Circuit board segmentation quality detection device
By combining a base, a conveying and positioning mechanism, and a bidirectional imaging detection unit, the problem of low efficiency and poor accuracy in circuit board segmentation quality inspection is solved, achieving efficient and accurate automated inspection, adapting to the inspection needs of circuit boards of different specifications, and reducing production costs.
Patent Information
- Application Number
- CN202521824375.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-27
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2035-08-27
AI Technical Summary
Existing methods for inspecting the quality of circuit board segmentation are inefficient and inaccurate. Manual inspection is difficult to meet the needs of large-scale production and is prone to missed or false detections, making it impossible to accurately detect minute defects.
The device employs a combination of a base, a conveying and positioning mechanism, an upper imaging and detection unit, and a lower imaging and detection unit to achieve automated, all-around image acquisition of circuit boards. Combined with a carrier positioning unit and a spacing adjustment mechanism, it ensures the accuracy and versatility of the detection.
It improves the efficiency and accuracy of circuit board segmentation quality inspection, enabling comprehensive detection of various defects in circuit boards, reducing production costs, and ensuring product quality stability.
Smart Images
Figure CN223551076U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of circuit board quality inspection technology, specifically to a circuit board segmentation quality inspection device. Background Technology
[0002] In the electronics manufacturing industry, circuit boards (also known as PCBs, printed circuit boards, etc.) are a key component of electronic products. As electronic products continue to develop towards miniaturization and high performance, the design and manufacturing processes of circuit boards are becoming increasingly complex. During the production process, circuit boards that meet specific shape requirements are usually separated from large-size circuit boards through a cutting process. For example, a large circuit board is fixed on a carrier, and then a small circuit board of a specific shape is laser-cut out.
[0003] However, the quality of circuit board cutting has a crucial impact on the performance and reliability of subsequent electronic products. Defects such as cutting deviations, excessively large or small gaps, or notches during the cutting process can lead to open circuits, short circuits, and other problems during subsequent assembly and use, severely affecting the quality and lifespan of electronic products. Therefore, circuit boards require quality inspection after being cut.
[0004] Currently, the main problems with circuit board (PCB) dicing quality inspection methods are as follows: Most factories use manual sampling inspection, relying on workers' experience and visual observation, or using simple tools such as calipers and magnifying glasses. However, manual inspection has many drawbacks. On the one hand, manual inspection is inefficient and cannot meet the needs of large-scale production. As the scale of PCB production continues to expand, manual inspection requires a large investment of manpower and time, and the inspection speed cannot keep up with the production speed. On the other hand, manual inspection is greatly affected by the subjective factors of workers, such as eye fatigue and inconsistent judgment standards, which easily leads to missed or incorrect inspections, causing some defective PCBs to enter the next process, increasing the product defect rate and production costs. In addition, manual inspection cannot achieve comprehensive and accurate inspection of PCB dicing quality, and it is difficult to detect some minor defects, thus failing to guarantee the stability of product quality.
[0005] Therefore, developing an efficient, accurate, and automated circuit board segmentation quality inspection device has become an urgent problem to be solved in the electronics manufacturing industry. Utility Model Content
[0006] The purpose of this application is to provide a circuit board segmentation quality inspection device to solve the problems of low efficiency and poor accuracy of existing circuit board segmentation quality inspection methods, so as to achieve efficient, accurate and automated inspection of circuit board segmentation quality, improve product quality and reduce production costs.
[0007] The technical solution adopted in this application is as follows:
[0008] A circuit board segmentation quality inspection device includes a base and a conveying and positioning mechanism, an upper imaging detection unit, and a lower imaging detection unit respectively mounted on the base. The conveying and positioning mechanism is used to convey a carrier carrying circuit boards and to position the carrier. The conveying and positioning mechanism includes: a fixed crossbeam and a movable crossbeam arranged in parallel; synchronous conveyor belt assemblies respectively disposed on opposite sides of the fixed crossbeam and the movable crossbeam for carrying and conveying the carrier; and a spacing adjustment mechanism for driving the movable crossbeam closer to or away from the fixed crossbeam. The upper imaging detection unit is located above the conveying and positioning mechanism with its imaging direction facing downwards, and is used to acquire circuit board images. The lower imaging detection unit is located below the conveying and positioning mechanism with its imaging direction facing upwards, and is used to acquire circuit board images.
[0009] Preferably, the conveying positioning mechanism further includes a carrier positioning unit, which includes: a stop portion installed on the fixed crossbeam; and a composite positioning mechanism installed on the fixed crossbeam, the composite positioning mechanism including a transverse drive member and a vertical drive member installed at the end of the transverse drive member. The composite positioning mechanism has a clearance position and a clamping position: in the clearance position, the vertical drive member descends below the conveyor belt; in the clamping position, the vertical drive member extends above the conveyor belt and the transverse drive member drives the vertical drive member to push the carrier against the stop portion, thereby clamping and positioning the carrier at the inspection station.
[0010] Preferably, the vertical drive component is a vertical telescopic cylinder, the horizontal drive component is a first horizontal telescopic cylinder, and the stop portion is a second horizontal telescopic cylinder.
[0011] Preferably, the spacing adjustment mechanism includes: a spacing adjustment drive motor; a lead screw and nut mechanism driven by the spacing adjustment drive motor, wherein the movable crossbeam is mounted on the nut of the lead screw and nut mechanism.
[0012] Preferably, the conveying and positioning mechanism further includes a support structure fixed to the base. The support structure includes two support plates, the lead screw of the lead screw and nut mechanism is rotatably mounted on the two support plates, the fixed crossbar is fixedly installed on one support plate, and the spacing adjustment drive motor is fixed on the other support plate.
[0013] Preferably, the synchronous conveyor belt assembly includes a conveyor belt, a drive wheel, a driven wheel, and a conveyor drive motor. The conveyor belt is tensioned on the drive wheel and the driven wheel, and the conveyor drive motor is connected to the drive wheel.
[0014] Preferably, both the upper shooting detection unit and the lower shooting detection unit include: a two-dimensional moving platform, including an X-axis moving module and a Y-axis moving module arranged perpendicularly to each other; a mounting base installed at the end of the Y-axis moving module; an industrial camera and a ring light source, both mounted on the mounting base, with the central through hole of the ring light source aligned with the lens of the industrial camera.
[0015] Preferably, the ring light source is connected to the mounting base via a first height-adjustable structure, the first height-adjustable structure comprising: a guide member disposed on the ring light source; a guide hole and a locking member disposed on the mounting base, the guide member being slidably disposed within the guide hole and the height being fixed by the locking member.
[0016] Preferably, the industrial camera is connected to the mounting base via a second height adjustment structure, the second height adjustment structure comprising: a vertical slide groove disposed on the mounting base; and a fastener passing through the vertical slide groove. The industrial camera is connected to the fastener, and when the fastener is loosened from the industrial camera, the fastener can move up and down along the slide groove and re-fix the industrial camera.
[0017] Preferably, the base includes: a base; a frame structure fixed to the base, the frame structure including a lower frame and an upper frame, the lower frame and the upper frame being connected by columns, crossbeams and longitudinal beams, the conveying and positioning mechanism being installed on the lower frame, the upper shooting and detection unit being installed on the upper frame, and the lower shooting and detection unit being installed on the base.
[0018] The above technical solutions can achieve at least the following technical effects:
[0019] 1. By setting a base as the overall support structure, the conveying and positioning mechanism can stably convey and position the carrier carrying the circuit board, ensuring the positional accuracy of the circuit board during the inspection process; the upper and lower imaging detection units respectively acquire images of the circuit board from above and below, realizing all-round image acquisition of the circuit board, providing a data basis for subsequent accurate inspection of the circuit board segmentation quality, effectively detecting various defects at the circuit board segmentation, and improving the accuracy and comprehensiveness of the inspection.
[0020] 2. The stop part and the composite positioning mechanism of the carrier positioning unit cooperate with each other. When avoiding the obstacle, it does not affect the carrier transportation. When clamping, it can accurately clamp and position the carrier at the inspection station, which further improves the accuracy and reliability of carrier positioning. This ensures the stability of the circuit board image acquired by the imaging and inspection unit, improves the accuracy of segmentation quality inspection, and avoids inspection errors caused by carrier position deviation.
[0021] 3. The spacing adjustment mechanism adopts a spacing adjustment drive motor and a lead screw and nut mechanism, which can accurately adjust the spacing between the fixed crossbeam and the movable crossbeam to adapt to the inspection requirements of different sized carriers and circuit boards, improve the versatility of the inspection device, and meet the requirements of the segmentation quality inspection of circuit boards of different specifications in various production scenarios.
[0022] 4. The two-dimensional moving platform of the upper and lower imaging detection units enables the industrial camera and the ring light source to move in the X and Y axes, facilitating the adjustment of the shooting position and angle to meet the inspection needs of circuit board segmentation areas with different positions and shapes; the ring light source provides uniform illumination for the industrial camera, making the captured circuit board images clearer and improving the accuracy and reliability of the inspection.
[0023] 5. The base frame structure is reasonably designed. The lower frame is used to install the conveying and positioning mechanism, the upper frame is used to install the upper imaging and detection unit, and the base is used to install the lower imaging and detection unit. This layered structure makes the entire detection device compact and reasonably laid out, and each component is installed firmly, which is convenient for operation and maintenance, and improves the overall stability and reliability of the detection device. Attached Figure Description
[0024] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:
[0025] Figure 1 This is a schematic diagram of the circuit board dicing quality inspection device provided in the embodiments of this application. Figure 1 ;
[0026] Figure 2 This is a schematic diagram of the circuit board dicing quality inspection device provided in the embodiments of this application. Figure 2 This is the state after the base is hidden;
[0027] Figure 3 This is a schematic diagram of the structure of the conveying and positioning mechanism provided in the embodiments of this application. Figure 1 ;
[0028] Figure 4 This is a schematic diagram of the structure of the conveying and positioning mechanism provided in the embodiments of this application. Figure 2 ;
[0029] Figure 5 This is a schematic diagram of the structure of the upper imaging detection unit provided in the embodiments of this application;
[0030] Figure 6 Assembly of the mounting base, industrial camera, ring light source, and guide provided in the embodiments of this application. Figure 1 ;
[0031] Figure 7 Assembly of the mounting base, industrial camera, ring light source, and guide provided in the embodiments of this application. Figure 2 ;
[0032] Figure 8 This is a schematic diagram of the structure of the base provided in an embodiment of this application.
[0033] List of components and reference numerals:
[0034] 1. Base, 11. Base plate, 12. Lower frame, 13. Upper frame;
[0035] 2 Conveying and positioning mechanism, 21 Fixed crossbeam, 22 Movable crossbeam, 231 Vertical telescopic cylinder, 232 First transverse telescopic cylinder, 233 Second transverse telescopic cylinder, 24 Spacing adjustment drive motor, 25 Screw and nut mechanism, 251 Nut, 252 Screw, 26 Support plate, 27 Synchronous conveyor belt assembly, 271 Conveyor belt, 272 Driving wheel, 273 Driven wheel, 274 Conveying drive motor;
[0036] 3. Upper imaging and detection unit;
[0037] 4. Lower camera detection unit;
[0038] 51 X-axis moving module, 52 Y-axis moving module, 53 mounting base, 531 guide hole, 532 locking hole, 533 vertical slide, 54 industrial camera, 55 ring light source, 56 guide component. Detailed Implementation
[0039] To more clearly illustrate the overall concept of this application, a detailed explanation is provided below with reference to the accompanying drawings.
[0040] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.
[0041] Furthermore, it should be understood in the description of this application that the terms "upper," "lower," "top," "bottom," "inner," "outer," "axial," "radial," "circumferential," "lateral," and "longitudinal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0042] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0043] In this application, unless otherwise expressly specified and limited, the "above" or "below" of the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. In the description of this specification, references to terms such as "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described can be combined in any suitable manner in one or more embodiments or examples.
[0044] In the embodiments of this application, reference is made to Figures 1 to 8 As shown, a circuit board segmentation quality inspection device is provided. For ease of explanation and understanding, the following descriptions are based on the illustrated product structure. Of course, those skilled in the art will understand that the above structure is merely a specific example and illustrative illustration, and does not constitute a specific limitation on the technical solution provided in this application.
[0045] like Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, the circuit board segmentation quality inspection device includes a base 1 and a conveying and positioning mechanism 2, an upper imaging and inspection unit 3, and a lower imaging and inspection unit 4, which are respectively installed on the base 1. The conveying and positioning mechanism 2 is used to convey a carrier carrying circuit boards and to position the carrier. The conveying and positioning mechanism 2 includes a fixed crossbeam 21, a movable crossbeam 22, synchronous conveyor belt assemblies 27 respectively located on opposite sides of the fixed crossbeam 21 and the movable crossbeam 22, and a spacing adjustment mechanism. The fixed crossbeam 21 and the movable crossbeam 22 are arranged in parallel. The synchronous conveyor belt assemblies 27 on both sides are used to carry and convey the carrier. The spacing adjustment mechanism is used to drive the movable crossbeam 22 to move closer to or away from the fixed crossbeam 21. The upper imaging and inspection unit 3 is located above the conveying and positioning mechanism 2 and faces downwards, and is used to acquire circuit board images. The lower imaging and inspection unit 4 is located below the conveying and positioning mechanism 2 and faces upwards, and is used to acquire circuit board images.
[0046] In this application, the circuit board segmentation quality inspection includes a base 1, a conveying and positioning mechanism 2, an upper imaging inspection unit 3, and a lower imaging inspection unit 4, which structurally solves the problems of low efficiency, missed detection, and false detection in existing manual inspection methods.
[0047] In actual use, the base 1 provides stable support for the entire system, ensuring that the equipment does not shake during the testing process and avoiding image blurring caused by vibration. The fixed crossbeam 21 and movable crossbeam 22 of the conveyor positioning mechanism 2 work together with the synchronous conveyor belt assembly 27 to achieve automated transport of the carrier, replacing manual handling and significantly improving transport efficiency. Synchronous transport also ensures smooth movement of the carrier, preventing the circuit board from shifting position due to bumps. The spacing adjustment mechanism can flexibly adjust the spacing between the two crossbeams according to the circuit board carriers of different sizes, adapting to various product specifications without the need for separate equipment for different circuit boards, thus reducing production costs.
[0048] Those skilled in the art will understand that if the imaging and detection unit is only set on top of the carrier, after acquiring the image of the front of the circuit board, the carrier needs to be flipped so that the circuit board can be flipped over to continue acquiring the image of the back side, which increases the detection steps and reduces detection efficiency. Therefore, in this application, the upper imaging and detection unit 3 and the lower imaging and detection unit 4 simultaneously acquire images from the top and bottom, respectively, covering the dividing edges of both sides of the circuit board. This solves the problem that manual inspection can only inspect one side and that small defects are easily missed. In particular, the cutting deviation or notch at the bottom of the circuit board can be clearly captured by the lower imaging unit, achieving full-dimensional inspection. In addition, in order to achieve efficient imaging and inspection by the upper imaging and detection unit 3 and the lower imaging and detection unit 4 together, the carrier is usually designed in a certain way. For example, a grid-like hollow structure is set on the carrier to support the circuit board, so that the lower imaging and detection unit 4 can penetrate the carrier to directly photograph the cutting seam on the bottom of the circuit board. After the upper imaging detection unit 3 and the lower imaging detection unit 4 capture images of the circuit board, the image data can be transmitted to the control system (such as a PLC or industrial computer). The control system analyzes the images of the upper and lower surfaces of the circuit board. For example, the images are first preprocessed, such as denoising, enhancing contrast, and highlighting the segmentation edge features. Then, the contour of the circuit board segmentation gap is extracted through edge detection technology, and parameters such as gap width, continuity, and edge flatness are calculated. Next, these parameters are compared with preset qualification standards (such as maximum allowable gap deviation, minimum notch size, etc.). At the same time, combined with the learning of historical detection data by the AI model, defects such as incomplete segmentation (gaps that are too narrow or not broken), the presence of notches (irregular edge depressions), and cutting offset (gaps that deviate from the design trajectory) are identified. Finally, the system determines whether the circuit board segmentation quality is qualified and outputs the detection results and defect location information.
[0049] In a preferred embodiment of this application, the conveying positioning mechanism 2 further includes a carrier positioning unit. The carrier positioning unit includes a stop portion installed on the fixed crossbeam 21 and a composite positioning mechanism installed on the fixed crossbeam 21. The composite positioning mechanism includes a transverse drive member and a vertical drive member installed at the end of the transverse drive member. The composite positioning mechanism has a clearance position and a clamping position: when in the clearance position, the vertical drive member descends below the conveyor belt 271; when in the clamping position, the vertical drive member extends above the conveyor belt 271 and the transverse drive member drives the vertical drive member to push the carrier against the stop portion, thereby clamping and positioning the carrier at the inspection station. Those skilled in the art will understand that simply transporting the carrier to the testing station via the synchronous conveyor belt assembly 27 has low conveying accuracy and is prone to inaccurate testing due to positional deviations. Therefore, in this application, before the carrier moves to the testing station with the conveyor belt 271, the composite positioning mechanism is in a clearance position, which does not affect the smoothness of the transport. When the carrier arrives at the station, the lateral drive component drives the vertical drive component to push the carrier against the stop part, forming a bidirectional clamping positioning, ensuring that the carrier is completely fixed during testing, avoiding image shift caused by carrier shaking, and ensuring the accuracy of subsequent image analysis.
[0050] In a preferred embodiment, such as Figure 3 and Figure 4 As shown, the vertical drive component is a vertical telescopic cylinder 231, the horizontal drive component is a first horizontal telescopic cylinder 232, and the stop component is a second horizontal telescopic cylinder 233. All three components—vertical, horizontal, and stop—are cylinders. Utilizing the characteristics of cylinders—fast action speed, sensitive response, and stable output—positioning efficiency and reliability are further improved. In actual operation, cylinders respond faster, reducing the time by nearly half compared to motor drives, thus increasing the number of inspections per unit time. Furthermore, cylinders have a simple structure and low maintenance costs. In dusty, high-frequency working environments, their failure rate is far lower than that of complex transmission mechanisms, reducing equipment downtime for maintenance and ensuring continuous production line operation. To facilitate clamping the carrier, clamping plates can be installed on the piston rods of the vertical telescopic cylinder 231 and the second horizontal telescopic cylinder 233, using these plates to hold the carrier. In other embodiments, the stop part can also use a mechanical stop block instead of the second transverse telescopic cylinder 233. A rubber or spring buffer layer can be added to the side of the stop block facing the carrier to buffer the impact force. The composite positioning mechanism can also be replaced by a rotary motor to drive the L-shaped paddle to rotate. The initial position of the paddle (avoidance position) is parallel to the conveyor belt 271 and hidden below the conveyor belt 271. When the carrier is in place, the motor drives the paddle to rotate upward 90° to above the conveyor belt 271 (clamping position). The end of the paddle pushes the carrier to abut against the stop part to form a clamp.
[0051] As a preferred embodiment of this application, such as Figure 3 and Figure 4As shown, the spacing adjustment mechanism includes a spacing adjustment drive motor 24 and a lead screw and nut mechanism 25 driven by the spacing adjustment drive motor 24. The movable crossbeam 22 is mounted on the nut 251 of the lead screw and nut mechanism 25. In actual operation, the spacing adjustment drive motor 24 drives the lead screw 252 to rotate, which in turn drives the movable crossbeam 22 to move linearly. The adjustment accuracy is high, and the adjustment process can be digitally input through the control panel, eliminating the need for manual measurement with a ruler and manual screw tightening. For example, when changing carriers of different widths, only the dimensional parameters need to be input on the operation screen, and the equipment will automatically complete the adjustment. The entire process is short, significantly reducing changeover time and adapting to the rapid changeover requirements of flexible production lines. In a preferred embodiment, a set of spacing adjustment drive motors 24 and lead screw and nut mechanisms 25 can be arranged at each end of the movable crossbeam 22, and the nuts 251 of the two lead screw and nut mechanisms 25 reliably and stably support the movable crossbeam 22.
[0052] Furthermore, such as Figure 3 As shown, the conveying positioning mechanism 2 also includes a support structure fixed to the base 1. The support structure includes two bracket plates 26. The lead screw 252 of the lead screw and nut mechanism 25 is rotatably mounted on the two bracket plates 26. The fixed crossbeam 21 is fixedly installed on one bracket plate 26, and the spacing adjustment drive motor 24 is fixed on the other bracket plate 26. The lead screw 252 and the drive motor are positioned by the two bracket plates 26 of the support structure, which enhances the overall rigidity of the conveying positioning mechanism 2. In actual use, the two ends of the lead screw 252 can be rotatably mounted on the bracket plate 26 through bearings to ensure the straightness and smooth rotation of the movable crossbeam 22 when it moves. The fixed crossbeam 21 and the drive motor are respectively installed on different bracket plates 26 to distribute the stress points, reduce the impact of motor vibration on the fixed crossbeam 21, and ensure the smooth operation of the conveyor belt 271. Especially during high-speed conveying, it can effectively prevent the carrier from bouncing or deviating due to equipment vibration.
[0053] As a preferred embodiment of this application, such as Figure 4 As shown, the synchronous conveyor belt assembly 27 includes a conveyor belt 271, a drive pulley 272, a driven pulley 273, and a conveyor drive motor 274. The conveyor belt 271 is tensioned on the drive pulley 272 and the driven pulley 273, and the conveyor drive motor 274 is connected to the drive pulley 272. In actual operation, the carrier is placed on the conveyor belt 271, and the conveyor drive motor 274 drives the drive pulley 272 to rotate. Through the linkage between the conveyor belt 271 and the driven pulley 273, the surface of the conveyor belt 271 remains in motion. The tension of the conveyor belt 271 between the drive pulley 272 and the driven pulley 273 prevents the carrier from tilting due to slack, ensuring that the carrier remains horizontal during the conveying process. This provides a stable foundation for subsequent positioning and detection. For example, when conveying thin circuit boards, it can prevent the circuit boards from bending or falling off due to unstable conveying.
[0054] As a preferred embodiment of this application, such as Figure 5, Figure 6 and Figure 7 As shown, both the upper imaging detection unit 3 and the lower imaging detection unit 4 include a two-dimensional moving platform, a mounting base 53, an industrial camera 54, and a ring light source 55. The two-dimensional moving platform includes an X-axis moving module 51 and a Y-axis moving module 52 arranged perpendicularly to each other. The mounting base 53 is mounted at the end of the Y-axis moving module 52. The industrial camera 54 and the ring light source 55 are both mounted on the mounting base 53, and the central through hole of the ring light source 55 is aligned with the lens of the industrial camera 54. In actual testing, the X-axis moving module 51 and the Y-axis moving module 52 drive the industrial camera 54 to move freely in the plane, accurately aligning it with any segmented area of the circuit board. Even for complex-shaped segmented edges (such as L-shaped or arc-shaped), a complete image can be stitched together by taking pictures from multiple positions. The central through-hole of the ring light source 55 is aligned with the lens, allowing light to evenly illuminate the surface of the circuit board from all sides, avoiding shadows caused by a single-sided light source and highlighting details of the segmented edges (such as burrs and notches). To avoid overheating of the equipment caused by prolonged operation of the ring light source 55, the ring light source 55 can be turned on and off using the existing "flash" working mode, that is, the ring light source 55 will only light up when the industrial camera 54 is taking pictures, and will turn off after the pictures are taken. Specifically, both the X-axis moving module 51 and the Y-axis moving module 52 can be selected from a variety of proven and mature solutions in the existing industrial field. For example, both can be linear slide modules. The movement of the Y-axis moving module 52 along the X-axis moving module 51 and the movement of the mounting base 53 along the Y-axis moving module 52 can be driven by a stepper motor in conjunction with a trapezoidal lead screw.
[0055] In a preferred embodiment, such as Figure 6As shown, the ring light source 55 is connected to the mounting base 53 via a first height-adjustable structure. This first height-adjustable structure includes a guide member 56 on the ring light source 55, a guide hole 531 on the mounting base 53, and a locking member. The guide member 56 is slidably disposed within the guide hole 531, and its height is fixed by the locking member. The first height-adjustable structure allows adjustment of the light source height according to the circuit board thickness or other needs, optimizing the lighting effect. In practical use, for thicker circuit boards, the light source can be raised to reduce reflections caused by direct light; for thin circuit boards, the light source can be lowered to enhance light intensity, ensuring contrast between the segmented edge and the substrate. For example, when inspecting flexible circuit boards, lowering the light source height allows for clear imaging of subtle curls at the flexible edges, avoiding misjudgments of cutting defects due to insufficient light. Specifically, the mounting base 53 can have multiple locking holes 532 spaced along the height direction, passing through the guide hole 531. The locking member is a set screw threaded into the locking hole 532. When the height of the ring light source 55 needs to be fixed, tighten the set screw so that its end abuts against the surface of the guide member 56. Friction restricts the sliding of the guide member 56 within the guide hole 531, achieving height locking. To adjust the height, loosen the set screw to allow the guide member 56 to move up and down along the guide hole 531. After adjusting to the target position, retighten the set screw at the corresponding height to complete the fixation. The advantages of this structure are that multiple spaced locking holes 532 provide multiple height adjustment options, the threaded connection of the set screw ensures a secure lock, and operation is simple, requiring no additional tools for manual height adjustment and fixation, meeting the needs of rapid adjustment on-site. Furthermore, the set screw is low-cost and easy to replace, reducing equipment maintenance costs. In other embodiments, the locking component can also be an existing pin-type locking structure, spring-loaded snap-locking structure, etc.
[0056] In a preferred embodiment, the industrial camera 54 is connected to the mounting base 53 via a second height adjustment structure, such as... Figure 7As shown, the second height adjustment structure includes a vertical slide 533 located on the mounting base 53 and a fastener (not shown in the figure, but it can be a hand-tightening screw or a wing nut) passing through the vertical slide 533. The industrial camera 54 is connected to the fastener. When the fastener is loosened, the fastener can move up and down along the slide and re-secure the industrial camera 54. By setting the second height adjustment structure, the focal length can be flexibly adjusted to meet the inspection needs of circuit boards of different sizes. In actual operation, when inspecting small circuit boards, the camera height can be lowered to shorten the focal length, obtain a higher magnification image, and clearly show fine cutting marks; when inspecting large circuit boards, the camera height can be raised to increase the shooting field of view, reduce the number of shooting moves, and improve inspection efficiency. This structure, through the cooperation of the slide and the fastener, allows for tool-free adjustment, which can be completed by hand by workers, meeting the needs of rapid adjustment in the workshop. During the adjustment, first loosen the fasteners that pass through the vertical slide groove 533. At this time, the locking force between the fasteners and the slide groove is released, and the industrial camera 54 can slide freely up and down along the vertical slide groove 533 with the fasteners. The operator manually pushes the industrial camera 54 to adjust its height according to the thickness of the circuit board, the required field of view, or the feedback of image clarity. After adjusting to the target height, tighten the fasteners again so that they fit tightly against the inner wall of the vertical slide groove 533 of the mounting base 53. The position of the fasteners is fixed by friction, thereby firmly locking the industrial camera 54 at the current height, completing the adjustment.
[0057] As a preferred embodiment of this application, such as Figure 1 and Figure 8As shown, the base 1 includes a base 11 and a frame structure fixed to the base 11. The frame structure includes a lower frame 12 and an upper frame 13, which are connected by columns, crossbeams, and longitudinal beams. The conveying and positioning mechanism 2 is installed on the lower frame 12, the upper imaging and detection unit 3 is installed on the upper frame 13, and the lower imaging and detection unit 4 is installed on the base 11. The layered frame structure of the base 1 enables an orderly layout of the components, solving the problems of cluttered structures and large space occupation of traditional detection equipment. In actual installation, the lower frame 12 supports the conveying and positioning mechanism 2, the upper frame 13 installs the upper imaging and detection unit 3, and the base 11 fixes the lower imaging and detection unit 4, making the conveying path correspond vertically to the imaging area and reducing the lateral space occupied by the equipment. The connection of the columns, crossbeams, and longitudinal beams enhances the overall rigidity, resisting the interference of vibrations from surrounding equipment in a workshop environment where multiple devices work together, ensuring the stability of imaging and conveying. Furthermore, the layered structure facilitates equipment maintenance. For example, when inspecting the lower imaging detection unit 4, it is not necessary to disassemble the upper components; operation can be performed directly from the base 11 area, reducing maintenance difficulty. Specifically, the base 11, as the foundation of the entire device, can be made of heavy steel plate or cast iron, with the surface milled to ensure levelness. The lower frame 12 and upper frame 13 are welded or spliced from rectangular steel pipes or aluminum profiles. The bottom of the lower frame 12 is directly fixed to the preset mounting holes of the base 11 using expansion bolts or high-strength bolts. The bolts pass through the bottom flange of the lower frame 12 and are threaded to the base 11, and locked with nuts 251 to ensure no relative displacement between the lower frame 12 and the base 11, providing stable support for the conveying and positioning mechanism 2. The fixing method of the lower frame 12 and upper frame 13 can be the same as that of the base 11, which will not be elaborated here.
[0058] For any parts not mentioned in this application, existing technologies may be used or referenced.
[0059] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.
[0060] The above description is merely an embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.
Claims
1. A circuit board segmentation quality inspection device, characterized in that, It includes a base and a conveying and positioning mechanism, an upper shooting and detection unit and a lower shooting and detection unit respectively installed on the base. The conveying and positioning mechanism is used to convey a carrier carrying a circuit board and to position the carrier. The conveying and positioning mechanism includes: Parallel fixed crossbars and movable crossbars; Synchronous conveyor belt assemblies, respectively located on opposite sides of the fixed crossbeam and the movable crossbeam, are used to carry and transport the vehicle. A spacing adjustment mechanism that drives the movable crossbeam closer to or further away from the fixed crossbeam; The upper imaging detection unit is located above the conveying and positioning mechanism and faces downwards, and is used to acquire circuit board images; the lower imaging detection unit is located below the conveying and positioning mechanism and faces upwards, and is used to acquire circuit board images.
2. The circuit board segmentation quality inspection device according to claim 1, characterized in that, The conveying and positioning mechanism further includes a carrier positioning unit, which comprises: Installed on the stop portion of the fixed crossbeam; The composite positioning mechanism installed on the fixed crossbeam includes a transverse drive member and a vertical drive member installed at the end of the transverse drive member. The composite positioning mechanism has a clearance position and a clamping position: in the clearance position, the vertical drive member descends below the conveyor belt; in the clamping position, the vertical drive member extends above the conveyor belt and the transverse drive member drives the vertical drive member to push the carrier against the stop part, thereby clamping and positioning the carrier at the inspection station.
3. The circuit board segmentation quality inspection device according to claim 2, characterized in that, The vertical drive component is a vertical telescopic cylinder, the horizontal drive component is a first horizontal telescopic cylinder, and the stop part is a second horizontal telescopic cylinder.
4. The circuit board segmentation quality inspection device according to claim 1, characterized in that, The spacing adjustment mechanism includes: Spacing adjustment drive motor; The ball screw and nut mechanism is driven by the pitch adjustment drive motor, and the movable crossbeam is mounted on the nut of the ball screw and nut mechanism.
5. The circuit board segmentation quality inspection device according to claim 4, characterized in that, The conveying and positioning mechanism also includes a support structure fixed to the base. The support structure includes two support plates. The lead screw of the lead screw and nut mechanism is rotatably mounted on the two support plates. The fixed crossbar is fixedly installed on one support plate. The spacing adjustment drive motor is fixed on the other support plate.
6. The circuit board segmentation quality inspection device according to claim 1, characterized in that, The synchronous conveyor belt assembly includes a conveyor belt, a drive wheel, a driven wheel, and a conveyor drive motor. The conveyor belt is tensioned on the drive wheel and the driven wheel, and the conveyor drive motor is connected to the drive wheel.
7. The circuit board segmentation quality inspection device according to claim 1, characterized in that, Both the upper shooting detection unit and the lower shooting detection unit include: A two-dimensional mobile platform, comprising an X-axis mobile module and a Y-axis mobile module arranged perpendicularly to each other; Mounting bracket installed at the end of the Y-axis moving module; The industrial camera and the ring light source are both mounted on the mounting base, with the central through-hole of the ring light source aligned with the industrial camera lens.
8. The circuit board segmentation quality inspection device according to claim 7, characterized in that, The ring light source is connected to the mounting base via a first height-adjustable structure, the first height-adjustable structure comprising: A guide component is provided at the ring light source; A guide hole and a locking element are provided in the mounting base. The guide element is slidably disposed in the guide hole, and the height is fixed by the locking element.
9. The circuit board segmentation quality inspection device according to claim 7, characterized in that, The industrial camera is connected to the mounting base via a second height adjustment structure, the second height adjustment structure comprising: A vertical sliding groove is provided in the mounting base; A fastener passes through the vertical slide groove, and the industrial camera is connected to the fastener. When the fastener releases the industrial camera, it can move up and down along the slide groove and re-secure the industrial camera.
10. The circuit board segmentation quality inspection device according to claim 1, characterized in that, The base includes: Base; A frame structure fixed to a base, the frame structure including a lower frame and an upper frame, the lower frame and the upper frame being connected by columns, crossbeams and longitudinal beams, the conveying and positioning mechanism being installed on the lower frame, the upper shooting and detection unit being installed on the upper frame, and the lower shooting and detection unit being installed on the base.