Water-cooling heat dissipation plate for graphics card

Abstract

The utility model relates to the technical field of radiators, in particular to a graphics card water-cooling heat dissipation plate which comprises an outer shell and a heat dissipation assembly, the heat dissipation assembly is arranged in the outer shell, a first notch is formed in the middle of the bottom of the outer shell, an attaching portion is arranged at the top of the heat dissipation assembly and located in the first notch, and the first notch is formed in the outer shell. A liquid flow channel is formed in the heat dissipation assembly, a water inlet and a water outlet are formed in the edge of the heat dissipation assembly, the water inlet and the water outlet are both communicated with the liquid flow channel, and a second notch is formed in the edge of the bottom of the outer shell; the water inlet and the water outlet are both located in the second notch, and the water inlet and the water outlet are both connected with water stop connectors. According to the utility model, through the reasonable structure arrangement and the mode of arranging the water stop joints at the water inlet and the water outlet, a plurality of graphics card water-cooling plates can be conveniently and quickly connected in series, and the reliability and simplicity of connection are ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to radiator technical field especially relates to a water cooling radiating plate of display card. BACKGROUND

[0002] With the continuous improvement of computer performance, as the core component of graphics processing, the heat generated by the display card during operation also increases. In order to effectively control the working temperature of the display card, ensure its stability and prolong its service life, the application of heat dissipation technology becomes crucial. Due to the limitation of space and noise, the traditional air cooling heat dissipation method has gradually become difficult to meet the heat dissipation needs of high-performance display cards. Therefore, as a kind of efficient and low-noise heat dissipation solution, water cooling heat dissipation is more and more favored by users

[0003] In the existing display card water cooling heat dissipation technology, a common design is to use independent water cooling radiating plate, that is, each display card is equipped with a specially designed water cooling heat dissipation device. This kind of water cooling radiating plate usually includes an outer shell and a heat dissipation assembly arranged in the outer shell, and through the internal liquid flow channel, the cooling liquid is circulated to take away the heat generated during the operation of the display card. However, in some application scenarios, such as data centers or high-performance computing clusters, it may be necessary to water cool multiple display cards. At this time, connecting the liquid flow channels of multiple water cooling plates in series to form a unified cooling system can improve the cooling efficiency and simplify the maintenance and management. However, the water cooling plate in the prior art has the problems of complex connection process and easy leakage when connected in series, which affects the flexibility and maintainability of the system. SUMMARY

[0004] The utility model aims at solving the technical problems existing in the prior art. Therefore, the utility model provides a display card water cooling radiating plate, which can conveniently and quickly realize the series connection of multiple display card water cooling plates while ensuring the heat dissipation performance, and ensure the reliability and convenience of the connection through reasonable structure setting and water stop joint setting at the water inlet and outlet.

[0005] According to some embodiments of the utility model, a display card water cooling radiating plate comprises an outer shell and a heat dissipation assembly, the heat dissipation assembly is arranged in the outer shell, a first gap is formed in the middle of the bottom of the outer shell, a top of the heat dissipation assembly is provided with a fitting part, the fitting part is located in the first gap, a liquid flow channel is arranged in the heat dissipation assembly, a water inlet and a water outlet are arranged at the edge of the heat dissipation assembly, the water inlet and the water outlet are both communicated with the liquid flow channel, a second gap is formed at the edge of the bottom of the outer shell, the water inlet and the water outlet are both located in the second gap, and a water stop joint is connected to the water inlet and the water outlet.

[0006] According to some embodiments of the utility model, the graphic card water cooling heat dissipation plate has at least the following beneficial effects:

[0007] The utility model discloses a second gap is arranged at the bottom edge of the shell body, so that the water inlet and the water outlet can be directly exposed, which facilitates the connection with the pipeline of other water cooling plates or external cooling systems, simplifies the installation process, reduces the system complexity and potential failure points, the water stop joint connected on the water inlet and the water outlet can effectively prevent the leakage of cooling liquid, ensures the sealing property and reliability of the interface when multiple graphic card water cooling plates are connected in series, the liquid flow channel in the heat dissipation assembly optimizes the flow path of the cooling liquid, increases the effective contact area with the heating area of the graphic card, thereby improving the heat exchange efficiency, and simultaneously, since the standardized water inlet and water outlet position and water stop joint design are adopted, when it is necessary to add or remove a node, large-scale adjustment or shutdown operation of the whole system is not needed.

[0008] According to some embodiments of the utility model, the graphic card water cooling heat dissipation plate has at least the following beneficial effects:

[0009] According to some embodiments of the utility model, the graphic card water cooling heat dissipation plate has at least the following beneficial effects:

[0010] According to some embodiments of the utility model, the graphic card water cooling heat dissipation plate has at least the following beneficial effects:

[0011] According to some embodiments of the utility model, the graphic card water cooling heat dissipation plate has at least the following beneficial effects:

[0012] According to some embodiments of the utility model, the graphic card water cooling heat dissipation plate has at least the following beneficial effects:

[0013] According to some embodiments of the utility model, the graphic card water cooling heat dissipation plate has at least the following beneficial effects:

[0014] According to the graphic card water cooling heat dissipation plate of some embodiments of the present application, the water inlet and the water outlet are arranged on the same side of the heat dissipation assembly.

[0015] The additional aspects and advantages of the present application will be given in part in the following description, and will become apparent from the following description, or will be learned by practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0016] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:

[0017] Figure 1 Structure diagram of the present application Figure 1 .

[0018] Figure 2 Structure diagram of the present application Figure 2 .

[0019] Figure 3 Structure diagram of the present application

[0020] Reference signs: 1, outer shell, 2, heat dissipation assembly, 3, first notch, 4, bonding part, 5, liquid flow channel, 6, water inlet, 7, water outlet, 8, second notch, 9, water stop joint, 10, heat dissipation base plate, 11, sealing upper cover, 12, third notch, 13, copper spade tooth, 14, lower shell, 15, upper shell, 16, side plate, 17, step part, 18, first connecting hole, 19, second connecting hole, 20, fastener, 21, heat conduction pad. DETAILED DESCRIPTION

[0021] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.

[0022] In the description of the present application, it should be understood that the orientation description, such as the orientation or position relationship indicated by up, down, left, right, front, back, etc. is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the modules or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0023] In the description of this utility model, the use of "first" and "second" is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features or the order of the technical features.

[0024] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0025] like Figures 1-3 As shown in the figure, this utility model embodiment provides a graphics card water cooling plate.

[0026] A graphics card water cooling plate includes a housing 1 and a heat dissipation component 2. The heat dissipation component 2 is disposed inside the housing 1. A first notch 3 is formed in the middle of the bottom of the housing 1. A fitting part 4 is provided on the top of the heat dissipation component 2. The fitting part 4 is located in the first notch 3. A liquid flow channel 5 is provided inside the heat dissipation component 2. A water inlet 6 and a water outlet 7 are provided on the edge of the heat dissipation component 2. Both the water inlet 6 and the water outlet 7 are connected to the liquid flow channel 5. A second notch 8 is provided on the bottom edge of the housing 1. Both the water inlet 6 and the water outlet 7 are located in the second notch 8. A water stop connector 9 is connected to both the water inlet 6 and the water outlet 7.

[0027] This invention features a second notch 8 at the bottom edge of the outer casing 1, directly exposing the inlet 6 and outlet 7. This facilitates connection to other water-cooled plates or external cooling systems, simplifying the installation process and reducing system complexity and potential failure points. The water-stop connector 9 connecting the inlet 6 and outlet 7 effectively prevents coolant leakage, ensuring the sealing and reliability of the interface when multiple graphics card water-cooled plates are connected in series. The internal liquid flow channel 5 of the heat dissipation assembly 2 optimizes the coolant flow path, increasing the effective contact area with the heat-generating areas of the graphics card, thereby improving heat exchange efficiency. Furthermore, due to the standardized inlet / outlet positions and water-stop connector design, adding or removing a node does not require large-scale adjustments or system shutdowns.

[0028] The water-cooled heat dissipation plate for graphics card provided by the embodiment comprises a heat dissipation assembly 2 and a shell body 1, wherein the heat dissipation assembly 2 comprises a heat dissipation base plate 10 and a sealing upper cover 11, the sealing upper cover 11 is arranged on the heat dissipation base plate 10, and a liquid flow channel 5 is arranged on the top of the heat dissipation base plate 10. Specifically, the heat dissipation assembly 2 composed of the heat dissipation base plate 10 and the sealing upper cover 11 can provide good sealing performance, prevent the cooling liquid from leaking, ensure the effective operation of the internal liquid flow channel 5, improve the stability and reliability of the system, and facilitate the processing of the liquid flow channel 5.

[0029] The water-cooled heat dissipation plate for graphics card provided by the embodiment comprises a heat dissipation assembly 2 and a shell body 1, wherein the heat dissipation assembly 2 comprises a heat dissipation base plate 10 and a sealing upper cover 11, the sealing upper cover 11 is arranged on the heat dissipation base plate 10, and a liquid flow channel 5 is arranged on the top of the heat dissipation base plate 10. Specifically, the heat dissipation assembly 2 composed of the heat dissipation base plate 10 and the sealing upper cover 11 can provide good sealing performance, prevent the cooling liquid from leaking, ensure the effective operation of the internal liquid flow channel 5, improve the stability and reliability of the system, and facilitate the processing of the liquid flow channel 5.

[0030] The water-cooled heat dissipation plate for graphics card provided by the embodiment comprises a heat dissipation assembly 2 and a shell body 1, wherein the heat dissipation assembly 2 comprises a heat dissipation base plate 10 and a sealing upper cover 11, the sealing upper cover 11 is arranged on the heat dissipation base plate 10, and a liquid flow channel 5 is arranged on the top of the heat dissipation base plate 10. Specifically, the heat dissipation assembly 2 composed of the heat dissipation base plate 10 and the sealing upper cover 11 can provide good sealing performance, prevent the cooling liquid from leaking, ensure the effective operation of the internal liquid flow channel 5, improve the stability and reliability of the system, and facilitate the processing of the liquid flow channel 5.

[0031] The water-cooled heat dissipation plate for graphics card provided by the embodiment comprises a heat dissipation assembly 2 and a shell body 1, wherein the heat dissipation assembly 2 comprises a heat dissipation base plate 10 and a sealing upper cover 11, the sealing upper cover 11 is arranged on the heat dissipation base plate 10, and a liquid flow channel 5 is arranged on the top of the heat dissipation base plate 10. Specifically, the heat dissipation assembly 2 composed of the heat dissipation base plate 10 and the sealing upper cover 11 can provide good sealing performance, prevent the cooling liquid from leaking, ensure the effective operation of the internal liquid flow channel 5, improve the stability and reliability of the system, and facilitate the processing of the liquid flow channel 5.

[0032] The water-cooled heat dissipation plate for graphics card provided by the embodiment comprises a heat dissipation assembly 2 and a shell body 1, wherein the heat dissipation assembly 2 comprises a heat dissipation base plate 10 and a sealing upper cover 11, the sealing upper cover 11 is arranged on the heat dissipation base plate 10, and a liquid flow channel 5 is arranged on the top of the heat dissipation base plate 10. Specifically, the heat dissipation assembly 2 composed of the heat dissipation base plate 10 and the sealing upper cover 11 can provide good sealing performance, prevent the cooling liquid from leaking, ensure the effective operation of the internal liquid flow channel 5, improve the stability and reliability of the system, and facilitate the processing of the liquid flow channel 5.

[0033] The second gap 8 is provided with a plurality of heat-conducting pads 21 on the outer periphery, and the heat-conducting pads 21 are arranged on the outer side of the first gap 3. Specifically, the plurality of heat-conducting pads 21 are arranged on the outer periphery, especially around the position of the first gap 3, which can enhance the heat conduction of the graphic card circuit, reduce the thermal resistance, further improve the heat dissipation effect, and protect the surface of the graphic card from damage.

[0034] The water inlet 6 and the water outlet 7 are arranged on the same side of the heat dissipation assembly 2. Specifically, the water inlet 6 and the water outlet 7 are arranged on the same side, which simplifies the water pipe arrangement, avoids complex pipe crossing, reduces the installation difficulty, is convenient for observation and maintenance, and improves the user experience.

[0035] Although the embodiments of the utility model have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and purposes of the utility model, and the scope of the utility model is defined by the claims and their equivalents.

Claims

1. A water-cooling heatsink for a graphics card, characterized in that: The device includes an outer casing and a heat dissipation assembly. The heat dissipation assembly is disposed within the outer casing. A first notch is formed in the middle of the bottom of the outer casing. A fitting part is provided on the top of the heat dissipation assembly, which is located in the first notch. A liquid flow channel is provided inside the heat dissipation assembly. An inlet and an outlet are provided at the edge of the heat dissipation assembly, and both the inlet and the outlet are connected to the liquid flow channel. A second notch is provided at the bottom edge of the outer casing, and both the inlet and the outlet are located in the second notch. A water-stop connector is connected to both the inlet and the outlet.

2. The graphics card water cooling plate according to claim 1, characterized in that: The heat dissipation assembly includes a heat dissipation substrate and a sealing top cover. The sealing top cover is disposed on the heat dissipation substrate, and the liquid flow channel is formed on the top of the heat dissipation substrate.

3. The graphics card water cooling plate according to claim 1, characterized in that: A third notch is provided in the middle of the liquid flow channel, which corresponds to the first notch. A copper spade tooth is provided in the third notch, and the fitting part is located at the bottom of the copper spade tooth.

4. A graphics card water-cooling heatsink according to claim 1, characterized in that: The outer casing includes a lower casing and an upper casing, and the lower casing and the upper casing are detachably connected.

5. A graphics card water-cooling heatsink according to claim 4, characterized in that: The upper housing has side plates on both sides, and the lower housing has stepped portions on both sides. The side plates and the stepped portions are respectively provided. The side plates are provided with multiple first connecting holes, and the stepped portions are provided with multiple second connecting holes. The first connecting holes and the second connecting holes are respectively provided. Fasteners are provided between the first connecting holes and the second connecting holes.

6. A graphics card water-cooling heatsink according to claim 1, characterized in that: The second notch connects the bottom and side of the outer casing.

7. A graphics card water-cooling heatsink according to claim 1, characterized in that: Multiple thermal pads are provided on the outer periphery of the second notch, and the thermal pads are located on the outside of the first notch.

8. A graphics card water-cooling heatsink according to claim 1, characterized in that: The water inlet and the water outlet are arranged side by side on the same side of the heat dissipation assembly.

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