LED device and electronic device

Abstract

The utility model relates to the technical field of semiconductors, in particular to an LED device and an electronic device, the LED device comprises a base, a bonding pad, a dark electroplating layer, an LED chip and a packaging piece, the base comprises a first surface, the bonding pad is arranged on the first surface, the dark electroplating layer is arranged on the bonding pad, and the LED chip is arranged on the first surface. The first surface is provided with a dark electroplated layer, the black degree of the dark electroplated layer meets a preset black degree range, the LED chip is arranged on the dark electroplated layer, the LED chip is electrically connected with the bonding pad, the packaging piece is arranged on the first surface, and the packaging piece covers the dark electroplated layer and the LED chip. The LED device and the electronic device provided by the utility model have the advantages of high contrast ratio, high production efficiency and good quality.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to LED devices and electronic devices. Background Technology

[0002] Light-emitting diodes (LEDs) are commonly used light-emitting devices, widely applied in various electronic devices such as displays. With technological advancements and societal progress, higher demands are placed on the display quality of LED displays. This is especially true for emerging virtual studio shooting, which requires high contrast to achieve more realistic and lifelike results.

[0003] In existing technologies, there are various methods to improve the contrast ratio of LED devices. One method is to achieve a high contrast effect by adding a black adhesive layer to the LED device. However, during the production and curing process of the adhesive layer, uneven settling is prone to occur, which not only leads to low production efficiency of LED devices but also affects device quality. Utility Model Content

[0004] The LED device and electronic apparatus provided in this embodiment of the present invention at least solve the problems of low production efficiency and poor quality of existing LED devices, and have high contrast while having high production efficiency and good quality.

[0005] In a first aspect, the present invention provides an LED device, including a base, the base including a first surface; pads disposed on the first surface; a dark electroplated layer disposed on the pads, the dark electroplated layer having a blackness satisfying a preset blackness range; an LED chip disposed on the dark electroplated layer and electrically connected to the pads; and a package disposed on the first surface, the package covering the dark electroplated layer and the LED chip.

[0006] In one embodiment of this utility model, the dark electroplating layer includes one of a black electroplating layer and a gray electroplating layer.

[0007] In one embodiment of this utility model, the dark electroplating layer is set as a silver-nickel alloy electroplating layer.

[0008] In one embodiment of this invention, the thickness of the dark electroplated layer is set to 10 micrometers to 100 micrometers.

[0009] In one embodiment of the present invention, a functional layer is provided on the dark electroplated layer, the functional layer including a gloss layer and / or a passivation layer.

[0010] In one embodiment of the present invention, the encapsulation component includes an encapsulation bracket, which is annular and surrounds the edge of the dark electroplated layer; and an encapsulation adhesive, which fills the encapsulation bracket.

[0011] In one embodiment of the present invention, an encapsulation groove is provided on the inner wall of the encapsulation bracket, and the encapsulation groove is located at the connection between the encapsulation bracket and the dark electroplated layer.

[0012] In one embodiment of this utility model, the inner wall of the packaging bracket is inclined so that the inner contour area of ​​the packaging bracket gradually decreases in the direction away from the dark electroplated layer.

[0013] In one embodiment of the present invention, the base further includes a second surface, which is disposed opposite to the first surface. An isolation portion is provided in the middle region of the second surface, and / or an arc-shaped portion is provided at the edge of the second surface.

[0014] Secondly, this utility model also provides an electronic device, including the LED device described in any one of the above claims.

[0015] Compared with the prior art, the above-mentioned technical solution of this utility model has the following beneficial effects:

[0016] The LED device described in this invention replaces the adhesive layer in the prior art by setting a dark electroplated layer on the solder pads. First, the dark electroplated layer ensures high blackness, thereby improving the contrast of the LED device, enhancing display effect, and resulting in superior display consistency. Second, the dark electroplated layer has a certain reflective effect, thus effectively reducing light decay and enabling the LED device to have high brightness. Finally, the dark electroplated layer has advantages such as strong adhesion, stable performance, and uniform plating, effectively improving the production efficiency and product quality of the LED device and enabling mass production. Attached Figure Description

[0017] The accompanying drawings, which are included to provide a further understanding of the present invention and constitute a part of this invention, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0018] Figure 1 This is a cross-sectional view of the LED device in a preferred embodiment of the present invention.

[0019] Figure 2 This is a partial cross-sectional view of the LED device in a preferred embodiment of the present invention.

[0020] Figure 3This is one of the top views of the LED device in a preferred embodiment of this utility model.

[0021] Figure 4 This is the second top view schematic diagram of the LED device in a preferred embodiment of this utility model.

[0022] The above-mentioned figures include the following reference numerals: 10, base; 11, first surface; 12, second surface; 121, isolation portion; 122, arc-shaped portion; 20, pad; 21, pin; 30, dark electroplated layer; 31, bright layer; 32, passivation layer; 40, LED chip; 41, first chip; 42, second chip; 43, third chip; 50, package; 51, package bracket; 511, package groove; 52, encapsulating adhesive. Detailed Implementation

[0023] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.

[0024] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to the present invention. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0025] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0026] It should be noted that in existing LED devices, in order to pursue high contrast, there is a method of encapsulation by applying a single application of encapsulating adhesive containing black filler, which can improve the contrast of LED devices.

[0027] In photography, blackness refers to the degree to which a material absorbs light; it is a dimensionless quantity. Blackness is typically calculated using the intensity of light transmitted through the material and the intensity of light incident on the material. In imaging, blackness is related to contrast and affects image sharpness and detail.

[0028] Contrast ratio refers to the difference in brightness between the brightest and darkest parts of an image. It's a crucial indicator of display performance, directly impacting the user's visual experience. High contrast ratio generally means better image quality, as it provides sharper details and richer colors.

[0029] However, this method also has its problems. For example, there is a double-layer adhesive encapsulation method where a layer of adhesive is first applied to the pads, which reacts chemically with the pads to form a black background layer. Then, a layer of encapsulating adhesive is applied on top of this black background layer. However, because the blackness of the first layer of adhesive is uncontrollable, and the uniformity of the adhesive surfaces of the two layers is also uncontrollable, LED device production efficiency is low, and the display is prone to severe pitting, dark spots, and even full-screen color differences. Furthermore, the display also experiences brightness decay, resulting in poor overall quality.

[0030] To solve the above problems, refer to Figure 1 As shown, this utility model provides an LED device, including a base 10, a pad 20, a dark electroplated layer 30, an LED chip 40, and a package 50.

[0031] The base 10 primarily serves a load-bearing function. Considering the insulation requirements, the base 10 is preferably made of PPA (polyphthalamide). The base 10 includes a first surface 11 for mounting corresponding components.

[0032] The pad 20 is primarily used for electrical connections and is made of conductive metal. The pad 20 is disposed on the first surface 11. Preferably, the pad 20 is made of copper and / or iron. The pad 20 includes pins 21, which are divided into cathode and anode pins. The pad 20 is electrically connected to external components, such as a circuit board, through the pins 21. Preferably, the two types of pins 21 are disposed opposite each other on both sides of the base 10 to avoid contact.

[0033] The dark electroplated layer 30 is the core of improving LED devices. It can ensure high blackness, thereby improving the contrast of LED devices, improving display effect, and making display consistency better.

[0034] A dark electroplated layer 30 is disposed on the pad 20. The dark electroplated layer 30 is obtained through electroplating. Preferably, before electroplating on the pad 20, a pretreatment is performed to remove impurities and dirt from the surface of the pad 20 using chemical and physical methods. After the pretreatment is completed, electroplating is performed on the surface of the pad 20 using an electroplating solution to form the dark electroplated layer 30. Exemplarily, the electroplating solution includes soluble silver salts, acids, surfactants, brighteners, and pH adjusters, etc.

[0035] During electroplating, based on the principle of electrochemical deposition, the target substance in the electroplating solution, such as electroplated silver, is used as the anode, and the pad 20 is used as the cathode. Through an oxidation-reduction reaction, it is electroplated onto the surface of the pad 20. Because it is an electroplated layer, it will not chemically react with the encapsulating adhesive 52 of the package 50, making it very stable. Simultaneously, the dark electroplated layer 30 also has a certain reflective effect, effectively reducing light decay. In summary, compared to the adhesive layer in existing technologies, the dark electroplated layer 30 obtained by electroplating has advantages such as strong adhesion, stable performance, and uniform plating, effectively improving the production efficiency and product quality of LED devices, and avoiding problems such as pitting, dark spots, overall screen color difference, or brightness decay. (Refer to...) Figure 4 As shown, the dark electroplated layer 30 enables LED devices to have high contrast and high brightness.

[0036] The blackness of the dark electroplated layer 30 meets a preset blackness range. This preset blackness range is an empirical value, and those skilled in the art can set different preset blackness ranges according to actual needs. The definition of blackness has been explained above and will not be repeated here. For example, in some embodiments, the dark electroplated layer 30 is set as a black electroplated layer. Alternatively, in some embodiments, the dark electroplated layer 30 is set as a gray electroplated layer. Black includes, but is not limited to, deep black and jet black, and gray includes, but is not limited to, dark gray, dark charcoal gray, and charcoal gray. It should be noted that regardless of the specific color of the dark electroplated layer 30, as long as its blackness meets the preset blackness range to improve the contrast of the LED device, it is acceptable.

[0037] In actual testing of LED devices, the gamma value (also known as GAM value) is used to reflect the performance of the LED device. The gamma value is a parameter describing the non-linear relationship between the input signal and the output brightness of a display or display device. The higher the gamma value, the higher the light reflectivity of the LED device, and the weaker the blackness effect. Preferably, by setting a suitable dark electroplating layer 30, the gamma value of the LED device is made between 0.5 and 1 to meet the usage requirements.

[0038] LED chip 40 is the source of light emission. LED chip 40 is disposed on a dark electroplated layer 30. Exemplarily, LED chip 40 is fixed using die-attach adhesive and then baked and cured; this fixing method has good fixing effect. LED chip 40 is electrically connected to pad 20 to facilitate power transmission and light emission. Those skilled in the art can configure LED chip 40 according to actual needs to meet the requirements of different electronic devices. Exemplarily, LED chip 40 includes a first chip 41, a second chip 42, and a third chip 43. The first chip 41 is used to emit red light, the second chip 42 is used to emit green light, and the third chip 43 is used to emit blue light. Of course, it is also possible to use only one or both of the first chip 41, the second chip 42, and the third chip 43.

[0039] The package 50 is disposed on the first surface 11, and the package 50 covers the dark electroplated layer 30 and the LED chip 40 to achieve the effect of encapsulation and protection.

[0040] The LED device of this invention replaces the adhesive layer in the prior art by providing a dark electroplated layer 30 on the solder pads 20. First, the dark electroplated layer 30 ensures high blackness, thereby improving the contrast of the LED device, enhancing display performance, and resulting in superior display consistency. Second, the dark electroplated layer 30 has a certain reflective effect, effectively reducing light decay and enabling the LED device to have high brightness. Finally, the dark electroplated layer 30 has advantages such as strong adhesion, stable performance, and uniform plating, effectively improving the production efficiency and product quality of the LED device and enabling mass production.

[0041] In some embodiments of the LED device described in this utility model, the dark electroplating layer 30 is set as a black silver-nickel alloy electroplating layer. The black silver-nickel alloy electroplating layer has high blackness, which can meet the high contrast requirement of the LED device. Of course, it is not limited to electroplating silver-nickel alloy; in some other embodiments, other metals or alloys can also be electroplated as needed. For example, any one or a combination of more than one of acid copper, alkali copper, silver, gold, nickel, chromium, zinc, and platinum can be electroplated.

[0042] Reference Figure 2 As shown, in some embodiments of the LED device described in this utility model, the thickness of the dark electroplated layer 30 is set to 10 micrometers to 100 micrometers. By setting the dark electroplated layer 30 within a suitable thickness range, the performance of the LED device can be improved, giving it good reflective effect, reducing light decay, and increasing brightness. When using die-attach adhesive to fix the LED chip 40, a dark electroplated layer 30 of suitable thickness can improve the adhesion to the die-attach adhesive. In addition, it also facilitates electrode wire bonding. Finally, a dark electroplated layer 30 of suitable thickness can improve corrosion resistance.

[0043] Those skilled in the art can set the thickness of the dark electroplated layer 30 according to actual needs, such as 10 micrometers, 20 micrometers, 30 micrometers, 40 micrometers, 50 micrometers, 60 micrometers, 70 micrometers, 80 micrometers, 90 micrometers, 100 micrometers, etc.

[0044] Those skilled in the art can set the coverage area of ​​the dark electroplated layer 30 according to actual needs, for example, covering the entire pad 20, or only covering a portion of it.

[0045] Reference Figure 2 As shown, in some embodiments of the LED device described in this utility model, a functional layer is provided on the dark electroplated layer 30, the functional layer including a bright layer 31 and / or a passivation layer 32.

[0046] For example, after electroplating, the dark electroplated layer 30 is treated with a brightener to form a bright layer 31, which improves color saturation and further enhances the reflective effect. The dark electroplated layer 30 is then treated with a passivating agent to form a passivation layer 32, improving its stability. Preferably, both the bright layer 31 and the passivation layer 32 are provided simultaneously for optimal effect.

[0047] Reference Figure 1 As shown, in some embodiments of the LED device described in this utility model, the encapsulation component 50 includes an encapsulation bracket 51 and encapsulating adhesive 52. The encapsulation bracket 51 is annular and surrounds the edge of the dark electroplated layer 30, serving a supporting and protective function. Preferably, the material of the encapsulation bracket 51 is PPA. Preferably, the encapsulation bracket 51 is integrally formed with the base 10. The encapsulating adhesive 52 fills the encapsulation bracket 51 to cover the LED chip 40 and the dark electroplated layer 30, achieving encapsulation. Preferably, during production, a dispensing machine is used to apply the encapsulating adhesive 52, and after dispensing, it is cured by heating.

[0048] Preferably, the encapsulating adhesive 52 contains resin and inorganic filler, has excellent matte effect and high light transmittance, so as to make the LED device bright.

[0049] Furthermore, refer to Figure 1 As shown, in some embodiments of the LED device described in this utility model, an encapsulation groove 511 is provided on the inner wall of the encapsulation bracket 51, and the encapsulation groove 511 is located at the connection between the encapsulation bracket 51 and the dark electroplated layer 30. By providing this encapsulation groove 511, the internal stress of the encapsulating adhesive 52 can be better released, and the airtightness of the entire encapsulation can also be improved, thereby improving product quality.

[0050] Furthermore, refer to Figure 1As shown, in some embodiments of the LED device described in this utility model, the inner wall of the encapsulation bracket 51 is inclined so that the inner contour area of ​​the encapsulation bracket 51 gradually decreases along the direction away from the dark electroplated layer 30. By setting this structure, the performance of the LED device is improved while providing good protection.

[0051] Reference Figure 1 As shown, the LED device of this utility model includes a base 10 further comprising a second surface 12, which is disposed opposite to the first surface 11.

[0052] In some embodiments, an isolation portion 121 is provided in the central region of the second surface 12. The isolation portion 121 is used to isolate the cathode and anode pins 21, preventing the pins 21 of the two polarities from contacting each other.

[0053] In some embodiments, the edge of the second surface 12 is provided with an arc-shaped portion 122. The arc-shaped portion 122 is provided to facilitate bending of the pin 21, thereby making the bent pin 21 flatter, improving the bonding effect of the patch, and reducing the risk of subsequent lamp drop; in addition, it can also prevent damage or breakage of the pin 21.

[0054] On the other hand, this utility model also provides an electronic device, including the LED device described in any of the above embodiments. Since the electronic device of this utility model includes the LED device described in the above embodiments, it also possesses all the beneficial effects described therein, and will not be repeated here. The electronic device includes, but is not limited to, computer monitors, mobile phone displays, etc.

[0055] Working principle:

[0056] First, impurities and contaminants on the surface of pad 20 are removed using chemical and physical methods. Second, an electrochemical deposition process is performed using an electroplating solution to form a black silver-nickel alloy plating layer on pad 20. Finally, the silver-nickel alloy plating layer is treated with a brightener and a passivating agent, thus completing the initial preparation.

[0057] Next, PPA is used for injection molding to form the base 10 and the package bracket 51. After injection molding, the leads 21 are bent. Subsequently, die bond adhesive is used to fix the LED chip 40 and then baked to cure. After curing, the device is transferred to the wire bonding station for wire bonding. After the LED chip 40 is set up, a dispensing machine applies encapsulating adhesive 52 inside the package bracket 51, and it is cured by heating to complete the fabrication of the entire LED device.

[0058] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0059] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0060] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An LED device, characterized in that, include: Base, the base including a first surface; A solder pad, wherein the solder pad is disposed on the first surface; A dark electroplated layer is disposed on the pad, and the blackness of the dark electroplated layer meets a preset blackness range; An LED chip is disposed on the dark electroplated layer and electrically connected to the pad; as well as A package is disposed on the first surface, and the package covers the dark electroplated layer and the LED chip.

2. The LED device according to claim 1, characterized in that: The dark electroplated layer includes one of a black electroplated layer and a gray electroplated layer.

3. The LED device according to claim 2, characterized in that: The dark-colored electroplating layer is a silver-nickel alloy electroplating layer.

4. The LED device according to any one of claims 1 to 3, characterized in that: The thickness of the dark electroplated layer is set to be between 10 micrometers and 100 micrometers.

5. The LED device according to any one of claims 1 to 3, characterized in that: A functional layer is provided on the dark electroplated layer, the functional layer including a bright layer and / or a passivation layer.

6. The LED device according to claim 1, characterized in that, The package includes: A packaging bracket, wherein the packaging bracket is configured as a ring and is disposed around the edge of the dark electroplated layer; and Encapsulating adhesive, which fills the encapsulation bracket.

7. The LED device according to claim 6, characterized in that: The inner wall of the packaging bracket is provided with a packaging groove, which is located at the connection between the packaging bracket and the dark electroplated layer.

8. The LED device according to claim 6, characterized in that: The inner wall of the packaging bracket is inclined so that the inner contour area of ​​the packaging bracket gradually decreases in the direction away from the dark electroplated layer.

9. The LED device according to claim 1, characterized in that: The base further includes a second surface, which is disposed opposite to the first surface. An isolation portion is provided in the central region of the second surface, and / or an arc-shaped portion is provided at the edge of the second surface.

10. An electronic device, characterized in that, Includes the LED device as described in any one of claims 1 to 9.

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