Chip appearance defect detection device

Abstract

The utility model belongs to the field of chip detection equipment, and particularly relates to a chip appearance defect detection device which comprises a base, a feeding station, a feeding conveying device, a discharging conveying device, a transferring device and a first visual detection device, the feeding conveying device is arranged on the base and used for conveying a material disc along a preset track. The discharging conveying device is arranged on the base and used for conveying a material disc along a preset track. The transferring device is arranged on the base and used for clamping the trays on the feeding conveying device and moving the trays to the discharging conveying device. The first visual detection device is arranged on the base and is used for carrying out image acquisition on the chips in the charging tray on the discharging conveying device so as to detect whether the surfaces of the chips have scratches, foreign matters or copper exposure defects or not; through reasonable layout and overlapping cooperative work of multiple stations, detection of bad curves such as scratches, foreign matters and copper exposure on the surface of the chip is achieved, the whole process is high in automation degree, the detection efficiency and stability are greatly improved, meanwhile, manpower input is reduced, and the product yield is improved.

Description

Technical Field

[0001] This utility model belongs to the field of chip testing equipment, and specifically relates to a chip appearance defect detection device. Background Technology

[0002] Semiconductor chip manufacturing belongs to the high-tech field and represents a country's level of industrial and technological development. Its production efficiency affects the production of downstream electronic products such as laptops and mobile phones. The semiconductor chip production process involves defect detection, which is one of the important aspects of product quality inspection. It has a wide market application demand in industrial intelligent manufacturing. The traditional detection method is to manually inspect chip defects. However, as semiconductor chips become more complex and precise, the efficiency and reliability of manual inspection are decreasing, and the cost of manual inspection is also rising. In other words, the existing manual inspection methods are inefficient, costly, and unreliable, and cannot achieve automated production, so improvements are urgently needed. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a chip appearance defect detection device.

[0004] The present invention adopts the following technical solution:

[0005] A chip appearance defect detection device includes a base, a loading station, a loading conveyor, an unloading conveyor, a transfer device, and a first vision inspection device.

[0006] The loading station includes a loading rack mounted on a base, a tray mounted on the loading rack for loading chips, and a loading and conveying device for clamping and moving the tray to a loading conveyor. The tray is provided with multiple loading slots for loading chips.

[0007] A feeding and conveying device, set on a base, is used to convey a material tray along a preset trajectory. It includes a movable seat set on the base to support the material tray, two clamping cylinders set opposite to the movable seat to clamp and fix the material tray, a feeding linear module set on the base to connect to and drive the movable seat to move, a feeding guide component set at one end of the feeding linear module, and a discharging guide component set at the other end of the feeding linear module.

[0008] The unloading conveyor is mounted on the base, opposite to the loading conveyor, and is used to convey the material tray along a preset trajectory.

[0009] The transfer device is installed on the base, located between the loading conveyor and the unloading conveyor, and it picks up the material tray on the loading conveyor and moves it to the unloading conveyor.

[0010] The first vision inspection device, set on the base, captures images of the chips in the feeding tray of the feeding device to detect whether there are scratches, foreign objects or exposed copper defects on their surface.

[0011] Preferably, it further includes a second visual inspection device disposed on the base to detect side gaps in the chip. The second visual inspection device is located between the feeding conveyor and the unloading conveyor. It includes a detection stage movably disposed on the base, a plurality of rotary nozzles disposed at intervals on the detection stage for adsorbing and fixing the chip, two visual inspection components disposed opposite to each other on the base and movable components disposed on the base and connected to and driving the detection stage to move. The visual inspection components are opposite to one side of the chip, and the rotary nozzles can be driven to rotate 90° relative to the chip so that the other side of the chip is opposite to the visual inspection components.

[0012] Preferably, the visual inspection component includes a 3D camera movably mounted on the base opposite to the side of the chip and an adjustment module mounted on the base to drive the 3D camera to move.

[0013] Preferably, it further includes a clamping device disposed on the base. The clamping device includes a clamping frame located between the feeding conveyor and the unloading conveyor, and a first clamping component and a second clamping component respectively movably disposed on the clamping frame. The first clamping component clamps and moves the chip in the feeding tray of the feeding conveyor to the rotary suction nozzle, and the second clamping component clamps and moves the chip in the rotary suction nozzle to the empty tray on the unloading conveyor.

[0014] Preferably, the second visual inspection device further includes a correction mechanism arranged near the feeding and conveying device. The correction mechanism includes a correction frame mounted on a base, a correction plate mounted on the correction frame that can move up and down, a plurality of correction holes spaced apart on the correction plate, and a lifting assembly mounted on the correction frame to drive the correction plate to move. The plurality of correction holes can be one-to-one with a plurality of rotating suction nozzles.

[0015] Preferably, it also includes a third vision inspection device for detecting chip warpage, which is mounted on the base and includes an inspection frame that can move up and down, a 3D line laser mounted on the inspection frame, and a drive assembly for driving the inspection frame to move up and down.

[0016] Preferably, the material tray is a magazine material tray. The loading station also includes multiple stacking frames spaced apart on the loading rack, two loading conveyor belts arranged opposite each other on the loading rack, and a loading clamping mechanism arranged on the base. Multiple material trays are stacked on the stacking frames. The loading and conveying device clamps and moves the stacking frames outward relative to the loading clamping mechanism. The loading clamping mechanism clamps the material trays in the stacking frames one by one and transfers them to the loading conveying device.

[0017] Preferably, it also includes a material unloading station, which includes a material unloading frame disposed on the base below the material loading frame and a material unloading and conveying device disposed on the base opposite to the material loading and conveying device. The material unloading and conveying device moves the material tray on the material unloading conveying device downward to the material unloading frame.

[0018] Preferably, the material tray is a TRAY tray, and the loading station further includes a lifting device mounted on the base. The material trays are stacked on the loading rack, and the lifting device lifts the multiple material trays stacked on the loading rack upwards. The lifting device includes a lifting plate that can be moved up and down in the loading rack, four guide plates arranged in a matrix on the loading rack, and a lifting assembly mounted on the base that connects to and drives the lifting plate to move. The material tray is located between the four guide plates.

[0019] As can be seen from the above description of this utility model, compared with the prior art, the beneficial effects of this utility model are as follows: This application, by defining the structure of the detection device and through the reasonable layout of multiple workstations and overlapping collaborative work, can realize the detection of defects such as scratches, foreign objects, and exposed copper on the chip surface. The overall process has a high degree of automation, greatly improving detection efficiency and stability, while reducing manpower input and improving product yield. Specifically, a first vision inspection device is introduced to detect surface scratches, foreign objects, and exposed copper defects in STF chips and LID chips; a second vision inspection device is introduced to detect side gaps in STF chips; and a third vision inspection device is introduced to detect warping in LID chips. This adapts to the detection of two different types of chips, STF chips and LID chips, thereby improving the applicability of the device. Attached Figure Description

[0020] Figure 1 Schematic diagram of the detection device Figure 1 ;

[0021] Figure 2 Schematic diagram of the detection device Figure 2 ;

[0022] Figure 3 This is a partial structural diagram of the detection device;

[0023] Figure 4 This is a partial structural diagram of the loading station when the material tray is a magazine tray;

[0024] Figure 5 This is a schematic diagram of the feeding and conveying device when the material tray is a magazine tray;

[0025] Figure 6 This is a schematic diagram of the feeding and clamping mechanism when the material tray is a magazine tray;

[0026] Figure 7This is a schematic diagram of the material feeding and clamping mechanism when the material tray is a magazine tray;

[0027] Figure 8 This is a schematic diagram of the lifting device when the material tray is a TRAY tray;

[0028] Figure 9 This is a schematic diagram of the loading and unloading station when the material tray is a TRAY tray;

[0029] Figure 10 This is a schematic diagram of the material conveying device.

[0030] Figure 11 This is a partial structural diagram of the second vision detection device;

[0031] Figure 12 This is a schematic diagram of the clamping device.

[0032] Figure 13 This is a schematic diagram of the transfer device.

[0033] Figure 14 for Figure 3 Enlarged view of part of the structure;

[0034] Figure 15 This is a schematic diagram of the structure of the magazine tray;

[0035] Figure 16 This is a schematic diagram of the TRAY tray structure;

[0036] Figure 17 for Figure 1 Enlarged view of the middle section structure;

[0037] In the diagram: 1. Base; 2. Loading station; 3. Loading conveyor; 4. Unloading conveyor; 5. Transfer device; 6. First vision inspection device; 7. Second vision inspection device; 8. Third vision inspection device; 9. Unloading station; 21. Loading rack; 22. Material tray; 221. Loading trough; 23. Loading and handling device; 231. First handling seat; 232. First handling gripper; 233. First horizontal linear module; 234. First vertical linear module; 235. Second handling seat; 236. Second handling gripper; 237. Second horizontal linear module; 238. Second vertical linear module 24. Stacking frame; 241. Support rod assembly; 25. Feeding conveyor belt; 26. Feeding clamping mechanism; 261. Feeding support frame; 262. Clamping seat; 263. Cylinder gripper; 264. First linear module; 265. Feeding lifting cylinder; 27. Lifting device; 271. Lifting plate; 272. Guide plate; 273. Lifting linear module; 274. Lifting rod; 31. Moving seat; 32. Clamping cylinder; 33. Feeding linear module; 34. Feeding guide assembly; 341. Guide frame; 342. Guide block; 343. Movable clearance area; 35. Unloading guide assembly; 41. NG 51. Material rack; 52. Transfer seat; 53. Transfer plate; 54. Transfer pneumatic gripper; 55. Lateral moving part; 56. Vertical moving part; 67. Mounting bracket; 68. 2D area scan camera; 69. Fill light cover; 70. Inspection table; 71. Rotary suction nozzle; 72. Vacuum suction head; 72. Rotating part; 73. Vision inspection assembly; 74. 3D camera; 75. Adjustment module; 76. Moving assembly; 77. Clamping device; 78. Clamping frame; 79. First clamping assembly; 70. Second clamping assembly; 71. First clamping seat; 72. First clamping plate; 73. First vacuum... 757. Empty suction cup; 758. First clamping cylinder; 759. Rotating component; 750. First horizontal drive component; 751. First vertical drive component; 76. Correction mechanism; 761. Correction frame; 762. Correction plate; 763. Correction hole; 764. Lifting assembly; 81. Detection frame; 82. 3D line laser; 83. Drive assembly; 91. Unloading frame; 92. Unloading and handling device; 93. Unloading conveyor belt; 94. Unloading clamping mechanism; 941. Unloading support frame; 942. Pusher seat; 943. Pusher plate; 944. Second linear module; 945. Unloading lifting cylinder; 95. Gantry frame. Detailed Implementation

[0038] The present invention will be further described below through specific embodiments.

[0039] Reference Figures 1 to 3 and Figure 17As shown, a chip appearance defect detection device includes a base 1, a loading station 2, a loading conveyor 3, a unloading conveyor 4, a transfer device 5, a first vision inspection device 6, a second vision inspection device 7, a third vision inspection device 8, and an unloading station 9. The detection device defined in this application is applicable to the detection of STF chips and LID chips, performing surface scratch, foreign matter, and exposed copper defect detection on STF and LID chips, warping detection on LID chips, and side gap detection on STF chips. Specifically, the STF chip is a chip reinforced with a frame, and the LID chip is a chip with a protective cover.

[0040] The loading station 2 includes a loading rack mounted on a base 1, multiple trays 22 spaced apart on the loading rack for loading chips, and a loading and conveying device 23 for clamping and moving the trays 22 onto a loading conveyor 3. Each tray 22 has multiple loading slots 221 for loading chips. The trays 22 involved in this application include two different types: magazine trays and tour trays, which are described in detail below. Figure 15 and Figure 16 As shown, the structures of loading station 2 and unloading station 9 differ when the types of material trays 22 are different.

[0041] Reference Figures 4 to 7 As shown, when the material tray 22 is a magazine material tray, the first embodiment of the loading station 2 further includes a plurality of stacking frames 24 spaced apart on the loading rack 21, two loading conveyor belts 25 arranged opposite to each other on the loading rack 21, and a loading clamping mechanism 26 arranged on the base 1. The stacking frames 24 have a plurality of material trays 22 stacked on them, and the stacking frames 24 are provided with a plurality of support rod assemblies 241 arranged vertically at intervals. Each support rod assembly 241 includes two oppositely arranged support rods, and the material trays 22 are supported between the two support rods. When the material trays 22 are clamped, the loading and conveying device 23 clamps and moves the stacking frames 24 outwards relative to the loading clamping mechanism 26. The loading clamping mechanism 26 clamps the material trays 22 in the stacking frames 24 one by one onto the loading and conveying device 23. Specifically, The feeding clamping mechanism 26 includes a feeding support frame 261 located on the base 1 and on one side of the feeding conveying device 3, a clamping seat 262 movably mounted on the feeding support frame 261, a cylinder clamping claw 263 mounted on the clamping seat 262, a first linear module 264 mounted on the feeding support frame 261 to drive the clamping seat 262 to move, and a feeding lifting cylinder 265 mounted on the first linear module 264 to drive the clamping seat 262 to move up and down. The first linear module 264 drives the clamping seat 262 to move to be opposite to the stacking frame 24 of the feeding and conveying device 23, and then the cylinder clamping claw 263 clamps the opposite material tray 22. At this time, the first linear module 264 drives the clamping seat 262 to move in the opposite direction, so that the clamped material tray 22 can be pulled outward to the feeding conveying device 3.

[0042] The loading and conveying device 23 includes a first conveying seat 231 that can move back and forth relative to the loading rack 21, a first conveying gripper 232 that can move up and down on the first conveying seat 231, a first horizontal linear module 233 that is mounted on the base 1 and drives the first conveying seat 231 to move, and a first vertical linear module 234 that is mounted on the first conveying seat 231 and drives the first conveying gripper 232 to move up and down. The first horizontal linear module 233 and the first vertical linear module 234 cooperate to allow the first conveying gripper 232 to remove the stacking frame 24 from the loading rack 21.

[0043] The unloading station 9 includes an unloading rack 91 located on the base 1 below the loading rack 21, an unloading conveying device 92 located on the base 1 opposite to the loading conveying device 23, two unloading conveyor belts 93 located opposite to the unloading rack 91, and an unloading clamping mechanism 94 located on the base 1 on one side of the unloading conveying device 4. After the material tray 22 is removed from the stacking frame 24, the empty stacking frame 24 is placed on the two unloading conveyor belts 93 and conveyed to the unloading conveying device 92. The unloading conveying device 92 clamps and transports the empty stacking frame 24 to the opposite side of the unloading conveying device 4. Then, the unloading clamping mechanism 94 clamps and moves the material tray 22 that has completed inspection on the unloading conveying device 4 into the stacking frame 24 to complete the unloading of the material tray 22. Specifically, the unloading clamping mechanism 94 includes an unloading support frame 941 located on the base 1 on one side of the unloading conveying device 4, and a movable support frame 942. The unloading support frame 941 includes a pusher seat 942, a pusher plate 943, a second linear module 944 on the unloading support frame 941 that drives the pusher seat 942 to move, and an unloading lifting cylinder 945 on the second linear module 944 that drives the pusher seat 942 to move up and down. After the chip is tested, the unloading conveyor 4 moves the tray 22 to be opposite the unloading transport device 92. The second linear module 944, in conjunction with the unloading lifting cylinder 945, makes the pusher plate 943 abut against the end of the tray 22. Then, the second linear module 944 continues to work, moving the pusher plate 943 closer to the unloading transport device 92, pushing the tray 22 into the empty stacking frame 24, thus completing the unloading of the tray 22. Specifically, the structure of the unloading transport device 92 is the same as that of the loading transport device 23, and will not be described further here.

[0044] Reference Figures 8 to 9As shown, when the material tray 22 is a TRAY tray, the second embodiment of the loading station 2 further includes a lifting device 27 disposed on the base 1. The material trays 22 are stacked on the loading rack 21. The lifting device 27 lifts the stacked material trays 22 in the loading rack 21 upward. It includes a lifting plate 271 that can be moved up and down in the loading rack 21, four guide plates 272 arranged in a matrix on the loading rack 21, and a lifting assembly disposed on the base 1 and connected to and driving the lifting plate 271 to move. The material tray 22 is located between the four guide plates 272. Specifically, the lifting assembly includes a lifting linear module 273 and two lifting rods 274 connected to the lifting linear module 273. The upper end of the lifting rods 274 is connected to the lifting plate 271. The lifting linear module 273, in conjunction with the lifting rods 274, drives the lifting plate 271 to move upward, thereby lifting the material trays 22 in the loading rack 21 upward so that they can be picked up by the loading and conveying device 23.

[0045] The loading and conveying device 23 includes a second conveying seat 235 that can move along the conveying direction of the vertical loading conveying device 3, a second conveying gripper 236 that can move up and down on the second conveying seat 235, a second horizontal linear module 237 that connects to and drives the second conveying seat 235 to move, and a second vertical linear module 238 that is disposed on the second conveying seat 235 to drive the second conveying gripper 236 to move up and down. The cooperation between the second horizontal linear module 237 and the second vertical linear module 238 enables the second conveying gripper 236 to remove the tray 22 from the loading rack 21.

[0046] The unloading station 9 includes an unloading rack located on one side of the unloading conveyor 4, a gantry 95 located between the loading conveyor 3 and the unloading conveyor 4, and an unloading transport device 92 located on the gantry 95. A second transport seat 235 is movably mounted on the gantry 95, and a second transverse linear module 237 is mounted on the gantry 95 to drive the second transport seat 235 to move. After multiple chips on the material tray 22 have completed testing, the unloading transport device 92 clamps the material tray 22 below it and moves it onto the unloading rack for subsequent processing. Specifically, the structure of the unloading rack is the same as that of the loading rack 21, and the structure of the unloading transport device 92 is the same as that of the loading transport device 23; further details are omitted here.

[0047] Reference Figure 10As shown, the feeding and conveying device 3, mounted on the base 1, is used to convey the material tray 22 along a preset trajectory. It includes a movable base 31 movably mounted on the base 1 to support the material tray 22; two clamping cylinders 32 mounted opposite each other on the movable base 31 to clamp and fix the material tray 22; a feeding linear module 33 mounted on the base 1 and connected to and driving the movable base 31; a feeding guide component 34 at one end of the feeding linear module 33; and a discharging guide component 35 at the other end of the feeding linear module 33. The feeding guide component 34 is positioned close to the feeding frame and guides and corrects the material tray 22 clamped onto the movable base 31, improving the accuracy of subsequent inspection. The discharging guide component 35 corrects the position of the material tray 22 moved to the transfer device 5. Ensure the transfer device 5 clamps and transfers the material tray 22; specifically, the loading guide assembly 34 includes two guide frames 341 relatively arranged on both sides of the loading linear module 33 and two guide blocks 342 relatively arranged on the top of the two guide frames 341, and the guide blocks 342 and the opposing surfaces of the clamping cylinder 32 form an outwardly extending movable clearance area 343 for the clamping cylinder 32 to move; during testing, the moving seat 31 can be moved to the space between the two guide frames 341 and below the two guide blocks 342. When the material tray 22 is clamped and supported on the moving seat 31, its position is first corrected by the two guide blocks 342, and then the two clamping cylinders 32 work to clamp the material tray 22; furthermore, the structure of the unloading guide assembly 35 is the same as that of the loading guide assembly 34, and will not be described further here.

[0048] The unloading conveyor 4 is set on the base 1, opposite to the loading conveyor 3, and is used to convey the material tray 22 along a preset track. The conveying direction of the loading conveyor 3 is opposite to that of the unloading conveyor 4. Specifically, the structure of the unloading conveyor 4 is basically the same as that of the loading conveyor 3, except that the unloading conveyor 4 also includes an NG material rack 41 for placing defective products.

[0049] Reference Figure 14 As shown, the first visual inspection device 6 is mounted on the base 1 and performs image acquisition on the chip in the loading tray 22 of the unloading conveyor 4 to detect whether there are scratches, foreign objects or exposed copper defects on its surface. It includes a mounting frame 61 mounted on the gantry 95 opposite to the unloading conveyor 4, a 2D area array camera 62 mounted on the mounting frame 61 for image acquisition of the chip, and a supplementary light cover 63 mounted on the mounting frame 61 below the 2D area array camera 62. Specifically, the 2D area array camera 62 is a commonly used device in the field of visual inspection, and its working principle will not be further described here; the inner wall of the supplementary light cover 63 is provided with a supplementary light source to provide supplementary lighting for the 2D area array camera 62.

[0050] Reference Figure 11As shown, the second visual inspection device 7, mounted on the base 1, performs side gap inspection on the chip. Located between the loading conveyor 3 and the unloading conveyor 4, it is suitable for inspecting STF chips. Specifically, the second visual inspection device 7 includes a movably mounted inspection stage 71 on the base 1, multiple rotary nozzles 72 mounted on the inspection stage 71 for adsorbing and fixing the chip, two movable visual inspection components 73 mounted opposite each other on the base 1, a moving component 74 mounted on the base 1 and connected to and driving the inspection stage 71, a clamping device 75 mounted on the base 1, and a correction mechanism 76 arranged near the loading conveyor 3. The visual inspection components 73 face one side of the chip, and the rotary nozzles 72 can be driven to rotate 90° relative to the chip so that the other side of the chip faces the visual inspection component 73, thus performing image inspection on the other side. For example, in terms of data acquisition, specifically, the rotation planes of two adjacent rotating suction nozzles 72 are at different heights to avoid diagonal interference with the chip. Furthermore, the rotating suction nozzle 72 includes a vacuum suction head 721 disposed in the inspection stage 71 and a rotating component 722 connected to and driving the vacuum suction head 721 to rotate. The rotating component 722 can be a device such as a motor or a rotary cylinder that can achieve a 90° rotation of the vacuum suction head 721, which will not be described in detail here. The vision inspection component 73 includes a 3D camera 731 movably disposed on the base 1 opposite to the side of the chip and an adjustment module 732 disposed on the base 1 to drive the 3D camera 731 to move. The adjustment module 732 can be a linear module to realize the back-and-forth movement of the 3D camera 731. The 3D camera 731 is a commonly used device in the field of vision inspection, and its specific working principle will not be described in detail here.

[0051] Reference Figure 12As shown, the clamping device 75 includes a clamping frame 751 located between the loading conveyor 3 and the unloading conveyor 4, and a first clamping assembly 752 and a second clamping assembly 753 respectively movably mounted on the clamping frame 751. The first clamping assembly 752 clamps and moves the chips from the loading tray 22 of the loading conveyor 3 to the rotary suction nozzle 72, and the second clamping assembly 753 clamps and moves the chips from the rotary suction nozzle 72 to the empty tray 22 of the unloading conveyor 4. Specifically, the first clamping assembly 752 includes a first clamping seat 754 movably mounted on the clamping frame 751, a first clamping plate 755 movably mounted on the first clamping seat 754, a plurality of first vacuum suction cups 756 spaced apart on the first clamping plate 755, a plurality of first clamping cylinders 757 spaced apart on the first clamping plate 755 and respectively connected to the plurality of first vacuum suction cups 756, and a plurality of driving cylinders 757 spaced apart on the first clamping plate 755 and respectively connected to the plurality of first vacuum suction cups 756. The first vacuum chuck 756 has a rotating component 758, a first lateral drive component 759 that connects to and drives the first clamping seat 754 to move laterally, and a first vertical drive component 750 that connects to and drives the first clamping plate 755 to move up and down. The first lateral drive component 759 and the first vertical drive component 750 can both be linear modules to realize the movement of the first clamping seat 754 and the first clamping plate 755 respectively. The rotating component 758 can be a motor with a transmission component to achieve a 90° rotation relative to the first vacuum chuck 756, so that the chip is in a suitable detection position. The first lateral drive component 759 and the first vertical drive component 750, together with multiple first vacuum chucks 756, simultaneously clamp and move multiple chips in the tray 22 onto multiple rotating nozzles 72, realizing the simultaneous detection of the side gaps of multiple STF chips. Furthermore, the second clamping assembly 753 has the same structure as the first clamping assembly 752, and will not be described further here.

[0052] The calibration mechanism 76 includes a calibration frame 761 mounted on the base 1, a calibration plate 762 movable up and down on the calibration frame 761, multiple calibration holes 763 spaced apart on the calibration plate 762, and a lifting assembly 764 mounted on the calibration frame 761 to drive the calibration plate 762 to move up and down. When detecting the side gap of the STF chip, the detection stage 71 moves to below the calibration plate 762 so that multiple rotating nozzles 72 are opposite to multiple calibration holes 763. Then, the first clamping assembly 752 moves laterally to clamp and move multiple chips arranged in the same row on the tray 22 to the multiple calibration holes 763. After the chip position is corrected by the calibration holes 763, it is then attracted and fixed by the relative rotating nozzles 72. Finally, the lifting assembly 764 drives the calibration plate 762 to move upward to detach from the chip, preventing interference with the movement of the detection stage 71. Specifically, the lifting assembly 764 can adopt a linear module to realize the up and down movement of the calibration plate 762.

[0053] Reference Figure 14As shown, the third vision inspection device 8 is mounted on the base 1, opposite to the feeding and conveying device 3, and performs warpage detection on the chip. It is suitable for the inspection of LID chips. It includes an inspection frame 81 that can be moved up and down on the gantry 95, a 3D line laser 82 mounted on the inspection frame 81, and a drive assembly 83 mounted on the gantry 95 to drive the inspection frame 81 to move up and down. The drive assembly 83 adopts a linear module. The 3D line laser 82 is a commonly used component in the field of vision inspection. Its working principle will not be further described here.

[0054] Reference Figure 13 As shown, the transfer device 5 is mounted on the base 1 and located between the loading conveyor 3 and the unloading conveyor 4. It clamps the material tray 22 on the loading conveyor 3 and moves it to the unloading conveyor 4. It includes a transfer seat 51 that can be moved laterally on the clamping frame 751, a transfer plate 52 that can be moved vertically on the transfer seat 51, a transfer pneumatic gripper 53 that clamps the material tray 22 on the transfer plate 52, a lateral moving member 54 that drives the transfer seat 51 to move laterally on the clamping frame 751, and a vertical moving member 55 that drives the transfer plate 52 to move vertically on the transfer seat 51. The lateral moving member 54 and the vertical moving member 55 can both be linear modules to realize the lateral movement of the transfer seat 51 and the vertical movement of the transfer plate 52.

[0055] When the detection chip is an STF chip, the detection process specifically includes the following steps:

[0056] Step 1: Stack the trays 22 containing STF chips on the loading rack. When the tray 22 is a magazine tray, the loading and conveying device 23 and the loading clamping mechanism 26 work together to move the tray 22 onto the loading conveying device 3. When the tray 22 is a TRAY tray, the loading and conveying device 23 and the lifting device 27 work together to move the tray 22 onto the loading conveying device 3.

[0057] Step 2: The feeding conveyor 3 moves the material tray 22 to be opposite the second vision inspection device 7, and the inspection table 71 moves to be vertically opposite the calibration plate 762. The first clamping component 752 clamps and moves multiple STF chips on the material tray 22 to be attracted and fixed by the opposite rotating suction nozzle 72. During the first operation, the empty material tray 22 is manually placed to the unloading conveyor 4. The empty material tray 22 is moved by the unloading conveyor 4 to be opposite the second clamping component 753. Then the inspection table 71 moves between the two vision inspection components 73. The 3D camera 731 captures images of the opposite side of the chip. Then the rotating suction nozzle 72 controls the relative STF chip to rotate 90° so that the other adjacent side can capture images of the chip with the 3D camera 731.

[0058] Step 3: The second clamping component 753 operates, clamping multiple STF chips from multiple rotating nozzles 72 onto the empty material tray 22 or NG material rack 41 of the unloading conveyor 4. During the clamping and moving process, the rotating component in the second clamping component 753 needs to control the STF chip to rotate 90° to ensure that the chip can be placed exactly on the corresponding loading slot 221.

[0059] Step 4: The unloading conveyor 4 moves the tray 22 loaded with chips to below the first vision inspection device 6. The 2D area array camera 62 captures images of the STF chip surface to confirm whether there are scratches, foreign objects, or exposed copper defects on the STF chip surface. If there are defects on the STF chip surface, the unloading conveyor 4 moves the tray 22 in the opposite direction to the second clamping component 753, where the second clamping component 753 clamps the corresponding chip and places it on the NG material rack 41.

[0060] Step 5: The unloading conveyor 4 moves the tray 22 loaded with chips closer to the unloading station 9. When the tray 22 is a magazine tray, the unloading conveyor 92 and the unloading clamping mechanism 94 work together to move the tray 22 to an empty stacking frame 24 and then send it to the unloading rack 91. When the tray 22 is a TRAY tray, the unloading conveyor 92 moves the tray 22 to the unloading rack.

[0061] When the detection chip is an LID chip, the detection process specifically includes the following steps:

[0062] Step 1: Stack the trays 22 containing LID chips on the loading rack. When the tray 22 is a magazine tray, the loading and conveying device 23 and the loading clamping mechanism 26 work together to move the tray 22 onto the loading conveying device 3. When the tray 22 is a TRAY tray, the loading and conveying device 23 and the lifting device 27 work together to move the tray 22 onto the loading conveying device 3.

[0063] Step 2: The feeding conveyor 3 moves the material tray 22 to be opposite the third vision inspection device 8. The LID chip is warped by the 3D line laser 82. Then the feeding conveyor 3 continues to move the material tray 22 to be opposite the transfer device 5. The transfer pneumatic gripper 53 transports the material tray 22 to the unloading conveyor 4. Then the unloading conveyor 4 moves the material tray 22 to be opposite the second clamping component 753. The second clamping component 753 adsorbs and transfers the unqualified LID chip to the NG material rack 41.

[0064] Step 3: The unloading conveyor 4 moves the tray 22 loaded with chips to below the first vision inspection device 6. The 2D area array camera 62 captures images of the LID chip surface to confirm whether there are scratches, foreign objects, or exposed copper defects on the LID chip surface. If there are defects on the LID chip surface, the unloading conveyor 4 moves the tray 22 in the opposite direction to the second clamping component 753, where the second clamping component 753 clamps the corresponding chip and places it on the NG material rack 41.

[0065] Step 4: The unloading conveyor 4 moves the tray 22 loaded with chips closer to the unloading station 9. When the tray 22 is a magazine tray, the unloading conveyor 92 and the unloading clamping mechanism 94 work together to move the tray 22 to an empty stacking frame 24 and then send it to the unloading rack 91. When the tray 22 is a TRAY tray, the unloading conveyor 92 moves the tray to the unloading rack.

[0066] This application, by defining the structure of the detection device and through the reasonable layout of multiple workstations and overlapping collaborative work, enables the detection of defects such as scratches, foreign objects, and exposed copper on the chip surface. The overall process is highly automated, greatly improving detection efficiency and stability, while reducing manpower input and increasing product yield. Specifically, a first vision inspection device 6 is introduced to detect surface scratches, foreign objects, and exposed copper defects in STF and LID chips; a second vision inspection device 7 is introduced to detect side gaps in STF chips; and a third vision inspection device 8 is introduced to detect warpage in LID chips. This adapts to the detection of two different types of chips, STF and LID chips, thereby improving the applicability of the device.

[0067] The above description is merely a preferred embodiment of the present utility model, and therefore cannot be construed as limiting the scope of the present utility model. All equivalent changes and modifications made in accordance with the scope of the patent application and the contents of the specification of the present utility model shall still fall within the scope of the patent of the present utility model.

Claims

1. A chip appearance defect detection device, characterized in that: It includes a base, a loading station, a loading conveyor, a discharging conveyor, a transfer device, and a first vision inspection device; The loading station includes a loading rack mounted on a base, a tray mounted on the loading rack for loading chips, and a loading and conveying device for clamping and moving the tray to a loading conveyor. The tray is provided with multiple loading slots for loading chips. A feeding and conveying device, set on a base, is used to convey a material tray along a preset trajectory. It includes a movable seat set on the base to support the material tray, two clamping cylinders set opposite to the movable seat to clamp and fix the material tray, a feeding linear module set on the base to connect to and drive the movable seat to move, a feeding guide component set at one end of the feeding linear module, and a discharging guide component set at the other end of the feeding linear module. The unloading conveyor is mounted on the base, opposite to the loading conveyor, and is used to convey the material tray along a preset trajectory. The transfer device is installed on the base, located between the loading conveyor and the unloading conveyor, and it picks up the material tray on the loading conveyor and moves it to the unloading conveyor. The first vision inspection device, set on the base, captures images of the chips in the feeding tray of the feeding device to detect whether there are scratches, foreign objects or exposed copper defects on their surface.

2. The chip appearance defect detection device according to claim 1, characterized in that: It also includes a second visual inspection device for detecting side gaps in the chip, which is set on the base. The second visual inspection device is located between the feeding conveyor and the unloading conveyor. It includes a detection stage that is movably set on the base, a plurality of rotating nozzles that are spaced apart on the detection stage for adsorbing and fixing the chip, two visual inspection components that are movably set opposite to each other on the base, and a moving component that is set on the base, connected to and drives the detection stage to move. The visual inspection components are opposite to one side of the chip, and the rotating nozzles can be driven to rotate 90° relative to the chip so that the other side of the chip is opposite to the visual inspection components.

3. The chip appearance defect detection device according to claim 2, characterized in that: The visual inspection component includes a 3D camera movably mounted on a base opposite to the side of the chip, and an adjustment module mounted on the base to drive the 3D camera to move.

4. The chip appearance defect detection device according to claim 2, characterized in that: It also includes a clamping device mounted on the base. The clamping device includes a clamping frame located between the feeding conveyor and the unloading conveyor, and a first clamping component and a second clamping component movably mounted on the clamping frame. The first clamping component clamps and moves the chip in the feeding tray of the feeding conveyor to the rotary suction nozzle, and the second clamping component clamps and moves the chip in the rotary suction nozzle to the empty tray of the unloading conveyor.

5. The chip appearance defect detection device according to claim 2, characterized in that: The second visual inspection device also includes a calibration mechanism arranged near the feeding and conveying device. The calibration mechanism includes a calibration frame on the base, a calibration plate that can be moved up and down on the calibration frame, a plurality of calibration holes spaced apart on the calibration plate, and a lifting assembly on the calibration frame that drives the calibration plate to move. The plurality of calibration holes can be one-to-one with a plurality of rotating suction nozzles.

6. The chip appearance defect detection device according to claim 1, characterized in that: It also includes a third vision inspection device for detecting chip warpage, which is mounted on a base and includes a vertically movable inspection frame, a 3D line laser mounted on the inspection frame, and a drive assembly for moving the inspection frame vertically.

7. The chip appearance defect detection device according to claim 1, characterized in that: The material tray is a magazine material tray. The loading station also includes multiple stacking frames spaced apart on the loading rack, two loading conveyor belts opposite to each other on the loading rack, and a loading clamping mechanism on the base. Multiple material trays are stacked on the stacking frames. The loading and conveying device clamps and moves the stacking frames outward relative to the loading clamping mechanism. The loading clamping mechanism clamps the material trays in the stacking frames one by one and moves them to the loading conveyor device.

8. The chip appearance defect detection device according to claim 7, characterized in that: It also includes a material unloading station, which includes a material unloading frame located on the base below the material loading frame and a material unloading and conveying device located on the base opposite to the material loading and conveying device. The material unloading and conveying device moves the material tray on the material unloading conveying device downwards to the material unloading frame.

9. The chip appearance defect detection device according to claim 1, characterized in that: The material tray is a TRAY tray. The loading station also includes a lifting device mounted on the base. The material trays are stacked on the loading rack. The lifting device lifts the multiple material trays stacked on the loading rack upwards. It includes a lifting plate that can be moved up and down in the loading rack, four guide plates arranged in a matrix on the loading rack, and a lifting assembly mounted on the base that connects to and drives the lifting plate to move. The material tray is located between the four guide plates.

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