Test fixture for large-current integrated circuit chip

By combining structures such as a flip-up base, display screen, and pin plate, the contact pressure between the pin plate and the chip pins can be monitored and adjusted in real time, solving the problem of test instability caused by changes in probe contact pressure in existing technologies, and achieving stability of high-current testing and chip protection.

CN223565739UActive Publication Date: 2025-11-18SHENZHEN GAOSHI SEMICONDUCTOR TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202422914133.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-28
Publication Date
2025-11-18
Estimated Expiration
2034-11-28

AI Technical Summary

Technical Problem

Existing high-current test fixtures experience changes in probe-pin contact pressure after prolonged use, leading to decreased test stability and potential chip damage.

Method used

It adopts a combination structure of flip base, display screen, needle plate, test leads, lifting base, guide rod, mounting base, spring, pressure sensor and adjustment base. The contact pressure between the needle plate and the chip pin is monitored and adjusted in real time through pressure sensor and display screen to ensure that it is within the rated range.

Benefits of technology

This improves the stability of high-current testing, avoids chip damage, and ensures the accuracy and reliability of test data.

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Abstract

The utility model provides a test fixture for a large-current integrated circuit chip, and the test fixture comprises a test assembly which comprises an overturning seat, a display screen, a needle plate, two test lines, a lifting seat, four guide rods, two installation seats, a spring, four pressure sensors, a limiting plate, and an adjusting seat. And the lower part of the outer side wall of the adjusting seat is in threaded connection with the upper part of the inner side wall of the overturning seat. According to the utility model, by rotating the adjusting seat, the adjusting seat moves downwards and pushes the lifting seat to move downwards, after the needle plate is in contact with the chip, the spring is stressed and compressed, the needle plate can keep in contact with the pin of the chip, the upward counter-acting force of the needle plate pushes the pressure sensor, and the pressure borne by the chip can be displayed through the display screen; and then the adjusting seat is rotated according to the displayed pressure value to adjust the pressure on the chip, so that the pressure of the probe and the chip pin can be ensured to be within a rated range, the test stability is improved, and the chip cannot be damaged.
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Description

TECHNICAL FIELD

[0001] The utility model relates to a test fixture, concretely big current integrated circuit chip's test fixture belongs to chip test fixture technical field. BACKGROUND

[0002] Integrated circuit chip is the micro electronic device that multiple electronic components and interconnection circuit are integrated on single silicon chip or other semiconductor material. Integrated circuit chip mainly includes silicon substrate, circuit, fixed seal ring, ground ring and protection ring etc. Circuit is formed on the silicon substrate, has at least one output / input pad. Fixed seal ring surrounds circuit and output / input pad, ground ring is electrically connected with fixed seal ring, and protection ring surrounds output / input pad to provide protection.

[0003] When big current test is carried out to integrated circuit chip, the probe or contact point of fixture needs to keep stable contact with the pin of chip to ensure the accuracy of test data. For big current test, the material and structure of contact point need to be able to withstand the impact and wear of big current.

[0004] It is known that Chinese public authorization patent (public number: CN221261168U) discloses a kind of radio frequency bare chip testing device, it is moved along guide rod and extruded spring by pressing seat, pressing seat drives connecting seat, connecting seat drives gold-plated signal needle plate, in turn can make the signal needle of gold-plated signal needle plate and radio frequency bare chip contact;

[0005] It makes the probe contact with the pin of chip by the way of spring pressing, although it can play the effect of keeping contact, but with the increase of spring use times, spring will be worn, in turn lead to the change of probe and pin contact pressure, affect the stability of test, for this, a kind of big current integrated circuit chip's test fixture is presented. Utility model content

[0006] Therefore, the utility model provides a kind of big current integrated circuit chip's test fixture to solve or alleviate the technical problems existing in prior art, at least provide a kind of beneficial selection.

[0007] The technical scheme of the utility model embodiment is realized as follows: a kind of big current integrated circuit chip's test fixture, including test component, the test component includes turnover seat, display screen, needle plate, two test lines, lifting seat, four guide rods, two mounting seats, spring, four pressure sensors, limit board and adjusting seat;

[0008] The lower part of the outer side wall of the adjusting seat is screwed to the upper part of the inner side wall of the turnover seat, the four guide rods are fixedly connected to the upper surfaces of the two mounting seats, the spring sleeve is connected to the outer side wall of the guide rod, the four pressure sensors are symmetrically mounted on the inner top walls of the two mounting seats, the outer side wall of the needle plate is slidably connected to the inner side walls of the two mounting seats, the limiting plate is fixedly connected to the lower surface of the mounting seat through a screw, the bottom ends of the two test lines are symmetrically mounted on the upper surface of the needle plate, the display screen is mounted on the front surface of the turnover seat, and the lifting seat is slidably connected to the inner side wall of the turnover seat.

[0009] Further preferably, the lower surface of the adjusting seat is attached to the upper surface of the lifting seat, and the lifting seat is slidably connected to the outer side walls of the four guide rods.

[0010] Further preferably, the top end of the spring is fixedly connected to the lower surface of the lifting seat, and the bottom end of the spring is fixedly connected to the upper surface of the mounting seat.

[0011] Further preferably, the upper surface of the limiting plate is attached to the lower surface of the needle plate, and the upper surface of the needle plate is attached to the bottom ends of the four pressure sensors.

[0012] Further preferably, the test line extends outward from the inside of the adjusting seat.

[0013] Further preferably, the lower surface of the turnover seat is provided with a support assembly, and the support assembly comprises a base, a chip limiting seat and a limiting groove.

[0014] The chip limiting seat is fixedly connected to the upper surface of the base, and the limiting groove is formed in the upper surface of the chip limiting seat.

[0015] Further preferably, the rear part of the lower surface of the turnover seat is rotatably connected to the upper surface of the chip limiting seat, and the front surface of the turnover seat is clamped with the chip limiting seat through a buckle.

[0016] Further preferably, the position of the needle plate corresponds to the position of the limiting groove.

[0017] The utility model discloses an embodiment has the following advantages because of adopting the above technical scheme: the utility model discloses through the rotation adjustment seat, adjustment seat moves down and promotes the lifting seat to move down, when needle plate and chip contact, spring force is compressed, under the impetus of spring, needle plate can keep and the pin contact of chip, and the counterforce of needle plate upward promotes pressure sensor, can show the pressure that chip received through display screen, then according to the pressure numerical value of display, rotation adjustment seat, the pressure that chip received is adjusted, and then can guarantee the pressure of probe and chip pin in the rated range, improve the stability of test, and will not cause the damage of chip.

[0018] The above summary is intended to illustrate only and is not intended to limit the application in any way. Further aspects, embodiments and features of the application will be apparent from a review of the drawings and the following detailed description. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0020] Figure 1 The utility model discloses a structural diagram;

[0021] Figure 2 The utility model discloses a support assembly structural diagram;

[0022] Figure 3 The utility model discloses a test assembly structural diagram;

[0023] Figure 4 The utility model discloses a lifting seat structural diagram;

[0024] Figure 5 The utility model discloses a mounting seat and needle plate connection schematic view;

[0025] Figure 6 The utility model discloses an adjustment seat structural diagram;

[0026] Figure 7 The utility model discloses a turnover seat structural diagram.

[0027] : 101, test assembly; 11, turnover seat; 12, display screen; 13, needle plate; 14, test line; 15, lifting seat; 16, guide rod; 17, mounting seat; 18, spring; 19, pressure sensor; 20, limiting plate; 21, adjusting seat; 301, supporting assembly; 31, base; 32, chip limiting seat; 33, limiting groove. DETAILED DESCRIPTION

[0028] In the following, only certain exemplary embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present application. Therefore, the drawings and the description are considered to be exemplary in nature rather than limiting.

[0029] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0030] As Figures 1-7 shown, the utility model discloses a kind of test fixtures of high-current integrated circuit chip, including test assembly 101, test assembly 101 including turnover seat 11, display screen 12, needle plate 13, two test lines 14, lifting seat 15, four guide rods 16, two mounting seats 17, spring 18, four pressure sensors 19, limiting plate 20 and adjusting seat 21;

[0031] The lower part of the outer side wall of adjusting seat 21 is screw-connected to the upper part of the inner side wall of turnover seat 11, four guide rods 16 are fixedly connected to the upper surfaces of two mounting seats 17 symmetrically, spring 18 is sleeved on the outer side wall of guide rod 16, four pressure sensors 19 are installed on the inner top walls of two mounting seats 17 symmetrically, the outer side wall of needle plate 13 is slidingly connected to the inner side wall of two mounting seats 17, limiting plate 20 is fixedly connected to the lower surface of mounting seat 17 by screw, the bottom ends of two test lines 14 are installed on the upper surface of needle plate 13 symmetrically, display screen 12 is installed on the front surface of turnover seat 11, and lifting seat 15 is slidingly connected to the inner side wall of turnover seat 11.

[0032] In one embodiment, the lower surface of adjusting seat 21 is attached to the upper surface of lifting seat 15, and lifting seat 15 is slidingly connected to the outer side wall of four guide rods 16. Since adjusting seat 21 is screw-connected to turnover seat 11, when adjusting seat 21 is rotated, adjusting seat 21 moves downward and pushes lifting seat 15 to move downward, and then the pressing action on the chip can be realized at this time, so that needle plate 13 contacts the pins of the chip.

[0033] In one embodiment, the top end of the spring 18 is fixedly connected to the lower surface of the lifting seat 15, the bottom end of the spring 18 is fixedly connected to the upper surface of the mounting seat 17, the upper surface of the limiting plate 20 is attached to the lower surface of the needle plate 13, the upper surface of the needle plate 13 is attached to the bottom end of the four pressure sensors 19, when the lifting seat 15 moves downward, the lifting seat 15 pushes the two mounting seats 17 through the spring 18, the two mounting seats 17 drive the needle plate 13 to move downward, when the needle plate 13 contacts the chip, the spring 18 is compressed under stress, and then the needle plate 13 can maintain contact with the pins of the chip, at the same time the upward reaction force of the needle plate 13 pushes the pressure sensor 19, the pressure sensor 19 can measure the pressure received by the chip, and then display the pressure value through the display screen 12, the user can adjust the adjusting seat 21 according to the pressure value displayed on the display screen 12 to increase or decrease the pressure of the needle plate 13 on the chip.

[0034] The signal end of the pressure sensor 19 is connected to the signal end of the display screen 12, and the model of the pressure sensor 19 is EVT-14A.

[0035] In one embodiment, the test line 14 extends from the inside of the adjusting seat 21 to the outside, and during testing, the chip can be connected to the external test equipment through the test line 14.

[0036] In one embodiment, the lower surface of the turnover seat 11 is provided with a supporting assembly 301, and the supporting assembly 301 comprises a base 31, a chip limiting seat 32 and a limiting groove 33.

[0037] The chip limiting seat 32 is fixedly connected to the upper surface of the base 31, and the limiting groove 33 is formed in the upper surface of the chip limiting seat 32, which can be used to place the chip and limit the position of the chip to avoid position deviation of the chip.

[0038] In one embodiment, the lower surface of the turnover seat 11 is rotatably connected to the upper surface of the chip limiting seat 32 at the rear, and the front surface of the turnover seat 11 is clamped with the chip limiting seat 32 through buckles, the position of the needle plate 13 corresponds to the position of the limiting groove 33, and the turnover seat 11 is connected with the chip limiting seat 32 through buckles, which can limit the position of the turnover seat 11, when the turnover seat 11 is opened, the needle plate 13 can be replaced by disassembling the screws on the limiting plate 20 to adapt to different models of chips.

[0039] The utility model discloses a chip pressure testing device, including the base 1, the display screen 12, the adjusting seat 21, the lifting seat 15, the spring 18, the two mounting seat 17, the needle plate 13, the pressure sensor 19, the limit groove 33, the turnover seat 11 and the chip limit seat 32, its work principle is: the chip that is placed in the limit groove 33 is contacted with the needle plate 13, and the pressure sensor 19 is pushed by the needle plate 13, and the pressure that the chip receives is measured through the pressure sensor 19, and then the display screen 12 is shown, and the user can adjust the adjusting seat 21 according to the pressure numerical value that the display screen 12 shows, and the pressure of the needle plate 13 to the chip is increased or reduced, and then the test line 14 is connected with external testing equipment, and the testing work can be carried out.

[0040] The above is only the specific implementation of the utility model, but the protection scope of the utility model is not limited to this, and anyone skilled in the art can easily think of various changes or replacements within the technical range disclosed by the utility model, and these should be covered in the protection scope of the utility model. Therefore, the protection scope of the utility model should be limited to the protection scope of the claims.

Claims

1. A test fixture for a high-current integrated circuit chip, comprising a test assembly (101), characterized in that: The test assembly (101) includes a flip seat (11), a display screen (12), a needle plate (13), two test lines (14), a lifting seat (15), four guide rods (16), two mounting seats (17), a spring (18), four pressure sensors (19), a limit plate (20), and an adjustment seat (21). The lower part of the outer side wall of the adjusting seat (21) is threaded to the upper part of the inner side wall of the flip seat (11). The four guide rods (16) are symmetrically fixed to the upper surfaces of the two mounting seats (17). The spring (18) is sleeved on the outer side wall of the guide rod (16). The four pressure sensors (19) are symmetrically installed on the inner top walls of the two mounting seats (17). The outer side wall of the needle plate (13) is slidably connected to the inner side wall of the two mounting seats (17). The limiting plate (20) is fixedly connected to the lower surface of the mounting seat (17) by screws. The bottom ends of the two test lines (14) are symmetrically installed on the upper surface of the needle plate (13). The display screen (12) is installed on the front surface of the flip seat (11). The lifting seat (15) is slidably connected to the inner side wall of the flip seat (11).

2. The test fixture for a high-current integrated circuit chip according to claim 1, characterized in that: The lower surface of the adjusting seat (21) is attached to the upper surface of the lifting seat (15), and the lifting seat (15) is slidably connected to the outer side wall of the four guide rods (16).

3. The test fixture for a high-current integrated circuit chip according to claim 2, characterized in that: The top end of the spring (18) is fixedly connected to the lower surface of the lifting seat (15), and the bottom end of the spring (18) is fixedly connected to the upper surface of the mounting seat (17).

4. The test fixture for a high-current integrated circuit chip according to claim 3, characterized in that: The upper surface of the limiting plate (20) is attached to the lower surface of the needle plate (13), and the upper surface of the needle plate (13) is attached to the bottom of the four pressure sensors (19).

5. The test fixture for a high-current integrated circuit chip according to claim 4, characterized in that: The test line (14) extends outward from the inside of the adjustment seat (21).

6. The test fixture for a high-current integrated circuit chip according to claim 5, characterized in that: The lower surface of the flip base (11) is equipped with a support assembly (301), which includes a base (31), a chip limiting base (32) and a limiting groove (33). The chip limiting seat (32) is fixedly connected to the upper surface of the base (31), and the limiting groove (33) is opened on the upper surface of the chip limiting seat (32).

7. A test fixture for a high-current integrated circuit chip according to claim 6, characterized in that: The rear part of the lower surface of the flip seat (11) is rotatably connected to the upper surface of the chip limiting seat (32), and the front surface of the flip seat (11) is snapped into the chip limiting seat (32) by a snap.

8. The test fixture for a high-current integrated circuit chip according to claim 7, characterized in that: The position of the needle plate (13) corresponds to the position of the limiting groove (33).

Citation Information

Patent Citations

  • Radio frequency bare chip testing device

    CN221261168U