Active alignment device for semiconductor device

Abstract

The utility model provides a semiconductor device active alignment device, which comprises an alignment jig, an alignment execution mechanism and an alignment driving mechanism, the alignment execution mechanism comprises a sliding deflector rod part, a sliding alignment part and a rotary alignment part, the sliding deflector rod part is used for converting vertical movement in the alignment driving mechanism into horizontal movement, and the rotary alignment part is used for rotating the alignment driving mechanism. Therefore, the rotary alignment part is driven to rotate, and the sliding alignment part is driven to perform alignment movement in the horizontal direction; and the alignment jig is used for placing the semiconductor device and is driven by the sliding alignment part to complete alignment of the semiconductor device. The active alignment device for the semiconductor device is simple and effective in structure, controllable in cost and suitable for large-scale production operation.

Description

Technical Field

[0001] This utility model belongs to the field of integrated circuits, and in particular relates to an active alignment device for semiconductor devices and its alignment method. Background Technology

[0002] In the testing and sorting process of semiconductor devices (such as packaged chips or bare chips), various transfer processes must be performed, such as transfer, testing, and sorting between processes or between carriers. In these cases, one or more semiconductor devices are placed in one or more positioning holes on a carrier (such as a device carrier, also known as a shuttle cart). The semiconductor devices must be in the correct position within their positioning holes. Otherwise, subsequent semiconductor device transfer will not be successful. For example, misaligned semiconductor devices, because they are not placed in the correct position in the positioning hole, will cause the subsequent transfer arm to be unable to remove the semiconductor devices from the positioning holes, resulting in an alarm and shutdown of the entire machine, affecting the overall output. Furthermore, during semiconductor device testing, it is required that the probes of the test socket be accurately aligned with the center of the semiconductor device's pins. If they are not accurately aligned, the test results cannot be guaranteed, seriously affecting testing efficiency and yield.

[0003] To address the above situation, there are two existing solutions: One solution is to improve the dimensional accuracy of the carrier positioning holes and reduce the opening size of the positioning holes to ensure the consistency of the semiconductor device's position after placement. However, this method has several drawbacks. First, it significantly increases the requirements for the positioning and placement of the loading and transfer arm; otherwise, it is difficult to accurately place the semiconductor device into the positioning hole. Second, because the opening size of the positioning hole has been reduced, semiconductor devices with large tolerances cannot be successfully placed into the positioning hole. Although the size of semiconductor devices is constantly shrinking, the manufacturing tolerance of the devices is still relatively large. Static alignment technology, which places semiconductor devices in the device carrier, cannot perform alignment adjustments after placement. Therefore, it is not a feasible solution for semiconductor devices that are relatively small in size but have large manufacturing tolerances, as it will cause jamming and machine alarms. The other solution is to use visual inspection and mechanical alignment simultaneously. First, the shape of the semiconductor device is inspected using a vision system, and then the calculated position compensation information is sent to three independently operable X, Y, and Theta motors, thereby improving the transfer positioning accuracy. This method also has several drawbacks. First, it is costly and complex, making it difficult to adapt to the requirements of testing multiple products simultaneously. Second, it is inefficient, especially when testing multiple products concurrently, which severely impacts machine output. Dynamic alignment technology can accommodate relatively small semiconductor devices, but it requires the simultaneous use of visual inspection and mechanical alignment. Traditional dynamic alignment technology requires extensive hardware integration of cameras and alignment motors. Typically, each alignment requires three motors to move in the X, Y, and Theta directions. For parallel testing of multiple or more devices, multiple sets of cameras and alignment motors are needed. Such additional equipment not only significantly increases costs but also reduces the equipment's throughput per hour (UPH). Utility Model Content

[0004] In view of this, the present invention aims to provide an active alignment device for semiconductor devices to solve the problems of low working efficiency and high testing cost in the prior art.

[0005] To achieve the above objectives, the technical solution of this utility model is implemented as follows:

[0006] An active alignment device for semiconductor devices includes an alignment fixture, an alignment actuator, and an alignment drive mechanism.

[0007] The alignment actuator includes a sliding lever, a sliding alignment part, and a rotating alignment part. The sliding lever is used to convert the vertical motion in the alignment drive mechanism into horizontal motion, thereby driving the rotating alignment part to rotate, and then driving the sliding alignment part to perform horizontal alignment motion.

[0008] Alignment fixtures are used to place semiconductor devices and are driven by sliding alignment parts to complete the alignment of semiconductor devices.

[0009] Furthermore, the alignment fixture includes two independently configured fixture units. Each fixture unit includes a tray and a first alignment claw and a second alignment claw disposed above it. The tray is used to place semiconductor devices and is fixedly connected to the alignment substrate below. The first alignment claw and the second alignment claw are both mounted on the horizontal slider of the sliding alignment unit, and a positioning cavity for placing semiconductor devices is formed between the first alignment claw and the second alignment claw.

[0010] Furthermore, the alignment actuator also includes an alignment substrate, which is provided with mounting holes for mounting the alignment drive mechanism.

[0011] Furthermore, the sliding lever portion and the sliding alignment portion are symmetrically mounted on the alignment base plate, and a sliding lever portion is mounted on one side of each sliding alignment portion to form an alignment group, and a rotating alignment portion is mounted above the alignment group.

[0012] Furthermore, the sliding lever part includes a lever and lever sliding pins fixedly connected to both sides. The lever sliding pins are used to insert into the second horizontal guide hole of the alignment substrate and can slide horizontally along the second horizontal guide hole 323. The top of one of the lever sliding pins is used to connect to the rotating alignment part. When the lever sliding pin moves, it can drive the rotating alignment part to rotate.

[0013] Furthermore, the sliding alignment part has a symmetrical structure, including two horizontal sliders. The two horizontal sliders are arranged opposite each other and are connected by two tension springs in symmetrical positions. Each horizontal slider is also provided with a horizontal sliding pin. The alignment base plate is provided with a first horizontal guide hole for the horizontal sliding pin to pass through, so that the bottom of the horizontal sliding pin can slide horizontally on the alignment base plate. The first alignment claw and the second alignment claw of a fixture unit are respectively fixedly connected to the top of the two horizontal sliders.

[0014] Furthermore, the rotating alignment unit includes a left-hand rotating lever and a right-hand rotating lever that are independently arranged, and the left-hand rotating lever and the right-hand rotating lever are respectively mounted above an alignment group via a bearing.

[0015] Furthermore, the left-hand rotating lever has a T-shaped structure, with a slot on each of its three sides, namely a first slot, a second slot, and a third slot. The second slot is in the opposite direction to the first slot, while the first and third slots are in the same direction. The first and second slots are connected to two horizontal sliding pins on the first alignment group, and the third slot is connected to a lever sliding pin on the first alignment group. The right-hand rotating lever also has a T-shaped structure, with a slot on each of its three sides, namely a fourth slot, a fifth slot, and a sixth slot. The fifth slot is in the opposite direction to the fourth slot, while the fourth and sixth slots are in the same direction. The fourth and fifth slots are connected to two horizontal sliding pins on the second alignment group, and the sixth slot is connected to a lever sliding pin on the second alignment group. The slots of the first, second, fourth, and fifth slots are all variable center-distance slots.

[0016] Furthermore, the alignment drive mechanism includes a driver fixing base, a drive cam rod, and a return spring. The driver fixing base is fixedly connected to the mounting hole of the alignment substrate. The drive cam rod is installed inside the base and is driven by an external material pick-up head mechanism. A return spring is installed at the bottom of the drive cam rod. The cam surface of the drive cam rod contacts the lever. The head of the drive cam rod has a cam surface with a diameter that is smaller in the middle and larger at both ends. The slope of the cam surface can be adjusted according to the characteristics of different semiconductor devices.

[0017] Compared with the prior art, the active alignment device for semiconductor devices described in this utility model has the following advantages:

[0018] (1) The active alignment device for semiconductor devices described in this utility model has a simple and effective structure, controllable cost, stable operation, easy implementation and promotion, and is suitable for large-scale production operations.

[0019] (2) The active alignment device for semiconductor devices described in this utility model can significantly improve the transfer accuracy, significantly improve the stability of the machine, the accuracy of the test, and the efficiency of the machine, effectively reduce the risk of downtime, thereby reducing production costs.

[0020] (3) The active alignment device for semiconductor devices described in this utility model has better compatibility with the product's own tolerances.

[0021] Another objective of this invention is to propose an alignment method for an active alignment device for semiconductor devices, in order to solve the problems of low working efficiency and high testing costs in the prior art.

[0022] To achieve the above objectives, the technical solution of this utility model is implemented as follows:

[0023] An alignment method for an active alignment device for a semiconductor device includes the following stages:

[0024] In the first stage of material feeding, without external force, the drive cam rod is in a high position under the action of the return spring, so that the first alignment jaw and the second alignment jaw are in the open state and have a large gap with the semiconductor device, which makes it easy to put the semiconductor device into the positioning cavity.

[0025] In the second stage of active alignment, during the material picking process, the material picking head mechanism will contact the top of the drive cam rod during the downward material picking process, until it drives the first alignment claw and the second alignment claw to close, ensuring that the semiconductor device is pushed to the center of the positioning cavity and achieving precise alignment.

[0026] In the third stage, the active release stage, the pick-up head mechanism continues to press down, driving the drive cam rod to continue pressing down synchronously until the first and second alignment claws open and close symmetrically. The pick-up head mechanism then lifts the semiconductor device to the set height without obstruction, ensuring that the semiconductor device is freed from the restricted area of ​​the first and second alignment claws. The pick-up head mechanism continues to lift the semiconductor device until the pick-up head mechanism is completely separated from the drive cam rod, and the first and second alignment claws are opened to their maximum extent, waiting for the next release action. Thus, the entire release and pick-up process can be repeated.

[0027] The alignment method of the semiconductor device active alignment device has the same advantages as the above-mentioned semiconductor device active alignment device over the prior art, and will not be repeated here. Attached Figure Description

[0028] The accompanying drawings, which form part of this utility model, are used to provide a further understanding of the utility model. The illustrative embodiments of the utility model and their descriptions are used to explain the utility model and do not constitute an undue limitation of the utility model. In the drawings:

[0029] Figure 1 This is a schematic diagram of the active alignment device for semiconductor devices described in an embodiment of the present invention;

[0030] Figure 2 This is a top view of the alignment fixture described in an embodiment of the present invention;

[0031] Figure 3 for Figure 2 Sectional view along axis AA;

[0032] Figure 4 This is a schematic diagram of the alignment actuator described in an embodiment of the present utility model;

[0033] Figure 5 This is a schematic diagram of the alignment substrate described in an embodiment of the present invention;

[0034] Figure 6This is a schematic diagram of the left-hand rotating lever described in an embodiment of the present utility model;

[0035] Figure 7 This is a schematic diagram of the right-hand rotating lever described in an embodiment of the present invention;

[0036] Figure 8 This is a schematic diagram of the working state of the left-hand rotating lever described in this embodiment of the utility model. Figure 1 ;

[0037] Figure 9 This is a schematic diagram of the working state of the left-hand rotating lever described in this embodiment of the utility model. Figure 2 ;

[0038] Figure 10 This is a cross-sectional view of the alignment drive mechanism described in an embodiment of the present invention;

[0039] Figure 11 This is a diagram showing the working state of the alignment drive mechanism during the feeding stage as described in this embodiment of the utility model.

[0040] Figure 12 for Figure 11 Enlarged view of section A;

[0041] Figure 13 This is a diagram showing the working state of the alignment drive mechanism in the active alignment stage according to an embodiment of the present invention.

[0042] Figure 14 for Figure 13 Enlarged view of section B;

[0043] Figure 15 This is a diagram showing the working state of the alignment drive mechanism during the active release phase as described in an embodiment of the present invention.

[0044] Figure 16 for Figure 15 Enlarged view of section C.

[0045] Explanation of reference numerals in the attached figures:

[0046] 1-Semiconductor device; 2-Alignment fixture; 21-Alignment jaw 1; 22-Alignment jaw 2; 23-Pattern; 3-Alignment actuator; 31-Sliding lever; 311-Lever; 312-Lever sliding pin; 32-Alignment substrate; 321-Horizontal guide hole 1; 322-Mounting hole; 323-Horizontal guide hole 2; 33-Sliding alignment part; 331-Horizontal slider; 332-Spring retaining pin; 333- Tension spring; 334-Horizontal sliding pin; 34-Rotating alignment part; 341-Left-rotating lever; 3411-First slot; 3412-Second slot; 3413-Third slot; 342-Right-rotating lever; 3421-Fourth slot; 3422-Fifth slot; 3423-Sixth slot; 4-Alignment drive mechanism; 401-Driver fixing base; 402-Drive cam rod; 403-Reset spring. Detailed Implementation

[0047] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0048] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0049] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0050] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0051] An active alignment device for semiconductor devices, such as Figures 1 to 16 As shown, it includes an alignment fixture 2, an alignment execution mechanism 3, and an alignment drive mechanism 4. The alignment execution mechanism 3 includes a sliding lever 31, a sliding alignment part 33, and a rotating alignment part 34. The sliding lever 31 is used to convert the vertical movement in the alignment drive mechanism 4 into horizontal movement, thereby driving the rotating alignment part 34 to rotate, and then driving the sliding alignment part 33 to perform horizontal alignment movement. The alignment fixture 2 is used to place the semiconductor device 1, and is driven by the sliding alignment part 33 to complete the alignment of the semiconductor device 1.

[0052] Semiconductor device 1 is the semiconductor chip to be aligned. This device includes, but is not limited to, semiconductor chips such as GBA, QFN, etc. The example shows a method for aligning two semiconductor devices 1 simultaneously, but this approach can be extended from two semiconductor devices 1 to multiple semiconductor devices 1 for simultaneous active alignment.

[0053] The alignment fixture 2 is a customized fixture based on the shape and other characteristics of the semiconductor device 1 to be aligned. If it is necessary to align semiconductor devices 1 of different specifications and shapes, the entire mechanism can be quickly changed by simply replacing the alignment fixture 2 accordingly, which ensures the needs of rapid machine modification for large-scale production and greatly saves the time for product changeover.

[0054] Alignment fixture 2 comprises two independently configured fixture units.

[0055] The fixture unit includes a tray 23 and a first alignment claw 21 and a second alignment claw 22 disposed on top of it. The tray 23 is used to place the semiconductor device 1 and is fixedly connected to the alignment substrate 32 below. The first alignment claw 21 and the second alignment claw 22 are both mounted on the horizontal slider 331 of the sliding alignment unit 33, and a positioning cavity for placing the semiconductor device 1 is formed between the first alignment claw 21 and the second alignment claw 22. The first alignment claw 21 and the second alignment claw 22 can be quickly changed according to the shape characteristics of the semiconductor device 1 to be aligned, and the tray 23 can be quickly changed according to the depth characteristics of the semiconductor device 1. These structures are designed and developed to better meet the needs of mass production of semiconductor devices 1 of various specifications.

[0056] During normal operation, when the semiconductor device 1 that needs to be aligned is placed into the tray 23, the first alignment claw 21 and the second alignment claw 22 will perform an alignment action, thereby pushing the semiconductor device 1 to the center position of the positioning cavity, and then allowing the material pick-up suction head mechanism to take away the semiconductor device 1.

[0057] The alignment actuator 3 includes an alignment base plate 32 and a sliding lever portion 31 and a sliding alignment portion 33 mounted on it. A rotating alignment portion 34 is also mounted above the sliding lever portion 31 and the sliding alignment portion 33.

[0058] The sliding lever 31 is used to convert the vertical motion in the alignment drive mechanism 4 into horizontal motion, thereby driving the rotating alignment part 34 to rotate, which in turn drives the sliding alignment part 33 to perform horizontal alignment motion, and finally completes the entire opening and closing alignment action.

[0059] The alignment substrate 32 has a symmetrical structure and is provided with mounting holes 322 on the top for mounting the alignment drive mechanism 4. It is also provided with a first horizontal guide hole 321 and a second horizontal guide hole 323.

[0060] The sliding lever part 31 includes a lever 311 and lever sliding pins 312 fixedly connected to both sides. The lever sliding pins 312 are used to insert into the second horizontal guide hole 323 of the alignment substrate 2 and can slide horizontally along the second horizontal guide hole 323. The top of one of the lever sliding pins 312 is used to connect to the rotating alignment part 34, and can drive the rotating alignment part 34 to rotate when the lever sliding pin 312 moves.

[0061] Preferably, the alignment actuator 3 has a symmetrical structure. Two sliding alignment parts 33 are symmetrically mounted on the alignment base plate 32, and a sliding lever part 31 is mounted on one side of each sliding alignment part 33 to form an alignment group.

[0062] The sliding alignment part 33 has a symmetrical structure, including a tension spring 333, a horizontal sliding pin 334, and two horizontal sliders 331. The two horizontal sliders 331 are arranged opposite each other and connected by two symmetrically positioned tension springs 333. Each horizontal slider 331 is also provided with a horizontal sliding pin 334. The alignment base plate 32 is provided with a first horizontal guide hole 321 for the horizontal sliding pin 334 to pass through, so that the bottom of the horizontal sliding pin 334 can slide horizontally on the alignment base plate 32. The first alignment claw 21 and the second alignment claw 22 of a fixture unit are respectively fixedly connected to the top of the two horizontal sliders 331.

[0063] Preferably, the tension spring 333 is connected to the horizontal slider 331 via a spring retaining pin 332. Two sets of tension springs 333 are installed at the bottom of the spring retaining pin 332, thereby ensuring that the two horizontal sliders 331 have opposing traction forces in the horizontal direction.

[0064] The rotating alignment unit 34 includes a left-hand rotating lever 341 and a right-hand rotating lever 342, which are respectively mounted above an alignment assembly via a bearing.

[0065] When the sliding lever 31 transmits the horizontal motion to the rotary alignment part 34, the left-hand rotary lever 341 and the right-hand rotary lever 342 rotate respectively. The left-hand rotary lever 341 and the right-hand rotary lever 342 are provided with variable center distance grooves, which will drive the sliding alignment part 33 to perform horizontal alignment.

[0066] Preferably, the left-hand rotating lever 341 has a T-shaped structure, with a slot on each of its three sides, namely a first slot 3411, a second slot 3412, and a third slot 3413. The second slot 3412 is opposite in direction to the first slot 3411, while the first slot 3411 and the third slot 3413 are oriented in the same direction. The first slot 3411 and the second slot 3412 are respectively connected to two horizontal sliding pins 334 on the first alignment group, and the third slot 3413 is connected to a lever sliding pin 312 on the first alignment group.

[0067] The right-hand rotating lever 342 has a T-shaped structure, with a slot on each of its three sides: a fourth slot 3421, a fifth slot 3422, and a sixth slot 3423. The fifth slot 3422 faces the opposite direction to the fourth slot 3421, while the fourth slot 3421 and the sixth slot 3423 face the same direction. The fourth slot 3421 and the fifth slot 3422 are connected to two horizontal sliding pins on the second alignment group, and the sixth slot 3423 is connected to a lever sliding pin on the second alignment group. The slots 3411, 3412, 3421, and 3422 are all arc-shaped, i.e., variable center distance slots.

[0068] Because the top of the horizontal sliding pin 334 is in contact with the variable center distance grooves of the left-hand rotating lever 341 and the right-hand rotating lever 342, when the left-hand rotating lever 341 and the right-hand rotating lever 342 rotate simultaneously, they will drive the two opposing horizontal sliders 331 to perform a horizontal opening and closing action. Since the left-hand rotating lever 341 and the right-hand rotating lever 342 are mirror images of each other, the working principle is explained using the left-hand rotating lever 341 as an example. For a detailed structural description, please refer to [reference needed]. Figures 6 to 9 When the left-hand rotary lever 341 rotates counterclockwise around the central axis, it causes the first slot 3411 and the second slot 3412 on both sides to rotate counterclockwise. Because of the variable center distance slot design, the distance from the slot to the center changes from N to M, and the difference between them is the designed opening and closing distance Δ. Therefore, the two horizontal sliders 331 corresponding to the first slot 3411 and the second slot 3412 will perform a closing action with a distance of Δ along with the horizontal sliding pin sliding 334. This solution utilizes this characteristic to complete the key action of active alignment. We can customize the variable center distance slot according to the external tolerance dimensions of the semiconductor device 1, that is, customize the size of Δ.

[0069] The alignment drive mechanism 4 includes a driver fixing base 401, a drive cam rod 402, and a return spring 403. The driver fixing base 401 is fixedly connected to the mounting hole 322 of the alignment substrate 32. The drive cam rod 402 is installed inside the base. The drive cam rod 402 is driven by an external material pick-up suction head mechanism. The return spring 403 is installed at the bottom of the drive cam rod 402. The cam surface of the drive cam rod 402 contacts the lever 311.

[0070] The main function of the driver fixing base 401 is to fix the entire alignment drive mechanism 4 on the alignment base plate 21. Then, the drive cam rod 402 is driven to move downward through the external material pick-up suction head mechanism (not shown). The cam surface on the drive cam rod 402 is in contact with the lever 311. The lever 311 is connected to the horizontal slider 331 through the left-hand rotating lever 341 and the right-hand rotating lever 342. Because there are two tension springs 333 at the bottom of the horizontal sliders 331 on both the upper and lower sides, the head of the lever 311 will always be in contact with the cam surface of the drive cam rod 402. The bottom of the drive cam rod 402 is supported by a return spring 403. Without external force, the drive cam rod 402 will be pushed upward to a high position, thereby ensuring that the alignment mechanism can automatically return to its original position after completing one alignment action and prepare for the next alignment action.

[0071] The drive cam rod 402 has a cam surface at its head, with a diameter that is smaller in the middle and larger at both ends. Its slope can be adjusted according to the characteristics of different semiconductor devices. By designing different cam surface diameters, the opening and closing speed and range of the alignment mechanism can be controlled. The cam surface is designed with a smaller middle and larger ends to allow the alignment mechanism to perform three actions—opening, closing, and gripping—in a single pressing process. This achieves precise alignment without affecting subsequent gripping actions.

[0072] An alignment method for an active alignment device for semiconductor devices consists of three stages: the first stage is the loading stage, the second stage is the active alignment stage, and the third stage is the active release stage.

[0073] In the first stage, the material loading stage, without external force, the drive cam rod 402 is in a high position (idle position) under the action of the return spring 403, such as... Figure 11As shown. Because the lever sliding pin 312 on the side closer to the drive cam rod 402 is in contact with the cam surface of the drive cam rod 402, the lever 311 is pushed to the upper and lower sides. Meanwhile, the other set of lever sliding pins 312 away from the drive cam rod 402 is in contact with the left-hand rotating lever 341 and the right-hand rotating lever 342, thus causing the levers to drive the left-hand rotating lever 341 and the right-hand rotating lever 342 to rotate clockwise and counterclockwise respectively. Furthermore, because the left-hand rotating lever 341 and the right-hand rotating lever 342 are designed with variable center distance grooves, as they rotate, the center distance increases, thereby driving the horizontal sliding pin 334 to move horizontally, which in turn drives the first alignment jaw 21 and the second alignment jaw 22 to open. For example... Figure 11 As shown.

[0074] At this point, the material waiting process is complete, and the machine awaits loading by the loading mechanism. Because alignment jaws 21 and 22 are open at this time, there is a large gap between the semiconductor device 1 and these jaws. The opening size is much larger than the tolerance size of the semiconductor device 1, making it easier for the loading suction head (not shown) to place the semiconductor device 1 into the positioning cavity. This significantly reduces the positioning accuracy requirements of the loading mechanism and greatly improves the stability of the loading process. After the loading mechanism completes its loading action, and the semiconductor device 1 is placed in the positioning cavity and transported to the testing position, the second stage of the process begins: the active alignment stage.

[0075] The second stage is the active alignment stage, such as Figure 13As shown, the material-picking head mechanism (not shown) contacts the top of the drive cam rod 402 during the downward material-picking process, thereby driving the drive cam rod 402 to perform a synchronous downward action. As the downward material-picking action proceeds, during the process of the drive cam rod 402 being pressed down to the middle section, the diameter of the cam surface of the drive cam rod 402 gradually decreases. At the same time, under the action of multiple tension springs 333, the two levers 311 are pushed to the middle side, and the left-hand rotating lever 341 and the right-hand rotating lever 342 rotate counterclockwise and clockwise, respectively. As the rotating levers rotate, the center distance decreases, which drives the horizontal sliding pin 334 to move horizontally, thereby driving the first alignment claw 21 and the second alignment claw 22 to perform a closing action. Because the fixture unit adopts a completely symmetrical design, and the two rotating levers also adopt a symmetrical design, the movement of the fixture unit is completely symmetrical, thereby ensuring that the center of the semiconductor device 1 placed into the material-feeding cavity can be accurately aligned with the center of the cavity. As the closing action is completed, the semiconductor device 1 is pushed to the center of the entire positioning cavity, thus completing the active alignment work. At this time, the pick-up suction head mechanism begins the pick-up action to ensure the accuracy and effectiveness of the pick-up position. The suction head will use vacuum suction or gripping actions to fix the semiconductor device 1, but at this time the pick-up suction head will not perform a pick-up action, but waits for the next active release stage.

[0076] The third stage is the active release stage. Please refer to [the relevant documentation / reference]. Figure 15During this stage, the material-picking head mechanism continues to press down, thereby driving the drive cam rod 402 to continue pressing down synchronously. As the pressing and picking action proceeds, the drive cam rod 402 is pressed down from the middle section to the rear section, and the diameter of the cam surface of the drive cam rod 402 gradually increases. At the same time, under the action of multiple tension springs 333, the two levers 311 are pushed to both sides again, and the left-hand rotating lever 341 and the right-hand rotating lever 342 rotate clockwise and counterclockwise respectively. As the rotating levers rotate, the center distance increases, which drives the horizontal sliding pin 334 to move horizontally, thereby driving the first alignment claw 21 and the second alignment claw 22 to open (note that the gap between the first alignment claw 21 and the second alignment claw 22 at this time is much smaller than the gap during the waiting stage. The opening action is designed here to ensure that the semiconductor device 1 is not interfered with by any external friction during the lifting process of the material-picking head, ensuring the accurate lifting of the semiconductor device 1 and not affecting the picking accuracy). At this stage, the pick-up head mechanism (not shown) raises the semiconductor device 1 to a certain height, ensuring that the semiconductor device 1 is out of the restricted area of ​​alignment jaw 21 and alignment jaw 22. After the drive cam rod 402 is compressed to its final section, the pick-up head (not shown) begins a micro-lifting motion. Note that because alignment jaws 21 and 22 are open at this time, the pick-up head only needs to lift a small distance to allow the semiconductor device 1 to escape the control area of ​​alignment jaws 21 and 22, thus completing the final pick-up action. Afterward, the entire pick-up head mechanism lifts again. Since the semiconductor device 1 is now completely out of the control area of ​​alignment jaws 21 and 22, subsequent opening and closing actions of alignment jaws 21 and 22 will not affect the accurate alignment of the semiconductor device 1. As the pick-up head mechanism completes its lifting action, it also separates from the drive cam rod 402. The drive cam rod 402 will return to the high position under the action of the return spring 403, and the first alignment claw 21 and the second alignment claw 22 will be opened to the maximum, waiting for the next feeding action.

[0077] This completes the entire cycle of actions.

[0078] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An active alignment device for semiconductor devices, characterized in that: This includes alignment fixtures, alignment actuators, and alignment drive mechanisms. The alignment actuator includes a sliding lever, a sliding alignment part, and a rotating alignment part. The sliding lever is used to convert the vertical motion in the alignment drive mechanism into horizontal motion, thereby driving the rotating alignment part to rotate, and then driving the sliding alignment part to perform horizontal alignment motion. Alignment fixtures are used to place semiconductor devices and are driven by sliding alignment parts to complete the alignment of semiconductor devices.

2. The active alignment device for a semiconductor device according to claim 1, characterized in that: The alignment fixture includes two independently configured fixture units. Each fixture unit includes a tray and a first alignment claw and a second alignment claw disposed on top of it. The tray is used to place semiconductor devices and is fixedly connected to the alignment substrate below. The first alignment claw and the second alignment claw are both mounted on the horizontal slider of the sliding alignment unit, and a positioning cavity for placing semiconductor devices is formed between the first alignment claw and the second alignment claw.

3. The active alignment device for a semiconductor device according to claim 1, characterized in that: The alignment actuator also includes an alignment substrate, which is further provided with mounting holes for mounting the alignment drive mechanism.

4. The active alignment device for a semiconductor device according to claim 3, characterized in that: Both the sliding lever and the sliding alignment part are symmetrically mounted on the alignment base plate, and a sliding lever is mounted on one side of each sliding alignment part to form an alignment group. A rotating alignment part is mounted above the alignment group.

5. The active alignment device for a semiconductor device according to claim 2, characterized in that: The sliding lever part includes a lever and lever sliding pins fixedly connected to both sides. The lever sliding pins are used to insert into the second horizontal guide hole of the alignment substrate and can slide horizontally along the second horizontal guide hole. The top of one of the lever sliding pins is used to connect to the rotating alignment part. When the lever sliding pin moves, it can drive the rotating alignment part to rotate.

6. The active alignment device for a semiconductor device according to claim 5, characterized in that: The sliding alignment part has a symmetrical structure, including two horizontal sliders. The two horizontal sliders are arranged opposite each other and are connected by two tension springs in symmetrical positions. Each horizontal slider is also provided with a horizontal sliding pin. The alignment base plate is provided with a first horizontal guide hole for the horizontal sliding pin to pass through, so that the bottom of the horizontal sliding pin can slide horizontally on the alignment base plate. The first alignment claw and the second alignment claw of a fixture unit are fixedly connected to the top of the two horizontal sliders respectively.

7. The active alignment device for a semiconductor device according to claim 6, characterized in that: The rotary alignment unit includes a left-hand rotary lever and a right-hand rotary lever that are independently arranged. The left-hand rotary lever and the right-hand rotary lever are each mounted above an alignment assembly via a bearing.

8. The active alignment device for a semiconductor device according to claim 7, characterized in that: The left-hand rotating lever has a T-shaped structure with a slot on each of its three sides, designated as the first, second, and third slots. The second slot faces the opposite direction to the first slot, while the first and third slots face the same direction. The first and second slots are connected to two horizontal sliding pins on the first alignment group, and the third slot is connected to a lever sliding pin on the first alignment group. The right-hand rotating lever also has a T-shaped structure with a slot on each of its three sides, designated as the fourth, fifth, and sixth slots. The fifth slot faces the opposite direction to the fourth slot, while the fourth and sixth slots face the same direction. The fourth and fifth slots are connected to two horizontal sliding pins on the second alignment group, and the sixth slot is connected to a lever sliding pin on the second alignment group. The slots of the first, second, fourth, and fifth slots are all center-distance slots.

9. The active alignment device for a semiconductor device according to claim 5, characterized in that: The alignment drive mechanism includes a driver mounting base, a drive cam rod, and a return spring. The driver mounting base is fixedly connected to the mounting hole of the alignment substrate. The drive cam rod is installed inside the base and is driven by an external material pick-up head mechanism. A return spring is installed at the bottom of the drive cam rod. The cam surface of the drive cam rod contacts the lever. The head of the drive cam rod has a cam surface with a diameter that is smaller in the middle and larger at both ends. The slope of the cam surface can be adjusted according to the characteristics of different semiconductor devices.

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