Material taking and placing device of semiconductor support

Abstract

The utility model relates to a semiconductor support material taking and placing device which comprises a mounting frame, a horizontal transferring module, a material clamping mechanism and a material taking and placing lifting piece, the horizontal transferring module can drive the material clamping mechanism and the material taking and placing lifting piece to move so as to move the material clamping mechanism to a material taking position, and the material taking and placing lifting piece drives the material clamping mechanism to descend. The material clamping driving piece drives the two clamping pieces to act so as to clamp the semiconductor support, after clamping is completed, the material taking and placing lifting piece drives the material clamping mechanism to ascend, the horizontal transferring module drives the material clamping mechanism to move to a material placing position, and the material clamping driving piece drives the two clamping pieces to be away from each other so as to conduct material placing; the distance between the two clamping pieces is adjusted through the distance adjusting piece, the adaptive distance can be adjusted according to semiconductor supports of different sizes, the clamping device can be compatible with the semiconductor supports of different sizes, clamping of the semiconductor supports of different types can be met, the application range is wide, and the structure is simple.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor support, in particular to a semiconductor support taking and placing device. BACKGROUND

[0002] With the increasingly fierce competition in the field of semiconductors, along with the continuous development of the industry, the degree of automation of production equipment is gradually improved. In various types of semiconductor automatic production equipment, the taking and placing device is an essential part. The taking and placing device in the related art has three main feeding modes: feeding box feeding, vacuum feeding and inclined pushing feeding. However, the above three modes are not suitable for thin and soft semiconductor supports, the application range is limited, and the structure of the taking and placing device in the related art is relatively complex. CONTENT OF THE UTILITY MODEL

[0003] Therefore, it is necessary to provide a semiconductor support taking and placing device which is compatible with different semiconductor supports, has a wide application range and a simple structure.

[0004] A semiconductor support taking and placing device, comprising a mounting frame, a horizontal conveying module, a clamping mechanism and a taking and placing lifting member;

[0005] The taking and placing lifting member is connected with the clamping mechanism, and the taking and placing lifting member is used to drive the clamping mechanism to ascend and descend;

[0006] The horizontal conveying module is arranged on the mounting frame and connected with the taking and placing lifting member, and the horizontal conveying module is used to drive the clamping mechanism to move between the taking position and the placing position;

[0007] The clamping mechanism comprises a clamping driving member, a clamping assembly and a spacing adjusting member. The clamping assembly comprises two oppositely arranged clamping members. The clamping driving member can drive the two clamping members to move away from each other or move close to each other. The spacing adjusting member is used to adjust the spacing between the two clamping members.

[0008] In one embodiment, clamping grooves are formed on the two clamping members, and the two clamping grooves are oppositely arranged. The two clamping grooves together form a clamping space for clamping a semiconductor support.

[0009] In one embodiment, the clamping member comprises a connecting portion and a clamping portion. The connecting portion is adjustably arranged on the power output end of the clamping driving member in the direction away from or close to the clamping driving member. The clamping portion is connected to one end of the connecting portion away from the clamping driving member. The clamping groove is formed on the clamping portion.

[0010] In one of the embodiments, the clamping member comprises an adjusting screw, the connecting part is provided with a first mounting hole, the power output end of the clamping driving member is provided with a first threaded hole, the adjusting screw is arranged in the first mounting hole and is threadedly connected with the first threaded hole.

[0011] In one of the embodiments, the two connecting parts are respectively provided with a spacing adjusting member, the two spacing adjusting members are oppositely arranged and can abut against each other, and the relative positions between the two spacing adjusting members and the corresponding connecting parts are adjustable.

[0012] In one of the embodiments, the clamping mechanism further comprises a reset member and a connecting bracket connected with the material taking and placing lifting member, the clamping driving member is hingedly connected with the connecting bracket, and the reset member is arranged between the connecting bracket and the clamping driving member.

[0013] In one of the embodiments, the clamping mechanism is adjustably arranged on the material taking and placing lifting member along the lifting direction of the material taking and placing lifting member.

[0014] In one of the embodiments, the material taking and placing lifting member is connected with the clamping mechanism through a connecting assembly.

[0015] The connecting assembly comprises a first connecting plate and a second connecting plate, the first connecting plate is connected with the power output end of the material taking and placing lifting member, the second connecting plate is adjustably arranged on the first connecting plate along the lifting direction of the material taking and placing lifting member, and the second connecting plate is connected with the clamping mechanism.

[0016] In one of the embodiments, the material taking and placing lifting member is further provided with a limiting assembly, the power output end of the material taking and placing lifting member can abut against the limiting assembly, and the limiting assembly is used for limiting the stroke of the power output end of the material taking and placing lifting member.

[0017] In one of the embodiments, the horizontal conveying module comprises a conveying driving member, a synchronous belt, a first synchronous wheel and a second synchronous wheel, the first synchronous wheel and the second synchronous wheel are rotatably arranged on the mounting frame, the synchronous belt is sleeved on the first synchronous wheel and the second synchronous wheel, the conveying driving member is in transmission connection with the first synchronous wheel, and the synchronous belt is connected with the material taking and placing lifting member.

[0018] In the above scheme, the horizontal conveying module, the clamping mechanism and the material taking and placing lifting piece are arranged, the horizontal conveying module can drive the clamping mechanism and the material taking and placing lifting piece to move, so as to move the clamping mechanism to the material taking position, the material taking and placing lifting piece drives the clamping mechanism to descend, the clamping driving piece drives the two clamping pieces to act, so as to clamp the semiconductor support, after the clamping is completed, the material taking and placing lifting piece drives the clamping mechanism to ascend, and the horizontal conveying module drives the clamping mechanism to move to the material placing position, the clamping driving piece drives the two clamping pieces to move away from each other, so as to place the material; the interval adjusting piece adjusts the interval between the two clamping pieces, the interval suitable for different sizes of semiconductor supports can be adjusted according to different sizes of semiconductor supports, different sizes of semiconductor supports can be compatible, different types of semiconductor supports can be clamped and taken, the application range is wide, and the structure is simple. BRIEF DESCRIPTION OF DRAWINGS

[0019] The accompanying drawings, which form a part of this application, are included to provide a further understanding of the application and are incorporated in and constitute a part of this application. The embodiments of this application illustrate the embodiments of the present application and, together with the description, serve to explain the principles of the present application.

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of these drawings.

[0021] Figure 1 The structure schematic view of the semiconductor support taking and placing device shown in an embodiment of the present application in a first perspective view.

[0022] Figure 2 The structure schematic view of the semiconductor support taking and placing device shown in an embodiment of the present application in a second perspective view.

[0023] Figure 3 The structure schematic view of the clamping mechanism, the material taking and placing lifting piece and the limiting assembly shown in an embodiment of the present application.

[0024] Explanation of reference signs:

[0025] 10. A semiconductor support pick-and-place device; 100, mounting frame; 110, vertical plate; 120, horizontal plate; 130, slide rail; 200, horizontal transfer module; 210, transfer driving member; 220, synchronous belt; 230, second synchronous wheel; 240, driven plate; 250, tension adjusting plate; 260, pressing plate; 300, clamping mechanism; 310, clamping driving member; 311, connecting rod; 312, abutting rod; 320, clamping piece; 321, clamping groove; 322, connecting part; 323, clamping part; 330, spacing adjusting member; 331, adjusting rod; 332, locking nut; 340, reset member; 341, swinging rod; 342, reset spring; 350, connecting bracket; 360, connecting assembly; 361, first connecting plate; 362, second connecting plate; 363, adjusting hole; 400, pick-and-place lifting member; 410, pick-and-place mounting plate; 500, limiting assembly; 510, limiting mounting plate; 520, limiting block. DETAILED DESCRIPTION

[0026] In order to make the above objectives, features and advantages of the present application more apparent, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the present application can be practiced in a variety of ways beyond the specific embodiments described herein without departing from the spirit of the present application, and it is intended that the present application cover all modifications and variations of this application within the scope of the appended claims.

[0027] In the description of the present application, it should be understood that, if these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0028] In addition, if these terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features referred to. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, if the term "a plurality of" appears, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0029] In the present application, unless specifically defined otherwise, the terms "mounting", "connected", "connecting", "fixed", "fixing", and the like are to be construed in a broad sense as encompassing a direct connection between elements, an indirect connection between elements through other elements, a fixed connection between elements, a detachable connection between elements, a mechanical connection between elements, an electrical connection between elements, and the like.

[0030] In the present application, unless specifically defined otherwise, the terms "on", "under", and the like in relation to a first element in relation to a second element are to be construed in a broad sense in that the first element can be directly in contact with the second element or indirectly in contact with the second element through an intermediate element. In addition, "above", "upper", and "on top of" in relation to a first element in relation to a second element can mean that the first element is directly above or obliquely above the second element, or can simply mean that the first element is horizontally higher than the second element. "Below", "under", and "underneath" in relation to a first element in relation to a second element can mean that the first element is directly below or obliquely below the second element, or can simply mean that the first element is horizontally lower than the second element.

[0031] It should be noted that if an element is referred to as being "fixed to" or "set to" another element, it can be directly on the other element or there can be an intermediate element. If an element is referred to as being "connected to" another element, it can be directly connected to the other element or there can be an intermediate element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right", and the like used in the present application are for illustrative purposes only and do not represent the only implementation.

[0032] Referring to Figure 1 , Figure 2 and Figure 3 , the present application relates to a semiconductor support taking and placing device 10, which comprises a mounting frame 100, a horizontal conveying module 200, a clamping mechanism 300, and a taking and placing lifting member 400. The taking and placing lifting member 400 is connected to the clamping mechanism 300 and is used to drive the clamping mechanism 300 to move up and down. The horizontal conveying module 200 is arranged on the mounting frame 100 and is connected to the taking and placing lifting member 400. The horizontal conveying module 200 is used to drive the clamping mechanism 300 to move between a taking position and a placing position. The clamping mechanism 300 is used to clamp a semiconductor support at the taking position and then place the semiconductor support at the placing position.

[0033] Referring to Figure 1 , Figure 2 and Figure 3The clamping mechanism 300 comprises a clamping driving member 310, a clamping assembly and a spacing adjusting member 330. The clamping assembly comprises two clamping members 320 arranged oppositely. The clamping driving member 310 can drive the two clamping members 320 to move away from or close to each other. The spacing adjusting member 330 is used to adjust the spacing between the two clamping members 320. Specifically, the clamping driving member 310 is a parallel cylinder. The two clamping members 320 are arranged at the two power output ends of the clamping driving member 310 respectively.

[0034] The horizontal transfer module 200 drives the clamping mechanism 300 and the material taking and placing lifting member 400 to move, so as to move the clamping mechanism 300 to the material taking position. The material taking and placing lifting member 400 drives the clamping mechanism 300 to descend. The clamping driving member 310 drives the two clamping members 320 to act, so as to clamp the semiconductor support. Then the material taking and placing lifting member 400 drives the clamping mechanism 300 to ascend. The horizontal transfer module 200 drives the clamping mechanism 300 to move to the material placing position. The clamping driving member 310 drives the two clamping members 320 to move away from each other, so as to place the material. The spacing adjusting member 330 is used to adjust the spacing between the two clamping members 320. The spacing can be adjusted according to the semiconductor support of different sizes. The semiconductor supports of different sizes can be compatible. Different types of semiconductor supports can be clamped. The application range is wide. The structure is simple.

[0035] Please refer to Figure 1 , Figure 2 and Figure 3 According to some embodiments of the present application, the two clamping members 320 are further provided with clamping grooves 321 for clamping the semiconductor support. The two clamping grooves 321 together enclose a containing space for clamping the semiconductor support. The shape of the inner profile of the clamping groove 321 is matched with the shape of the outer profile of the semiconductor support.

[0036] By arranging the clamping groove 321, the semiconductor support will not fall off during the transfer process. The transfer stability of the semiconductor support is improved.

[0037] Please refer to Figure 1 , Figure 2 and Figure 3 According to some embodiments of the present application, the clamping member 320 comprises a connecting part 322 and a clamping part 323. The connecting part 322 is adjustably arranged at the power output end of the clamping driving member 310 in the direction away from or close to the clamping driving member 310. The clamping part 323 is connected to one end of the connecting part 322 away from the clamping driving member 310. The clamping groove 321 is arranged at one side of the clamping part 323 close to the connecting part 322. Specifically, the two power output ends of the clamping driving member 310 are respectively connected with a connecting rod 311. The two connecting rods 311 are respectively connected with the two connecting parts 322.

[0038] More specifically, the connecting part 322 comprises a first vertical part and a first horizontal part, one end of the first vertical part is connected with the connecting rod 311, the other end of the first vertical part is connected with the first horizontal part, and the first horizontal part is connected with the clamping part 323 away from the one end of the first vertical part.

[0039] By adjustably arranging the connecting part 322 on the power output end of the clamping material driving part 310 in the direction away from or close to the clamping material driving part 310, the position of the connecting part 322 relative to the clamping material driving part 310 is adjustable.

[0040] Please refer to Figure 1 , Figure 2 and Figure 3 According to some embodiments of the present application, optionally, the clamping part 320 comprises an adjusting screw, the connecting part 322 is provided with a first mounting hole, the power output end of the clamping material driving part 310 is provided with a first threaded hole, and the adjusting screw is arranged in the first mounting hole and is threadedly connected with the first threaded hole. Specifically, the first mounting hole is provided with a thread, and the adjusting screw is threadedly connected with the first mounting hole. When it is necessary to adjust the position between the two connecting parts 322, the adjusting screw can be rotated.

[0041] Please refer to Figure 1 , Figure 2 and Figure 3 According to some embodiments of the present application, optionally, the two connecting parts 322 are provided with a spacing adjusting part 330, the two spacing adjusting parts 330 are oppositely arranged and can abut against each other, and the relative position between the two spacing adjusting parts 330 and the corresponding connecting part 322 is adjustable.

[0042] Specifically, the spacing adjusting part 330 comprises an adjusting rod 331 and a locking nut 332, one end of the adjusting rod 331 is protruded to form an abutting part, the other end of the adjusting rod 331 is provided with a handle, the connecting part 322 is provided with a second threaded hole, the adjusting rod 331 is arranged in the second threaded hole and is threadedly connected with the second threaded hole. The locking nut 332 is threadedly connected with the middle part of the adjusting rod 331.

[0043] When it is necessary to adjust the position between the two connecting parts 322, the adjusting rod 331, the locking nut 332 and the adjusting screw are rotated to make the position of the adjusting rod 331 relative to the connecting part 322 movable and the position of the connecting part 322 relative to the clamping material driving part 310 movable. After the position between the two connecting parts 322 is adjusted, the adjusting rod 331, the locking nut 332 and the adjusting screw are rotated to fix the position of the adjusting rod 331 relative to the connecting part 322 and the position of the connecting part 322 relative to the clamping material driving part 310.

[0044] Please refer to Figure 1 , Figure 2 and Figure 3According to some embodiments of the present application, optionally, the clamping mechanism 300 comprises a reset member 340 and a connecting bracket 350 connected with the material taking and placing lifting member 400, and the clamping driving member 310 is hinged to the connecting bracket 350 so that the clamping driving member 310 can swing relative to the connecting bracket 350. The reset member 340 is arranged between the connecting bracket 350 and the clamping driving member 310 and is used to provide a reset force for keeping the clamping driving member 310 in the initial state. Specifically, the clamping driving member 310 is hinged to the inner side wall of the connecting bracket 350, and the connecting bracket 350 is a groove-shaped member with an opening facing the direction in which the two clamping members 320 move away from each other.

[0045] The clamping driving member 310 is provided with an abutting rod 312 protruding therefrom, and the reset member 340 comprises two oppositely arranged swing rods 341 and a reset spring 342 arranged between the two swing rods 341. One end of each of the two swing rods 341 is hingedly arranged on the outer side wall of the connecting bracket 350, and the other end of each of the two swing rods 341 extends out of the connecting bracket 350. The abutting rod 312 is located between the two swing rods 341 and abuts against the other end of each of the two swing rods 341. The reset spring 342 is located at the middle part of the two swing rods 341.

[0046] By hinging the clamping driving member 310 to the connecting bracket 350, the clamping of the semiconductor bracket can be facilitated, and after the clamping is completed, the reset member 340 drives the clamping driving member 310 back to the initial position.

[0047] Please refer to Figure 1 , Figure 2 and Figure 3 According to some embodiments of the present application, optionally, the clamping mechanism 300 is adjustably arranged on the material taking and placing lifting member 400 along the lifting direction of the material taking and placing lifting member 400, so as to adjust the position of the clamping mechanism 300 relative to the material taking and placing lifting member 400. For example, the material taking and placing lifting member 400 is a pneumatic cylinder.

[0048] Specifically, the material taking and placing lifting member 400 is connected with the clamping mechanism 300 through a connecting assembly 360. The connecting assembly 360 comprises a first connecting plate 361 and a second connecting plate 362. The first connecting plate 361 is connected to the power output end of the material taking and placing lifting member 400, the second connecting plate 362 is adjustably arranged on the first connecting plate 361 along the moving direction of the power output end of the material taking and placing lifting member 400, and the second connecting plate 362 is connected with the clamping mechanism 300. More specifically, the second connecting plate 362 is connected with the groove bottom of the connecting bracket 350.

[0049] The first connecting plate 361 comprises a second vertical part and a second horizontal part connected to one end of the second vertical part, and the second horizontal part is connected to the power output end of the material taking and placing lifting member 400, and the second vertical part is slidingly connected to the cylinder of the material taking and placing lifting member 400. The second connecting plate 362 is provided with an adjusting hole 363, and the second vertical part is provided with a second mounting hole, a fastening bolt is slidingly connected to the adjusting hole 363 along the extension direction of the adjusting hole 363, the fastening bolt passes through the adjusting hole 363 and is threadedly connected to the second mounting hole.

[0050] Please refer to Figure 1 、 Figure 2 and Figure 3 According to some embodiments of the present application, the material taking and placing lifting member 400 is further provided with a limiting assembly 500, the power output end of the material taking and placing lifting member 400 can abut against the limiting assembly 500, and the limiting assembly 500 is used for limiting the stroke of the power output end of the material taking and placing lifting member 400.

[0051] The limiting assembly 500 comprises a limiting mounting plate 510 and a limiting block 520, and the limiting mounting plate 510 is arranged on the cylinder of the material taking and placing lifting member 400. Specifically, the limiting mounting plate 510 comprises a third vertical part and a third horizontal part, the third vertical part is connected to the cylinder of the material taking and placing lifting member 400, the third horizontal part is connected to the third vertical part, the limiting block 520 is arranged on the third vertical part, and the second horizontal part can abut against the limiting block 520.

[0052] More specifically, the limiting block 520 is adjustably arranged on the third horizontal part along the extension direction of the third vertical part, so that the position of the limiting block 520 relative to the third horizontal part is adjustable, and the position of the limiting block 520 relative to the third horizontal part can be adjusted according to actual use requirements.

[0053] Please refer to Figure 1 、 Figure 2 and Figure 3 According to some embodiments of the present application, the horizontal transfer module 200 comprises a transfer driving member 210, a synchronous belt 220, a first synchronous wheel and a second synchronous wheel 230, the first synchronous wheel and the second synchronous wheel 230 are rotatably arranged on the mounting frame 100, the synchronous belt 220 is sleeved on the first synchronous wheel and the second synchronous wheel 230, the transfer driving member 210 is in transmission connection with the first synchronous wheel, and the synchronous belt 220 is connected with the material taking and placing lifting member 400. Specifically, the synchronous belt 220 is provided with a driven plate 240, the material taking and placing lifting member 400 is connected to a material taking and placing mounting plate 410, and the material taking and placing mounting plate 410 is connected with the driven plate 240. The transfer driving member 210 adopts a motor.

[0054] The transfer driving member 210 drives the first synchronous wheel to rotate, and the first synchronous wheel drives the synchronous belt 220 and the second synchronous wheel 230 to move simultaneously, so as to drive the driven plate 240 to move, and thus drive the material taking and placing lifting member 400 and the material clamping mechanism 300 to move.

[0055] Please refer to Figure 1 、 Figure 2 and Figure 3 According to some embodiments of the present application, the horizontal transfer module 200 further comprises a tensioning assembly and a pressing plate 260, the tensioning assembly acts on the synchronous belt 220 to adjust the tension of the synchronous belt 220. The pressing plate 260 and the driven plate 240 are respectively located on both sides of the synchronous belt 220, and the pressing plate 260 and the driven plate 240 can clamp the synchronous belt 220. Specifically, the tensioning assembly is a tensioning adjusting plate 250, and the tensioning adjusting plate 250 is arranged on the second synchronous wheel 230. The tensioning adjusting plate 250 adopts a known mechanism.

[0056] Please refer to Figure 1 、 Figure 2 and Figure 3 According to some embodiments of the present application, the mounting frame 100 comprises two vertical plates 110 arranged at intervals and a horizontal plate 120 arranged between the two vertical plates 110, the horizontal transfer module 200 is arranged on the horizontal plate 120, and the extension direction of the horizontal plate 120 is the same as the moving direction of the material clamping mechanism 300. The horizontal plate 120 is further provided with a sliding rail 130, and the material taking and placing mounting plate 410 is provided with a sliding block which is slidingly connected to the sliding rail 130, which facilitates the movement of the material taking and placing lifting member 400.

[0057] The technical features of the above-mentioned embodiments can be combined in any way. In order to make the description simple, not all possible combinations of the technical features in the above-mentioned embodiments are described, however, as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present application.

[0058] The above-mentioned embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, some modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A semiconductor substrate loading and unloading device, characterized in that, The device comprises a mounting frame, a horizontal conveying module, a clamping mechanism and a material taking and placing lifting device, The material taking and placing lifting device is connected with the clamping mechanism, and is used to drive the clamping mechanism to ascend and descend. The horizontal conveying module is arranged on the mounting frame and is connected with the material taking and placing lifting device, and is used to drive the clamping mechanism to move between the material taking position and the material placing position. The clamping mechanism comprises a clamping driving device, a clamping assembly and a spacing adjusting device, the clamping assembly comprises two oppositely arranged clamping members, the clamping driving device can drive the two clamping members to move away from or close to each other, and the spacing adjusting device is used to adjust the spacing between the two clamping members.

2. The semiconductor rack handling apparatus of claim 1, wherein Two clamping members are provided with clamping grooves, and the two clamping grooves are oppositely arranged, and the two clamping grooves together form a clamping space for clamping a semiconductor support.

3. The apparatus according to claim 2, wherein The clamping member comprises a connecting part and a clamping part, the connecting part is adjustably arranged on the power output end of the clamping driving device in the direction away from or close to the clamping driving device, the clamping part is connected to one end of the connecting part away from the clamping driving device, and the clamping groove is arranged on the clamping part.

4. The apparatus according to claim 3, wherein The clamping member comprises an adjusting screw, the connecting part is provided with a first mounting hole, the power output end of the clamping driving device is provided with a first threaded hole, the adjusting screw is arranged in the first mounting hole and is threadedly connected with the first threaded hole.

5. The apparatus according to claim 3, wherein Two connecting parts are provided with one spacing adjusting device, the two spacing adjusting devices are oppositely arranged and can abut against each other, and the relative positions between the two spacing adjusting devices and the corresponding connecting parts are adjustable.

6. The apparatus according to claim 1, wherein The clamping mechanism further comprises a reset device and a connecting bracket connected with the material taking and placing lifting device, the clamping driving device is hinged to the connecting bracket, and the reset device is arranged between the connecting bracket and the clamping driving device.

7. The apparatus according to claim 1, wherein The clamping mechanism is adjustably arranged on the material taking and placing lifting device in the ascending and descending direction of the material taking and placing lifting device.

8. The apparatus according to claim 7, wherein The material taking and placing lifting device is connected with the clamping mechanism through a connecting assembly. The connecting assembly comprises a first connecting plate and a second connecting plate, the first connecting plate is connected to the power output end of the material taking and placing lifting device, the second connecting plate is adjustably arranged on the first connecting plate in the ascending and descending direction of the material taking and placing lifting device, and the second connecting plate is connected with the clamping mechanism.

9. The apparatus according to claim 1, wherein The material taking and placing lifting device is further provided with a limiting assembly, the power output end of the material taking and placing lifting device can abut against the limiting assembly, and the limiting assembly is used to limit the stroke of the power output end of the material taking and placing lifting device.

10. The apparatus according to claim 1, wherein The horizontal conveying module comprises a conveying driving device, a synchronous belt, a first synchronous wheel and a second synchronous wheel, the first synchronous wheel and the second synchronous wheel are rotatably arranged on the mounting frame, the synchronous belt is sleeved on the first synchronous wheel and the second synchronous wheel, the conveying driving device is in transmission connection with the first synchronous wheel, and the synchronous belt is connected with the material taking and placing lifting device.

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