Wafer waxing device

Abstract

The utility model discloses a wafer waxing device, which belongs to the technical field of wafer processing and comprises an upper tank body, a wax storage cylinder, a lower tank body, a cylinder cover, a dispensing head and a heating mechanism, the wax storage cylinder is inserted into the upper tank body, the lower tank body is connected to the lower end of the upper tank body, a discharge hole of the wax storage cylinder is arranged in a hole body arranged on the lower tank body, the cylinder cover is connected to the upper tank body, and the dispensing head is arranged on the cylinder cover. The dispensing head is installed on the lower tank body, the hole body is communicated with the feeding end of the dispensing head, and the heating mechanism is connected to the upper tank body and used for heating the upper tank body. The wax storage cylinder is heated through the heating mechanism, so that solid wax in the wax storage cylinder is melted, passes through the discharging hole and then drips onto the wafer through the dispensing head, and due to the fact that the solidifying point of the solid wax is high, the solid wax is solidified and does not flow after an etching pattern on the surface of the wafer is filled with the solid wax, and therefore waxing operation on the wafer with the etching pattern is achieved. And the solidified solid wax does not flow in the pattern, so that the pattern on the surface of the wafer is kept in a state of being filled with the wax all the time.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing technical field, especially relate to a wafer waxing device. BACKGROUND

[0002] Wafer waxing patch process plays a vital role in semiconductor manufacturing, and its processing precision and stability directly affect the performance and quality of the final product. Before rough polishing, fine polishing and other key processing steps, it is crucial to ensure the stable positioning of the wafer.

[0003] At present, the industry often adopts the method of coating the wafer with a wax layer by a waxing machine, and then sticking the wafer to a ceramic disc through the wax layer. In the working process of the existing waxing machine, liquid wax needs to be poured into the wax dripping device of the waxing machine first, and the liquid wax is coated on the wafer surface by the wax dripping device. Since the liquid wax has a certain fluidity, this kind of wax dripping device is more suitable for planar wafers. For wafers with etching patterns on the surface, there will be a problem that the wafer surface pattern cannot be filled, so the applicability of wafers with etching patterns is poor. SUMMARY

[0004] The embodiment of the present application provides a wafer waxing device to solve the technical problem of waxing the wafer with etching patterns on the surface.

[0005] The embodiment of the present application provides a wafer waxing device, which comprises:

[0006] an upper tank body;

[0007] a wax storage cylinder inserted into the upper tank body, the wax storage cylinder being used for storing solid wax;

[0008] a lower tank body connected to the lower end of the upper tank body, the lower tank body being provided with a hole body, and the discharge hole of the wax storage cylinder being arranged in the hole body;

[0009] a cylinder cover connected to the upper tank body and used for closing the upper end of the wax storage cylinder;

[0010] a dispensing head mounted on the lower tank body, the hole body being in communication with the feeding end of the dispensing head;

[0011] a heating mechanism connected to the upper tank body, the heating mechanism being used for heating the upper tank body.

[0012] The beneficial effect of the above embodiment is that the wax storage cylinder is heated by the heating mechanism, so that the solid wax in the wax storage cylinder is melted and dripped onto the wafer through the dispensing head after passing through the discharge hole, and since the solid wax has a high solidification point, it solidifies after filling the etching pattern on the wafer surface and does not flow, thereby achieving the wax filling operation on the wafer with the etching pattern, and the solidified solid wax does not flow in the pattern, so that the pattern on the wafer surface is kept filled with wax at all times.

[0013] On the basis of the above embodiment, the embodiments of the present application can also be improved as follows:

[0014] In one of the embodiments of the present application: the cylinder cover comprises: a cover body connected to the upper tank body, the flange at the upper end of the wax storage cylinder is located above the upper tank body and has a gap between the upper end surface of the upper tank body; a cover is arranged on the cover body; a connecting piece connects the cover and the cover body. The beneficial effect of this step is that the flange has a gap with the upper tank body, which facilitates the taking and placing of the wax storage cylinder.

[0015] In one of the embodiments of the present application: the heating mechanism comprises: a heating plate connected to the upper tank body; and a heating piece inserted into the heating plate. The beneficial effect of this step is that the upper tank body is heated by the heating plate, so that the solid wax in the upper tank body is melted.

[0016] In one of the embodiments of the present application: the inner bottom surface of the lower tank body is a conical structure with a tapered tip pointing downward, the wax storage cylinder extends downward to form a material guide pipe, a discharge hole penetrating the material guide pipe is formed in the center of the bottom surface of the lower tank body, and the material guide pipe is inserted into the corresponding hole in the lower tank body. The beneficial effect of this step is that the liquid wax can flow into the lower tank body.

[0017] In one of the embodiments of the present application: it further comprises: a sealing assembly arranged between the cylinder cover and the wax storage cylinder, between the upper tank body and the lower tank body, and between the wax storage cylinder and the lower tank body. The beneficial effect of this step is that the sealing effect between the components is improved by the sealing assembly to prevent the liquid wax from leaking out.

[0018] In one of the embodiments of the present application: it further comprises: a temperature sensor connected to the lower tank body for detecting the working temperature. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the drawings needed in the specific embodiments or prior art description will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn according to the actual proportions.

[0020] Figure 1A schematic view of a three-dimensional structure of the waxing device on a wafer;

[0021] Figure 2 A schematic view of a two-dimensional structure of the waxing device on a wafer;

[0022] Figure 3 A schematic view of Figure 2 A sectional view along A-A of the waxing device;

[0023] Figure 4 A schematic view of Figure 2 A sectional view along B-B of the waxing device;

[0024] Figure 5 A schematic view of Figure 2 A sectional view along C-C of the waxing device.

[0025] A schematic view of the waxing device on a wafer;

[0026] A schematic view of the waxing device on a wafer;

[0027] A schematic view of the waxing device on a wafer;

[0028] A schematic view of the waxing device on a wafer;

[0029] A schematic view of the waxing device on a wafer;

[0030] A schematic view of the waxing device on a wafer;

[0031] A schematic view of the waxing device on a wafer;

[0032] A schematic view of the waxing device on a wafer;

[0033] A schematic view of the waxing device on a wafer;

[0034] A schematic view of the waxing device on a wafer;

[0035] A schematic view of the waxing device on a wafer; DETAILED DESCRIPTION

[0036] In the present application, unless otherwise explicitly specified and limited, the terms in the present application should be understood in a broad sense, for example, the connection can be fixed connection, or detachable connection or integral, can be directly connected, or indirectly connected through intermediate medium. If it involves power, electronic device, it can also be electrically connected or communication signal connected, etc. For those skilled in the art, different terms in the present application can be understood according to the specific meaning, and the scope of the specific meaning should be limited to the function of the present application.

[0037] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0038] Example 1

[0039] like Figures 1-3 As shown, a wafer waxing device includes: an upper tank 1, a wax storage cylinder 2, a lower tank 3, a cylinder cover 4, a dispensing head 5, and a heating mechanism 6. The wax storage cylinder 2 is inserted into the upper tank 1 and is used to store solid wax. The lower tank 3 is connected to the lower end of the upper tank 1 and has a hole 301. The discharge hole 201 of the wax storage cylinder 2 is inserted into the hole 301. The cylinder cover 4 is connected to the upper tank 1 and is used to seal the upper end of the wax storage cylinder 2. The dispensing head 5 is installed in the lower tank 3 and the hole 301 is connected to the feed end of the dispensing head 5. The heating mechanism 6 is connected to the upper tank 1 and is used to heat the upper tank 1.

[0040] Specifically, such as Figure 1 As shown, a mounting plate is bolted to the back of the upper tank 1, and the wafer waxing device is mounted on the lifting mechanism of the waxing machine via the mounting plate.

[0041] Specifically, such as Figure 3 As shown, the cylinder cover 4 includes: a cover body 401, a sealing cap 402, and a connector 403. The cover body 401 is bolted to the upper tank 1. The flange at the upper end of the wax storage cylinder 2 is located above the upper tank 1 and has a gap with the upper end face of the upper tank 1. The sealing cap 402 is disposed on the cover body 401. The connector 403 connects the sealing cap 402 to the cover body 401. The connector 403 uses a MISUMI pipe fitting clamp. The cylinder cover 4 seals the wax storage cylinder 2 within the upper tank 1 and the lower tank 3. When solid wax needs to be added, the connector 403 is released and the tank cover is opened to add solid wax to the wax storage cylinder 2. The gap between the flange and the upper tank 1 facilitates manual handling of the wax storage cylinder 2.

[0042] Specifically, such as Figure 1As shown, the wax feeding device further comprises a first pipe joint 7 connected to the cylinder cover 4, which is used to discharge the gas in the wax storage cylinder 2 during the wax melting stage and to add high-pressure gas into the wax storage cylinder 2 during the wax dripping stage. The first pipe joint 7 can be connected to an exhaust pipe and a high-pressure gas source through an electromagnetic valve. When gas is generated during the wax melting, the exhaust pipe is switched to discharge the gas. When the wax is dripping, the wax storage cylinder 2 is pressurized by the high-pressure gas source, which facilitates the flow of liquid wax from the wax storage cylinder 2. The high-pressure gas source can be a high-pressure gas source directly configured in the factory or a vacuum pump connected through a pipe to pump high-pressure gas.

[0043] Specifically, as shown in Figure 1 The heating mechanism 6 comprises a heating plate 601 and a heating element 602. The heating plate 601 is connected to the front side of the upper tank body 1 through bolts, and a plurality of installation holes are formed in the upper end surface of the heating plate 601 in the vertical direction. The heating element 602 is an electric heating tube, which is inserted into the installation hole. The upper tank body 1 is heated by the heating plate 601, so that the solid wax in the upper tank body 1 is melted.

[0044] Specifically, as shown in Figure 3 The bottom surface of the lower tank body 3 is in a conical structure with a tapered tip pointing downward. The wax storage cylinder 2 extends downward to form a material guide pipe. A discharge hole 201 is formed in the center of the bottom surface of the lower tank body 3 and penetrates the material guide pipe. The material guide pipe is inserted into a corresponding hole body 301 formed in the lower tank body 3.

[0045] Specifically, as shown in Figure 3 The wax feeding device further comprises a sealing assembly 8 arranged between the cylinder cover 4 and the wax storage cylinder 2, between the upper tank body 1 and the lower tank body 3, and between the wax storage cylinder 2 and the lower tank body 3. The sealing assembly 8 improves the sealing effect between the components to prevent liquid wax from leaking out.

[0046] Specifically, as shown in Figure 3As shown, the sealing assembly 8 comprises: a first sealing ring 801, a second sealing ring 802, a third sealing ring 803, a fourth sealing ring 804, a fifth sealing ring 805, and a sixth sealing ring 806. The upper end surface of the cover body 401 is provided with a first sealing ring 801 groove, and the first sealing ring 801 is compressed in the first sealing ring 801 groove by the cover 402. The inner side of the cover body 401 has a second sealing groove, and the second sealing ring 802 is compressed in the second sealing ring 802 groove by the flange of the wax storage cylinder 2. The inner hole wall of the upper tank body 1 for inserting the wax storage cylinder 2 is provided with a third sealing ring 803 groove and a fourth sealing ring 804 groove, respectively. The third sealing ring 803 and the fourth sealing ring 804 are compressed in the corresponding third sealing ring 803 groove or fourth sealing ring 804 groove by the outer wall of the wax storage cylinder 2. The upper surface of the lower tank body 3 is provided with a fifth sealing ring 805 groove, and the fifth sealing ring 805 is compressed in the fifth sealing ring 805 groove by the upper tank body 1. The inner wall of the hole body 301 of the lower tank body 3 for inserting the material guide pipe is provided with a sixth sealing ring 806 groove, and the sixth sealing ring 806 is compressed in the sixth sealing ring 806 groove by the outer wall of the material guide pipe.

[0047] Specifically, as shown in the figure, Figures 3-5 The dispensing head 5 adopts a U.S. Nordson dispensing head. The lower end of the hole body 301 is provided with a passage communicating with the feed port of the dispensing head 5. The lower tank body 3 is also provided with a corresponding air return passage corresponding to the air return port of the dispensing head 5. The air return passage is externally connected to the second pipe joint 9 mounted on the lower tank body 3. The second pipe joint 9 is externally connected to a negative pressure gas source through a pipeline, such as a vacuum pump. The liquid wax in the dispensing head 5 is sucked back by negative pressure, thereby improving the accuracy of the wax drop amount of the dispensing head 5.

[0048] The working process of the wafer waxing device is as follows: solid wax is put into the wax storage cylinder 2 through the tank cover, the heating mechanism 6 is started to melt the solid wax into liquid wax, and the dispensing head 5 is started to drop the liquid wax on the wafer surface. The solid wax flows in the pattern etched on the wafer surface and fills the pattern. After solidification, it will not continue to flow in the pattern, thereby ensuring that the pattern is always filled, thereby solving the technical problem that the pattern cannot be filled at all times when using liquid wax to coat the wafer surface.

[0049] Embodiment two

[0050] On the basis of embodiment one, the waxing device further comprises a temperature sensor 10 connected to the lower tank body 3. The temperature sensor 10 is used to detect the working temperature. The temperature sensor 10 is connected to the controller of the waxing machine. When the temperature reaches the preset working temperature, the temperature sensor 10 sends an electrical signal to the controller. The controller of the waxing machine controls the working of the wafer waxing device.

[0051] Embodiment three

[0052] On the basis of the first or second embodiment, the wax-on-wafer device further comprises a material detection mechanism 11, which comprises a fiber-optic sensor 1101, a mounting seat 1102, and a transparent piece 1103. Two opposite mounting holes are formed in the two sides of the lower jar 3, and the mounting holes are in communication with the hole body 301. The mounting seat 1102 is mounted in the mounting hole. The fiber-optic sensor 1101 is a pair of sensors. The two fiber-optic sensors 1101 are respectively mounted in the corresponding mounting seat 1102. The transparent piece 1103 is mounted in the mounting seat 1102. The transparent piece 1103 can be made of glass or transparent plastic. The transparent piece 1103 is arranged between the fiber-optic sensor 1101 and the hole body 301. Sealing rings are respectively arranged between the mounting seat 1102 and the mounting hole and between the transparent piece 1103 and the mounting seat 1102. The fiber-optic sensor 1101 is used to detect whether there is liquid wax in the hole body 301.

[0053] The above is only an embodiment of the present application, and the common knowledge of specific structures and properties in the scheme is not described in detail. The ordinary skilled person in the art knows all the ordinary technical knowledge in the technical field of the present application before the application date or the priority date, can know all the prior art in the field, and has the ability to apply conventional experimental means before that date. The ordinary skilled person in the art can improve and implement the present scheme based on their own ability under the guidance of the present application. Some typical known structures or known methods should not be an obstacle for the ordinary skilled person in the art to implement the present application. It should be noted that for those skilled in the art, without departing from the structure of the present application, a number of modifications and improvements can be made, which should also be considered as the protection scope of the present application. These will not affect the effect and practicality of the present application.

Claims

1. A wafer waxing apparatus, characterized by, The application relates to a wax feeding device, which comprises the following parts: an upper tank body; a wax storage cylinder arranged in the upper tank body, which is used for storing solid wax; a lower tank body connected to the lower end of the upper tank body, which is provided with a hole body, and a discharge hole of the wax storage cylinder is arranged in the hole body; a cylinder cover connected to the upper tank body and used for sealing the upper end of the wax storage cylinder; a dispensing head mounted on the lower tank body, and the hole body is communicated with a feeding end of the dispensing head; a heating mechanism connected to the upper tank body, which is used for heating the upper tank body.

2. The waxing apparatus of claim 1, wherein, The cylinder cover comprises: a cover body connected to the upper tank body, and a flange of the upper end of the wax storage cylinder is arranged above the upper tank body and has a gap with an upper end surface of the upper tank body; a cover arranged on the cover body; a connecting piece connecting the cover and the cover body.

3. The waxing apparatus of claim 1, wherein, The heating mechanism comprises: a heating plate connected to the upper tank body; a heating piece inserted into the heating plate.

4. The waxing apparatus of claim 1, wherein, An inner bottom surface of the lower tank body is a conical structure with a tapered tip downward, a guide pipe is extended downward from the wax storage cylinder, a discharge hole penetrating through the guide pipe is arranged at the center of a bottom surface of the lower tank body, and the guide pipe is arranged in a corresponding hole body of the lower tank body.

5. The waxing apparatus of claim 1, wherein, The application further comprises: a sealing assembly arranged between the cylinder cover and the wax storage cylinder, between the upper tank body and the lower tank body, and between the wax storage cylinder and the lower tank body.

6. The waxing apparatus of claim 1, wherein, The application further comprises: a temperature sensor connected to the lower tank body and used for detecting a working temperature.

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