Electroplating liquid impurity cleaning device

Abstract

The utility model discloses an electroplating liquid impurity cleaning device and relates to the field of electroplating equipment. The electroplating liquid impurity cleaning device comprises an electroplating liquid circulating pipeline and an inclined impurity bearing plate, a circulating water pump is installed on the electroplating liquid circulating pipeline, an impurity filtering piece is installed on the electroplating liquid circulating pipeline, and the electroplating liquid circulating pipeline comprises a circulating water pump and an inclined impurity bearing plate; the end part of the electroplating liquid inlet main pipe is arranged at the upper end of the inclined impurity bearing plate, and the end parts of the electroplating liquid outlet pipe and the electroplating liquid inlet auxiliary pipe are arranged on the two sides of the lower end of the inclined impurity bearing plate. According to the electroplating liquid impurity cleaning device, the electroplating liquid discharging main pipe is connected with the gushing frame to gush downwards from the top of the inclined impurity bearing plate, metal impurities are rapidly gathered to the bottom end of the inclined impurity bearing plate, then the impurities are blown to one side through the electroplating liquid discharging auxiliary pipe, and the impurities rapidly enter the electroplating liquid discharging pipe to be collected and discharged.

Description

TECHNICAL FIELD

[0001] The utility model relates to electroplating equipment technical field, concretely is a kind of electroplating solution impurity cleaning device. BACKGROUND

[0002] For the electroplating processing of metal products, it is usually necessary to store a large amount of electroplating solution in the electroplating tank, and the metal parts are immersed in the electroplating solution for electroplating treatment. However, before electroplating, the metal parts are usually subjected to cutting, bending, grinding and other process operations. Although pre-cleaning is performed before entering the electroplating tank, a small amount of metal impurities will inevitably adhere and deposit on the inner bottom of the electroplating tank during the electroplating process.

[0003] Therefore, an external circulation pipeline is usually provided in the electroplating tank to filter and clean impurities during the circulation of the electroplating solution. However, the existing external circulation pipeline usually discharges the electroplating solution from the bottom, filters it through a filter, and then returns the electroplating solution to the electroplating tank from the upper end. However, in actual use, the electroplating solution in the electroplating tank flows in a directional circulation, but the flow speed is low, and only one set of electroplating solution external circulation outlet is usually provided, which makes it difficult to quickly circulate and discharge the metal impurities deposited at the bottom of the electroplating tank, affecting the cleaning effect. Therefore, an electroplating solution impurity cleaning device is provided to solve the above problems. SUMMARY

[0004] In view of the deficiencies of the prior art, the utility model provides an electroplating solution impurity cleaning device to solve the problem that the existing external circulation pipeline flows in a directional circulation in the electroplating tank during actual use, but the flow speed is low, and only one set of electroplating solution external circulation outlet is usually provided, which makes it difficult to quickly circulate and discharge the metal impurities deposited at the bottom of the electroplating tank, affecting the cleaning effect.

[0005] To achieve the above purpose, the utility model realizes the following technical scheme: an electroplating solution impurity cleaning device, comprising an electroplating solution circulation pipeline and an inclined impurity supporting plate, a circulating water pump is installed on the electroplating solution circulation pipeline, and an impurity filter is installed on the electroplating solution circulation pipeline.

[0006] The electroplating solution circulation pipeline comprises:

[0007] An electroplating solution discharge pipe is connected to the input end of the circulating water pump.

[0008] An electroplating solution discharge main pipe and an electroplating solution discharge auxiliary pipe are fixedly installed on the output end of the circulating water pump through a three-way valve.

[0009] The end of the electroplating liquid discharge main pipe is arranged at the upper end of the inclined impurity supporting plate, the end of the electroplating liquid discharge pipe is arranged at one side of the lower end of the inclined impurity supporting plate, and the end of the electroplating liquid discharge auxiliary pipe is arranged at the other side of the lower end of the inclined impurity supporting plate.

[0010] Preferably, the end of the electroplating liquid discharge main pipe is fixedly provided with a spray frame, the surface of the spray frame is provided with a plurality of equidistant spray holes, and the output direction of the spray holes is parallel to the upper surface of the inclined impurity supporting plate.

[0011] Preferably, the end of the electroplating liquid discharge auxiliary pipe is fixedly provided with a small nozzle, and the small nozzle faces the end of the electroplating liquid discharge pipe.

[0012] Preferably, the pipe diameter of the electroplating liquid discharge main pipe is greater than the pipe diameter of the electroplating liquid discharge auxiliary pipe.

[0013] Preferably, the impurity filtering element is installed between the electroplating liquid discharge pipe and the circulating water pump.

[0014] Preferably, the impurity filtering element comprises a device box and a reverse flow filter bottle arranged in the device box, the inner top of the reverse flow filter bottle is provided with a water inlet hose and a water outlet hose, the water inlet hose is connected with the electroplating liquid discharge pipe, and the water outlet hose is connected with the circulating water pump.

[0015] Preferably, the inner top of the reverse flow filter bottle is threadedly connected with a sealing plug, the bottom end of the sealing plug is fixedly provided with a filter screen, and the water inlet hose and the water outlet hose are fixedly arranged in the sealing plug.

[0016] Preferably, the water inlet hose penetrates through the filter screen, the end of the water inlet hose is fixedly provided with a return elbow, the end of the water inlet hose is vertically opposite to the top surface of the filter screen, and the end of the return elbow is vertically opposite to the bottom surface of the filter screen.

[0017] The utility model discloses an electroplating liquid impurity cleaning device, and has the beneficial effects as follows: the device is provided with an inclined impurity supporting plate in the electroplating pool, is used for supporting metal impurities, then utilizes the electroplating liquid circulating pipeline, and through the electroplating liquid discharge main pipe connection spray frame from the top of the inclined impurity supporting plate downwardly spouts, thereby realizing that the metal impurities are quickly gathered to the bottom end of the inclined impurity supporting plate, then through the electroplating liquid discharge auxiliary pipe, the impurities at the bottom end of the inclined impurity supporting plate are blown to one side, thereby making the impurities can quickly enter the electroplating liquid discharge pipe, and making the metal impurities quickly collect and discharge. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description, obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the premise of the drawings.

[0019] Figure 1 It is a whole outer surface structure schematic diagram of the present application.

[0020] Figure 2 It is a plating solution circulating pipeline structure schematic diagram of the present application.

[0021] Figure 3 It is an impurity filtering piece structure schematic diagram of the present application.

[0022] Figure 4 It is an internal structure sectional view of the countercurrent filter bottle of the present application.

[0023] In the figure: 1, circulating water pump; 2, impurity filtering piece; 21, equipment box; 22, countercurrent filter bottle; 23, sealing plug; 24, water outlet hose; 25, water inlet hose; 26, filter screen; 27, return bend; 3, plating solution circulating pipeline; 31, plating solution discharge pipe; 32, spraying frame; 33, small nozzle; 34, plating solution discharge main pipe; 35, plating solution discharge auxiliary pipe; 36, three-way valve; 4, inclined impurity supporting plate. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme in the embodiments of the present application is described clearly and completely, obviously, the described embodiments are some embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application.

[0025] The application embodiment provides a plating solution impurity cleaning device, solves the problem that the existing external circulating pipeline generates directional circulating flow of the plating solution in the plating tank, but the flow speed, and only one group of plating solution external circulating outlets is generally arranged, so that the metal impurities deposited at the bottom of the plating tank are difficult to be quickly circulated and discharged, and the cleaning effect is affected.

[0026] In order to better understand the above technical solutions, the above technical solutions will be described in detail in combination with the drawings of the specification and specific embodiments.

[0027] The embodiments of the present application disclose a plating solution impurity cleaning device.

[0028] According to the attached Figures 1-4 As shown, including the electroplating solution circulation pipeline 3 and the inclined impurity support plate 4, the electroplating solution circulation pipeline 3 is installed with a circulating water pump 1, and the electroplating solution circulation pipeline 3 is installed with an impurity filter 2;

[0029] The electroplating solution circulation pipeline 3 includes;

[0030] The electroplating solution discharge pipe 31 is connected with the input end of the circulating water pump 1;

[0031] The electroplating solution discharge main pipe 34 and the electroplating solution discharge auxiliary pipe 35 are fixedly installed on the output end of the circulating water pump 1 through the three-way valve 36;

[0032] The end of the electroplating solution discharge main pipe 34 is arranged at the upper end of the inclined impurity support plate 4, the end of the electroplating solution discharge pipe 31 is arranged at one side of the lower end of the inclined impurity support plate 4, and the end of the electroplating solution discharge auxiliary pipe 35 is arranged at the other side of the lower end of the inclined impurity support plate 4.

[0033] The end of the electroplating solution discharge main pipe 34 is fixedly provided with a spouting frame 32, a plurality of equidistant spray holes are arranged on the surface of the spouting frame 32, and the output direction of the spray holes is parallel to the upper surface of the inclined impurity support plate 4.

[0034] The end of the electroplating solution discharge auxiliary pipe 35 is fixedly provided with a small nozzle 33, and the small nozzle 33 is opposite to the end of the electroplating solution discharge pipe 31.

[0035] By arranging the inclined impurity support plate 4 inside the electroplating tank for supporting metal impurities, and then using the electroplating solution circulation pipeline 3 to connect the spouting frame 32 through the electroplating solution discharge main pipe 34 to spout from the top of the inclined impurity support plate 4 to the bottom, the metal impurities can be quickly gathered to the bottom end of the inclined impurity support plate 4, and then the impurities at the bottom end of the inclined impurity support plate 4 are blown to one side through the electroplating solution discharge auxiliary pipe 35, so that the impurities can quickly enter the electroplating solution discharge pipe 31, and the metal impurities are quickly collected and discharged

[0036] The pipe diameter of the electroplating solution discharge main pipe 34 is greater than that of the electroplating solution discharge auxiliary pipe 35, so that the water flow at the spouting frame 32 is larger, the impurities are quickly gathered to the bottom end through the long inclined surface of the inclined impurity support plate 4, and the water flow at the small nozzle 33 is smaller, so that the bottom end impurities move slowly laterally, avoiding the scattering of impurities caused by stirring.

[0037] The impurity filter 2 is installed between the electroplating solution discharge pipe 31 and the circulating water pump 1.

[0038] The impurity filtering piece 2 comprises a device box 21 and a counter-flow filtering bottle 22 placed inside the device box 21, the inner top of the counter-flow filtering bottle 22 is provided with a water inlet hose 25 and a water outlet hose 24, the water inlet hose 25 is connected with the electroplating solution discharge pipe 31, the water outlet hose 24 is connected with the circulating water pump 1, the impurities in the electroplating solution discharged into the main pipe 34 enter into the counter-flow filtering bottle 22, then the electroplating solution is discharged in counter-flow, and the impurities are collected in the counter-flow filtering bottle 22.

[0039] The inner top of the counter-flow filtering bottle 22 is screw-connected with a sealing plug 23, the bottom end of the sealing plug 23 is fixedly provided with a filter screen 26, the water inlet hose 25 and the water outlet hose 24 are fixedly arranged in the sealing plug 23, the water inlet hose 25 penetrates through the filter screen 26, the end of the water inlet hose 25 is fixedly provided with a return bend 27, the end of the water inlet hose 25 is vertically opposite to the top surface of the filter screen 26, the end of the return bend 27 is vertically opposite to the bottom surface of the filter screen 26, the impurities in the electroplating solution enter into the return bend 27 and are sprayed upwards to the bottom of the filter screen 26, on the one hand, the impurities are cleaned by water power, on the other hand, the electroplating solution is quickly upwardly shaped and moved, meanwhile, the impurities at the bottom of the counter-flow filtering bottle 22 are avoided from being agitated to cause the filter screen 26 to be blocked, and the metal impurities are quickly deposited on the inner bottom of the counter-flow filtering bottle 22.

[0040] The basic principle and main features of the utility model and the advantages of the utility model are shown and described. It should be understood by the person skilled in the art that the utility model is not limited by the above-mentioned embodiments, the above-mentioned embodiments and the description in the specification are only for illustrating the principle of the utility model, under the premise of not departing from the spirit and scope of the utility model, the utility model can have various changes and improvements, and these changes and improvements all fall into the scope of the utility model claimed for protection. The protection scope of the utility model is defined by the appended claims and the equivalents thereof.

Claims

1. An electroplating solution impurity cleaning device, comprising an electroplating solution circulation pipeline (3) and an inclined impurity support plate (4), wherein a circulating water pump (1) is installed on the electroplating solution circulation pipeline (3), characterized in that, An impurity filter element (2) is installed on the electroplating solution circulation pipeline (3); The electroplating solution circulation pipeline (3) includes: The electroplating solution discharge pipe (31) is connected to the input end of the circulating water pump (1); Electroplating solution is discharged into a main pipe (34) and an electroplating solution is discharged into a secondary pipe (35). The main pipe (34) and the secondary pipe (35) are fixedly installed at the output end of the circulating water pump (1) through a three-way valve (36). The end of the main pipe (34) for discharging the electroplating solution is located at the upper end of the inclined impurity support plate (4), the end of the electroplating solution discharge pipe (31) is located on one side of the lower end of the inclined impurity support plate (4), and the end of the secondary pipe (35) for discharging the electroplating solution is located on the other side of the lower end of the inclined impurity support plate (4).

2. The electroplating solution impurity cleaning device according to claim 1, characterized in that: The end of the electroplating solution is fixedly provided with a jetting frame (32) and the surface of the jetting frame (32) is provided with a plurality of equidistant jet holes, and the output direction of the jet holes is parallel to the upper surface of the inclined impurity support plate (4).

3. The electroplating solution impurity cleaning device according to claim 2, characterized in that: A small nozzle (33) is fixedly installed at the end of the electroplating solution discharge pipe (35), and the small nozzle (33) is directly opposite the end of the electroplating solution discharge pipe (31).

4. The electroplating solution impurity cleaning device according to claim 1, characterized in that: The diameter of the main pipe (34) into which the electroplating solution is discharged is larger than the diameter of the secondary pipe (35) into which the electroplating solution is discharged.

5. The electroplating solution impurity cleaning device according to claim 1, characterized in that: The impurity filter element (2) is installed between the electroplating solution discharge pipe (31) and the circulating water pump (1).

6. The electroplating solution impurity cleaning device according to claim 1, characterized in that: The impurity filter element (2) includes an equipment box (21) and a counter-current filter bottle (22) placed inside the equipment box (21). The counter-current filter bottle (22) has an inlet hose (25) and an outlet hose (24) installed on its inner top. The inlet hose (25) is connected to the electroplating solution discharge pipe (31), and the outlet hose (24) is connected to the circulating water pump (1).

7. The electroplating solution impurity cleaning device according to claim 6, characterized in that: The inner top of the counter-current filter bottle (22) is threaded with a sealing plug (23), and a filter screen (26) is fixedly installed at the bottom of the sealing plug (23). The inlet hose (25) and the outlet hose (24) are both fixedly installed in the sealing plug (23).

8. The electroplating solution impurity cleaning device according to claim 7, characterized in that: The water inlet hose (25) passes through the filter screen (26), and a return bend (27) is fixedly provided at the end of the water inlet hose (25). The end of the water inlet hose (25) is perpendicular to the top surface of the filter screen (26), and the end of the return bend (27) is perpendicular to the bottom surface of the filter screen (26).

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