Semiconductor refrigeration equipment

Abstract

The utility model provides semiconductor refrigeration equipment. When the semiconductor refrigeration part is powered on, the hot end generates heat, the heat conduction shell is tightly attached to the hot end of the semiconductor refrigeration part, a refrigerant in the heat conduction shell absorbs the heat of the hot end and then is heated to be in a gas state, then the refrigerant flows out of the refrigerant outlet, and gas-liquid two-phase backflow is formed after heat dissipation and cooling are conducted through the heat pipe radiator. The liquid state is further increased after throttling of the throttling device, then the liquid state returns to the heat conduction refrigerant channel in the heat conduction shell, a certain resistance difference is formed between a refrigerant inlet and a refrigerant outlet of the heat conduction refrigerant channel due to the arrangement of the throttling device, and the liquid state refrigerant in the heat conduction refrigerant channel expands in the process of being heated into the gas state; and the gaseous refrigerant is driven to flow out from the refrigerant outlet, so that the heat dissipation circulation of the refrigerant is completed, and a heat pipe effect is formed. The heat at the hot end of the semiconductor refrigeration piece can be taken away rapidly through the separated heat pipe effect, heat concentration is avoided, and the heat dissipation effect is improved.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor refrigeration technology, and more particularly to a semiconductor refrigeration device. Background Technology

[0002] In the field of refrigeration technology, semiconductor refrigeration refrigerators have attracted much attention and have been widely used due to their advantages such as simple structure, no moving mechanical parts, and quiet operation.

[0003] In related technologies, heat dissipation of the thermoelectric cooler is generally achieved by attaching heat pipes to the hot end of the thermoelectric cooler. This method is limited by the size of the thermoelectric cooler, such as an area of ​​only 40x40mm, which makes the number of heat pipes that can be arranged on it extremely limited. This patent can only arrange 5 narrow heat pipe strips, which ultimately makes it difficult to significantly improve the heat dissipation effect and cannot meet the requirements for rapid and effective heat dissipation in scenarios with higher cooling demands. Utility Model Content

[0004] In view of this, in order to solve the technical problem that the heat dissipation effect is limited by the size of the semiconductor cooling chip in the prior art, this disclosure provides a semiconductor cooling device.

[0005] According to a first aspect of the present disclosure, a semiconductor cooling device is provided, the semiconductor cooling device including a semiconductor cooling component, a heat pipe radiator, a first heat-conducting component and a throttling device, the first heat-conducting component including a heat-conducting shell and a heat-conducting refrigerant channel located inside the heat-conducting shell;

[0006] The heat-conducting shell is closely attached to the hot end of the semiconductor refrigeration component. The refrigerant inlet of the heat-conducting refrigerant channel is connected to the refrigerant outlet of the heat pipe radiator through the throttling device, and the refrigerant outlet of the heat-conducting refrigerant channel is connected to the refrigerant inlet of the heat pipe radiator, so as to dissipate the heat absorbed by the first heat-conducting component from the semiconductor refrigeration component through the heat pipe radiator.

[0007] In one optional implementation,

[0008] The semiconductor refrigeration device includes a heating device and a sealing plate. The heating device includes a heating chamber for placing the object to be heated.

[0009] The heating device and the sealing plate are both located above the heat pipe radiator. The sealing plate is fixedly connected to the side plate of the heat pipe radiator, so that the sealing plate, the heat pipe radiator and the heating device form a heat dissipation airflow channel with the opening facing.

[0010] In one optional implementation,

[0011] The heating device includes a heating plate and a heating compensator. The heating plate forms the side plate of the heating cavity facing the sealing plate, such that the heating plate, the sealing plate, and the heat pipe radiator form the heat dissipation airflow channel. The heating compensator is located on the side of the heating plate facing the sealing plate and is used to heat the heating plate.

[0012] In one optional implementation,

[0013] The interval between the heating plate and the sealing plate is greater than or equal to 6 mm and less than or equal to 15 mm, so that when the heat from the heat pipe radiator is dissipated to the opening of the heat dissipation airflow channel, a chimney effect is formed in the heat dissipation airflow channel.

[0014] In one optional implementation,

[0015] The heating device includes a temperature detector and a controller. The temperature detector is disposed on the heating plate and is used to detect the temperature of the heating plate.

[0016] The controller is electrically connected to the temperature detector and the heating compensator respectively, and the controller is configured to control the operation of the heating compensator based on the temperature detected by the temperature detector.

[0017] In one optional implementation,

[0018] The heating device includes a placement detector for the object to be heated, the placement detector being configured to generate a signal characterizing that the object to be heated is placed in the heating cavity after the object to be heated is placed into the heating cavity.

[0019] In one optional implementation,

[0020] The placement detector includes a photoelectric sensor switch and / or a photoelectric sensor.

[0021] In one optional implementation,

[0022] The heating chamber is a flat rectangular shape and is used to heat the face mask.

[0023] In one optional implementation,

[0024] The semiconductor refrigeration device includes a cooling conductor and a cooling plate. The cooling plate is used to cool the compartment of the semiconductor refrigeration device. The cooling conductor is located between the cooling plate and the semiconductor refrigeration device, with one side of the cooling conductor in close contact with the cooling plate and the other side of the cooling conductor in close contact with the semiconductor refrigeration device.

[0025] In one optional implementation,

[0026] The semiconductor refrigeration device includes an insulation layer located on a first side of the cooling plate, the first side being the side of the cooling plate away from the compartment of the semiconductor refrigeration device, and the cooling conductive element being located within the insulation layer.

[0027] In one optional implementation,

[0028] The semiconductor cooling device includes a rear baffle and a fan. The rear baffle and the cooling plate are spaced apart to form a cooling airflow channel. The cooling airflow channel is connected to the chamber of the semiconductor cooling device, and the fan is located inside the cooling airflow channel to drive the flow of gas in the cooling airflow channel.

[0029] In one optional implementation,

[0030] The bottom of the cooling airflow channel is provided with a drain hole and a water collection box. The drain hole is used to discharge the condensate generated in the cooling airflow channel to the water collection box.

[0031] In one optional implementation,

[0032] The semiconductor cooling device includes a second heat-conducting element, one end of which is connected to the first heat-conducting element, and the other end of which is connected to the water receiving box.

[0033] The second heat-conducting element absorbs heat from the first heat-conducting element to evaporate the condensate in the water collection box.

[0034] In one optional implementation,

[0035] The water receiving box is equipped with absorbent cotton, which is positioned at the location of the drain hole.

[0036] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects: In this disclosure, the semiconductor cooling component in the semiconductor cooling device is separated from the heat pipe radiator, and a first heat-conducting component and a throttling device are added. The heat-conducting shell of the first heat-conducting component is closely attached to the hot end of the semiconductor cooling component. The refrigerant inlet of the heat-conducting refrigerant channel in the heat-conducting shell is connected to the refrigerant outlet of the heat pipe radiator through the throttling device, and the refrigerant outlet of the heat-conducting refrigerant channel is connected to the refrigerant inlet of the heat pipe radiator. In other words, in this disclosure, when the thermoelectric cooler is energized, heat is generated at its hot end. Because the heat-conducting housing is in close contact with the hot end of the thermoelectric cooler, the refrigerant inside absorbs the heat and is heated into a gaseous state. It then flows out from the refrigerant outlet and dissipates heat through a heat pipe radiator. After cooling, it forms a two-phase gas-liquid recirculation. After being throttled by a throttling device, the liquid phase further increases and returns to the heat-conducting refrigerant channel within the heat-conducting housing. The throttling device creates a resistance difference between the refrigerant inlet and outlet of the heat-conducting refrigerant channel. As the liquid refrigerant in the channel is heated into a gaseous state, it expands, driving the gaseous refrigerant to flow out from the outlet, completing the refrigerant's heat dissipation cycle and forming a heat pipe effect. The separate heat pipe effect allows heat from the hot end of the thermoelectric cooler to be quickly dissipated, preventing heat concentration and improving heat dissipation.

[0037] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0038] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.

[0039] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0041] Figure 1 This is a schematic side cross-sectional view of a semiconductor cooling device according to an exemplary embodiment.

[0042] Figure 2 This is a schematic diagram of the back of a semiconductor cooling device according to an exemplary embodiment.

[0043] Figure 3 This is a partial structural schematic diagram of a semiconductor cooling device according to an exemplary embodiment.

[0044] Figure 4 This is a schematic diagram of the internal channels of a first heat-conducting element according to an exemplary embodiment.

[0045] Figure 5 This is a schematic diagram of a heating device according to an exemplary embodiment.

[0046] Figure 6 This is another schematic diagram of a heating device according to an exemplary embodiment.

[0047] Figure 7 This is a partial schematic diagram of a side cross-section of a semiconductor cooling device according to an exemplary embodiment.

[0048] Figure label:

[0049] 1. Semiconductor cooling component; 2. Heat pipe radiator; 21. Side plate; 3. First heat conduction component; 31. Heat conduction shell; 4. Throttling device; 5. Heating device; 51. Insertion port; 52. Heating plate; 53. Heating compensator; 54. Temperature detector; 55. Detector mounting plate; 6. Sealing plate; 7. Cooling component; 8. Cooling plate; 9. Insulation layer; 10. Rear baffle; 11. Fan; 12. Drain hole; 13. Water collection box; 14. Absorbent cotton; 15. Second heat conduction component;

[0050] 101. First pipeline; 102. Second pipeline;

[0051] 201. Heat-conducting refrigerant channel; 202. Heat dissipation airflow channel; 203. Cooling airflow channel. Detailed Implementation

[0052] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0053] The following disclosure provides numerous different embodiments or examples for implementing various aspects of the present invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0054] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0055] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. Therefore, the drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0056] The embodiments of this application will be described below with reference to the accompanying drawings and preferred embodiments. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be understood that the preferred embodiments are only for illustrating this application and are not intended to limit the scope of protection of this application.

[0057] To address the technical problem of limited heat dissipation due to the size of the semiconductor cooling chip in the prior art, this disclosure provides a semiconductor cooling device and control method.

[0058] In this disclosure, the semiconductor cooling component in the semiconductor cooling device is separated from the heat pipe radiator, and a first heat-conducting component and a throttling device are added. The heat-conducting shell of the first heat-conducting component is closely attached to the hot end of the semiconductor cooling component. The refrigerant inlet of the heat-conducting refrigerant channel in the heat-conducting shell is connected to the refrigerant outlet of the heat pipe radiator through the throttling device, and the refrigerant outlet of the heat-conducting refrigerant channel is connected to the refrigerant inlet of the heat pipe radiator. In other words, in this disclosure, when the thermoelectric cooler is energized, heat is generated at its hot end. Because the heat-conducting housing is in close contact with the hot end of the thermoelectric cooler, the refrigerant inside absorbs the heat and is heated into a gaseous state. It then flows out from the refrigerant outlet and dissipates heat through a heat pipe radiator. After cooling, it forms a two-phase gas-liquid recirculation. After being throttled by a throttling device, the liquid phase further increases and returns to the heat-conducting refrigerant channel within the heat-conducting housing. The throttling device creates a resistance difference between the refrigerant inlet and outlet of the heat-conducting refrigerant channel. As the liquid refrigerant in the channel is heated into a gaseous state, it expands, driving the gaseous refrigerant to flow out from the outlet, completing the refrigerant's heat dissipation cycle and forming a heat pipe effect. The separate heat pipe effect allows heat from the hot end of the thermoelectric cooler to be quickly dissipated, preventing heat concentration and improving heat dissipation.

[0059] In one exemplary embodiment, a semiconductor refrigeration device is provided. This semiconductor refrigeration device may be, for example, a semiconductor refrigerator, a semiconductor freezer, or other devices utilizing semiconductor refrigeration; there is no limitation thereto.

[0060] Among them, reference Figures 1 to 4 As shown, the semiconductor cooling device includes a semiconductor cooling element 1, a heat pipe radiator 2, a first heat-conducting element 3, and a throttling device 4. The semiconductor cooling element 1 can be, for example, a cooling chip or a cooling block, or it can be configured with other shapes according to actual needs; there are no limitations on this. The semiconductor cooling element 1 can use high-quality semiconductor materials, such as bismuth telluride (Bi2Te3) and its alloys. This material has good thermoelectric properties and can generate a significant temperature difference effect when energized, thereby achieving the cooling function. It should be noted that the cooling chip may include two opposite sides, namely a hot end and a cold end. The hot end generates a large amount of heat when energized, which needs to be dissipated promptly and effectively to ensure the cooling effect of the cold end.

[0061] The throttling device 4 can be, for example, a capillary tube, an electronic expansion valve, or other devices that can be used for throttling; there is no limitation in this regard. The first heat-conducting component 3 can be, for example, a heat-conducting aluminum box, or other heat-conducting components with sufficient thermal conductivity; there is no limitation in this regard.

[0062] The first heat-conducting element 3 includes a heat-conducting housing 31 and a heat-conducting refrigerant channel 201 located inside the heat-conducting housing 31. The heat-conducting housing 31 is disposed in close contact with the hot end of the semiconductor refrigeration element 1 to absorb heat from the hot end of the semiconductor refrigeration element 1. The refrigerant inlet of the heat-conducting refrigerant channel 201 is connected to the refrigerant outlet of the heat pipe radiator 2 through a throttling device 4, and the refrigerant outlet of the heat-conducting refrigerant channel 201 is connected to the refrigerant inlet of the heat pipe radiator 2, so that the heat absorbed by the first heat-conducting element 3 from the semiconductor refrigeration element 1 is dissipated through the heat pipe radiator 2.

[0063] The heat-conducting shell 31 of the first heat-conducting element 3 can be made of aluminum alloy, which is lightweight and has good thermal conductivity. The thickness of the heat-conducting shell 31 can be 3mm. It is tightly fitted to the hot end of the semiconductor cooling element 1, and the mating surface is finely machined to achieve a surface roughness of Ra0.8μm to ensure good heat conduction. Thermal grease can also be applied between the heat-conducting shell 31 and the hot end of the semiconductor cooling element 1 to further reduce thermal resistance and improve heat transfer efficiency.

[0064] The heat-conducting refrigerant channel 201 is located inside the heat-conducting shell 31. It can adopt a serpentine pipe design, and the inner diameter of the pipe can be 4mm. The refrigerant inlet and refrigerant outlet can be located on the same side of the heat-conducting shell 31 or on different sides of the heat-conducting shell 31, without limitation.

[0065] When the semiconductor cooling device 1 is energized, the cold end begins to cool, while the hot end generates heat. Since the heat-conducting housing 31 is in close contact with the hot end of the semiconductor cooling device 1, heat is rapidly transferred to the heat-conducting housing 31. The liquid refrigerant in the heat-conducting refrigerant channel 201 within the heat-conducting housing 31 absorbs heat and begins to vaporize, becoming gaseous refrigerant. Under the influence of the pressure difference, the gaseous refrigerant flows out from the refrigerant outlet and enters the heat pipe radiator 2.

[0066] In the heat pipe radiator 2, gaseous refrigerant enters through the evaporation section of the heat pipe. Under the action of the working fluid inside the heat pipe, heat is rapidly transferred to the condensation section. In the condensation section, the gaseous refrigerant releases heat and liquefies, forming a two-phase refrigerant. The two-phase refrigerant flows out from the refrigerant outlet of the heat pipe radiator 2 and passes through the throttling device 4. The throttling device 4 reduces the pressure of the refrigerant, increasing the amount of liquid refrigerant and creating a resistance difference that drives the refrigerant to continue circulating. After throttling, the refrigerant returns to the heat-conducting refrigerant channel 201 within the heat-conducting shell 31, beginning the next cycle of heat absorption and transfer. Through this split heat pipe effect, heat at the hot end of the semiconductor cooling component 1 can be quickly removed, avoiding heat concentration and effectively improving heat dissipation, thereby ensuring the cooling efficiency at the cold end.

[0067] It should be noted that the heat-conducting refrigerant channel 201 can be set as a unidirectional channel. During the process of the liquid refrigerant in the heat-conducting refrigerant channel 201 being heated into a gaseous state, it expands and can better drive the gaseous refrigerant to flow out from the refrigerant outlet, completing the heat dissipation cycle of the refrigerant and forming a heat pipe effect. Figure 2 and Figure 4 The arrows near the pipes indicate the direction of refrigerant flow.

[0068] In some embodiments, the semiconductor cooling device may include a first conduit 101 and a second conduit 102, wherein the first conduit 101 connects the refrigerant outlet of the heat-conducting refrigerant channel 201 to the refrigerant inlet of the heat pipe radiator 2, and the second conduit 102 connects the refrigerant inlet of the heat-conducting refrigerant channel 201 to the refrigerant outlet of the heat pipe radiator 2. The first conduit 101 may include a relatively large conduit, such as one with a diameter of D7. The second conduit 102 may include a capillary tube as a throttling device 4 to throttle the flow, thereby creating a certain resistance difference between the refrigerant inlet and the refrigerant outlet of the heat-conducting refrigerant channel 201. The heat pipe radiator 2 may be a tube-fin heat exchanger, which may be filled with a low-pressure refrigerant, such as R600a. When the thermoelectric cooler is energized, heat is generated at its hot end. The refrigerant inside the heat-conducting housing 31 (e.g., a hot-end aluminum box), being in close contact with the hot end of the thermoelectric cooler, is heated and condenses into a gaseous state. This gaseous refrigerant flows out from the refrigerant outlet, moves upwards to the tube-fin heat exchanger, and is cooled, forming a two-phase gas-liquid reflux. After passing through a capillary throttling tube, the liquid phase further increases, returning to the heat-conducting refrigerant channel 201 within the hot-end aluminum box. The hot-end aluminum box has a unidirectional channel; as the liquid refrigerant inside the box expands during heating to a gaseous state, it drives the gaseous refrigerant to flow out from the outlet pipe. This forms a cycle, creating a heat pipe effect. However, it is important to note that the amount of refrigerant should not be too small, otherwise the heat pipe effect will be unstable, and liquid reflux may not be possible. In this embodiment, the amount of refrigerant can be between 25g and 45g.

[0069] In this embodiment, the unique combination design of the first heat-conducting element 3, the heat pipe radiator 2, and the throttling device 4 forms a highly efficient split heat pipe effect, which can quickly and effectively dissipate the heat at the hot end of the semiconductor cooling element 1, effectively reduce the hot end temperature, and improve the cooling efficiency.

[0070] In addition, the improved stability of the refrigeration system enables more precise temperature control, which is of great significance for the storage of temperature-sensitive items, such as pharmaceuticals and biological products, and can better ensure the quality and performance of the items.

[0071] Furthermore, the entire semiconductor refrigeration equipment features a compact structural design with tight and rational connections between components. For example, the connection between the first heat-conducting component 3 and the semiconductor refrigeration component 1 and heat pipe radiator 2 can utilize interfaces with excellent sealing performance, reducing the risk of refrigerant leakage. Simultaneously, the absence of complex moving parts lowers the equipment's failure rate, improves its reliability and lifespan, reduces maintenance and repair costs, and enhances the user experience.

[0072] In one exemplary embodiment, a semiconductor cooling device and its control method are provided. (Reference) Figures 1 to 6 As shown, the semiconductor cooling device may include a heating element 5 and a sealing plate 6. The heating element 5 includes a heating cavity for placing an object to be heated. The heating element 5 may also include an insertion port 51 for the object to be heated, through which the object can be inserted into the heating cavity. The object to be heated may be, for example, a face mask, a glove, or other items, and is not limited thereto. For example, the heating cavity may be constructed in a flat rectangular shape for heating a face mask.

[0073] In this design, both the heating device 5 and the sealing plate 6 are located above the heat pipe radiator 2. The sealing plate 6 can be, for example, an aluminum plate, referred to as the rear aluminum plate. The sealing plate 6 is fixedly connected to the side plate 21 of the heat pipe radiator 2, so that the sealing plate 6, the heat pipe radiator 2, and the heating device 5 form a heat dissipation airflow channel 202 with the opening facing upwards. For example, the sealing plate 6 can be made of a 4mm thick aluminum plate, which is fixedly connected to the side plate 21 of the heat pipe radiator 2 by rivets to form a stable structural frame. When the heat pipe radiator 2 dissipates heat from the hot end of the semiconductor cooling element 1 upwards, a chimney effect is formed through the aforementioned heat dissipation airflow channel 202. The flow direction within the heat dissipation airflow channel 202 can be referenced. Figure 2 As indicated by the arrow above the heat pipe radiator 2.

[0074] In the aforementioned heat dissipation airflow channel 202, the distance 'a' between the sealing plate 6 and the heating device 5 can be greater than or equal to 6 mm and less than or equal to 15 mm, for example, 6 mm. Because the heat dissipation airflow channel 202 is relatively narrow, a slight fluid channel effect can be generated to enhance heat dissipation (when the heat pipe radiator 2 reaches a heat dissipation temperature of 54°C without the fan 11, a flow rate of approximately 0.4 m / s can be generated). In this embodiment, the hot air passing through the channel disperses upwards on one hand, and on the other hand, it can heat the object being heated in the heating chamber.

[0075] The heating device 5 may include a heating plate 52 and a heating compensator 53. The heating plate 52 is, for example, an aluminum plate, which may be referred to as the inner aluminum plate. The heating plate 52 forms the side plate of the heating chamber facing the sealing plate 6, such that the heating plate 52, the sealing plate 6, and the heat pipe radiator 2 form a heat dissipation airflow channel 202, and the heating compensator 53 is located on the side of the heating plate 52 facing the sealing plate 6, for heating the heating plate 52.

[0076] In this embodiment, the object to be heated in the heating chamber can be heated using the heat dissipation airflow channel 202, or it can be heated using the heating compensator 53 via the heating plate 52; neither is limited. However, when heating is required, if the ambient temperature of the environment where the semiconductor cooling device is located is detected to be higher than the set ambient temperature, it indicates that the ambient temperature is high enough and the heat dissipation temperature of the heat pipe radiator 2 may be relatively high. In this case, the heating compensator 53 of the heating device 5 can be controlled to be in the off state, and only the heat dissipation airflow channel 202 is used to heat the object. That is, the heat dissipation of the heat pipe radiator 2 is used to heat the object.

[0077] It should be noted that the above-mentioned ambient temperature setting can be adjusted according to actual conditions, and its specific value is not limited. The semiconductor refrigeration equipment can be equipped with a temperature sensor for detecting the ambient temperature. Alternatively, the semiconductor refrigeration equipment can also communicate with an ambient temperature detection device in the environment to obtain the ambient temperature; this is not limited.

[0078] When the ambient temperature is less than or equal to the set ambient temperature, the heating compensator 53 can be controlled to be in the open state. In this case, the heating compensator 53 and the heat pipe radiator 2 work together to heat the object being heated, thereby shortening the heating time. For example, by using the heating compensator 53 and the heat pipe radiator 2 to heat the face mask, the face mask can be heated to >30°C within 3 minutes. In addition, besides inserting the face mask into the heating chamber, the face mask can also be inserted into the heat dissipation airflow channel 202, thereby achieving simultaneous heating of two face masks. It should be noted that when the ambient temperature is relatively low, such as 16°C, the heat dissipation temperature of the heat pipe radiator 2 may be low, for example, only 35°C. At this time, the heat dissipation airflow channel 202 is less effective at heating the face mask. However, since the heating plate 52 and the heating compensator 53 are provided, the heating amount can be supplemented by the heating compensator 53, thereby achieving a better heating effect in a shorter time.

[0079] The heating compensator 53 can be made of electric heating wire, which is made of nickel-chromium alloy and has a power of 600W. The heating wire is evenly distributed on the side of the heating plate 52 facing the sealing plate 6 and is in close contact with the heating plate 52 to ensure that heat can be evenly transferred to the heating plate 52, thereby efficiently heating the items in the heating cavity.

[0080] The interval between the heating plate 52 and the sealing plate 6 can be greater than or equal to 6 mm and less than or equal to 15 mm, for example, 6 mm, thereby forming a narrower heat dissipation airflow channel 202, so that when the heat of the heat pipe radiator 2 is dissipated to the opening of the heat dissipation airflow channel 202, a chimney effect is formed in the heat dissipation airflow channel 202.

[0081] The heating device 5 may include a temperature detector 54 and a controller (not shown in the figure). The temperature detector 54 is disposed on the heating plate 52 and is used to detect the temperature of the heating plate 52. The controller is electrically connected to the temperature detector 54 and the heating compensator 53, respectively. The controller may be configured to control the operation of the heating compensator 53 based on the temperature detected by the temperature detector 54. That is, in this embodiment, the controller can obtain the temperature of the heating plate 52 from the temperature detector 54 (e.g., a temperature sensing bulb) and then control the operation of the heating compensator 53 based on the obtained temperature.

[0082] In this embodiment, the semiconductor cooling device may include a temperature sensor (not shown) for detecting ambient temperature, which may be electrically connected to the controller. When the object to be heated is placed in the heating chamber, the controller can obtain the ambient temperature of the environment in which the semiconductor cooling device is located through the temperature sensor, and then determine the magnitude of the ambient temperature compared with the set ambient temperature.

[0083] If the ambient temperature is higher than the set ambient temperature, the heating compensator 53 of the heating device 5 is in the off state. In this case, the semiconductor cooling device uses the heat dissipation airflow channel 202 to heat the object being heated, that is, it uses the heat dissipation of the heat pipe radiator 2 to heat the object being heated.

[0084] If the ambient temperature is less than or equal to the set ambient temperature, it indicates that the ambient temperature is too low, and the heat pipe radiator 2 alone cannot effectively heat the object being heated. In this case, the heating compensator 53 can be controlled to be in the open state, using both the heating compensator 53 and the heat pipe radiator 2 to heat the object. Furthermore, the controller can determine the initial heating duration of the heating compensator 53 of the heating device 5 based on the acquired ambient temperature.

[0085] The higher the ambient temperature, the shorter the initial heating time. For example, when the ambient temperature T ≤ 16℃, the initial heating time of the heating compensator 53 can be set to 6 minutes. When 16℃ < T ≤ 25℃, the initial heating time can be set to 3 minutes. When the ambient temperature T > 25℃, the initial heating time can be set to 2 minutes.

[0086] When the heating compensator 53 is in the open state, the controller can obtain the temperature of the heating plate 52 from the temperature detector 54. After the heating compensator 53 has completed the initial heating time, the controller can control the operation of the heating compensator 53 based on the temperature of the heating plate 52 (i.e., the temperature obtained from the temperature detector 54) to better achieve the heating of the object being heated.

[0087] If the temperature of the heating plate 52 is greater than the first temperature threshold, it indicates that the temperature of the heating plate 52 is too high, and the heating compensator 53 can be controlled to stop heating to avoid overheating of the object being heated. If the temperature of the heating plate 52 is less than or equal to the first temperature threshold, it indicates that the temperature of the object being heated is still too low and further heating is required, and the heating compensator 53 can be controlled to continue heating until the temperature of the heating plate 52 is greater than or equal to the second temperature threshold. The second temperature threshold is greater than or equal to the first temperature threshold.

[0088] It should be noted that the first and second temperature thresholds can be set according to actual needs, and their specific values ​​are not limited.

[0089] In some embodiments, the first temperature threshold can be 35°C, the second temperature threshold can be 45°C, and the object being heated can be a face mask. In this embodiment, after the heating compensator 53 completes the initial heating time, if the temperature of the heating plate 52 is still below 35°C, it indicates that the temperature of the face mask is still low, and the actual heating temperature of the face mask may only be 25°C. In this case, the heating time of the heating compensator 53 can be extended, for example, by extending the set heating time (e.g., 8 minutes or 10 minutes, the specific data is not limited). After completing the set heating time, the temperature of the heating plate 52 can be further judged. If the temperature of the heating plate 52 is still below 35°C, the set time can be extended further. During the extended heating process, if the temperature of the heating plate 52 exceeds 45°C, heating is immediately stopped, that is, the heating compensator 53 is turned off.

[0090] It should be noted that in this embodiment, when the ambient temperature is high, heating by the heating compensator 53 is generally unnecessary, and the heat pipe radiator 2 can be used directly to heat the object. However, when the original temperature of the object is low, for example, when the object is stored in a semiconductor refrigeration device and its temperature has dropped to 2°C to 4°C when it is taken out, the short-term heating effect is insufficient, and the heating compensator 53 needs to be used.

[0091] In addition, in this embodiment, the heating device 5 may include a placement detector 55 for the object to be heated, which is configured to generate a signal indicating that the object to be heated is placed in the heating cavity after the object to be heated is placed into the heating cavity.

[0092] The detector 55 includes a photoelectric sensor switch and / or a photoelectric sensor. The photoelectric sensor switch operates on the principle of having a recessed slot with a small light-emitting window and a light-receiving window. When an object is inserted into this recessed slot, different relative photocurrents and corresponding voltages are obtained. The photoelectric sensor switch can detect the insertion of an object by observing voltage changes, thus accurately identifying it. A signal is then sent to the heating compensator 53. The controller can only turn the heating compensator 53 on or off upon receiving the aforementioned signal. Alternatively, the signal can also be sent to the controller, which, upon receiving the signal, can control the operation of the heating compensator 53.

[0093] For example, if a photoelectric sensor switch is used for detection, such as a reflective photoelectric sensor switch, its emitting end continuously emits light. When the object to be heated has not entered the heating chamber, the receiving end can receive the reflected light, and the device is in a standby detection state. Once the object to be heated is inserted into the heating chamber, the light is blocked, the receiving end cannot receive the light, and the photoelectric switch immediately outputs a signal change. This signal serves as a signal indicating that the object to be heated is placed in the heating chamber.

[0094] For example, if a photoelectric sensor is used for detection, such as a through-beam photoelectric sensor, there is originally light transmission between its transmitter and receiver. When the object to be heated enters the heating chamber and blocks the light, the photoelectric sensor generates a signal change, which serves as a signal indicating that the object to be heated is placed in the heating chamber.

[0095] In this embodiment, the controller can obtain the ambient temperature of the environment in which the semiconductor cooling device is located only after detecting that the object to be heated is placed in the heating cavity of the heating device 5, and then perform subsequent heating control to improve the reliability of heating control.

[0096] This embodiment integrates components such as the heating device 5, the semiconductor cooling component 1, and the heat pipe radiator 2 to achieve integrated cooling, heating, and efficient heat dissipation functions. A single device can meet the needs of various scenarios, reducing equipment purchase costs and space requirements.

[0097] Furthermore, the intelligent heating compensator 53 control strategy based on ambient temperature and the temperature of the heating plate 52 in this embodiment can precisely adjust the heating power and time according to different environmental conditions and the heating requirements of the heated object. This ensures that the heated object quickly reaches the appropriate temperature while avoiding energy waste and damage caused by overheating. Moreover, the unique heat dissipation airflow channel 202 design and the efficient heat dissipation performance of the heat pipe radiator 2 of this semiconductor refrigeration device better ensure the stable operation of the equipment. For example, the hot end temperature of the semiconductor refrigeration component 1 can be effectively controlled at a low level, ensuring the cooling effect of the cold end; while the temperature inside the heating device 5 will not be too high, avoiding safety hazards and improving heating efficiency. In other words, whether for cooling or heating, this semiconductor refrigeration device can achieve relatively precise temperature control, which can well meet the needs of refrigeration and heating.

[0098] In one exemplary embodiment, a semiconductor cooling device and its control method are provided. (Reference) Figures 1 to 7 As shown, the semiconductor cooling device may include a cooling conductor 7 (e.g., a cooling aluminum block) and a cooling plate 8 (e.g., an aluminum plate). The cooling conductor 7 is located between the cooling plate 8 and the semiconductor cooling device 1, and one side of the cooling conductor 7 is in close contact with the cooling plate 8, while the other side of the cooling conductor 7 is in close contact with the semiconductor cooling device 1. The cooling plate 8 is used to cool the compartment of the semiconductor cooling device.

[0099] The semiconductor refrigeration equipment includes an insulation layer 9, located on the first side of the cooling plate 8, which is the side of the cooling plate 8 facing away from the compartment of the semiconductor refrigeration equipment. The heat-conducting component 7 is located within the insulation layer 9. The insulation layer 9 is made of polyurethane foam material with a thermal conductivity as low as 0.02 W / (m·K), providing excellent thermal insulation performance. By enclosing the heat-conducting component 7 within the insulation layer 9 on the side of the cooling plate 8 facing away from the compartment of the semiconductor refrigeration equipment, the insulation layer 9 effectively reduces the loss of cold energy to the outside, improves the refrigeration efficiency of the equipment, and reduces energy consumption.

[0100] The semiconductor cooling device includes a rear baffle 10 and a fan 11. The rear baffle 10 is spaced apart from the cooling plate 8 to form a cooling airflow channel 203. Gaps may exist between the rear baffle and the chamber walls of the semiconductor cooling device, allowing the cooling airflow channel 203 to communicate with the chamber. The fan 11 is located within the cooling airflow channel 203 to drive the flow of gas within it, thereby uniformly cooling the chamber of the semiconductor cooling device. It should be noted that the fan 11 can be fixed to the rear baffle 10 via a bracket, or to other structures of the semiconductor cooling device; this is not limited. Figure 1 The arrows in the diagram indicate the direction of gas flow.

[0101] The cooling airflow channel 203 is provided with a drain hole 12 and a water collection box 13 at its bottom. The drain hole 12 is used to discharge the condensate generated in the cooling airflow channel 203 to the water collection box 13 to avoid the accumulation of condensate.

[0102] The semiconductor cooling device includes a second heat-conducting element 15, one end of which is connected to the first heat-conducting element 3, and the other end of which is connected to a water collection box 13. The second heat-conducting element 15 absorbs heat from the first heat-conducting element 3 to evaporate condensate in the water collection box 13.

[0103] The water receiving box 13 contains absorbent cotton 14, which is positioned at the drain hole 12 to better absorb condensation formed within the cooling airflow channel 203. For example, the absorbent cotton 14 may be made of polyester fiber, which has excellent absorbency. One end of the absorbent cotton 14 contacts the drain hole 12, while the other end is immersed in a small amount of water within the water receiving box 13 to further absorb condensation. When condensation flows from the drain hole 12, the absorbent cotton 14 quickly absorbs and diffuses it into the water receiving box 13, preventing condensation from accumulating and clogging the drain hole 12.

[0104] It should be noted that condensation may occur when the semiconductor refrigeration equipment leaks cold or the compartment is left open for an extended period. This condensation can flow along the cooling plate 8 and accumulate at the bottom of the cooling airflow channel 203. A drain hole 12 at the bottom effectively drains the condensation. Furthermore, since the drain hole 12 is equipped with absorbent cotton 14, the absorbent cotton effectively guides the water into the water collection box 13. The condensation is then evaporated by the heat absorbed from the first heat conductor 3 by the second heat conductor 15. The second heat conductor 15 can be, for example, a heat-dissipating aluminum plate, and the first heat conductor 3 can be, for example, a hot-end aluminum box. The heat-dissipating aluminum plate and the hot-end aluminum box are connected, and under the effect of heat conduction (approximately 45°C to 55°C), the condensation in the water collection box 13 can be effectively evaporated.

[0105] In this type of semiconductor cooling device, when the device comprises two or more compartments, the cooling plate 8 has folded edges between adjacent compartments to facilitate the formation of a complete cooling plate 8. Condensate can flow along these folded edges along the cooling plate 8. This design allows the cooling plate 8 to better cover each compartment, ensuring uniform distribution of cooling capacity, while the condensate can flow along the folded edges along the cooling plate 8 to the bottom of the cooling airflow channel 203.

[0106] In this embodiment, through the synergistic effect of the cooling conductor 7, the cooling plate 8, and the fan 11, the semiconductor refrigeration equipment can achieve efficient cooling and uniform temperature distribution. In different application scenarios, such as commercial refrigerated display cases or multi-purpose food storage boxes, the temperature difference between different parts of the compartment can be controlled within a small range, ensuring the consistency of the quality of refrigerated items.

[0107] Furthermore, the combined design of the drain hole 12, absorbent cotton 14, water collection box 13, and second heat-conducting component 15 effectively solves the problem of condensation handling during the use of semiconductor refrigeration equipment. In high-humidity environments or when doors are frequently opened, condensation can be drained and evaporated in a timely manner, preventing water accumulation and the formation of a damp environment inside the equipment. This not only protects the electrical and structural components of the equipment from water damage but also reduces the possibility of bacterial and mold growth, improving the hygiene, safety, and reliability of the equipment and extending its service life.

[0108] Furthermore, the use of insulation layer 9 significantly reduces heat loss and lowers the energy consumption of semiconductor refrigeration equipment. During long-term operation, it can save a substantial amount of electricity, meeting modern energy-saving and environmental protection requirements.

[0109] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0110] It should be noted that the terms "one implementation," "embodiment," "exemplary embodiment," and "some embodiments" used in the specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0111] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0112] The above embodiments are merely preferred embodiments provided to fully illustrate this application, and the scope of protection of this application is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on this application are all within the scope of protection of this application.

Claims

1. A semiconductor cooling device, characterized in that, The semiconductor refrigeration device includes a semiconductor refrigeration component, a heat pipe radiator, a first heat-conducting component, and a throttling device. The first heat-conducting component includes a heat-conducting shell and a heat-conducting refrigerant channel located inside the heat-conducting shell. The heat-conducting shell is closely attached to the hot end of the semiconductor refrigeration component. The refrigerant inlet of the heat-conducting refrigerant channel is connected to the refrigerant outlet of the heat pipe radiator through the throttling device, and the refrigerant outlet of the heat-conducting refrigerant channel is connected to the refrigerant inlet of the heat pipe radiator, so as to dissipate the heat absorbed by the first heat-conducting component from the semiconductor refrigeration component through the heat pipe radiator.

2. The semiconductor cooling device according to claim 1, characterized in that, The semiconductor refrigeration device includes a heating device and a sealing plate. The heating device includes a heating chamber for placing the object to be heated. The heating device and the sealing plate are both located above the heat pipe radiator. The sealing plate is fixedly connected to the side plate of the heat pipe radiator, so that the sealing plate, the heat pipe radiator and the heating device form a heat dissipation airflow channel with the opening facing.

3. The semiconductor cooling device according to claim 2, characterized in that, The heating device includes a heating plate and a heating compensator. The heating plate forms the side plate of the heating cavity facing the sealing plate, such that the heating plate, the sealing plate, and the heat pipe radiator form the heat dissipation airflow channel. The heating compensator is located on the side of the heating plate facing the sealing plate and is used to heat the heating plate.

4. The semiconductor cooling device according to claim 3, characterized in that, The interval between the heating plate and the sealing plate is greater than or equal to 6 mm and less than or equal to 15 mm, so that when the heat from the heat pipe radiator is dissipated to the opening of the heat dissipation airflow channel, a chimney effect is formed in the heat dissipation airflow channel.

5. The semiconductor cooling device according to claim 3, characterized in that, The heating device includes a temperature detector and a controller. The temperature detector is disposed on the heating plate and is used to detect the temperature of the heating plate. The controller is electrically connected to the temperature detector and the heating compensator respectively, and the controller is configured to control the operation of the heating compensator based on the temperature detected by the temperature detector.

6. The semiconductor cooling device according to claim 2, characterized in that, The heating device includes a placement detector for the object to be heated, the placement detector being configured to generate a signal characterizing that the object to be heated is placed in the heating cavity after the object to be heated is placed into the heating cavity.

7. The semiconductor cooling device according to claim 6, characterized in that, The placement detector includes a photoelectric sensor switch and / or a photoelectric sensor.

8. The semiconductor cooling device according to claim 2, characterized in that, The heating chamber is a flat rectangular shape and is used to heat the face mask.

9. The semiconductor cooling device according to any one of claims 1-8, characterized in that, The semiconductor refrigeration device includes a cooling conductor and a cooling plate. The cooling plate is used to cool the compartment of the semiconductor refrigeration device. The cooling conductor is located between the cooling plate and the semiconductor refrigeration device, with one side of the cooling conductor in close contact with the cooling plate and the other side of the cooling conductor in close contact with the semiconductor refrigeration device.

10. The semiconductor cooling device according to claim 9, characterized in that, The semiconductor refrigeration device includes an insulation layer located on a first side of the cooling plate, the first side being the side of the cooling plate away from the compartment of the semiconductor refrigeration device, and the cooling conductive element being located within the insulation layer.

11. The semiconductor cooling device according to claim 9, characterized in that, The semiconductor cooling device includes a rear baffle and a fan. The rear baffle and the cooling plate are spaced apart to form a cooling airflow channel. The cooling airflow channel is connected to the chamber of the semiconductor cooling device, and the fan is located inside the cooling airflow channel to drive the flow of gas in the cooling airflow channel.

12. The semiconductor cooling device according to claim 11, characterized in that, The bottom of the cooling airflow channel is provided with a drain hole and a water collection box. The drain hole is used to discharge the condensate generated in the cooling airflow channel to the water collection box.

13. The semiconductor cooling device according to claim 12, characterized in that, The semiconductor cooling device includes a second heat-conducting element, one end of which is connected to the first heat-conducting element, and the other end of which is connected to the water receiving box. The second heat-conducting element absorbs heat from the first heat-conducting element to evaporate the condensate in the water collection box.

14. The semiconductor cooling device according to claim 13, characterized in that, The water receiving box is equipped with absorbent cotton, which is positioned at the location of the drain hole.

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