Large-current welding-free terminal
By using a spindle-shaped, solderless terminal, the instability and high cost of connectors caused by traditional soldering methods are solved, achieving stability and durability for high current transmission and reducing manufacturing costs.
Patent Information
- Application Number
- CN202423139383.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-19
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2034-12-19
AI Technical Summary
Traditional welding methods for manufacturing high-current connectors have problems such as complex processes, high costs, unstable connections, and poor durability. In particular, terminals with a thickness of 1.2 to 1.5 mm are prone to deformation or damage, and the heat during high-current transmission can cause the solder joints to fail.
The solderless terminal features a shuttle-shaped design, including a pre-insertion area, a press-in area, and a strength area. Combined with flexible through-holes and guide bevels, it ensures stable connection between the terminal and the PCB board. Conductivity is achieved through copper-plated holes, avoiding stress and heat concentration.
It achieves stability and durability in high current transmission, reduces manufacturing costs, avoids the complexity and thermal stress damage of traditional welding, and extends service life.
Smart Images

Figure CN223552716U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of connector technology, and in particular to a high-current solderless terminal. Background Technology
[0002] In the electronics manufacturing industry, the demand for high-current connectors is growing rapidly with the increasing demand for current. This is particularly true in fields such as automotive, power management, and industrial control, where connectors capable of stably transmitting high currents of 40–60A are required. Traditional connection methods, such as soldering, while meeting current transmission requirements to some extent, suffer from drawbacks including complex processes, high costs, and difficulty in repair. Furthermore, for terminals with a thickness in the range of 1.2–1.5 mm, traditional soldering may introduce thermal stress during manufacturing, leading to terminal deformation or damage, thus affecting the stability and reliability of the connection. In addition, the heat generated during high-current transmission can also cause solder joint failure, further reducing the durability of the connection. Utility Model Content
[0003] In view of this, the purpose of this utility model is to provide a high-current solderless terminal with strong current transmission capability, high connection stability and low manufacturing cost.
[0004] To achieve the above objectives, this utility model employs a high-current solderless terminal comprising a base and a plug-in portion connected to each other. The base is located above the plug-in portion. The plug-in portion is spindle-shaped and is divided into a pre-insertion area, a pressing area, and a strength area from bottom to top. The pre-insertion area is located at the bottom of the plug-in portion and has a guide portion extending from the lower end of the pressing area. The top of the guide portion forms an insertion portion that facilitates PCB board insertion. The top of the insertion portion has a bevel. The pressing area is located above the pre-insertion area and has an elastic through-hole at its center. The upper and lower ends of the elastic through-hole are both arc surfaces, and the radius of the lower arc surface is smaller than the radius of the upper arc surface. Arc-shaped elastic portions are formed on both sides of the elastic through-hole. The strength area is located above the pressing area.
[0005] The beneficial effects of the above structure are as follows: the shuttle-shaped design of the connector, divided into a pre-insertion area, a pressing area, and a strength area from bottom to top, allows the terminal to be gradually guided and stably connected when inserted into the PCB board. The flexible through-hole design not only ensures good contact between the terminal and the PCB board, but also increases the tightness and stability of the contact through the difference in radius of the upper and lower arc surfaces. The setting of the strength area enhances the overall strength and durability of the terminal, enabling it to withstand the heat and mechanical stress generated during high current transmission, thus extending its service life. Its solderless design avoids the process complexity and cost problems brought about by traditional soldering methods, reducing manufacturing costs.
[0006] This utility model is further configured such that both the inner and outer surfaces of the elastic part are curved. This curved design of the inner and outer surfaces of the elastic part more effectively disperses the stress and heat generated during high current transmission, preventing terminal deformation or damage caused by stress concentration.
[0007] This invention further features a guide bevel on the outer side of the guide section. This guide bevel design allows the terminal to be gradually guided and smoothly inserted into the plating hole during insertion into the PCB board, effectively reducing resistance and difficulty during insertion.
[0008] This utility model is further configured such that the insertion part has a chamfered outer peripheral surface on all four sides. This chamfered outer peripheral surface design allows the terminal to enter the plating hole more smoothly during insertion into the PCB board, reducing resistance caused by shape mismatch.
[0009] This invention is further configured with corresponding mating plated holes on the PCB board, the inner walls of which are covered with copper foil. The copper foil covering the inner walls of the plated holes has excellent conductivity, ensuring smooth transmission of large current between the terminals and the PCB board, and reducing resistance and heat caused by poor contact. Attached Figure Description
[0010] Figure 1 This is a structural schematic diagram of an embodiment of the present utility model.
[0011] Figure 2 This is a schematic diagram of the state of the PCB board not being pressed in according to an embodiment of the present invention.
[0012] Figure 3 This is a schematic diagram of the state after the PCB board is pressed into the present invention.
[0013] Figure 4 yes Figure 3 AA sectional view. Detailed Implementation
[0014] like Figures 1-4As shown, an embodiment of this utility model provides a high-current solderless terminal, including a base 1 and a plug-in portion 2 connected to each other. The base 1 is located above the plug-in portion 2 and is used to provide stable support and connection interface. The plug-in portion 2 has a spindle-shaped design, which helps to provide gradual guidance and stable mating when inserting into a PCB board 6. The plug-in portion 2 is divided into a pre-insertion area 3, a pressing area 4, and a strength area 5 from bottom to top. The pre-insertion area 3 is located at the bottom end of the plug-in portion 2 and has a guide portion 31 extending from the lower end of the pressing area 4. The top end of the guide portion 31 forms an insertion portion 32 to facilitate the insertion of the PCB board 6. The top of section 32 has a bevel 321. The design of the bevel 321 helps guide the PCB board 6 smoothly into the plating hole 61 and reduces the resistance during insertion. The pressing area 4 is located above the pre-insertion area 3, and a flexible through hole 41 is opened in its center. The upper and lower ends of the flexible through hole 41 are both arc surfaces. This design helps to provide better elasticity and tightness of contact when inserting the PCB board 6. The radius of the lower arc surface 411 is smaller than the radius of the upper arc surface 412. This difference design helps to provide a gradual compression and fixation effect during insertion. Arc-shaped elastic sections 42 are formed on both sides of the flexible through hole 41. These elastic portions 42 can deform and return to their original shape when subjected to external force, thus providing strong elastic recovery force. The strength zone 5 is located above the pressing zone 4 to provide additional strength and stability. The design of the strength zone 5 helps ensure that the terminal will not deform or be damaged when subjected to the heat and mechanical stress generated during high current transmission. The inner and outer surfaces of the elastic portions 42 are both arc-shaped. This design helps to more effectively disperse the stress and heat generated during high current transmission, avoiding terminal deformation or damage caused by stress concentration. The outer surface of the guide portion 31 is a guide slope. This design allows the terminal to... During insertion into the PCB board 6, the terminal can be gradually guided and smoothly enter the plating hole 61, effectively reducing the resistance and difficulty of insertion. The insertion part 32 has a chamfered outer peripheral surface on all four sides. This design allows the terminal to enter the plating hole 61 more smoothly during insertion into the PCB board 6, reducing the resistance caused by shape mismatch. The PCB board 6 has corresponding plating holes 61 for insertion. The inner wall of the plating hole 61 is covered with copper foil 62. Copper foil 62 has excellent conductivity, which can ensure smooth transmission of large current between the terminal and the PCB board 6, reducing the resistance and heat caused by poor contact.
[0015] Of course, in addition to the above embodiments, this utility model may have other various embodiments. Without departing from the essential technical solution of this utility model, those skilled in the art can make various corresponding changes and modifications based on this utility model, and these changes or modifications are equivalent to the technical solution in this patent. Therefore, these corresponding changes and modifications should all fall within the protection scope of the appended claims of this utility model, and the utility model creation is in line with the applicant's actual R&D capabilities and resource conditions.
Claims
1. A high-current solderless terminal, characterized in that: The device includes an interconnected base and a connector. The base is located above the connector. The connector is spindle-shaped and is divided into a pre-insertion area, a pressing area, and a strength area from bottom to top. The pre-insertion area is located at the bottom of the connector and has a guide portion extending from the lower end of the pressing area. The top of the guide portion forms an insertion portion to facilitate the insertion of a PCB board. The top of the insertion portion has a bevel. The pressing area is located above the pre-insertion area and has an elastic through hole in its center. The upper and lower ends of the elastic through hole are both arc surfaces, and the radius of the lower arc surface is smaller than the radius of the upper arc surface. Arc-shaped elastic portions are formed on both sides of the elastic through hole. The strength area is located above the pressing area.
2. The high-current solderless terminal according to claim 1, characterized in that: Both the inner and outer surfaces of the elastic part are curved surfaces.
3. The high-current solderless terminal according to claim 1 or 2, characterized in that: The outer surface of the guide is a guide slope.
4. The high-current solderless terminal according to claim 3, characterized in that: The insertion part has a chamfered outer peripheral surface on all four sides.
5. The high-current solderless terminal according to claim 4, characterized in that: The PCB board has corresponding plating holes for insertion, and the inner wall of the plating holes on the PCB board is covered with copper foil.