Chip bonding device with chip overturning function

Abstract

The utility model relates to the technical field of chip processing, in particular to a chip jointing device with a chip overturning function, which comprises a panel and a bottom plate, a clamping groove is arranged on the panel, clamping plates are arranged at two ends of the clamping groove, a clamping mechanism for driving the clamping plates to be synchronously closed and opened is arranged on one side surface of the panel facing the bottom plate, and the clamping plate is arranged on the bottom plate. The middle of the clamping groove protrudes to form a platform, a chip is placed on the platform, the chip is clamped and fixed through clamping plates at the two ends, and a fixing frame is arranged outside the panel. According to the utility model, the structure is simple, the chip can be placed in the clamping groove, the lead screw can drive the clamping plate to move at high precision and clamp and position the chip, the overturning mechanism can overturn the chip to enable the welding spot surface of the chip to face the lower substrate, and the second electric push rod can enable the chip to descend, so that the chip can be clamped and positioned. And the welding position is accurately placed in the welding area of the substrate, so that the bonding operation is carried out.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, and specifically to a chip bonding device with chip flipping function. Background Technology

[0002] A chip is a silicon wafer containing integrated circuits. It is small in size and is generally manufactured on the surface of a semiconductor wafer. During the production of chips, they need to be connected to other components and used in combination.

[0003] However, the chip is small, and if the chip needs to be replaced later, the lack of a positioning structure makes it impossible for the chip to be set perpendicularly to the soldering area on the substrate, affecting the connection accuracy between the solder joints on the chip and the solder joints on the substrate, and affecting the bonding quality. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a chip bonding device with a chip flipping function, which can quickly clamp and position the chip, and can automatically flip and lower to complete the bonding operation, so as to solve the problems mentioned in the background art.

[0005] This utility model is achieved through the following technical solution:

[0006] A chip bonding device with a flip chip function includes a front panel and a back panel. The front panel and the back panel are arranged parallel to each other along the z-direction. The front panel has a clamping groove, and clamping plates are respectively provided at both ends of the clamping groove along the x-direction. A clamping mechanism is installed on the side of the front panel facing the back panel, which drives the clamping plates to move closer and open synchronously along the x-direction. A platform is formed by protruding in the middle of the clamping groove along the z-direction. A chip is placed on the platform and is clamped and fixed by the clamping plates at both ends. A fixing frame is provided on the outside of the front panel. A flipping mechanism is installed on the fixing frame to drive the front panel and the chip to rotate. A driving mechanism is installed on the outside of the fixing frame away from the front panel. A positioning groove for placing a substrate is provided on the back panel.

[0007] Wherein, the direction from the panel to the base plate is z, the length direction of the panel is x, and the width direction is y;

[0008] A gap is formed between the side of the clamping plate and the clamping groove to allow the clamping plate to move outward;

[0009] The upper surface of the chip where the solder joints are set protrudes from the surface of the panel.

[0010] As a preferred embodiment, the clamping mechanism includes a first motor, a lead screw, a fixed plate, and a first bearing. The clamping groove has a strip-shaped opening on one side along the x-direction. One end of each clamping plate protrudes along the y-direction to form an adjustment part. The adjustment part extends through the strip-shaped opening to the bottom surface of the panel. A pair of lead screw holes are provided on the adjustment part along the x-direction. The fixed plate is located on the outside of the adjustment part away from the lead screw and is fixedly connected to the bottom of the panel. The first bearing is embedded in the fixed plate. The lead screw is threadedly connected to the corresponding lead screw holes along the x-direction. One end of the lead screw is installed in the inner ring of the first bearing, and the other end is fixedly connected to the shaft of the first motor. The housing of the first motor is installed below the panel.

[0011] As a preferred embodiment, the flipping mechanism includes a second motor, multiple shafts, and multiple second bearings. The fixing frame is arranged in a "U" shape, including a bottom edge extending along the x-direction and two side edges extending along the y-direction. The second bearings are embedded in the two side edges of the fixing frame. The shafts are arranged along the x-direction, with one end of the shaft rotatably connected to the inner ring of the second bearing, and the other end fixedly connected to the panel. The second motor is mounted on the fixing frame, and the shaft of the second motor extends along the x-direction and is fixedly connected to one of the shafts.

[0012] As a preferred embodiment, the drive mechanism includes a first electric push rod, a second electric push rod, and a support frame. One end of the support frame is mounted on the base plate, and the other end is fixedly connected to the second electric push rod. The piston rod of the second electric push rod is arranged along the z-direction and passes through the support frame, and is vertically fixedly connected to the cylinder of the first electric push rod. The piston rod of the first electric push rod is arranged along the y-direction and is vertically fixedly connected to the fixed frame.

[0013] As a preferred embodiment, the screw threads are arranged in opposite directions on both sides of its midpoint along the x-direction.

[0014] As a preferred embodiment, the clamping mechanism, the flipping mechanism, and the driving mechanism are all electrically connected to the microcontroller and the power supply.

[0015] As a preferred option, the second motor is a brake motor.

[0016] The beneficial effects of this utility model are: the utility model has a simple structure, the chip can be placed into the clamping groove, and the clamping plate can be moved with high precision by the lead screw to clamp and position the chip. The flipping mechanism can flip the chip so that the solder joint surface of the chip faces the substrate below, and the second electric push rod can lower the chip until it is accurately placed in the soldering area of ​​the substrate for bonding operation. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a side view of the present invention;

[0019] Figure 3 This is a schematic diagram of the structure of this utility model after the chip is removed;

[0020] Figure 4 This is a schematic diagram of the structure of the clamping plate of this utility model.

[0021] The components are as follows: 1. Panel; 2. Clamping plate; 3. Adjustment part; 4. Chip; 5. Base plate; 6. Positioning groove; 7. Fixing frame; 8. Shaft; 9. Second motor; 10. First electric push rod; 11. Second electric push rod; 12. Support frame; 13. Fixing plate; 14. Lead screw; 15. First motor; 16. Strip opening; 17. Platform; 18. Clamping groove. Detailed Implementation

[0022] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, a chip bonding device with a flip chip function includes a front panel 1 and a base plate 5. The front panel 1 and the base plate 5 are arranged parallel to each other along the z-direction. The front panel 1 is provided with a clamping groove 18. The clamping groove 18 is provided with clamping plates 2 at both ends along the x-direction. A clamping mechanism is installed on the side of the front panel 1 facing the base plate 5 to drive the clamping plates 2 to move closer and open synchronously along the x-direction. The middle of the clamping groove 18 protrudes along the z-direction to form a platform 17. A chip 4 is placed on the platform 17 and is clamped and fixed by the clamping plates 2 at both ends. A fixing frame 7 is provided on the outside of the front panel 1. A flipping mechanism is installed on the fixing frame 7 to drive the front panel 1 and the chip 4 to rotate. A driving mechanism is installed on the outside of the fixing frame 7 away from the front panel 1. The base plate 5 is provided with a positioning groove 6 for placing a substrate.

[0023] The direction from the panel to the base plate is z, the length direction of the panel is x, and the width direction is y.

[0024] A gap is formed between the side of the clamping plate 2 and the clamping groove 18 to allow the clamping plate 2 to move outward.

[0025] The upper surface of the chip 4, where the solder joints are located, protrudes from the surface of the panel 1, ensuring full contact between the chip and the substrate and preventing the panel from obstructing the bonding process and affecting the bonding quality.

[0026] Preferably, the clamping mechanism includes a first motor 15, a lead screw 14, a fixing plate 13, and a first bearing. The clamping groove 18 has a strip-shaped opening 16 on one side along the x-direction. One end of each clamping plate 2 protrudes along the y-direction to form an adjustment part 3. The adjustment part 3 extends through the strip-shaped opening 16 to the bottom surface of the panel 1. A pair of lead screw holes are provided on the adjustment part 3 along the x-direction. The fixing plate 13 is located on the outside of the adjustment part 3 away from the lead screw 14 and is fixedly connected to the bottom of the panel 1. The first bearing is embedded in the fixing plate 13. The lead screw 14 is threadedly connected to the corresponding lead screw holes along the x-direction. One end of the lead screw 14 is installed in the inner ring of the first bearing, and the other end is fixedly connected to the shaft of the first motor 15. The housing of the first motor 15 is installed below the panel 1.

[0027] Preferably, the flipping mechanism includes a second motor 9, multiple shafts 8, and multiple second bearings. The fixing frame 7 is arranged in a "U" shape, including a bottom edge extending along the x direction and two side edges extending along the y direction. The second bearings are embedded in the two side edges of the fixing frame 7. The shafts 8 are arranged along the x direction, with one end of the shaft 8 rotatably connected to the inner ring of the second bearing, and the other end fixedly connected to the panel 1. The second motor 9 is mounted on the fixing frame 7, and the shaft of the second motor 9 extends along the x direction and is fixedly connected to one side of the shaft 8.

[0028] Preferably, the drive mechanism includes a first electric push rod 10, a second electric push rod 11, and a support frame 12. One end of the support frame 12 is mounted on the base plate 5, and the other end is fixedly connected to the second electric push rod 11. The piston rod of the second electric push rod 11 is arranged along the z-direction and passes through the support frame 12, and is vertically fixedly connected to the cylinder of the first electric push rod 10. The piston rod of the first electric push rod 10 is arranged along the y-direction and is vertically fixedly connected to the fixed frame 7.

[0029] Preferably, the screw 14 has its threads arranged oppositely on both sides of its midpoint along the x-direction.

[0030] Preferably, the clamping mechanism, the flipping mechanism, and the driving mechanism are all electrically connected to the microcontroller and the power supply.

[0031] Preferably, both the panel 1 and the base plate 5 are made of insulating plastic material to avoid electrical contact with the chip or substrate.

[0032] Preferably, the second motor is a brake motor, which can position the rotated panel so that the panel is in a horizontal state.

[0033] The working principle of this utility model is as follows:

[0034] The first electric push rod can push the panel back and forth. After the chip is soldered to the substrate, the panel can be moved upward and pushed backward to remove the panel from above the base plate, leaving the area above the base plate open and facilitating the disassembly and assembly of the substrate.

[0035] In use, the substrate is placed into the positioning groove 6 of the base plate, the chip can be placed into the clamping groove 18 and placed on the platform 17. The chip 4 can be pushed upward through the platform 17, so that the solder joints on the chip 4 protrude from the surface of the panel 1. The clamping mechanism is activated, and the first motor 15 is started. The start of the first motor 15 drives the lead screw 14. The rotation of the lead screw 14 drives the adjustment part 3, so that the adjustment part 3 moves inward synchronously along the strip opening 16. The movement of the adjustment part 3 drives the clamping plate 2. The inward clamping plate 2 can clamp and fix the chip 4.

[0036] Then start the second motor 9. The start of the second motor 9 drives the rotating shaft. The rotation of the rotating shaft drives the panel 1 and the chip 4. The panel 1 and the chip 4 can be flipped synchronously until the solder joints on the chip face the substrate.

[0037] After the above is completed, the second electric push rod 11 is activated, causing the piston rod of the second electric push rod 11 to extend. The movement of the piston rod drives the first electric push rod 10, the fixing frame 7 and the panel 1. The panel 1 can drive the chip 4, so that the chip 4 can descend stably until it contacts the substrate and is set up for bonding.

[0038] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions conceived without inventive effort should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope defined in the claims.

Claims

1. A chip bonding device with chip flipping function, characterized in that: The device includes a panel (1) and a base plate (5). The panel (1) and the base plate (5) are arranged parallel to each other along the z direction. The panel (1) is provided with a clamping groove (18). The clamping groove (18) is provided with clamping plates (2) at both ends along the x direction. A clamping mechanism is installed on the side of the panel (1) facing the base plate (5) to drive the clamping plates (2) to move and open synchronously along the x direction. A platform (17) is formed by protruding in the middle of the clamping groove (18) along the z direction. A chip (4) is placed on the platform (17) and the chip (4) is clamped and fixed by the clamping plates (2) at both ends. A fixing frame (7) is provided on the outside of the panel (1). A flipping mechanism is installed on the fixing frame (7) to drive the panel (1) and the chip (4) to rotate. A driving mechanism is installed on the outside of the fixing frame (7) away from the panel (1). A positioning groove (6) for placing a substrate is provided on the base plate (5). Wherein, the direction from the panel to the base plate is z, the length direction of the panel is x, and the width direction is y; A gap is formed between the side of the clamping plate (2) and the clamping groove (18) for the clamping plate (2) to move outward; The upper surface of the chip (4) with solder joints protrudes from the surface of the panel (1).

2. A chip bonding device with chip flipping function according to claim 1, characterized in that: The clamping mechanism includes a first motor (15), a lead screw (14), a fixing plate (13), and a first bearing. The clamping groove (18) has a strip-shaped opening (16) on one side along the x direction. One end of each clamping plate (2) protrudes along the y direction to form an adjustment part (3). The adjustment part (3) extends through the strip-shaped opening (16) to the bottom surface of the panel (1). A pair of lead screw holes are provided on the adjustment part (3) along the x direction. The fixing plate (13) is located on the outside of the adjustment part (3) away from the lead screw (14) and is fixedly connected to the bottom of the panel (1). The first bearing is embedded in the fixing plate (13). The lead screw (14) is threadedly connected to the corresponding lead screw holes along the x direction. One end of the lead screw (14) is installed in the inner ring of the first bearing, and the other end is fixedly connected to the shaft of the first motor (15). The housing of the first motor (15) is installed below the panel (1).

3. A chip bonding device with chip flipping function according to claim 1, characterized in that: The flipping mechanism includes a second motor (9), multiple shafts (8) and multiple second bearings. The fixed frame (7) is arranged in a "U" shape, including a bottom edge extending along the x direction and two sides extending along the y direction. The second bearings are embedded in the two sides of the fixed frame (7). The shafts (8) are arranged along the x direction. One end of the shaft (8) is rotatably connected to the inner ring of the second bearing, and the other end is fixedly connected to the panel (1). The second motor (9) is mounted on the fixed frame (7). The shaft of the second motor (9) extends along the x direction and is fixedly connected to the shaft (8) on one side.

4. A chip bonding device with chip flipping function according to claim 1, characterized in that: The drive mechanism includes a first electric push rod (10), a second electric push rod (11), and a support frame (12). One end of the support frame (12) is mounted on the base plate (5), and the other end is fixedly connected to the second electric push rod (11). The piston rod of the second electric push rod (11) is arranged along the z direction and passes through the support frame (12), and is vertically fixedly connected to the cylinder of the first electric push rod (10). The piston rod of the first electric push rod (10) is arranged along the y direction and is vertically fixedly connected to the fixed frame (7).

5. A chip bonding device with chip flipping function according to claim 2, characterized in that: The screw (14) has its threads on both sides of the center in the x direction, with the center point as the center point.

6. A chip bonding apparatus with a flip chip function according to claim 1, characterized in that: The clamping mechanism, flipping mechanism, and drive mechanism are all electrically connected to the microcontroller and the power supply.

7. A chip bonding apparatus with a flip chip function according to claim 1, characterized in that: The second motor is a brake motor.

Images