High-precision antenna spring of semiconductor chip

By employing a T-shaped test probe and tentacled spring connection assembly in a semiconductor chip testing device, and utilizing a fastening screw and rubber pad design, the problem of difficulty in replacing the spring individually after damage is solved, achieving convenient replacement and cost reduction.

CN223565755UActive Publication Date: 2025-11-18GUOXIN INTELLIGENT MANUFACTURING (SHANDONG) INTELLIGENT TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202422813972.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-19
Publication Date
2025-11-18
Estimated Expiration
2034-11-19

AI Technical Summary

Technical Problem

In existing semiconductor chip testing equipment, it is difficult to replace a damaged spring individually, resulting in high overall replacement costs.

Method used

The test probe with a T-shaped cross-section is fixedly connected to the antenna spring through a connecting assembly. The antenna spring can be easily replaced using fastening screws and rubber pads. The replacement process is simplified by the design of disassembling the top cover and positioning base.

Benefits of technology

This technology enables easy replacement of the antenna springs, reducing replacement costs and improving maintenance convenience and stability.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the field of antenna springs, and discloses a semiconductor chip high-precision antenna spring, which comprises a sleeve internally provided with a test probe, the top end of the sleeve is fixedly connected with a positioning cylinder, the top end of the positioning cylinder is fixedly connected with a side positioning block, and the top end of the side positioning block is covered with a top cover. The top end of the top cover is fixedly connected with one end of the antenna spring, the outer side of the test probe penetrates through the center position of the positioning cylinder in a sliding mode and extends into the positioning cylinder, the top end of the test probe is fixedly connected with a connecting assembly, and the bottom end of the antenna spring is fixedly connected to the outer side of the connecting assembly in a sleeved mode. And the cost is reduced.
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Description

TECHNICAL FIELD

[0001] The utility model relates to the field of feeler spring, concretely is semiconductor chip high-precision feeler spring. BACKGROUND

[0002] The test probe is an electronic element for testing connection of semiconductor chips, and the types of the test probe include PCB probe, ICT function test probe (automobile wire harness test probe, battery needle, current and voltage needle, switch needle, capacitor polarity needle, high-frequency needle), BGA test probe and the like.

[0003] The utility model discloses a spring probe for semiconductor chip testing discloses the utility model relates to spring probe technical field. The utility model discloses a needle tube and needle shaft, the inside of needle tube is provided with spring groove, the inner surface of spring groove is connected with buffer spring, and the one end of buffer spring is fixedly connected with the one end of needle shaft, and needle shaft and needle tube slide fit, and the one end of needle shaft is fixedly connected with needle head, and the one end of needle shaft is provided with installation slot, and installation slot is spherical groove structure, and the inside installation of installation slot has ball.

[0004] The one end of the spring in the above-mentioned device is fixedly connected to the bottom surface of the sleeve body, and the other end is fixedly connected to the tail of the needle body, so that when the spring is damaged and loses elasticity, it is inconvenient to replace the individual spring, and the entire needle body and accessories need to be discarded together, which is costly. UTILITY MODEL CONTENTS

[0005] The utility model discloses a semiconductor chip high-precision feeler spring, which solves the problems in the above background technology.

[0006] To achieve the above object, the utility model provides the following technical scheme: a semiconductor chip high-precision feeler spring, comprising a sleeve internally provided with a test probe, the top end of the sleeve is fixedly connected with a positioning cylinder, and the top end of the positioning cylinder is fixedly connected with a side positioning block, the top end of the side positioning block is covered with a top cover, and the bottom end of the top cover is fixedly connected with one end of a feeler spring, the outside of the test probe is slidingly penetrated through the center position of the positioning cylinder and extends into the inside of the positioning cylinder, and the top end of the test probe is fixedly connected with a connecting assembly, and the bottom end of the feeler spring is fixedly sleeved on the outside of the connecting assembly.

[0007] Preferably, a plurality of through holes threadedly matched with the fastening screw are formed in the two sides of the side positioning block and the top cover.

[0008] Preferably, the connecting assembly comprises a positioning top block fixedly connected to the bottom end of the antenna spring.

[0009] Preferably, the bottom end of the positioning top block is fixedly connected with a positioning bottom block, and the test probe has a T-shaped structure.

[0010] Preferably, a fastening groove is formed in the center of the top end of the test probe and is adapted to the shape of the bottom end of the positioning bottom block.

[0011] Preferably, the outer side of the positioning bottom block is sleeved with a rubber pad.

[0012] Compared with the prior art, the utility model has the beneficial effects that:

[0013] The top end of the test probe with a T-shaped structure is fixedly connected with the antenna spring through the connecting assembly, so that the test probe can be conveniently detected, and when the antenna spring needs to be replaced, the top cover is disassembled from the top end of the side positioning block by disassembling a plurality of fastening screws, the antenna spring at the bottom end of the top cover is pulled out, and the positioning bottom block at the bottom end of the positioning top block is pulled out from the fastening groove of the test probe, the antenna spring is replaced, and after replacement, the positioning bottom block is inserted and fixed in the fastening groove, and the elasticity of the sleeved rubber pad makes the positioning bottom block more firmly connected with the fastening groove. BRIEF DESCRIPTION OF DRAWINGS

[0014] Fig. 1 It is a structural schematic view of the utility model;

[0015] Fig. 2 It is an enlarged schematic view of the structure at A of the utility model.

[0016] In the drawing: 1, test probe; 2, sleeve; 3, positioning cylinder; 4, side positioning block; 5, top cover; 6, antenna spring; 7, connecting assembly; 8, fastening screw; 101, fastening groove; 71, positioning top block; 72, positioning bottom block; 73, rubber pad. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0018] Embodiment one

[0019] Please refer to Figs. 1-2, the semiconductor chip high-precision antenna spring in the drawing, including the sleeve 2 that is internally provided with the test probe 1, the sleeve 2 top end fixedly connected with the positioning cylinder 3, and the positioning cylinder 3 top end fixedly connected with the side positioning block 4, the side positioning block 4 top end covers the top cover 5, and the top cover 5 bottom end is fixedly connected with the antenna spring 6 one end, the test probe 1 outside and the positioning cylinder 3 center position slidingly penetrates and extends to the positioning cylinder 3 inside, and the test probe 1 top end is fixedly connected with the connecting assembly 7, and the antenna spring 6 bottom end is fixedly connected with the connecting assembly 7 outside.

[0020] In the embodiment, a plurality of through holes matched with the fastening screw 8 are formed on both sides of the side positioning block 4 and the top cover 5, the connecting assembly 7 includes the positioning top block 71 fixedly connected with the antenna spring 6 bottom end outside, the positioning top block 71 bottom end is fixedly connected with the positioning bottom block 72, and the test probe 1 is in T-shaped structure, a fastening groove 101 matched with the shape of the positioning bottom block 72 bottom end is formed on the test probe 1 top end center position, and the positioning bottom block 72 outside is sleeved with the rubber pad 73.

[0021] Further, the test probe 1 top end in T-shaped structure is fixedly connected with the antenna spring 6 through the connecting assembly 7, so that the test probe 1 can be conveniently detected, when the antenna spring 6 needs to be replaced, the top cover 5 is detached from the side positioning block 4 top end after a plurality of fastening screws 8 are detached, the antenna spring 6 at the top cover 5 bottom end is pulled out, the positioning bottom block 72 at the positioning top block 71 bottom end is pulled out from the fastening groove 101 of the test probe 1, the antenna spring 6 is replaced, and after replacement, the positioning bottom block 72 is inserted and fixed in the fastening groove 101, and the elasticity of the sleeved rubber pad 73 makes the positioning bottom block 72 more firmly connected with the fastening groove 101.

[0022] The working principle of the utility model is: the test probe 1 top end in T-shaped structure is fixedly connected with the antenna spring 6 through the connecting assembly 7, so that the test probe 1 can be conveniently detected, when the antenna spring 6 needs to be replaced, the top cover 5 is detached from the side positioning block 4 top end after a plurality of fastening screws 8 are detached, the antenna spring 6 at the top cover 5 bottom end is pulled out, the positioning bottom block 72 at the positioning top block 71 bottom end is pulled out from the fastening groove 101 of the test probe 1, the antenna spring 6 is replaced, and after replacement, the positioning bottom block 72 is inserted and fixed in the fastening groove 101, and the elasticity of the sleeved rubber pad 73 makes the positioning bottom block 72 more firmly connected with the fastening groove 101.

[0023] It is to be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0024] While the embodiments of the present application have been illustrated and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and alterations can be made therein without departing from the spirit and scope of the application as defined by the appended claims and their equivalents.

Claims

1. A high-precision feeler spring for semiconductor chips, comprising a sleeve (2) with a test probe (1) arranged inside, characterized in that: a positioning cylinder (3) is fixedly connected to the top end of the sleeve (2), a side positioning block (4) is fixedly connected to the top end of the positioning cylinder (3), a top cover (5) is covered on the top end of the side positioning block (4), one end of the feeler spring (6) is fixedly connected to the bottom end of the top cover (5), the test probe (1) is slidably penetrated through the center of the positioning cylinder (3) and extends into the inside of the positioning cylinder (3), a connecting assembly (7) is fixedly connected to the top end of the test probe (1), and the bottom end of the feeler spring (6) is fixedly sleeved outside the connecting assembly (7). A plurality of through holes are formed on both sides of the side positioning block (4) and the top cover (5) and are threadedly matched with fastening screws (8).

2. The semiconductor chip high-precision feeler spring according to claim 1, characterized in that: The connecting assembly (7) comprises a positioning top block (71) fixedly sleeved with the bottom end of the feeler spring (6) on the outside.

3. The semiconductor chip high-precision feeler spring according to claim 2, characterized in that: The positioning top block (71) comprises a positioning bottom block (72) fixedly connected to the bottom end.

4. The semiconductor chip high-precision feeler spring according to claim 3, characterized in that: The test probe (1) has a T-shaped structure in cross section.

5. The semiconductor chip high-precision feeler spring according to claim 4, characterized in that: A fastening groove (101) is formed in the center of the top end of the test probe (1) and is matched with the shape of the bottom end of the positioning bottom block (72).

6. The semiconductor chip high-precision feeler spring according to claim 5, characterized in that: A rubber pad (73) is sleeved on the outside of the positioning bottom block (72).

Citation Information

Patent Citations

  • Spring probe for testing semiconductor chip

    CN216209354U