U-shaped Pin-free surface-mounted device capable of reducing reject ratio

Abstract

The utility model relates to a surface-mounted device, in particular to a U-shaped Pin-free surface-mounted device capable of reducing the reject ratio. The U-shaped Pin-free surface-mounted device capable of reducing the reject ratio comprises a component body, the component body is a square plastic plate, a U-shaped groove is formed in the middle of the component body, and the component body is in a U shape. The U-shaped groove in the U-shaped structure of the component body can disperse stress, stress concentration caused by thermal expansion or mechanical pressure is reduced, the reject ratio can be reduced, and the electrical performance and the mechanical strength of the component cannot be affected.

Description

Technical Field

[0001] This utility model relates to a surface mount device, and more particularly to a U-shaped pinless surface mount device that reduces the defect rate. Background Technology

[0002] Pinless surface mount devices, also known as leadless surface mount components, are a type of simple electronic component designed primarily for surface mount technology. Electronic components play a variety of important roles in circuits, including but not limited to voltage switching, signal generation, signal amplification, signal conversion, on / off switching, and voltage control.

[0003] When mounting surface-mount components onto a circuit board, the bonding quality between the components and the substrate directly affects the stability and reliability of the product. If problems such as short circuits in the solder pads or poor contact of the pins occur after the surface-mount components are installed, it may lead to a high defect rate during SMD processing. Conventional components are difficult to position during mounting and soldering due to their structure. Cables are often wrapped around the winding end, which makes it difficult to straighten the coils, increasing the complexity of assembly and reducing assembly efficiency. In addition, most components are shaped to fit the substrate shape, which makes it difficult to dissipate heat during later use, thus increasing the product defect rate. Utility Model Content

[0004] To overcome the aforementioned shortcomings, the technical problem of this utility model is to provide a U-shaped pinless surface mount device that reduces the defect rate.

[0005] The technical solution is as follows: A U-shaped pinless surface mount device with reduced defect rate, comprising a component body, which is a square plastic plate, with a U-shaped groove in the middle of the component body, and the component body is U-shaped.

[0006] Furthermore, the surface mount device also includes L-shaped pillars. Multiple L-shaped pillars are evenly connected to both sides of the U-shaped groove. The L-shaped pillars on both sides are symmetrically distributed, and the bottom surface of the L-shaped pillars is on the same horizontal plane as the bottom surface of the component body.

[0007] Furthermore, surface mount devices also include heat sinks, with heat sinks mounted on the top surface of the component body.

[0008] Furthermore, two winding slots are provided on both sides of the bottom surface of the component body. The winding slots are vertical rectangular slots, and the winding slots on both sides are symmetrically distributed.

[0009] Furthermore, positioning grooves are provided on both front corners of the component body, and the cutting surfaces of the positioning grooves are inclined.

[0010] Furthermore, the four apex corners of the component body are rounded.

[0011] Compared with the prior art, the present invention has the following advantages: 1. The U-shaped groove in the U-shaped structure of the component body can disperse stress, reduce stress concentration caused by thermal expansion or mechanical pressure, reduce the defect rate, and will not affect the electrical performance and mechanical strength of the device.

[0012] 2. The U-shaped structure of the component body, in conjunction with the positioning groove, helps to position and align the component during assembly. Cables can pass through the winding groove, leaving space for cable positioning, which is beneficial for installation and use.

[0013] 3. The U-shaped design of the component body makes the device more compact and suitable for circuit boards with limited space. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the first three-dimensional structure of this utility model.

[0015] Figure 2 This is a schematic diagram of the second three-dimensional structure of the present invention.

[0016] Figure 3 This is a front view of the planar structure of this utility model.

[0017] Figure 4 This is a top view of the planar structure of this utility model.

[0018] Figure labeling: 1-Component body, 2-U-shaped groove, 3-Wound groove, 4-L-shaped post, 5-Positioning groove, 6-Heat sink. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Example: A U-shaped pinless surface mount device with reduced defect rate, such as... Figures 1-4 As shown, it includes a component body 1, which is a square plastic plate. A U-shaped groove 2 is provided in the middle of the component body 1. The component body 1 is U-shaped and the four apex corners of the edge of the component body 1 are rounded surfaces.

[0021] like Figures 1-4As shown, the surface mount device also includes L-shaped posts 4 and heat sinks 6. Multiple L-shaped posts 4 are evenly welded on both sides of the U-shaped groove 2. The L-shaped posts 4 on both sides are symmetrically distributed. The bottom surface of the L-shaped posts 4 is on the same horizontal plane as the bottom surface of the component body 1. The heat sink 6 is installed on the top surface of the component body 1. Two winding grooves 3 are opened on both sides of the bottom surface of the component body 1. The winding grooves 3 are vertical rectangular grooves used for winding cables. The winding grooves 3 on both sides are symmetrically distributed. Positioning grooves 5 are provided on the left and right corners of the front side of the component body 1. The cutting surface of the positioning grooves 5 is oblique. The positioning grooves 5 are used to assist in the installation of this device.

[0022] When installing this device, the positioning slot 5 can be used to locate the position of the component body 1. The cable can then pass through the winding slot 3 on the bottom of the component body 1. The L-shaped post 4 replaces the pin, reducing the pin installation process. The U-shaped structure of the component body 1 can enhance the structure of the device, making it more stable during assembly and use, and reducing damage caused by stress. At the same time, when the electrical device is running, it will generate some heat. The heat sink 6 can absorb the heat and carry it outward. The U-shaped slot 2 can serve as a heat dissipation channel to help the internal heat dissipate more quickly.

[0023] The above embodiments are merely preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model. Therefore, all equivalent changes made based on the content described in the claims of the present utility model should be included within the scope of the claims of the present utility model.

Claims

1. A U-shaped pinless surface mount device for reducing defect rate, characterized in that it includes... There is a component body (1), which is a square plastic plate. A U-shaped groove (2) is provided in the middle of the component body (1), and the component body (1) is U-shaped. The surface mount device also includes an L-shaped post (4). Multiple L-shaped posts (4) are evenly connected on both sides of the U-shaped groove (2). The L-shaped posts (4) on both sides are symmetrically distributed. The bottom surface of the L-shaped post (4) is on the same horizontal plane as the bottom surface of the component body (1). The surface mount device also includes a heat sink (6), and the heat sink (6) is mounted on the top surface of the component body (1). Two winding grooves (3) are provided on both sides of the bottom surface of the component body (1). The winding grooves (3) are vertical rectangular grooves, and the winding grooves (3) on both sides are symmetrically distributed. The component body (1) has positioning grooves (5) on both front corners, and the cutting surface of the positioning grooves (5) is oblique.

2. The U-shaped pinless surface mount device for reducing defect rate according to claim 1, characterized in that, The four corners of the edge of the component body (1) are rounded.

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