Honeycomb-like array type micro-channel condenser

By designing a honeycomb array-type microchannel condenser, combined with superhydrophobic treatment and an intelligent wind speed regulation system, the problems of low heat exchange efficiency, frosting, and large size of the condenser are solved, achieving a high-efficiency, compact, lightweight, and intelligent condensation effect.

CN223550678UActive Publication Date: 2025-11-14SOUTHEAST UNIV
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Patent Information

Application Number
CN202422797228.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-18
Publication Date
2025-11-14
Estimated Expiration
2034-11-18

AI Technical Summary

Technical Problem

Existing condensers suffer from problems such as low heat exchange efficiency, severe frost formation, and large size, which limit their application in high-efficiency, energy-saving, and miniaturized applications.

Method used

A compact condenser is designed using a honeycomb array-style microchannel structure, combined with superhydrophobic microchannel copper tubes and an intelligent airflow regulation system. This includes S-shaped bent microchannel copper tubes, honeycomb-style heat dissipation fins, and an intelligent controller.

Benefits of technology

It significantly improves heat exchange efficiency, prevents frost formation, and enables compact and lightweight condensers. It features high efficiency, energy saving, and intelligence, making it suitable for modern equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The honeycomb-imitated array type micro-channel condenser comprises two pairs of frame plates arranged in parallel, a plurality of groups of micro-channel copper pipes vertically penetrating through the frame plates and a plurality of groups of cooling fins arranged between the two frame plates in parallel; a connecting bent pipe is arranged between every two adjacent micro-channel copper pipes, and the multiple parallel micro-channel copper pipes are connected end to end. A plurality of groups of orthohexagonal air chamber units are arranged on the radiating fins, and the edge of each air chamber unit is in contact with the edge of the adjacent unit to form a continuous heat exchange unit. The radiating fins of a honeycomb-like structure are adopted, and the hexagonal air chamber unit layout is combined, so that the heat exchange surface area is greatly increased, the heat exchange process is optimized, and the condensation efficiency is improved. And meanwhile, due to the design of the S-shaped bent micro-channel copper pipe array, steam can be better distributed in a limited space, and the condensation efficiency is further improved.
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Description

Technical Field

[0001] This utility model belongs to the field of condenser technology, specifically relating to a honeycomb array-type microchannel condenser. Background Technology

[0002] Condensers are crucial components in many industrial equipment, household appliances (such as air conditioners and refrigerators), and energy systems, and their condensation efficiency directly affects equipment performance and energy consumption. However, existing condenser technology has several shortcomings that limit its further application in areas such as high efficiency, energy saving, and miniaturization. The condensation process in a condenser involves a two-phase change, and frosting is a significant factor affecting the condenser's heat transfer efficiency. Frost on the condenser surface reduces the cooling effect of equipment such as air conditioners and refrigerators, leads to condenser blockage, inhibits the normal flow of refrigerant, deteriorates cooling performance, and increases unnecessary energy consumption. Specifically, existing condensation technology has the following shortcomings:

[0003] 1. Low heat exchange efficiency and insufficient heat exchange surface area: Most existing condensers adopt traditional tube or finned designs. Although these designs are effective in some applications, their heat exchange surface area is usually limited, resulting in low heat exchange efficiency. To improve heat exchange efficiency, traditional solutions usually require increasing the condenser volume and surface area, but this leads to problems such as excessive equipment size, weight, and inconvenience in transportation and installation. Therefore, how to effectively improve heat exchange efficiency within limited space remains a pressing problem to be solved in condenser technology.

[0004] 2. Severe frosting issues lead to decreased equipment efficiency: In many condenser applications, especially in low-temperature condensation processes, surface frosting is a major factor affecting condensation efficiency. Frost formation not only reduces heat transfer efficiency but also causes blockage on the condenser surface, severely impacting refrigerant flow and leading to equipment malfunction or reduced efficiency. Traditional condensers have limited anti-frost design measures, typically relying on larger dimensions or complex defrosting mechanisms, which increases both equipment costs and maintenance difficulty.

[0005] 3. Large and heavy condensers: Many existing condensers require a large physical space to provide sufficient heat exchange area due to the design of the heat dissipation fins and the arrangement of the microchannels. This makes the condensers large and heavy, inconvenient to transport and install, especially in applications with limited space or requiring lightweight design, thus failing to meet the requirements. Summary of the Invention

[0006] The purpose of this invention is to overcome the shortcomings of the prior art and provide a honeycomb array-type microchannel condenser with improved heat exchange effect.

[0007] To solve the above-mentioned technical problems, the technical method adopted by the present invention is as follows: The present invention discloses a honeycomb array microchannel condenser, including two pairs of parallel racks, multiple sets of microchannel copper tubes that pass vertically through the racks, and several sets of heat dissipation fins that are parallel to each other between the two racks.

[0008] A connecting bend is provided between two adjacent microchannel copper tubes to connect several parallel microchannel copper tubes end to end.

[0009] The heat dissipation fins are provided with several sets of hexagonal air chamber units, and the side of each air chamber unit is in contact with the side of the adjacent unit to form a continuous heat exchange unit.

[0010] Furthermore, the heat dissipation fins have a thickness of 0.5 mm, a length of 104 mm, and a width of 13 mm; the air chamber unit has a side length of 600 μm, and the spacing between adjacent heat dissipation fins is 4 mm.

[0011] The mounting plate has holes for fixing the microchannel copper tube, and the diameter of the holes is 8mm.

[0012] Furthermore, both the inner and outer surfaces of the microchannel copper tube are coated with a superhydrophobic coating.

[0013] Furthermore, the heat dissipation fins are provided with slots that match the outer diameter of the microchannel copper tube.

[0014] Furthermore, a wind speed sensor is provided at one end of the microchannel copper tube. The wind speed sensor is installed at the air inlet of the condenser to monitor the wind speed entering the condenser in real time. An adjustable fan system is provided at the air outlet of the condenser.

[0015] Furthermore, the wind speed sensor is connected to the intelligent controller via a wire. The intelligent controller is installed on the side of the condenser and is used to receive the data signal from the wind speed sensor and adjust the fan speed of the adjustable fan system.

[0016] Furthermore, the adjustable fan system includes a PWM speed-regulating fan, and the fan motor controls its speed change through an intelligent controller to achieve precise control of the wind speed.

[0017] Furthermore, the condenser is equipped with a power module that provides 24VDC power and supplies power to the wind speed sensor, intelligent controller and fan system through a DC-DC conversion module.

[0018] Furthermore, the power module integrates overcurrent, overvoltage, and undervoltage protection devices to prevent power abnormalities from damaging the wind speed sensor, intelligent controller, and fan system.

[0019] Furthermore, the intelligent controller is also connected to a communication module, which is an ESP8266 Wi-Fi module, used to transmit the condenser's wind speed data to the remote control system, enabling remote monitoring of wind speed and fan status. Beneficial effects

[0020] 1. Significantly improves heat exchange efficiency:

[0021] The heat dissipation fins, employing a honeycomb-like structure and arranged in a combination of several adjacent hexagonal air chamber units, significantly increase the heat exchange surface area, optimize the heat exchange process, and improve condensation efficiency. Simultaneously, the S-shaped, bent microchannel copper tube array design allows for better steam distribution within a limited space, further enhancing condensation efficiency.

[0022] 2. Effectively prevents frost formation:

[0023] The inner and outer surfaces of the microchannel copper tubes are treated with superhydrophobic coating, effectively reducing the risk of frost formation on the condenser surface. This hydrophobicity, combined with a honeycomb-like structure, minimizes the contact area between the condenser surface and the cooling medium, preventing frost formation, thereby improving condensation efficiency, preventing condenser blockage, and ensuring long-term stable operation of the equipment.

[0024] 3. Compact and lightweight design:

[0025] By employing S-shaped bends in microchannel copper tubes and a compact, honeycomb-like heat dissipation fin structure, the condenser of this invention achieves efficient heat exchange within a limited space, while maintaining a small size and light weight. This gives the condenser a significant advantage in applications requiring lightweight design and space-saving features, particularly suitable for modern equipment demanding high efficiency and compact design, such as high-performance air conditioners, home appliances, and automotive air conditioning systems. Attached Figure Description

[0026] Figure 1 This is a front view schematic diagram of the condenser in this invention;

[0027] Figure 2 This is a top view of the condenser structure in this invention;

[0028] Figure 3 This is a side view of the condenser structure in this invention;

[0029] Figure 4 This is a partial schematic diagram of the heat dissipation fins in this invention;

[0030] Figure 5 This is a schematic diagram of the specific structure at the junction of the heat dissipation fins and the copper tube in this invention. Detailed Implementation

[0031] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0032] like Figure 1-5 As shown, a honeycomb array microchannel condenser is described. In this embodiment, the honeycomb array microchannel condenser includes two parallel racks 1, multiple microchannel copper tubes 4, and several heat dissipation fins 3.

[0033] The support plate 1 is mainly used to support the microchannel copper tubes 4 and ensure their fixed position. The dimensions of each support plate 1 are: length 118mm, width 13mm, and thickness 2mm. The surface of the support plate 1 has holes 2 for fixing the position of the microchannel copper tubes 4. The diameter of the holes 2 is 8mm, and the distance between the holes 2 is 20mm to ensure the precise relative position of the microchannel copper tubes 4.

[0034] The microchannel copper tube 4 has an outer diameter of 7mm and an inner diameter of 5mm. Its surface is treated with a superhydrophobic coating to effectively prevent frost formation. The microchannel copper tube 4 passes through the support plate 1 and is arranged in an S-shaped bend along the horizontal plane of the condenser. The copper tubes are arranged in an array, with a distance of 20mm between adjacent tubes, maximizing the use of limited space to improve heat exchange efficiency.

[0035] The heat dissipation fins 3 adopt a honeycomb-like structure, with each fin arranged in a regular hexagonal pattern, each with a side length of 600μm. The fin thickness is 0.5mm, the length is 104mm, and the width is 13mm. The spacing between adjacent fins is 4mm. This structure improves condensation efficiency by increasing the surface area in contact with airflow, and due to its special structural design, it reduces the solid-liquid contact area, effectively preventing frost formation.

[0036] In this embodiment, the condenser is also equipped with an intelligent fan speed regulation system to further optimize the condenser's heat exchange efficiency. Specifically, this system mainly consists of a fan speed sensor, an intelligent controller, an adjustable fan, a power module, circuit protection, and a human-machine interface.

[0037] The condenser's intelligent controller includes a data storage unit for storing real-time data from the wind speed sensor and historical fan adjustment records, supporting subsequent data analysis and fault diagnosis. The controller also integrates a temperature sensor to monitor the temperature of the microchannel copper tube 4, which, combined with wind speed data, enables dynamic control of the overall heat exchange of the condenser. Through real-time communication with the fan system, the intelligent controller adjusts the fan speed and airflow based on the combined analysis of wind speed and temperature, further optimizing the condensation effect, and automatically switches to energy-saving mode when a specified threshold is reached.

[0038] The anemometer is used to monitor the airflow speed entering the condenser in real time. Installed at the condenser's air inlet, it accurately measures airflow velocity using fluid dynamics principles. The sensor features a high-precision design and can operate stably under various environmental conditions. The anemometer model is SENSIRIONSFM3300, and it boasts high sensitivity and stability.

[0039] The intelligent controller receives data from the wind speed sensor and analyzes it based on a preset algorithm, adjusting the fan speed in real time to optimize the condenser's heat exchange effect. The intelligent controller, model ESP32-WROOM-32, features high-performance data processing capabilities, Wi-Fi functionality, and support for multiple interfaces. Through intelligent control, it can adjust the fan speed according to real-time wind speed data, achieving energy saving and noise reduction while ensuring the efficient operation of the condenser.

[0040] The fan system consists of multiple high-efficiency PWM speed-controlled fans, whose speed is adjusted by an intelligent controller to maintain the airflow within the optimal range. The fan system includes DC motors and a precision control unit, enabling smooth airflow changes, reducing noise, and extending equipment lifespan. The fan model is NoctuaNF-F12iPPC-3000PWM, featuring high airflow and stability, suitable for long-term operation in environments requiring low noise.

[0041] The power module of this condenser provides 24V DC power, which powers the wind speed sensor, intelligent controller, and fan system via a DC-DC converter. The power module features overcurrent, overvoltage, and undervoltage protection to ensure safe system operation under various electrical fault conditions. The power module is MeanWellHDR-15-24, offering efficient and stable power supply capabilities.

[0042] The circuit protection module ensures that the wind speed regulation system is not damaged by voltage fluctuations or abnormal current during operation. This protection module employs overcurrent, overvoltage, and undervoltage protection technologies to prevent power abnormalities from damaging the sensors, intelligent controller, and fan system.

[0043] Users can adjust the condenser's operating mode, set fan speed thresholds, and view real-time fan speed data through a user-friendly human-machine interface. This interface uses an OLED display to provide real-time data feedback and supports touch operation and parameter adjustment. The human-machine interface design is simple, intuitive, and easy to use.

[0044] This condenser is also equipped with a Wi-Fi communication module, using the ESP8266 Wi-Fi module, which can remotely transmit the condenser's real-time operating data to a host computer or cloud for monitoring and analysis. This communication function is particularly suitable for remote control and fault diagnosis.

[0045] The working process of this invention is as follows: When refrigerant vapor enters the condenser through the microchannel copper tube 4, the vapor transfers heat to the heat dissipation fins 3 through the tube wall. Due to the use of honeycomb-like heat dissipation fins 3, the heat exchange surface area of ​​the condenser is significantly increased, allowing the heat from the vapor to be transferred more effectively to the surrounding cooling medium. After absorbing heat, the cooling medium condenses the vapor into a liquid, completing the condensation process.

[0046] During this process, a wind speed sensor monitors the airflow rate entering the condenser in real time, and the intelligent controller dynamically adjusts the fan speed based on the data provided by the wind speed sensor to ensure that the airflow rate is within the optimal range. This not only improves condensation efficiency but also effectively reduces energy consumption and noise.

[0047] This invention provides an array-type microchannel condenser with a honeycomb-like structure, which, combined with a wind speed sensor, intelligent controller, and adjustable fan system, achieves efficient heat exchange and wind speed regulation. Through rational design, this condenser can effectively improve heat exchange efficiency, prevent frost formation, reduce size and weight, and is intelligent and energy-saving, making it suitable for various applications such as air conditioners, refrigerators, and automotive air conditioners.

[0048] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A honeycomb array-style microchannel condenser, characterized in that, include: Two pairs of parallel racks (1), multiple sets of microchannel copper tubes (4) that pass vertically through the racks, and several sets of heat dissipation fins (3) that are parallel to each other between the two racks (1). A connecting bend is provided between two adjacent microchannel copper tubes (4) to connect several parallel microchannel copper tubes (4) end to end; The heat dissipation fins (3) are provided with several groups of hexagonal air chamber units, and the side of each air chamber unit is in contact with the side of the adjacent unit to form a continuous heat exchange unit.

2. The honeycomb array-type microchannel condenser according to claim 1, characterized in that: The heat dissipation fins (3) have a thickness of 0.5 mm, a length of 104 mm, and a width of 13 mm; the side length of the air chamber unit is 600 μm, and the spacing between adjacent heat dissipation fins is 4 mm. The mounting plate (1) is provided with holes (2) for fixing the microchannel copper tube (4), and the diameter of the holes (2) is 8mm.

3. The honeycomb array-type microchannel condenser according to claim 1, characterized in that: The microchannel copper tube (4) has a superhydrophobic coating on both its inner and outer surfaces.

4. The honeycomb array-type microchannel condenser according to claim 1, characterized in that: The heat dissipation fins (3) are provided with slots (41) that match the outer diameter of the microchannel copper tube (4).

5. The honeycomb array-type microchannel condenser according to claim 1, characterized in that, One end of the microchannel copper tube (4) is equipped with a wind speed sensor, which is installed at the air inlet of the condenser to monitor the wind speed entering the condenser in real time; an adjustable fan system is provided at the air outlet of the condenser.

6. The honeycomb array-type microchannel condenser according to claim 5, characterized in that, The wind speed sensor is connected to the intelligent controller via a wire. The intelligent controller is installed on the side of the condenser and is used to receive the data signal from the wind speed sensor and adjust the fan speed of the adjustable fan system.

7. The honeycomb array-type microchannel condenser according to claim 5, characterized in that, The adjustable fan system includes a PWM speed-regulating fan, and the fan motor's speed is controlled by an intelligent controller to achieve precise control of the airflow.

8. The honeycomb array-type microchannel condenser according to claim 7, characterized in that, The condenser is equipped with a power module that provides 24VDC power and supplies power to the wind speed sensor, intelligent controller and fan system through a DC-DC conversion module.

9. The honeycomb array-type microchannel condenser according to claim 8, characterized in that, The power module integrates overcurrent, overvoltage, and undervoltage protection devices to prevent damage to the wind speed sensor, intelligent controller, and fan system caused by abnormal power supply.

10. The honeycomb array-type microchannel condenser according to claim 9, characterized in that, The intelligent controller is also connected to a communication module, which is an ESP8266 Wi-Fi module, used to transmit the condenser's wind speed data to the remote control system, enabling remote monitoring of wind speed and fan status.