Circuit board testing device and control system

Abstract

The utility model provides a circuit board testing device and a control system, and belongs to the technical field of circuit board production, the testing device comprises a testing main body and a tray, the tray is provided with a placing position for placing a circuit board, a pressing mechanism is arranged above the tray, and the pressing mechanism comprises a pressing driving device. A switch probe is arranged on the test main body, a first electrode and a second electrode are arranged on the switch probe, the first electrode is located above the second electrode, a compression structure is arranged between the first electrode and the second electrode, and the first electrode and the second electrode are both electrically connected with the pressing driving device. And when the circuit board is placed at the placement position in a preset posture, the tray moves downwards to compress the first electrode, so that the first electrode is connected with the second electrode, and the downward pressing driving device is electrified to operate. The device has a fool-proof function, can avoid the occurrence of abnormal stress and damage caused by inaccurate placement position of the circuit board in the test process, and is beneficial to improving the effectiveness of circuit board test.

Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing technology, and in particular to a circuit board testing device and control system. Background Technology

[0002] Controllers are essential components in various home appliances, used to control their operation. The motherboard, as the core component of the controller, integrates processors, circuits, interfaces, and other electronic components, responsible for executing control logic, processing data, and communicating with other devices. During the manufacturing process, the controller motherboard needs to be tested to ensure its proper functioning. Ensuring the correct position and state of the motherboard within the test fixture is crucial during testing. Traditional controller motherboard testing methods typically involve placing the motherboard in a test tray of the test fixture and pressing it down with a cylinder to the test probe bed, causing the test probes to conduct electricity with the test points in the motherboard's circuitry. However, in current test fixtures, it is difficult to visually and quickly determine whether the motherboard is correctly placed on the tray and whether it fits snugly against the tray. If the motherboard is incorrectly positioned in the test tray or the fit between the motherboard and the tray is insufficient, the test probes may apply inappropriate mechanical pressure or stress to the components on the motherboard during the cylinder's downward press, directly leading to damage to the components or even crushing the motherboard itself. To overcome this deficiency, photoelectric sensing technology is currently used in test fixtures to detect the motherboard's position on the test tray. While photoelectric sensing can achieve preliminary detection of the motherboard's location to some extent, it is susceptible to environmental contamination. Contamination of the photoelectric sensor can lead to inaccurate detection, posing a risk of device damage. Furthermore, the complex control logic of the photoelectric sensor increases the complexity and maintenance cost of the test system, thus limiting the widespread adoption of photoelectric sensing technology in industrial applications.

[0003] Therefore, existing motherboard testing equipment needs to be improved to overcome the shortcomings of the existing technology. Utility Model Content

[0004] To overcome the problems existing in related technologies, one of the objectives of this utility model is to provide a circuit board testing device. This device, through the setting of switch probes, ensures that the circuit board is placed in a preset orientation before the pressure-down drive device is energized, thereby pressing down the tray to test the circuit board. The linkage between the switch probes and the pressure-down drive device provides a foolproof function, preventing damage caused by inaccurate circuit board placement during testing due to abnormal force. This helps reduce component damage caused by human error during testing and improves testing effectiveness.

[0005] A circuit board testing device includes a testing body and a tray. The tray is liftably mounted on the testing body and has a placement position for placing circuit boards. A pressing mechanism is provided above the tray, and the pressing mechanism includes a pressing drive device.

[0006] The test body is provided with a switch probe, and the switch probe is provided with a first electrode and a second electrode. The first electrode is located above the second electrode, and a compression structure is provided between the first electrode and the second electrode. Both the first electrode and the second electrode are electrically connected to the pressure driving device.

[0007] When the circuit board is placed in the preset position, the tray descends and compresses the first electrode, causing the first electrode to connect with the second electrode, thereby energizing the downward driving device.

[0008] Traditional circuit board testing equipment may suffer damage due to improper operation or inaccurate circuit board placement, leading to abnormal stress. This device, however, employs a switch probe to implement a foolproof function, ensuring that testing is only performed when the circuit board is correctly positioned, effectively preventing such damage. The linkage between the switch probe and the pressure-down drive ensures that the drive is only powered on when the circuit board is placed in the preset position. This design avoids testing errors caused by inaccurate circuit board placement, thus improving testing accuracy.

[0009] Because the device has a foolproof function, it can ensure that the circuit board is placed in the correct position every time it is tested, thus reducing the number of repeated tests caused by incorrect placement and reducing damage to the circuit board, thereby improving testing efficiency.

[0010] In a preferred embodiment of this invention, the axis of the switch probe is arranged vertically, and when the circuit board is placed in the placement position in a preset posture, the axis of the switch probe and the center of gravity of the circuit board are on the same straight line.

[0011] In this embodiment, the axis of the switch probe is collinear with the center of gravity of the circuit board. When the circuit board is placed in the correct position, the center of gravity of the circuit board coincides with the axis of the switch probe, thereby enabling the tray to move downward under the action of the circuit board, compressing the first electrode of the switch probe, so that the first electrode connects with the second electrode, thereby realizing the circuit conduction of the downward driving device.

[0012] In a preferred embodiment of this invention, the test body is provided with a mounting groove, and the switch probe is snapped into the mounting groove.

[0013] The axis of the mounting groove coincides with the axis of the placement position.

[0014] This embodiment uses a mounting slot to restrict the position of the switch probe, which ensures that the probe has a fixed and accurate position after installation.

[0015] This helps reduce detection errors caused by probe position deviations, improving test accuracy. Furthermore, during installation, operators do not need to spend excessive time adjusting the probe's position; they simply snap it into the mounting slot, thus improving work efficiency.

[0016] In a preferred embodiment of this utility model, a snap-fit ​​component is provided at the opening of the mounting groove, and the snap-fit ​​component has a snap-fit ​​opening. The axis of the snap-fit ​​opening coincides with the axis of the mounting groove, and the switch probe is snapped into the snap-fit ​​component.

[0017] A connecting piece is provided at the bottom of the mounting slot, and the connecting piece is electrically connected to the pressing drive device.

[0018] The snap-fit ​​design and its snap-fit ​​openings ensure that the switch probe is securely snapped into the mounting slot, preventing it from loosening or shifting. It also simplifies the installation and removal of the switch probe.

[0019] Operators can easily insert or remove the probe into the snap-fit ​​opening without complicated adjustments or fixing steps, improving work efficiency. Furthermore, the connecting piece at the bottom of the mounting slot is electrically connected to the pressure drive device, ensuring stable and reliable electrical signal transmission between the switch probe and the drive device.

[0020] In a preferred embodiment of this invention, the switch probe includes a housing, one end of which is provided with a first electrode, and the other end of which is provided with a second electrode.

[0021] The second electrode is fixed on the housing, and the first electrode is slidably disposed in the housing. The housing is also provided with the compression structure, the axis of which coincides with the axis of the housing, and the compression structure is disposed between the first electrode and the second electrode.

[0022] In a preferred embodiment of this invention, the compression structure includes a first spring and a second spring. The first spring is disposed at one end of the second spring, and the second spring is fixed in the housing. The first spring is disposed between the second spring and the first electrode, with one end of the first spring connected to the second spring and the other end connected to the first electrode.

[0023] The first electrode is slidably disposed in the housing and connected to the compression structure. It can generate different compression strokes and elastic feedback when subjected to pressure, thereby enabling it to connect with or not connect with the second electrode under different pressure conditions, thus giving the device a foolproof function.

[0024] In a preferred embodiment of this invention, an insulating member is provided at one end of the housing. The insulating member is disposed between the housing and the second electrode, and the second electrode is fixed in the housing by the insulating member.

[0025] The insulating component provides a mounting position for the second electrode and prevents electrical connection between the second electrode and the housing, so that the switch probe can only achieve circuit conduction of the pressure drive device when the first electrode and the second electrode are connected.

[0026] In a preferred embodiment of this utility model, the pressing mechanism includes a pressure plate, a pressing drive device, and a solenoid valve. The pressing drive device is fixed above the tray, and the pressure plate is fixed at the output end of the pressing drive device. The pressing drive device drives the pressure plate to move up and down above the tray.

[0027] The solenoid valve is installed in the control circuit of the pressure drive device. The solenoid valve is electrically connected to the first electrode and the second electrode. When the first electrode and the second electrode are connected, the solenoid valve is turned on, so that the control circuit of the pressure drive device forms a path.

[0028] In the pressing mechanism provided in this embodiment, when the switch probe is subjected to pressure, the first electrode and the second electrode are connected, and the two electrodes are in a short-circuit state. The signal is transmitted to the solenoid valve, causing the solenoid valve to open.

[0029] After the solenoid valve opens, the cylinder begins to press down, pressing the circuit board firmly onto the test probe bed for subsequent testing. If the motherboard's position or state is incorrect, the probes will not compress to a sufficient stroke. In this case, the solenoid valve remains closed, and the cylinder will not press down, thus avoiding testing under incorrect conditions. This method, through automated detection and control, reduces the impact of human factors during the testing process, minimizing the risk of test errors or device damage due to human error.

[0030] In a preferred embodiment of this invention, the testing body includes a machine body, and the machine body is further provided with multiple test probes, which correspond to the tray.

[0031] Multiple test probes can test different locations on a circuit board, thereby improving the testing efficiency of the circuit board.

[0032] The second objective of this utility model is to provide a control system, which is applied to the circuit board testing device described above.

[0033] The beneficial effects of this utility model are as follows:

[0034] This utility model provides a circuit board testing device, which includes a testing body and a tray. The tray is liftable and mounted on the testing body, and has a placement position for placing the circuit board. A pressing mechanism, including a pressing drive, is located above the tray. A switch probe is mounted on the testing body, and the switch probe has a first electrode and a second electrode. The first electrode is located above the second electrode, and a compression structure is provided between the first and second electrodes. Both the first and second electrodes are electrically connected to the pressing drive. When the circuit board is placed in the placement position in a preset posture, the tray descends and compresses the first electrode, bringing it into contact with the second electrode, thereby energizing the pressing drive. In practical applications, this device, through the linkage between the switch probe and the pressing drive, ensures that the pressing drive is only energized and activated when the circuit board is placed in the placement position in the preset posture, allowing the tray to be pressed down so that the circuit board on the tray contacts the test probe to complete the test. This design avoids the possibility of abnormal force caused by improper operation or inaccurate circuit board placement in traditional circuit board testing devices, which could damage the circuit board or testing equipment, thus providing a foolproof function. The foolproof function ensures that the circuit board is placed in the correct position every time it is tested, thus reducing the number of repeated tests caused by incorrect placement, thereby improving testing efficiency and extending the service life of the device.

[0035] This application also provides a control system for the above-mentioned testing device. The control system has a foolproof function, which makes the circuit board testing process more automated and intelligent, reduces the possibility of manual intervention and misoperation, and can improve production efficiency and product yield. Attached Figure Description

[0036] Figure 1 This is a perspective view of the circuit board testing device provided in the embodiments of this utility model with a circuit board placed on it.

[0037] Figure 2 This is a top view of the circuit board testing device provided in an embodiment of the present invention with a circuit board placed on it.

[0038] Figure 3 This is a side view of the circuit board testing device provided in an embodiment of the present invention with a circuit board placed on it.

[0039] Figure 4 yes Figure 3 Sectional view at point AA;

[0040] Figure 5 This is a perspective view of the circuit board provided in an embodiment of the present invention above the circuit board testing device;

[0041] Figure 6 This is a side view of the circuit board provided in an embodiment of the present invention when it is above the circuit board testing device;

[0042] Figure 7 This is a schematic diagram of the switch probe provided in an embodiment of this utility model;

[0043] Figure 8 This is a schematic diagram of the interior of the switch probe provided in an embodiment of this utility model;

[0044] Figure 9 This is a schematic diagram of the pressing mechanism and the circuit board testing device provided in the embodiments of this utility model.

[0045] Figure label:

[0046] 1. Test body; 11. Test probe; 2. Tray; 21. Placement position; 3. Switch probe; 31. First electrode; 32. Second electrode; 33. Housing; 34. Insulating component; 4. Circuit board; 5. Compression structure; 51. First spring; 52. Second spring; 6. Pressing mechanism; 61. Pressing drive device; 62. Pressure plate; 63. Solenoid valve. Detailed Implementation

[0047] Preferred embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present invention will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art.

[0048] Traditional controller motherboard testing methods typically involve placing the motherboard in a test tray of a testing fixture and pressing it down with a cylinder towards the test probe bed. This allows the test probes to conduct electricity through the test points in the motherboard's circuitry. However, in current testing fixtures, it's difficult to visually and quickly determine whether the motherboard is correctly positioned on the tray and whether it's tightly fitted. If the motherboard is incorrectly positioned or the fit between it and the tray is insufficient, the test probes may apply inappropriate mechanical pressure or stress to the components on the motherboard during the cylinder's downward press, directly causing damage to the components or crushing the motherboard. To overcome this deficiency, photoelectric sensing technology is currently used in testing fixtures to detect the motherboard's position on the test tray. While photoelectric sensing can achieve a preliminary detection of the motherboard's position to some extent, it is susceptible to environmental contamination. Once the photoelectric sensor becomes contaminated, inaccurate detection can occur, still posing a risk of component damage. Furthermore, the complex control logic of the photoelectric sensor increases the complexity and maintenance cost of the testing system, thus limiting the widespread adoption of photoelectric sensing technology in industrial applications.

[0049] Based on this, this application provides a circuit board testing device.

[0050] Example 1

[0051] like Figures 1-9 As shown, this embodiment provides a circuit board testing device, including a testing body 1 and a tray 2. The tray 2 is liftably mounted on the testing body 1. The tray 2 is provided with a placement position 21 for placing circuit boards. A pressing mechanism 6 is provided above the tray 2. The pressing mechanism 6 includes a pressing drive device 61.

[0052] The test body 1 is provided with a switch probe 3, and the switch probe 3 is provided with a first electrode 31 and a second electrode 32. The first electrode 31 is located above the second electrode 32. A compression structure 5 is provided between the first electrode 31 and the second electrode 32. The first electrode 31 and the second electrode 32 are both electrically connected to the pressure driving device 61.

[0053] When the circuit board 4 is placed in the placement position 21 in a preset posture, the tray 2 descends and compresses the first electrode 31, so that the first electrode 31 is connected to the second electrode 32, thereby energizing the downward driving device 61.

[0054] In practical applications, this device, through the linkage between the switch probe 3 and the pressure-driven device 61, ensures that the pressure-driven device 61 is only energized and activated when the circuit board 4 is placed in the preset position 21, thus pressing down the tray 2 to bring the circuit board 4 on the tray 2 into contact with the test probe 11 to complete the test. This design avoids the possibility of abnormal force caused by improper operation or inaccurate placement of the circuit board 4 in traditional circuit board testing devices, which could damage the circuit board 4 or the testing equipment. This gives the testing device a foolproof function. The foolproof function ensures that the circuit board 4 is placed in the correct position every time the test is performed, thereby reducing the number of repeated tests due to incorrect placement, improving testing efficiency, and extending the service life of the device.

[0055] It should be noted that the preset posture of the circuit board 4 in this application refers to the placement angle of the circuit board 4 during testing. For example, if the circuit board 4 needs to be placed face up during testing, then the preset posture of the circuit board 4 in this application is the face-up placement posture of the circuit board 4. The circuit board 4 has an asymmetrical structure. If the circuit board 4 is placed in different postures at the placement position 21, the center of gravity of the circuit board 4 will be different, resulting in different weight on the tray 2, and thus different downward strokes of the tray 2. For example, when the face of the circuit board 4 is placed in the placement position 21, the tray 2 will be pressed down by 3mm, while when the back of the circuit board 4 is placed in the placement position 21, the tray 2 will be pressed down by 2mm. In this case, the first electrode 31 cannot be connected to the second electrode 32, and the downward driving device 61 cannot be energized and operated.

[0056] Example 2

[0057] like Figures 1-9 As shown, this embodiment is an improvement on embodiment 1.

[0058] In this embodiment, the axis of the switch probe 3 is set in the vertical direction. When the circuit board 4 is placed in the placement position 21 in a preset posture, the axis of the switch probe 3 and the center of gravity of the circuit board 4 are on the same straight line.

[0059] In this embodiment, the axis of the switch probe 3 is on the same straight line as the center of gravity of the circuit board 4. When the circuit board 4 is placed in the correct position 21, the center of gravity of the circuit board 4 coincides with the axis of the switch probe 3, thereby enabling the tray 2 to move downward under the action of the circuit board 4, compressing the first electrode 31 of the switch probe 3, so that the first electrode 31 is connected to the second electrode 32, thereby realizing the circuit conduction of the pressure driving device 61.

[0060] Example 3

[0061] Unlike Embodiment 2, this embodiment provides a specific installation method for the switch probe 3.

[0062] like Figures 1-9 As shown, specifically:

[0063] In this embodiment, the test body 1 is provided with a mounting slot, and the switch probe 3 is snapped into the mounting slot;

[0064] The axis of the mounting groove coincides with the axis of the placement position 21.

[0065] This embodiment utilizes a mounting slot design to precisely control the position of the switch probe 3. This ensures the probe has a fixed and accurate position after installation, reducing positional deviations. This helps minimize detection errors caused by probe positional deviations and improves test accuracy. Furthermore, the mounting slot design simplifies the installation process of the switch probe 3; operators simply insert the probe into the mounting slot without requiring complex positional adjustments. This saves installation time and improves overall work efficiency.

[0066] In practical applications, the shape of the mounting slot's cross-section can be adjusted as needed; for example, the cross-section of the mounting slot can be circular, rectangular, or square. A circular mounting slot can be used to mount components with a circular cross-section.

[0067] Example 4

[0068] like Figures 1-9 As shown, this embodiment is an improvement on embodiment 3.

[0069] In this embodiment, a snap-fit ​​component is provided at the opening of the mounting groove, and the snap-fit ​​component is provided with a snap-fit ​​opening. The axis of the snap-fit ​​opening coincides with the axis of the mounting groove, and the switch probe 3 is snapped into the snap-fit ​​component.

[0070] A connecting piece is provided at the bottom of the mounting slot, and the connecting piece is electrically connected to the pressing drive device 61.

[0071] The snap-fit ​​design and snap-fit ​​opening on the snap-fit ​​component ensure that the switch probe 3 is securely snapped into the mounting slot, preventing it from loosening or shifting. It also simplifies the installation and removal process of the switch probe 3.

[0072] Operators can easily insert or remove the probe into the snap-fit ​​opening without complicated adjustments or fixing steps, improving work efficiency. Furthermore, the connecting piece at the bottom of the mounting slot is electrically connected to the pressure drive device 61, ensuring stable and reliable electrical signal transmission between the switch probe 3 and the drive device.

[0073] In one specific embodiment, the snap-fit ​​element can be made of an elastic material. The snap-fit ​​opening undergoes elastic deformation when the switch probe 3 is inserted, thereby limiting and fixing the switch probe 3. The shape of the snap-fit ​​opening can be designed according to the outer wall of the switch probe 3. It should be noted that the switch probe 3 and the snap-fit ​​opening are interference fit.

[0074] Example 5

[0075] like Figures 1-9 As shown, this embodiment is an improvement on embodiments 1-4.

[0076] In this embodiment, a specific implementation of the switch probe 3 is provided, as follows:

[0077] The switch probe 3 includes a housing 33, one end of which is provided with a first electrode 31, and the other end is provided with a second electrode 32;

[0078] The second electrode 32 is fixed on the housing 33, and the first electrode 31 is slidably disposed in the housing 33. The housing 33 is also provided with the compression structure 5, the axis of the compression structure 5 coincides with the axis of the housing 33, and the compression structure 5 is disposed between the first electrode 31 and the second electrode 32.

[0079] In this embodiment, the compression structure 5 includes a first spring 51 and a second spring 52. The first spring 51 is disposed at one end of the second spring 52, and the second spring 52 is fixed in the housing 33. The first spring 51 is disposed between the second spring 52 and the first electrode 31. One end of the first spring 51 is connected to the second spring 52, and the other end is connected to the first electrode 31.

[0080] The first electrode 31 is slidably disposed in the housing 33 and connected to the compression structure 5. It can generate different compression strokes and elastic feedback when subjected to pressure, thereby enabling it to connect with or not connect with the second electrode 32 under different pressure conditions, thus giving the device a foolproof function.

[0081] In this embodiment, an insulating member 34 is also provided at one end of the housing 33. The insulating member 34 is disposed between the housing 33 and the second electrode 32, and the second electrode 32 is fixed in the housing 33 by the insulating member 34.

[0082] The insulating component 34 provides a mounting position for the second electrode 32 and prevents electrical connection between the second electrode 32 and the housing 33, so that the switch probe 3 can only realize the circuit conduction of the pressure driving device 61 when the first electrode 31 and the second electrode 32 are connected.

[0083] In practical applications, a limiting block is provided in the housing 33 to limit the spring. The limiting block restricts the rotation of the spring without affecting its extension and contraction. This allows the first electrode 31 to be pressed down and squeeze the spring when subjected to pressure, thereby achieving connection with the second electrode 32.

[0084] In practical applications, the switch probe 3, under the action of the first spring 51 and the second spring 52, undergoes three compression strokes: the first stroke is approximately 2mm, with the compression force of the two springs ≥30g; during this stroke, it primarily functions as a switch, and the detection unit is in an unloaded state. The second stroke is from 2mm to 5.6mm, with the compression force of the two springs ≥30g; its main function is under load. The third compression stroke is from 5.6mm to 7.1mm, with the compression force of the two springs ≥350g; its main function is compression buffering and increasing the redundancy of the compression size. The two electrodes of the switch probe 3 are soldered to the pressure-driven device 61. The switch probe 3 changes its overall size and thus its overall conduction state through the pressure applied. When not compressed or compressed to the first stroke, the two electrodes of the switch probe 3 are open-circuited; when compressed to the second and third strokes, the two electrodes of the switch probe 3 are short-circuited. At this time, the circuit of the pressure-driven device 61 is connected, and the pressure-driven device 61 is energized and operates, thereby pressing down on the tray 2 to complete the testing of the circuit board 4.

[0085] Example 6

[0086] like Figures 1-9 As shown, this embodiment is an improvement based on embodiments 1-5.

[0087] In this embodiment, a specific implementation of the pressing mechanism 6 is provided as follows:

[0088] The pressing mechanism 6 includes a pressure plate 62, a pressing drive device 61, and a solenoid valve 63. The pressing drive device 61 is fixed above the tray 2, and the pressure plate 62 is fixed at the output end of the pressing drive device 61. The pressing drive device 61 drives the pressure plate 62 to move up and down above the tray 2.

[0089] The solenoid valve 63 is disposed in the control circuit of the pressure driving device 61. The solenoid valve 63 is electrically connected to the first electrode 31 and the second electrode 32. When the first electrode 31 and the second electrode 32 are connected, the solenoid valve 63 is turned on, so that the control circuit of the pressure driving device 61 forms a path.

[0090] In the pressing mechanism 6 provided in this embodiment, when the switch probe 3 is subjected to pressure, the first electrode 31 and the second electrode 32 are connected, and the two electrodes are in a short-circuit state. The signal is transmitted to the solenoid valve 63, causing the solenoid valve 63 to open.

[0091] After solenoid valve 63 opens, the cylinder begins to press down, pressing circuit board 4 firmly onto the test probe bed for subsequent testing. If the motherboard's position or state is incorrect, the probes will not compress to a sufficient stroke. In this case, solenoid valve 63 remains closed, and the cylinder will not press down, thus avoiding testing under incorrect conditions. This method, through automated detection and control, reduces the influence of human factors during the testing process, minimizing the risk of test errors or device damage due to human error.

[0092] Example 7

[0093] like Figures 1-9 As shown, this embodiment is an improvement on embodiment 6.

[0094] In this embodiment, a specific implementation method for test subject 1 is provided, as follows:

[0095] The test body 1 includes a body, and the body is also provided with a plurality of test probes 11, which correspond to the tray 2.

[0096] Multiple test probes 11 can test different locations on the circuit board 4, thereby improving the testing efficiency of the circuit board 4. When testing different models of the circuit board 4, the wiring positions of the test probes 11 may need to be readjusted.

[0097] Example 8

[0098] like Figures 1-9 As shown, this embodiment is an improvement on embodiment 1.

[0099] This embodiment provides a control system applied to the circuit board testing device described above. Specifically, the control system includes a processor, an actuator, and a switch probe 3. The actuator includes a pressure-driven device 61 and may also include a three-way valve. After a short circuit is formed between the two poles of the switch probe 3, the processor controls the pressure-driven device 61 to operate, enabling the pressure-driven device 61 to press down on the tray 2, so that the circuit board 4 on the tray 2 connects with the test probe 11, completing the testing process.

[0100] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0101] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this application.

[0102] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A circuit board testing device, comprising a testing body (1) and a tray (2), wherein the tray (2) is liftably mounted on the testing body (1), the tray (2) is provided with a placement position (21) for placing a circuit board, and a pressing mechanism (6) is provided above the tray (2), the pressing mechanism (6) comprising a pressing drive device (61), characterized in that: The test body (1) is provided with a switch probe (3), and the switch probe (3) is provided with a first electrode (31) and a second electrode (32). The first electrode (31) is located above the second electrode (32). A compression structure (5) is provided between the first electrode (31) and the second electrode (32). Both the first electrode (31) and the second electrode (32) are electrically connected to the pressure driving device (61). When the circuit board (4) is placed in the placement position (21) in a preset posture, the tray (2) descends and compresses the first electrode (31), so that the first electrode (31) and the second electrode (32) are connected, thereby energizing the downward driving device (61).

2. The circuit board testing device according to claim 1, characterized in that: The axis of the switch probe (3) is set in the vertical direction. When the circuit board (4) is placed in the placement position (21) in a preset posture, the axis of the switch probe (3) and the center of gravity of the circuit board (4) are on the same straight line.

3. The circuit board testing device according to claim 1, characterized in that: The test body (1) is provided with a mounting slot, and the switch probe (3) is snapped into the mounting slot; The axis of the mounting groove coincides with the axis of the placement position (21).

4. The circuit board testing device according to claim 3, characterized in that: A snap-fit ​​component is provided at the opening of the mounting slot. The snap-fit ​​component has a snap-fit ​​opening. The axis of the snap-fit ​​opening coincides with the axis of the mounting slot. The switch probe (3) is snapped into the snap-fit ​​component. A connecting piece is provided at the bottom of the mounting slot, and the connecting piece is electrically connected to the pressing drive device (61).

5. The circuit board testing apparatus according to any one of claims 1-4, characterized in that: The switch probe (3) includes a housing (33), one end of which is provided with a first electrode (31), and the other end is provided with a second electrode (32); The second electrode (32) is fixed on the housing (33), and the first electrode (31) is slidably disposed in the housing (33). The housing (33) is also provided with the compression structure (5), the axis of the compression structure (5) coincides with the axis of the housing (33), and the compression structure (5) is disposed between the first electrode (31) and the second electrode (32).

6. The circuit board testing apparatus according to claim 5, characterized in that: The compression structure (5) includes a first spring (51) and a second spring (52). The first spring (51) is disposed at one end of the second spring (52). The second spring (52) is fixed in the housing (33). The first spring (51) is disposed between the second spring (52) and the first electrode (31). One end of the first spring (51) is connected to the second spring (52), and the other end is connected to the first electrode (31).

7. The circuit board testing apparatus according to claim 5, characterized in that: An insulating member (34) is provided at one end of the housing (33). The insulating member (34) is disposed between the housing (33) and the second electrode (32). The second electrode (32) is fixed in the housing (33) by the insulating member (34).

8. The circuit board testing apparatus according to any one of claims 1-4, characterized in that: The pressing mechanism (6) includes a pressure plate (62), a pressing drive device (61), and a solenoid valve (63). The pressing drive device (61) is fixed above the tray (2), and the pressure plate (62) is fixed at the output end of the pressing drive device (61). The pressing drive device (61) drives the pressure plate (62) to move up and down above the tray (2). The solenoid valve (63) is disposed in the control circuit of the pressure drive device (61). The solenoid valve (63) is electrically connected to the first electrode (31) and the second electrode (32). When the first electrode (31) and the second electrode (32) are connected, the solenoid valve (63) is turned on, so that the control circuit of the pressure drive device (61) forms a path.

9. The circuit board testing apparatus according to any one of claims 1-4, characterized in that: The test body (1) includes a body, and the body is also provided with multiple test probes (11), which correspond to the tray (2).

10. A control system, characterized in that: The control system is applied in the circuit board testing apparatus as described in any one of claims 1-9.

Images