LED lamp bead and LED lamp strip
By using partition strips to divide the cavity into independent areas using LED beads, the color difference problem caused by the mixing of different colored fluorescent adhesives is solved, achieving higher luminous quality and display effect.
Patent Information
- Application Number
- CN202520022914.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-06
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2035-01-06
AI Technical Summary
In the LED chip manufacturing process, directly applying fluorescent adhesives of different colors can easily lead to mixing and color differences, affecting the light emission quality and display effect.
The cavity is divided into two independent areas, a first area and a second area, by using partition strips, and each area is filled with fluorescent glue of a different color to prevent mixing.
It effectively avoids color differences caused by color mixing, and improves the quality of light emission and display effect.
Smart Images

Figure CN223564036U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of lighting, and particularly relates to an LED lamp bead and an LED lamp strip. BACKGROUND
[0002] In the manufacturing process of the LED lamp bead, in order to realize the multi-color light emitting effect, different colors of fluorescent glue need to be filled on the light emitting chip. However, directly filling and coating different colors of fluorescent glue is prone to cause the mixing of different colors of fluorescent glue, resulting in color difference caused by color mixing, thereby affecting the light emitting quality and display effect.
[0003] It should be noted that the above content is not necessarily prior art, and is not used to limit the patent protection scope of the application. CONTENT OF THE UTILITY MODEL
[0004] Embodiments of the application provide an LED lamp bead and an LED lamp strip to solve or alleviate one or more technical problems in the prior art.
[0005] The first aspect of the embodiments of the application provides an LED lamp bead, comprising:
[0006] A support comprising opposite first and second sides, wherein a through hole penetrating through the first side and the second side is formed in the support;
[0007] A heat dissipation plate fixed to the first side of the support and sealing a first end of the through hole, wherein the heat dissipation plate and the through hole of the support cooperate to form a concave cavity;
[0008] A partition strip fixed to a side of the heat dissipation plate facing the support and spanning the inner walls of the through hole at both ends, wherein the partition strip is used to separate the concave cavity into a spaced first region and a second region;
[0009] A plurality of light emitting chips mounted on the heat dissipation plate, at least part of the light emitting chips being located in the first region and the other part of the light emitting chips being located in the second region;
[0010] An optical lens fixed to the second side of the support and sealing a second end of the through hole.
[0011] Optionally, the height of the partition strip is less than the depth of the through hole.
[0012] Optionally, the area of the first region and the area of the second region are the same.
[0013] Optionally, the projection shape of the support in the vertical direction is a rectangle or a circle.
[0014] The projection shape of the through hole in the vertical direction is a rectangle or a circle.
[0015] Optionally, the light emitting chip located in the first region comprises a plurality of first sub light emitting chips, and the light emitting colors of the plurality of first sub light emitting chips are different.
[0016] Optionally, the LED lamp bead further comprises:
[0017] a first glue layer filled in the first region and covering the light emitting chip in the first region;
[0018] a second glue layer filled in the second region and covering the light emitting chip in the second region;
[0019] the color of the first glue layer and the color of the second glue layer are different.
[0020] Optionally, the LED lamp bead further comprises a third glue layer covering the first glue layer and the second glue layer.
[0021] Optionally, the shape of the optical lens body is a cone.
[0022] Optionally, the LED lamp bead further comprises a sealing ring annularly distributed along the joint of the optical lens body and the support.
[0023] A second aspect of the embodiments of the present application provides an LED light bar, comprising:
[0024] a substrate;
[0025] a plurality of LED lamp beads as described in any one of the above, and the plurality of LED lamp beads are fixedly arranged on the substrate.
[0026] The technical solutions of the embodiments of the present application can include the following advantages:
[0027] The partition strip can separate the concave cavity into two independent regions, i.e., the first region and the second region, so that different color fluorescent glue can be filled in the first region and the second region respectively when filling the fluorescent glue of different colors, thereby avoiding interference and mixing of the fluorescent glue of different colors and reducing the color difference caused by color mixing to affect the light emitting quality and display effect.
[0028] The above summary is only for the purpose of the description and is not intended to limit in any way. In addition to the above described exemplary aspects, embodiments and features, further aspects, embodiments and features of the present application will be readily apparent to those skilled in the art by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF DRAWINGS
[0029] In the drawings, like reference numerals refer to like elements throughout the various figures. The drawings are not necessarily to scale, the emphasis instead being placed upon illustrating the principles of the application. It should be understood that the drawings are merely schematic and that the application can be embodied in many different forms.
[0030] Figure 1 A structural schematic diagram of an LED lamp bead provided by an embodiment of the application;
[0031] Figure 2 A sectional view of an LED lamp bead provided by an embodiment of the application;
[0032] Figure 3 A top view of an LED lamp bead provided by an embodiment of the application;
[0033] Figure 4 A structural schematic diagram of an LED lamp strip provided by an embodiment of the application.
[0034] Legend of reference numerals:
[0035] Support 11; concave cavity 111; first region 113; second region 115; heat dissipation plate 12; light emitting chip 13; optical lens body 14; partition strip 16; sealing ring 19; first glue layer 21; second glue layer 22; third glue layer 23; LED lamp bead 100; substrate 200. DETAILED DESCRIPTION
[0036] Embodiments of the application are described in detail below, examples of which are shown in the accompanying drawings. In the drawings, the size and relative sizes of layers, regions, elements, and the like can be exaggerated for clarity. Identical or similar components are denoted by identical or similar reference numerals throughout the drawings. The embodiments described below by reference to the drawings are exemplary only, and are intended to explain the application, but should not be understood as limiting the application.
[0037] It will be understood that when an element or layer is referred to as being "on" or "connected to" another element or layer, it can be directly on or connected to the other element or layer or intervening elements or layers can be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present application. Similarly, a second element, component, region, layer or section discussed below could be termed a first element, component, region, layer or section without departing from the teachings of the present application.
[0038] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, can be fixedly connected, or can be detachably connected, or can be integrated; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium; can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above-mentioned terms in the present application can be understood according to the specific circumstances.
[0039] It should be noted that the terms "first", "second", and the like in the description and in the claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily have to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device that includes a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.
[0040] In this application, when referring to a numerical interval (i.e., a numerical range), the distribution of the selectable values within the numerical interval is considered continuous and includes both numerical endpoints (i.e., the minimum and maximum values) of the numerical interval and every numerical value between the two numerical endpoints, unless otherwise specified. When a numerical interval refers only to integers within the numerical interval, unless otherwise specified, the two endpoint integers and every integer between the two endpoints are considered to be directly enumerated. When multiple numerical ranges are provided to describe a characteristic or feature, the numerical ranges can be combined. In other words, unless otherwise specified, a numerical range disclosed herein should be interpreted to include any and all sub-ranges encompassed therein. A "value" in a numerical interval can be any quantitative value, such as a number, a percentage, a ratio, etc. A "numerical interval" is intended to broadly encompass quantitative intervals, such as percentage intervals, ratio intervals, value intervals, etc.
[0041] The embodiments of the present application provide a LED lamp bead and a LED lamp strip technical solution. Based on this, the filling and coating of different color fluorescent glue in the LED lamp bead is reduced. The different color fluorescent glue is mixed with each other, thereby affecting the light emitting quality and display effect. See the following.
[0042] Hereinafter, exemplary embodiments according to the present application will be described in more detail with reference to the accompanying drawings. It should be understood that the exemplary embodiments can be implemented in various manners, and should not be interpreted as being limited to the embodiments set forth herein.
[0043] Please refer to Figures 1 to 3 The embodiments of the present application provide a LED lamp bead, which comprises a support 11, a heat dissipation plate 12, a partition strip 16, a plurality of light emitting chips 13 and an optical lens body 14. The following will be described in detail.
[0044] The support 11 comprises opposite first and second sides, and a through hole is formed in the support 11 and penetrates the first and second sides, that is, the through hole can penetrate from the first side to the second side. The support 11 can be used as the overall structure support of the LED lamp bead, and the material of the support 11 can comprise one of ceramic, EMC (Epoxy Molding Compound), PPA (Polyphthalamide) and PCT (Polycyclohexylene Dimethylene Terephthalate).
[0045] For example, the polyphthalamide has high mechanical strength and toughness, and is not easy to break or deform, so it can better protect the light-emitting chip 13 inside, and is suitable for scenes that require impact resistance and wear resistance. The ceramic has high thermal conductivity, can effectively conduct heat away to prevent overheating, and can withstand high temperature and mechanical wear, and is suitable for applications that require high heat resistance.
[0046] The heat dissipation plate 12 is fixed to the first side of the support 11 and blocks the first end of the through hole. The heat dissipation plate 12 and the through hole of the support 11 cooperate to form a recessed cavity 111, which can be used to accommodate the light-emitting chip 13.
[0047] The material of the heat dissipation plate 12 can include one of ceramic, copper, aluminum, iron and the like. The side of the heat dissipation plate 12 away from the support 11 is directly in contact with the external environment to absorb heat generated by the light-emitting chip 13 during operation, and dissipate the absorbed heat through the surface exposed to the external environment, which can reduce performance degradation and light decay caused by heat accumulation.
[0048] For example, aluminum has high thermal conductivity, between 200-250 W / (m·K), which can meet the heat dissipation and heat dissipation effect of the light-emitting chip 13. The weight of aluminum is relatively light, which helps to reduce the weight of the overall assembly.
[0049] The partition strip 16 is fixed to the side of the heat dissipation plate 12 facing the support 11, and the two ends are bridged on the inner wall of the through hole. The partition strip 16 is used to separate the recessed cavity 111 into spaced first and second regions 113 and 115.
[0050] A plurality of light-emitting chips 13 are mounted on the heat dissipation plate 12, at least part of the light-emitting chips 13 being located in the first region 113, and the other part of the light-emitting chips 13 being located in the second region 115.
[0051] The optical lens body 14 is fixed to the second side of the support 11 and blocks the second end of the through hole. The optical lens body 14 is made of transparent material and can be used to focus or adjust the beam angle of the light source. In the present embodiment, the optical lens body 14 can control the scattering angle of the light beam to be between 3° and 180°, which can be achieved by adjusting the height, thickness, shape, refractive index, etc. of the optical lens body 14.
[0052] In the present embodiment, the partition strip 16 can separate the recessed cavity 111 into two independent regions (i.e. the first and second regions 113 and 115), so that when filling different colors of fluorescent glue, different colors of fluorescent glue can be filled in the first and second regions 113 and 115 respectively, avoiding interference and mixing of different colors of fluorescent glue, and reducing the color difference caused by color mixing, which affects the light-emitting quality and display effect.
[0053] Further, in the embodiment, the height of the partition strip 16 is less than the depth of the through hole, and the propagation path of light from the light-emitting chip 13 to the optical lens body 14 is not easily blocked or interfered by the partition strip 16, thereby maintaining the uniformity and brightness of the light.
[0054] In an optional embodiment, the area of the first region 113 and the area of the second region 115 are the same. The two regions have the same area, which can accommodate the same number of fluorescent glue and light-emitting chips 13, thereby achieving balanced light intensity output and avoiding uneven or color-biased light emission due to area differences.
[0055] In addition, if the two regions are filled with different colors of fluorescent glue and the light-emitting chips 13 have the same power, the equal area can ensure that the light output ratio of the two colors is consistent, avoiding the case that one color is too strong or too weak, and improving the color restoration and performance.
[0056] Specifically, when the projection shape of the through hole in the vertical direction is circular, i.e., the recess 111 is cylindrical, the partition strip 16 can coincide along the diameter of the recess 111 to divide the recess 111 into two semicircles with the same area. When the projection shape of the through hole in the vertical direction is rectangular, i.e., the recess 111 is a rectangular space, the partition strip 16 can divide the recess 111 into two smaller rectangles with the same area.
[0057] In an optional embodiment, the projection shape of the support 11 in the vertical direction is rectangular or circular, and the projection shape of the through hole in the vertical direction is rectangular or circular. The circular through hole can make the light more concentrated and uniformly distributed when reflecting the light, and is more suitable for application scenarios that require high light intensity or circular light spots.
[0058] It can be understood that the projection shape of the support 11 in the vertical direction can also be other shapes, such as triangular, pentagonal, etc., and the overall shape of the support 11 can also be customized according to requirements, which is not limited herein.
[0059] In an optional embodiment, the light-emitting chip 13 located in the first region 113 includes a plurality of first sub-light-emitting chips 13, and the light-emitting colors of the plurality of first sub-light-emitting chips 13 are different.
[0060] The plurality of sub-light-emitting chips 13 of different colors can achieve multi-color light output by combining light emission, thereby meeting the user's demand for color richness. Specifically, the brightness ratio of the sub-light-emitting chips 13 of different colors can be controlled to achieve a dynamic color-changing effect (such as RGB color mixing), which can be used for scene lighting or atmosphere lighting.
[0061] In some embodiments, the plurality of color sub-light-emitting chips 13 can also work individually or jointly to adapt to different optical application requirements, such as adjusting color temperature and color tone.
[0062] In some embodiments, the plurality of first sub-light emitting chips 13 can also emit the same light color, and on this basis, the corresponding color of fluorescent glue can be filled on the plurality of first sub-light emitting chips 13 to control the overall light emitting color.
[0063] In an optional embodiment, the LED lamp bead further comprises a first glue layer 21 and a second glue layer 22, wherein the first glue layer 21 is filled in the first area 113 and covers the light emitting chip 13 in the first area 113, the second glue layer 22 is filled in the second area and covers the light emitting chip 13 in the second area, and the color of the first glue layer 21 and the color of the second glue layer 22 are different. Specifically, in this embodiment, the first glue layer 21 and the second glue layer 22 can be fluorescent glue, and the fluorescent glue has fluorescent powder therein, and the material of the fluorescent powder in the fluorescent glue, the material of the light emitting chip 13, etc. can be adjusted to meet the requirements of light efficiency, color temperature, color rendering index, etc. of specific applications.
[0064] The color of the first glue layer 21 and the second glue layer 22 is different, and the light of the light emitting chip 13 in each area can be combined with the color of the glue layer to achieve different color light output and meet the demand of multi-color light source. And since the first area 113 and the second area 115 are separated by the partition strip 16 and are independent of each other, the two glue layers can not interfere with each other, avoiding the problem of impure light color or color difference caused by color mixing, so as to improve the light emitting quality.
[0065] In some embodiments, the partition strip 16 can be cross-shaped to isolate four independent areas in the cavity 111, and the light emitting chip 13 and the fluorescent glue of different colors can be arranged in the four different areas to achieve more light emitting effects.
[0066] For example, the light emitting chip 13 can emit monochromatic light (such as blue light or ultraviolet light), and the fluorescent glue contains fluorescent powder, which will emit light of different colors when excited by the light emitted by the light emitting chip 13. By mixing different fluorescent powders, the originally monochromatic light can be converted into white light or other color light needed, thereby meeting different application requirements.
[0067] Further, in this embodiment, the LED lamp bead can further comprise a third glue layer 23, the third glue layer 23 covers the first glue layer 21 and the second glue layer 22, and the third glue layer 23 can be a transparent material.
[0068] The third glue layer 23 covers the first glue layer 21 and the second glue layer 22, which can effectively protect the internal fluorescent glue layer and the light-emitting chip 13 from the external environment, improve the reliability and service life of the LED lamp bead. The transparent third glue layer 23 can also uniformly refract and conduct the light emitted from the first glue layer 21 and the second glue layer 22, reducing the scattering and loss of light, thereby improving the overall light efficiency and brightness. The third glue layer 23 can also play the role of optical flattening, that is, by covering the interface of the first and second glue layers 22, the output light is more uniform, avoiding optical unevenness caused by the glue layer interface.
[0069] In an optional embodiment, the shape of the optical lens body 14 is a cone. The conical optical lens body 14 can effectively concentrate light, concentrating the light emitted by the light-emitting chip 13 to a specified area, improving the light intensity, and adapting to scenes requiring high brightness or directional lighting. The conical optical lens body 14 can also better distribute light, reduce glare problems, and optimize the uniformity of the outgoing light, avoiding obvious light spots.
[0070] Specifically, the conical optical lens body 14 can also control the degree of light divergence by adjusting the angle and height of the cone, thereby meeting different optical design requirements, such as narrow-beam or wide-beam lighting.
[0071] In some embodiments, the optical lens body 14 can also be spherical, cylindrical, or biconvex, among other shapes. The spherical optical lens body 14 is simple to manufacture and has good light concentrating and diffusing performance, allowing for uniform light distribution. The cylindrical optical lens body 14 has strong light concentrating directionality, which can focus light into a line, suitable for strip lights, lasers, etc. The biconvex optical lens body 14 has convex surfaces on both sides, with strong optical focusing ability, which can be suitable for projectors, high-brightness lamps, etc.
[0072] In this embodiment, the optical lens body 14 can include materials such as silicone, epoxy, glass, etc. that have transparent properties.
[0073] In an optional embodiment, the LED lamp bead further includes a sealing ring 19, which is annularly distributed along the intersection of the optical lens body 14 and the support 11.
[0074] The sealing ring 19 can effectively prevent dust, moisture, liquid, and other external pollutants from entering the internal structure of the lamp bead, protecting the light-emitting chip 13, the fluorescent glue layer, and other electronic components, and prolonging the service life of the lamp bead. Moreover, the sealing ring 19 can further strengthen the connection stability between the optical lens body 14 and the support 11. The sealing ring 19 can also absorb the stress generated by the thermal expansion and contraction of the optical lens body 14 and the support 11, reducing structural loosening or falling caused by temperature changes.
[0075] In an optional embodiment, the LED lamp bead further comprises an IC chip. The IC chip can be fixed on the heat sink 12 and electrically connected with the light-emitting chip 13. Specifically, the IC chip can convert the voltage of the input power supply into a suitable voltage required by the light-emitting chip 13. For example, the light-emitting chip 13 can require a lower voltage than the voltage provided by the power supply, and the IC chip is responsible for adjusting and stabilizing these voltages. The IC chip can also accurately control the current flowing through the light-emitting chip 13, ensuring that the light-emitting chip 13 operates within a safe and efficient operating range, thereby prolonging the service life of the light-emitting chip 13 and optimizing the light output. The IC chip can also be used to adjust the light-emitting mode of the light-emitting chip 13, for example, controlling the light-emitting chip 13 to emit light in the form of a breathing light, a flicker, a gradient, etc.
[0076] Referring to Figure 4 The embodiments of the present application also provide an LED light bar comprising a substrate 200 and a plurality of LED lamp beads 100 according to any of the above embodiments, the plurality of LED lamp beads 100 being fixed on the substrate 200 at intervals.
[0077] The substrate 200 can be a flexible printed circuit board (FPCB) having good bending and flexibility, and the substrate 200 can be easily wound, bent or laid along a complex profile shape, so that the LED light bar can adapt to various installation environments, such as curved surfaces, curved surfaces or specific shapes.
[0078] The substrate 200 can be a flexible printed circuit board (FPCB) having good bending and flexibility, and the substrate 200 can be easily wound, bent or laid along a complex profile shape, so that the LED light bar can adapt to various installation environments, such as curved surfaces, curved surfaces or specific shapes.
[0079] In a preferred embodiment, the plurality of LED lamp beads 100 are arranged at intervals on the substrate 200. Uniformly spaced arrangement can prevent the light source from producing significant brightness differences or hot spots, ensuring uniform light distribution throughout the lighting area and avoiding the appearance of light spots or dark areas. Uniform arrangement can also allow the light between the LED lamp beads 100 to overlap effectively, resulting in consistent brightness throughout the LED light bar or lighting area, thereby providing a smooth and uniform lighting effect. In addition, the uniform distribution of the LED lamp beads 100 can also disperse the heat generated by the plurality of LED lamp beads 100, avoiding local overheating and reducing the shortening of the service life of the lamp beads caused by high temperature.
[0080] The LED light bar of the embodiment can be widely applied in multiple fields to meet different lighting and decoration needs. For example, it can be applied in home lighting, such as installing the LED light bar in areas such as ceiling, wall, under cabinet, etc. to provide soft background light or decorative light effect and improve the aesthetics of the home environment. Or it can be used to create a specific atmosphere, such as warm bedroom light or modern style living room light, to adapt to different use situations by adjusting the brightness and color temperature. It can also be applied in outdoor lighting, such as exterior contour lighting of buildings to highlight the structure and design of the building and enhance the visual impact at night.
[0081] It should be noted that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. The orientation terms "inner" and "outer" refer to the inner and outer of the profile of each component itself. For example, if the device in the drawing is inverted, the device described as "above" or "on" other devices or structures will be positioned "below" or "under" the other devices or structures. Thus, the exemplary term "above" can include both "above" and "below" orientations. The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein are interpreted accordingly.
[0082] It should also be noted that "one embodiment", "another embodiment", "embodiment", and the like in the present application refer to specific features, structures or characteristics described in conjunction with the embodiment, which are included in at least one embodiment generally described in the present application. The same expression appearing in multiple places in the specification does not necessarily refer to the same embodiment. Further, when a specific feature, structure or characteristic is described in conjunction with any embodiment, it is claimed that the implementation of such feature, structure or characteristic in conjunction with other embodiments also falls within the scope of the present application.
[0083] In the above embodiments, the description of each embodiment has its own focus, and the parts not described in detail in a certain embodiment can be referred to the relevant description of other embodiments.
[0084] It also needs to be explained that the above is only the preferred embodiment of the application, and does not limit the patent protection scope of the application, and any equivalent structure or equivalent process transformation using the content of the application specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the application.
Claims
1. An LED lamp bead, characterized in that, The LED lamp bead comprises: a support comprising opposite first and second sides, the support having a through hole extending through the first and second sides; a heat sink fixed to the first side of the support and blocking a first end of the through hole, the heat sink and the through hole of the support cooperating to form a concave cavity; a partition strip fixed to a side of the heat sink facing the support and spanning the inner walls of the through hole at both ends, the partition strip being used to divide the concave cavity into spaced first and second regions; a plurality of light emitting chips mounted on the heat sink, at least some of the light emitting chips being located in the first region and the other light emitting chips being located in the second region; an optical lens body fixed to the second side of the support and blocking a second end of the through hole.
2. The LED lamp bead of claim 1, wherein, The height of the partition strip is less than the depth of the through hole.
3. The LED lamp bead of claim 1, wherein, The area of the first region is the same as the area of the second region.
4. The LED lamp bead of claim 1, wherein, The support has a rectangular or circular projection shape in the vertical direction. The through hole has a rectangular or circular projection shape in the vertical direction.
5. The LED lamp bead of claim 1, wherein, The light emitting chips located in the first region comprise a plurality of first sub light emitting chips, and the light emitting colors of the first sub light emitting chips are different.
6. The LED lamp bead of claim 1, wherein, The LED lamp bead further comprises: a first glue layer filled in the first region and covering the light emitting chips in the first region; a second glue layer filled in the second region and covering the light emitting chips in the second region; The color of the first glue layer is different from the color of the second glue layer.
7. The LED lamp bead of claim 6, wherein, The LED lamp bead further comprises a third glue layer covering the first glue layer and the second glue layer.
8. The LED lamp bead according to any one of claims 1-7, characterized in that, The optical lens body has a conical shape.
9. The LED lamp bead according to any one of claims 1-7, characterized in that, The LED lamp bead further comprises a sealing ring annularly distributed along the joint of the optical lens body and the support.
10. An LED light bar, characterized by, The LED lamp bead comprises: a substrate; a plurality of LED lamp beads according to any one of claims 1-9, the LED lamp beads being fixed on the substrate in a spaced manner.