Dry fluid spray pipe for wafer cleaning

Abstract

The utility model relates to a dry fluid spray pipe for wafer cleaning, and belongs to the technical field of wafer production equipment. The dry fluid spraying pipe for wafer cleaning is composed of the inner pipe and the outer pipe, dry fluid enters the inner pipe firstly and is sprayed out from the second spraying opening in the inner pipe, due to the fact that the second spraying opening and the first spraying opening are opposite in direction, rectification is conducted in the space between the inner pipe and the outer pipe, then the dry fluid is sprayed out from the first spraying opening in the outer pipe, and spraying of the dry fluid is more stable. Due to the arrangement of the supporting rings, when the whole pipeline is long, it can be guaranteed that the cross section of the space between the inner pipe and the outer pipe is not changed.

Description

Technical Field

[0001] This application belongs to the field of wafer manufacturing equipment technology, and in particular relates to a drying fluid nozzle for wafer cleaning. Background Technology

[0002] During the production process, wafers need to undergo multiple cleaning and drying processes, both of which require the introduction of fluids (liquid or gas) into the tank.

[0003] For example, Chinese utility model patent document CN217334021U discloses a drying device with a wafer drying oscillation mechanism. It includes a drying chamber, a cover covering the upper part of the drying chamber, an oscillation structure disposed inside the drying chamber, and a driving device for driving the oscillation structure. An isopropanol injection pipe is provided on one side of the bottom of the drying chamber for injecting isopropanol liquid into the drying chamber, and an isopropanol discharge pipe is provided at the bottom of the drying chamber for discharging the isopropanol liquid from the drying chamber. A nitrogen injection pipe for injecting heated nitrogen gas into the drying chamber is located near the upper end of the drying chamber, and a nitrogen discharge pipe is located near the upper side wall of the drying chamber. An overflow trough is provided near the upper edge of the drying chamber, and an overflow discharge pipe is provided at the bottom of the overflow trough for discharging the overflow liquid from the overflow trough. This utility model uses the oscillation mechanism to disrupt the surface tension between water molecules on the wafer surface and the high aspect ratio voids, thereby continuously precipitating moisture from the vacant areas and improving the drying effect. However, in this patent document, the drying fluid inlet pipe, i.e. the isopropanol outlet pipe, is directly discharged into the tank, which leads to a relatively chaotic gas in the tank, which is not conducive to the efficient drying of the wafer. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a wafer cleaning dry fluid nozzle that rectifyes the dry fluid and ensures that the cross-section of the space between the inner and outer tubes remains unchanged, in order to overcome the shortcomings of the prior art.

[0005] The technical solution adopted by this utility model to solve its technical problem is:

[0006] A drying fluid nozzle for wafer cleaning, comprising:

[0007] The outer tube has rows of first nozzles.

[0008] The inner tube has rows of second nozzles, and the direction of the first nozzles is opposite to that of the second nozzles.

[0009] A support ring is disposed between the outer tube and the inner tube. The width of the support ring is less than the distance between two adjacent second nozzles, and the support ring is disposed between two adjacent second nozzles.

[0010] An end plug is used to seal one end of an outer tube and an inner tube, including a first inner cylinder and a first end plug, wherein one end of the inner tube extends into the first inner cylinder and the outer tube is sleeved on the outer wall of the first inner cylinder;

[0011] A connector, located at the other end of the outer tube and the inner tube, is used to connect with other liquid supply pipelines. It includes a second inner cylinder and a second end, with the other end of the inner tube extending into the second inner cylinder and the outer tube sleeved on the outer wall of the second inner cylinder.

[0012] Preferably, in the wafer cleaning drying fluid nozzle of this invention, the surface of the support ring has several protrusions, and channels are formed between the protrusions to allow the drying fluid to flow.

[0013] Preferably, in the wafer cleaning drying fluid nozzle of this invention, the first inner cylinder and the outer wall of the inner tube are bonded together, as are the outer tube and the outer wall of the first inner cylinder.

[0014] Preferably, the drying fluid nozzle for wafer cleaning of this utility model further includes a fixing pin, which passes through the outer tube and the first inner tube and extends into the inner tube.

[0015] Preferably, in the wafer cleaning dry fluid nozzle of this invention, the first nozzle is located between two adjacent second nozzles, and the second nozzle is located between two adjacent first nozzles.

[0016] Preferably, in the wafer cleaning drying fluid nozzle of this invention, both the first end and the second end have sidewalls, and the sidewalls abut against the outer tube.

[0017] The beneficial effects of this utility model are:

[0018] This invention relates to a drying fluid nozzle for wafer cleaning, comprising an inner tube and an outer tube. The drying fluid first enters the inner tube and is ejected from a second nozzle on the inner tube. Because the second nozzle and the first nozzle face opposite directions (forming a 180° angle), the fluid is rectified in the space between the inner and outer tubes before being ejected from the first nozzle on the outer tube, resulting in a more stable ejection of the drying fluid. The support ring design ensures that the cross-sectional area of ​​the space between the inner and outer tubes remains unchanged even when the overall pipe length is long. Attached Figure Description

[0019] The technical solution of this application will be further described below with reference to the accompanying drawings and embodiments.

[0020] Figure 1 This is a schematic diagram of the structure of a drying fluid nozzle for wafer cleaning according to an embodiment of this application;

[0021] Figure 2 This is a longitudinal sectional view of a drying fluid nozzle for wafer cleaning according to an embodiment of this application;

[0022] Figure 3 This is a schematic diagram of the structure behind the hidden outer tube of the drying fluid nozzle for wafer cleaning according to an embodiment of this application;

[0023] Figure 4 This is a schematic diagram of the end plug of the drying fluid nozzle for wafer cleaning according to an embodiment of this application;

[0024] The attached figures are labeled as follows:

[0025] 1. Outer tube;

[0026] 2. Inner tube;

[0027] 3. Support ring;

[0028] 4. End plug;

[0029] 5 connectors;

[0030] 11 First nozzle;

[0031] 12 Second nozzle;

[0032] 21 Second nozzle;

[0033] 41. First inner cylinder;

[0034] 42 First end;

[0035] 43. Fixing pin;

[0036] 51. Second inner cylinder;

[0037] 52. Second end. Detailed Implementation

[0038] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0039] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the scope of protection of this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0040] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0041] The technical solution of this application will now be described in detail with reference to the accompanying drawings and embodiments.

[0042] Example

[0043] This embodiment provides a drying fluid nozzle for wafer cleaning, such as... Figure 1 As shown, it includes:

[0044] Outer tube 1, wherein a row of first nozzles 11 are provided on the outer tube 1;

[0045] The inner tube 2 has a row of second nozzles 12, and the direction of the first nozzle 11 is opposite to the direction of the second nozzle 12.

[0046] A support ring 3 is disposed between the outer tube 1 and the inner tube 2. The width of the support ring 3 is less than the distance between two adjacent second nozzles 12, and the support ring 3 is disposed between two adjacent second nozzles 12.

[0047] End plug 4 is used to seal one end of outer tube 1 and inner tube 2, including first inner cylinder 41 and first end 42, one end of inner tube 2 extends into first inner cylinder 41, and outer tube 1 is sleeved on the outer wall of first inner cylinder 41;

[0048] Connector 5, located at the other end of outer tube 1 and inner tube 2, is used to connect with other liquid supply pipelines. It includes a second inner cylinder 51 and a second end 52. The other end of the inner tube 2 extends into the second inner cylinder 51, and the outer tube 1 is sleeved on the outer wall of the second inner cylinder 51.

[0049] The wafer cleaning drying fluid nozzle of this embodiment consists of an inner tube 2 and an outer tube 1. The drying fluid first enters the inner tube 2 and is ejected from the second nozzle 21 on the inner tube 2. Since the second nozzle 21 and the first nozzle 11 are oriented oppositely (forming a 180° angle), the fluid is rectified in the space between the inner tube 2 and the outer tube 1 before being ejected from the first nozzle 11 on the outer tube 1, making the ejection of the drying fluid more stable. The support ring 3 ensures that the cross-section of the space between the inner tube 2 and the outer tube 1 remains unchanged even when the overall pipe length is long.

[0050] Furthermore, the surface of the support ring 3 has several protrusions, and channels are formed between the protrusions to allow the drying fluid to flow.

[0051] Furthermore, the first inner cylinder 41 is bonded to the outer wall of the inner tube 2, and the outer tube 1 is bonded to the outer wall of the first inner cylinder 41.

[0052] Furthermore, it also includes a fixing pin 43, which passes through the outer tube 1 and the first inner cylinder 41 and extends into the inner tube 2.

[0053] Furthermore, the first nozzle 11 is located between two adjacent second nozzles 12, and the second nozzle 12 is located between two adjacent first nozzles 11. This excludes the first nozzles 11 and second nozzles 12 at both ends.

[0054] Furthermore, both the first end 42 and the second end 52 have sidewalls that abut against the outer tube 1.

[0055] The drying fluid is isopropyl glycol (IPA) gas mixed with nitrogen.

[0056] The drying fluid nozzle for wafer cleaning is installed inside the cleaning tank, specifically at the bottom of the cleaning tank, and is used to supply liquid into the cleaning tank.

[0057] The drying fluid nozzle for wafer cleaning is used to pass a mixture of IPA (isopropanol) and nitrogen gas.

[0058] Based on the above-described preferred embodiments according to this application, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this application. The technical scope of this application is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A drying fluid nozzle for wafer cleaning, characterized in that, include: The outer tube (1) has rows of first nozzles (11) on it. The inner tube (2) is provided with a row of second nozzles (12), and the direction of the first nozzle (11) is opposite to the direction of the second nozzle (12); A support ring (3) is disposed between the outer tube (1) and the inner tube (2). The width of the support ring (3) is less than the distance between two adjacent second nozzles (12), and the support ring (3) is disposed between two adjacent second nozzles (12). End plug (4) is used to seal one end of the outer tube (1) and the inner tube (2), including a first inner cylinder (41) and a first end (42). One end of the inner tube (2) extends into the first inner cylinder (41), and the outer tube (1) is sleeved on the outer wall of the first inner cylinder (41). The connector (5), located at the other end of the outer tube (1) and the inner tube (2), is used to connect with other liquid supply pipes. It includes a second inner cylinder (51) and a second end (52). The other end of the inner tube (2) extends into the second inner cylinder (51), and the outer tube (1) is sleeved on the outer wall of the second inner cylinder (51).

2. The drying fluid nozzle for wafer cleaning according to claim 1, characterized in that, The surface of the support ring (3) has several protrusions, and channels are formed between the protrusions to allow the drying fluid to flow.

3. The drying fluid nozzle for wafer cleaning according to claim 1, characterized in that, The first inner cylinder (41) is bonded to the outer wall of the inner tube (2), and the outer tube (1) is bonded to the outer wall of the first inner cylinder (41).

4. The drying fluid nozzle for wafer cleaning according to claim 1, characterized in that, It also includes a fixing pin (43), which passes through the outer tube (1) and the first inner tube (41) and extends into the inner tube (2).

5. The drying fluid nozzle for wafer cleaning according to claim 1, characterized in that, The first nozzle (11) is located between two adjacent second nozzles (12), and the second nozzle (12) is located between two adjacent first nozzles (11).

6. The drying fluid nozzle for wafer cleaning according to claim 1, characterized in that, The first end (42) and the second end (52) both have sidewalls that abut against the outer tube (1).

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