Laser processing system capable of removing splashed pollutants

Abstract

The utility model discloses a laser processing system capable of removing splashed pollutants, which belongs to the field of laser processing, and comprises a rack, a processing table, a laser device and a cleaning device, the processing table is arranged on the rack, and the laser device and the cleaning device are arranged on the rack and above the processing table; the cleaning device comprises a CCD camera, a piezoelectric cleaning assembly and a gas jet cleaning assembly, the piezoelectric cleaning assembly comprises a piezoelectric cleaning rod, a cleaning sponge is arranged at the lower end of the piezoelectric cleaning rod, and a piezoelectric device is arranged between the cleaning sponge and the piezoelectric cleaning rod; an outlet of a gas jet pipe of the gas jet cleaning assembly faces downwards. The device has the advantages that the piezoelectric cleaning assembly and the gas jet cleaning assembly are combined to clean and dry the surface of a sample on the machining table, pollutants on the surface of the sample are removed, the time needed for large-area excavation of the surface of the sample is greatly shortened, and the machining quality of the follow-up FIB fine trimming process is guaranteed.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of laser processing, specifically, a laser processing system capable of removing splashing contaminants. BACKGROUND

[0002] Laser processing is a technique that uses laser light to cut or melt materials, including semiconductors, printed circuit boards, metals, wood, glass, plastics, and high-molecular ceramics. The working principle of laser processing is to guide the output of different power lasers through an optical system. The laser light used in laser cutting is controllable monochromatic light with high intensity and high energy density. By concentrating through an optical system, it can produce a high power density, allowing the high-energy laser beam to irradiate the pre-cutting or hole-digging area of the workpiece to complete the processing.

[0003] Industrial laser cutting machines are commonly used for cutting flat materials as well as structural and pipe materials. When a focused laser beam is directed at a material sample, the material at the point of action melts, burns, or evaporates, producing vapor or gasified substances that can be blown away by a gas jet, leaving a high-quality surface finish on the cut edge. Due to the high energy of laser, it has the advantage of fast processing, and in recent years has been introduced into semiconductor process processing applications, replacing the commonly used expensive and slow FIB for rough digging of wafers.

[0004] When using laser to perform large-area rough digging on semiconductor wafers, a large amount of foreign matter will be splashed around the processing area, which will hinder the subsequent FIB finishing process. Therefore, after laser rough digging, the splashing material needs to be removed before precise FIB finishing processing can be performed. There are many ways to remove splashing material, including vacuuming, blowing gas, and organic solvent cleaning. The methods used are suitable for removing splashing material in a large area. If the laser processing area is less than 1 cm or smaller, the result of removing the splashing material is not satisfactory.

[0005] For semiconductor wafer or 3D package FA rough digging accelerated laser processing, due to the wide range of splashing of the molten material, it will affect the FIB processing quality, and the knife marks are difficult to remove. Therefore, the general practice is to leave a splashing distance around the target area to avoid too many foreign matters above the target area affecting the FIB processing quality, which also causes the required FIB processing time to increase significantly, affecting the entire case delivery period. In addition, some laser processing splashing materials have high adhesion, and simply using a spray gun air flow to blow them off is also not easy to remove.

[0006] In view of the above, the present inventors have conducted in-depth research on this demand, and thus the present case has been produced. UTILITY MODEL CONTENT

[0007] The present application provides a laser processing system capable of removing splashed contaminants, which can greatly reduce the time required for large-area excavation on the surface of a semiconductor wafer and ensure the processing quality of subsequent FIB fine processing.

[0008] The laser processing system capable of removing splashed contaminants comprises a rack, a processing table, a laser device and a cleaning device, wherein the processing table is arranged on the rack, and the laser device and the cleaning device are arranged above the processing table on the rack.

[0009] The cleaning device comprises a CCD camera, a piezoelectric cleaning assembly and a gas jet cleaning assembly, wherein the piezoelectric cleaning assembly comprises a piezoelectric cleaning rod, the lower end of the piezoelectric cleaning rod is provided with a cleaning sponge, and a piezoelectric device is arranged between the cleaning sponge and the piezoelectric cleaning rod; and the outlet of the gas jet pipe of the gas jet cleaning assembly is arranged downward.

[0010] The piezoelectric cleaning assembly and the gas jet cleaning assembly are combined to clean and dry the surface of the sample on the processing table, remove the contaminants on the surface of the sample, greatly reduce the time required for large-area excavation on the surface of the sample, and ensure the processing quality of subsequent FIB fine processing.

[0011] In a preferred embodiment, the lower end of the piezoelectric cleaning rod is provided with a piezoelectric cleaning disc, the cleaning sponge is arranged on the lower surface of the piezoelectric cleaning disc, and the piezoelectric device is arranged between the piezoelectric cleaning disc and the cleaning sponge.

[0012] The piezoelectric cleaning rod is formed with a cleaning liquid delivery channel in communication with the cleaning sponge, and the liquid inlet of the cleaning liquid delivery channel is connected with a cleaning liquid supply device.

[0013] During cleaning, the cleaning sponge of the piezoelectric cleaning rod contacts the surface of the sample, the cleaning liquid enters the cleaning sponge from the cleaning liquid delivery channel, and the contaminants on the surface of the sample are cleaned by the rotation and vibration of the cleaning sponge, wherein the piezoelectric device mainly plays a vibration role.

[0014] In a preferred embodiment, in order to realize the lifting of the piezoelectric cleaning rod so as to make the cleaning sponge close to or away from the surface of the sample, and to realize the cleaning of the surface of the sample by the rotation of the cleaning sponge, the piezoelectric cleaning assembly further comprises a lifting and rotating driving structure for controlling the lifting and rotating movement of the piezoelectric cleaning rod, wherein the lifting and rotating driving structure can control the lifting and rotation of the piezoelectric cleaning rod.

[0015] In a preferred embodiment, the cleaning device further comprises a cleaning base and a cleaning driving assembly for driving the cleaning base to move in a horizontal direction, the cleaning driving assembly is installed on the frame, and the cleaning base is installed on a movable end of the cleaning driving assembly.

[0016] The CCD camera, the piezoelectric cleaning assembly and the gas jet cleaning assembly are all installed on the cleaning base.

[0017] In a preferred embodiment, a cleaning tank is further arranged on the frame, the cleaning tank is arranged below the cleaning driving assembly, the cleaning base is moved to be right above the cleaning tank by controlling the cleaning driving assembly, and then the piezoelectric cleaning rod is moved downward into the cleaning tank to clean the cleaning sponge by controlling the lifting driving structure.

[0018] In a preferred embodiment, the cleaning tank comprises a tank body and a grinding pad, the tank body contains a cleaning solution, and the grinding pad is horizontally arranged in the tank body and is in a position submerged in the cleaning solution. When the cleaning sponge is cleaned, it is contacted with the grinding pad and cleaned by the rotation and vibration of the piezoelectric cleaning rod.

[0019] In a preferred embodiment, a liquid inlet pipeline is arranged on a side of the tank body, a liquid outlet pipeline is arranged at a bottom of the tank body, and a control valve is arranged on the liquid outlet pipeline. The cleaning solution in the tank body is replaced by liquid inlet through the liquid inlet pipeline and liquid outlet through the liquid outlet pipeline, and the cleaning solution can be alcohol or isopropyl alcohol.

[0020] The technical scheme of the present application has the following beneficial effects:

[0021] (1) The piezoelectric cleaning assembly and the gas jet cleaning assembly are combined to clean and dry the sample surface on the processing table, remove the pollutants on the sample surface, greatly reduce the time required for large-area excavation of the sample surface, and ensure the processing quality of the subsequent FIB fine processing process.

[0022] (2) The cleaning sponge of the piezoelectric cleaning rod contacts the sample surface, the cleaning liquid enters the cleaning sponge from the cleaning liquid conveying channel, and the sample surface pollutants are cleaned by the rotation and vibration of the cleaning sponge, wherein the piezoelectric device mainly plays a vibration role. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. Other related drawings can also be obtained by those skilled in the art without creative labor.

[0024] Fig. 1 is a preferable laser processing system overall structure schematic view of the utility model;

[0025] Fig. 2 is a preferable cleaning device structure schematic view of the utility model;

[0026] Fig. 3 is a preferable piezoelectric cleaning assembly structure schematic view of the utility model. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be described clearly and completely below in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the claimed utility model, but only represents selected embodiments of the utility model.

[0028] Referring to Figs. 1-3 The laser processing system capable of removing splashing contaminants includes a rack 1, a processing table 2, a laser device 3 and a cleaning device 4. The processing table 2 is arranged on the rack 1, and the laser device 3 and the cleaning device 4 are arranged at a position above the processing table 2 on the rack 1.

[0029] As shown in Fig. 2 The cleaning device 4 includes a CCD camera 41, a piezoelectric cleaning assembly 42 and a gas jet cleaning assembly 43. The piezoelectric cleaning assembly 42 includes a piezoelectric cleaning rod 421, and a cleaning sponge 422 is arranged at the lower end of the piezoelectric cleaning rod 421. A piezoelectric device 423 is arranged between the cleaning sponge 422 and the piezoelectric cleaning rod 421. The outlet of the gas jet pipe 431 of the gas jet cleaning assembly 43 is arranged downward. The gas jet pipe can spray air, nitrogen or argon, etc. The gas jet pipe 431 is a flexible pipe, and the spraying angle and position can be changed as needed.

[0030] After the laser processing is completed, the cleaning device can be automatically moved to the position directly above the processing table. Then, the operator can determine the position and range to be cleaned according to the image of the CCD camera, and the cleaning steps can be executed by the program automatically. The piezoelectric cleaning assembly and the gas jet cleaning assembly are combined to clean and dry the surface of the sample on the processing table, so that the contaminants on the surface of the sample are removed, the time required for large-area excavation of the surface of the sample is greatly reduced, and the processing quality of the subsequent FIB fine processing process is ensured.

[0031] Here, the piezoelectric cleaning component 42 needs to achieve the cleaning of the sample surface by the cleaning sponge, and the cleaning sponge needs to be in a wet state during cleaning, and the cleaning solution needs to be supplied, and the piezoelectric vibration and rotation are used to achieve the cleaning. In order to achieve this effect, a piezoelectric cleaning disc 424 can be arranged at the lower end of the piezoelectric cleaning rod 421, the cleaning sponge 422 is arranged on the lower surface of the piezoelectric cleaning disc 424, and the piezoelectric device 423 is arranged between the piezoelectric cleaning disc 424 and the cleaning sponge 422.

[0032] As shown in Fig. 3 The piezoelectric cleaning rod 421 is formed with a cleaning liquid conveying channel 425 in communication with the cleaning sponge 422, and the liquid inlet of the cleaning liquid conveying channel 425 is connected with a cleaning liquid supply device (not shown in the figure). The cleaning liquid can be alcohol or isopropyl alcohol. During cleaning, the cleaning sponge of the piezoelectric cleaning rod contacts the sample surface, the cleaning liquid enters the cleaning sponge from the cleaning liquid conveying channel, and the rotation and vibration of the cleaning sponge are used to clean the contaminants on the sample surface, wherein the piezoelectric device mainly plays a vibration role.

[0033] In order to achieve the lifting of the piezoelectric cleaning rod, so that the cleaning sponge is close to or away from the sample surface, and the rotation of the cleaning sponge is used to achieve the cleaning of the sample surface, the piezoelectric cleaning component 42 further comprises a lifting and rotating driving structure for controlling the lifting and rotating movement of the piezoelectric cleaning rod. The lifting and rotating driving structure can control the lifting and rotation of the piezoelectric cleaning rod.

[0034] In a preferred embodiment, the cleaning device 4 further comprises a cleaning base 40 and a cleaning driving component 44 for driving the cleaning base to move in the horizontal direction, the cleaning driving component 44 is installed on the rack 1, and the cleaning base 40 is installed on the movable end of the cleaning driving component 44.

[0035] The CCD camera 41, the piezoelectric cleaning component 42 and the gas jet cleaning component 43 are all installed on the cleaning base 40.

[0036] In a preferred embodiment, the cleaning sponge in the piezoelectric cleaning component has contaminants attached to it after cleaning treatment. In order to enable the cleaning sponge to repeatedly clean the sample surface, the contaminants on the surface of the cleaning sponge need to be cleaned. In order to achieve this purpose, a cleaning tank 5 can be arranged on the rack 1, and the cleaning tank 5 is arranged below the cleaning driving component 44. By controlling the cleaning driving component 44 to move the cleaning base to above the cleaning tank 5, and then controlling the lifting driving structure to move the piezoelectric cleaning rod 421 downward into the cleaning tank to clean the cleaning sponge 422.

[0037] In a preferred embodiment, the cleaning tank 5 comprises a tank body 51 containing a cleaning solution 53 and a polishing pad 52 horizontally arranged in the tank body 51 and immersed in the cleaning solution 53. The cleaning sponge is cleaned by contacting the polishing pad and rotating and vibrating the piezoelectric cleaning rod.

[0038] In a preferred embodiment, the tank body 51 is provided with a liquid inlet pipe 54 on the side and a liquid outlet pipe 55 on the bottom, and the liquid outlet pipe 55 is provided with a control valve 56. The cleaning solution in the tank body is replaced by liquid inlet through the liquid inlet pipe and liquid outlet through the liquid outlet pipe, and the cleaning solution can be alcohol or isopropyl alcohol.

[0039] Specifically, the sample surface contaminant cleaning step of the laser processing system is as follows:

[0040] Step one, after laser processing is completed, the cleaning device moves to the position directly above the processing table, and the operator selects the position and range to be cleaned according to the CCD camera;

[0041] Step two, the piezoelectric cleaning rod is lowered, the cleaning liquid is injected on the cleaning sponge, and the cleaning of the sample surface is started by rotating and vibrating;

[0042] Step three, after cleaning is completed, the piezoelectric cleaning rod is raised, the cleaning device is moved to the appropriate position, the gas jet cleaning assembly sprays gas to clean and dry the sample surface, and there is no slag residue;

[0043] Step four, after cleaning different positions repeatedly, the cleaning device moves to above the cleaning tank, and the piezoelectric cleaning rod is lowered to immerse in the cleaning liquid and contact the polishing pad below, and the piezoelectric vibration is started to clean the cleaning sponge.

[0044] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can be variously changed and modified. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A laser processing system capable of removing splashed contaminants, characterized in that, It includes a frame, a processing table, a laser device, and a cleaning device. The processing table is mounted on the frame, and the laser device and the cleaning device are mounted on the frame above the processing table. The cleaning device includes a CCD camera, a piezoelectric cleaning component, and a gas jet cleaning component. The piezoelectric cleaning component includes a piezoelectric cleaning rod with a cleaning sponge at its lower end and a piezoelectric device between the cleaning sponge and the piezoelectric cleaning rod. The gas jet cleaning component has a downward-facing gas jet outlet.

2. The laser processing system for removing splashed contaminants according to claim 1, characterized in that, The piezoelectric cleaning rod is provided with a piezoelectric cleaning disc at its lower end, the cleaning sponge is provided on the lower surface of the piezoelectric cleaning disc, and the piezoelectric device is provided between the piezoelectric cleaning disc and the cleaning sponge; The piezoelectric cleaning rod has a cleaning liquid delivery channel that communicates with the cleaning sponge, and the inlet of the cleaning liquid delivery channel is connected to a cleaning liquid supply device.

3. The laser processing system for removing splashed contaminants according to claim 1, characterized in that, The piezoelectric cleaning assembly also includes a lifting and rotating drive structure for controlling the lifting and rotating motion of the piezoelectric cleaning rod.

4. The laser processing system for removing splashed contaminants according to claim 3, characterized in that, The cleaning device further includes a cleaning base and a cleaning drive assembly for driving the cleaning base to move horizontally. The cleaning drive assembly is mounted on the frame, and the cleaning base is mounted on the movable end of the cleaning drive assembly. The CCD camera, piezoelectric cleaning assembly, and gas jet cleaning assembly are all mounted on the cleaning base.

5. The laser processing system for removing splashed contaminants according to claim 4, characterized in that, The frame is also equipped with a cleaning tank, which is located below the cleaning drive assembly.

6. The laser processing system for removing splashed contaminants according to claim 5, characterized in that, The cleaning tank includes a tank body and an abrasive pad. The tank body is filled with a cleaning solution, and the abrasive pad is horizontally arranged in the tank body and positioned to be submerged in the cleaning solution.

7. The laser processing system for removing splashed contaminants according to claim 6, characterized in that, The tank has an inlet pipe on its side and a drain pipe at its bottom, with a control valve installed on the drain pipe.

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