motor is fixedly mounted on the lower surface of the mounting base. The output shaft of the servo motor extends into the interior of the transmission cavity and is fixedly connected to a large gear. A small gear that meshes with the large gear is fixedly connected to one end of the lead screw located inside the transmission cavity.

[0012] By using large and small gears, the servo motor can drive three lead screws to rotate simultaneously through the large and small gears, thus achieving a transmission effect.

[0013] In a preferred embodiment, the inner wall of the placement groove is provided with a fixing groove, and a bidirectional threaded rod is provided inside the fixing groove. Two symmetrical threaded blocks are threadedly connected to the surface of the bidirectional threaded rod. The inner wall of the placement groove is provided with two symmetrical receiving grooves, and a clamping plate is provided inside each of the two receiving grooves. The inner wall of the fixing groove is provided with a sliding strip opening that extends into the two receiving grooves. The surfaces of the two threaded blocks are fixedly connected to the two clamping plates respectively through the sliding strip opening.

[0014] The clamping plates allow for the holding of wafers within the placement slot, improving their stability and enabling the fixing of wafers with smaller diameters.

[0015] In a preferred embodiment, the surface of the threaded block is provided with a limit slider, and the inner wall of the fixing groove is provided with a limit groove for the limit slider to slide.

[0016] Guided by the limiting slider, the threaded block can drive the clamping plate to move in a specific direction through the rotation of the bidirectional threaded rod.

[0017] In a preferred embodiment, the surface of the mounting base has a rotating opening that extends into the fixed groove, and the inner wall of the rotating opening is rotatably connected to an operating rod that is fixedly connected to the end of a bidirectional threaded rod. Anti-slip pads are provided on the opposite surfaces of the two clamping plates.

[0018] The anti-slip pads protect the wafer after it is clamped and fixed by the clamping plates, preventing damage to the wafer.

[0019] As can be seen from the above, the wafer grinding equipment provided by this utility model has the following technical effects.

[0020] Firstly, the servo motor drives the large gear to rotate slowly. The rotation of the large gear drives the three lead screws to rotate simultaneously through the small gear. This causes the threaded cylinder to move the top plate upward through the rotation of the lead screws, pushing the wafers in the placement slot out of the slot. This facilitates the wafer unloading operation of the device and improves its practicality.

[0021] Secondly, rotating the operating lever drives the bidirectional threaded rod to rotate. Under the rotation of the bidirectional threaded rod, the two threaded blocks drive the two clamping plates to move until the two clamping plates clamp and fix the wafer in the placement slot, improving the stability of the wafer after placement. It can also fix wafers with smaller diameters, thus improving the adaptability of the device. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural diagram of a wafer grinding equipment proposed in this utility model.

[0023] Figure 2 This is a schematic diagram of the front section structure of a wafer grinding equipment proposed in this utility model.

[0024] Figure 3 This is a top-section schematic diagram of the transmission cavity structure of a wafer grinding equipment proposed in this utility model.

[0025] Figure 4 This is a top-section diagram of the placement groove structure of a wafer grinding equipment proposed in this utility model.

[0026] Figure 5 This utility model proposes a wafer grinding device. Figure 4 Enlarged structural diagram at point A in the middle.

[0027] In the attached diagram: 1. Mounting base; 2. Grinding groove; 3. Placement groove; 4. Top plate; 5. Transmission cavity; 6. Lead screw; 7. Threaded cylinder; 8. Guide slider; 9. Servo motor; 10. Large gear; 11. Small gear; 12. Bidirectional threaded rod; 13. Threaded block; 14. Clamping plate; 15. Limit slider; 16. Operating lever. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0029] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0030] Reference Figures 1-5 A wafer grinding device includes a mounting base 1, a grinding groove 2 is formed on the upper surface of the mounting base 1, and three placement grooves 3 arranged in a circumferential array are formed on the inner bottom wall of the grinding groove 2. A lifting mechanism and a fixing mechanism are respectively provided inside the placement grooves 3.

[0031] The lifting mechanism includes an installation groove formed in the bottom wall of the placement groove 3. A top plate 4 is provided inside the installation groove. A transmission cavity 5 is provided inside the housing of the mounting base 1. Three columnar grooves are formed in the inner top wall of the transmission cavity 5, which respectively penetrate into the three placement grooves 3. A lead screw 6 extending into the columnar groove is rotatably connected to the inner bottom wall of the transmission cavity 5. A threaded cylinder 7 is threadedly connected to the surface of the lead screw 6. The upper end of the threaded cylinder 7 is fixedly connected to the lower surface of the top plate 4.

[0032] Reference Figure 2 In a preferred embodiment, the surface of the threaded cylinder 7 is provided with a guide slider 8, and the inner wall of the columnar groove is provided with a guide groove for the guide slider 8 to slide. Under the guidance of the guide slider 8, the threaded cylinder 7 can move up and down in a directional manner by rotating the screw 6.

[0033] Reference Figure 2 and Figure 3 In a preferred embodiment, a servo motor 9 is fixedly mounted on the lower surface of the mounting base 1. The output shaft of the servo motor 9 extends into the interior of the transmission cavity 5 and is fixedly connected to a large gear 10. A small gear 11 that meshes with the large gear 10 is fixedly connected to one end surface of the lead screw 6 located inside the transmission cavity 5.

[0034] By setting up the large gear 10 and the small gear 11, the servo motor 9 can drive the three lead screws 6 to rotate simultaneously through the large gear 10 and the small gear 11, thus achieving the effect of transmission.

[0035] Reference Figure 4 and Figure 5In a preferred embodiment, the inner wall of the placement groove 3 is provided with a fixing groove, and a bidirectional threaded rod 12 is provided inside the fixing groove. Two symmetrical threaded blocks 13 are threadedly connected to the surface of the bidirectional threaded rod 12. The inner wall of the placement groove 3 is provided with two symmetrical receiving grooves, and a clamping plate 14 is provided inside each of the two receiving grooves. The inner wall of the fixing groove is provided with a sliding strip opening that penetrates into the two receiving grooves. The surfaces of the two threaded blocks 13 are fixedly connected to the two clamping plates 14 through the sliding strip openings.

[0036] The clamping plate 14 can be used to clamp the wafer in the placement slot 3, improving its stability and fixing wafers with smaller diameters.

[0037] Reference Figure 4 and Figure 5 In a preferred embodiment, the surface of the threaded block 13 is provided with a limiting slider 15, and the inner wall of the fixing groove is provided with a limiting groove for the limiting slider 15 to slide. Under the guiding action of the limiting slider 15, the threaded block 13 can drive the clamping plate 14 to move in a directional manner through the rotation of the bidirectional threaded rod 12.

[0038] Reference Figure 5 In a preferred embodiment, the surface of the mounting base 1 is provided with a rotating opening that extends into the fixed groove. The inner wall of the rotating opening is rotatably connected to an operating rod 16 that is fixedly connected to the end of the bidirectional threaded rod 12. Anti-slip pads are provided on the opposite surfaces of the two clamping plates 14. The anti-slip pads can protect the wafer after the clamping plates 14 clamp and fix it, thus preventing the wafer from being damaged.

[0039] Working principle: During use, the wafer to be ground and polished is placed in the placement groove 3. The operating lever 16 is rotated to drive the bidirectional threaded rod 12 to rotate. The two threaded blocks 13 drive the two clamping plates 14 to move under the rotation of the bidirectional threaded rod 12 until the two clamping plates 14 clamp and fix the wafer in the placement groove 3, improving the stability of the wafer after placement. After placement, the wafer in the placement groove 3 can be ground and polished by the external grinding disc. After the wafer is ground and polished, the servo motor 9 drives the large gear 10 to rotate slowly. The rotation of the large gear 10 drives the three lead screws 6 to rotate through the small gear 11. The threaded cylinder 7 drives the top plate 4 to move upward through the rotation of the lead screws 6, pushing the wafer out of the placement groove, thereby achieving the purpose of assisting in material discharge.

[0040] The above description is merely a preferred embodiment of this utility model, but the protection scope of this utility model is not limited thereto. The substitutions may be replacements of some structures, devices, or method steps, or they may be complete technical solutions. Equivalent substitutions or modifications made based on the technical solution and inventive concept of this utility model should all be covered within the protection scope of this utility model.

Claims

1. A wafer grinding device, characterized in that, It includes a mounting base (1), the upper surface of the mounting base (1) is provided with a grinding groove (2), the inner bottom wall of the grinding groove (2) is provided with three placement grooves (3) arranged in a circumferential array, and the interior of the placement grooves (3) is provided with a lifting mechanism and a fixing mechanism respectively. The lifting mechanism includes an installation groove formed in the bottom wall of the placement groove (3), a top plate (4) is provided inside the installation groove, a transmission cavity (5) is provided inside the housing of the mounting base (1), and three columnar grooves are formed in the inner top wall of the transmission cavity (5) respectively penetrating into the three placement grooves (3). A lead screw (6) extending into the columnar groove is rotatably connected to the inner bottom wall of the transmission cavity (5), and a threaded cylinder (7) is threadedly connected to the surface of the lead screw (6). The upper end of the threaded cylinder (7) is fixedly connected to the lower surface of the top plate (4).

2. The wafer grinding equipment according to claim 1, characterized in that, The surface of the threaded cylinder (7) is provided with a guide slider (8), and the inner wall of the columnar groove is provided with a guide groove for the guide slider (8) to slide.

3. The wafer grinding equipment according to claim 1, characterized in that, A servo motor (9) is fixedly mounted on the lower surface of the mounting base (1). The output shaft of the servo motor (9) extends into the interior of the transmission cavity (5) and is fixedly connected to a large gear (10). A small gear (11) that meshes with the large gear (10) is fixedly connected to one end of the lead screw (6) located inside the transmission cavity (5).

4. The wafer grinding equipment according to claim 1, characterized in that, The inner wall of the placement groove (3) is provided with a fixing groove, and a bidirectional threaded rod (12) is provided inside the fixing groove. Two symmetrical threaded blocks (13) are threadedly connected to the surface of the bidirectional threaded rod (12). The inner wall of the placement groove (3) is provided with two symmetrical receiving grooves. A clamping plate (14) is provided inside the two receiving grooves. The inner wall of the fixing groove is provided with a sliding strip opening that penetrates into the two receiving grooves. The surfaces of the two threaded blocks (13) are fixedly connected to the two clamping plates (14) respectively through the sliding strip opening.

5. The wafer grinding equipment according to claim 4, characterized in that, The surface of the threaded block (13) is provided with a limiting slider (15), and the inner wall of the fixing groove is provided with a limiting groove for the limiting slider (15) to slide.

6. The wafer grinding equipment according to claim 4, characterized in that, The surface of the mounting base (1) is provided with a rotating opening that extends through the fixed groove. The inner wall of the rotating opening is rotatably connected to an operating rod (16) that is fixedly connected to the end of the bidirectional threaded rod (12). Anti-slip pads are provided on the opposite surfaces of the two clamping plates (14).

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