Cleaning device, cleaning machine and semiconductor device processing equipment

Abstract

The utility model discloses a cleaning device, a cleaning machine and semiconductor device processing equipment. The cleaning device comprises a cleaning barrel body and a piece suction table which is arranged in the cleaning barrel body and driven by a rotary driving assembly to rotate, a top cover which is driven by the driving assembly to turn over or ascend and descend relative to the cleaning barrel body to achieve opening and closing is arranged at the top of the cleaning barrel body, and a swing arm cleaning assembly is arranged on the top cover. A power part of the swing arm cleaning assembly is located on the upper side of the top cover. According to the cleaning device, the swing arm cleaning assembly is arranged on the top cover, so that the swing arm cleaning assembly can be directly arranged over the sheet suction table, a complex waterproof structure is not needed, meanwhile, the horizontal space occupied by the swing arm cleaning assembly can be saved, the length of the swing arm can be set to be shorter, and the cleaning efficiency is improved. And an additional rotating shaft is not needed, so that the structure of the swing arm cleaning assembly is simplified, and the miniaturization of the cleaning device is facilitated.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor device processing especially cleaning device, cleaning machine and semiconductor device processing equipment. BACKGROUND

[0002] After the processing of semiconductor devices such as wafers, the wafers need to be cleaned.

[0003] The utility model with publication number CN220085991U discloses a usable cleaning machine, which adopts a yawing unit to drive an ion water cleaning unit and a drying unit to clean. In order to avoid the influence of liquid on the motor and circuit of the yawing unit during cleaning, the yawing unit is usually arranged on the side of the wastewater collecting unit, which occupies a certain horizontal space, which is not conducive to the size control of the cleaning device, and the yawing unit needs a longer shaft and a longer swing arm. UTILITY MODEL CONTENT

[0004] The utility model aims at solving the above problems in the prior art and provides a cleaning device, a cleaning machine and a semiconductor device processing equipment.

[0005] The utility model achieves the above-mentioned purpose through the following technical solutions.

[0006] The cleaning device comprises a cleaning barrel body and a suction piece table driven to rotate by a rotating drive assembly in the cleaning barrel body, a top cover arranged on the top of the cleaning barrel body and driven by a drive assembly to flip or lift relative to the cleaning barrel body to realize opening and closing, a swing arm cleaning assembly arranged on the top cover, and a power component of the swing arm cleaning assembly located on the upper side of the top cover.

[0007] Preferably, in the cleaning device, the power component is a rotary air cylinder or a motor.

[0008] Preferably, in the cleaning device, an ion air blower is arranged on the top cover.

[0009] Preferably, in the cleaning device, a lifting drive and a guide are connected to the side of the cleaning barrel body.

[0010] Preferably, in the cleaning device, a ceramic suction disc is used for the suction piece table.

[0011] The cleaning machine comprises any one of the above-mentioned cleaning devices.

[0012] Preferably, the cleaning machine further comprises a carrying mechanism for transferring wafers at a predetermined position to the cleaning device, and the carrying mechanism can move and load the wafers grabbed thereby to the second cleaning mechanism below the wafers and cooperate with the second cleaning mechanism to clean the bottom surface of the wafers.

[0013] Preferably, in the cleaning machine, the second cleaning mechanism comprises a swing brush assembly arranged in the drain groove and a nozzle spraying liquid upward below the brush of the swing brush assembly.

[0014] Preferably, in the cleaning machine, the driving source driving the brush of the swing brush assembly to rotate is a pneumatic motor.

[0015] The semiconductor device processing equipment comprises the cleaning device as any one of the above.

[0016] The advantages of the technical scheme of the utility model mainly embody in:

[0017] The cleaning device sets the swing arm cleaning assembly on the top cover, so that the swing arm cleaning assembly can be directly arranged above the wafer suction table, without the need of complicated waterproof structure, while the horizontal space occupied by the swing arm cleaning assembly can be saved, and the length of the swing arm can be set shorter, without the need of setting an additional rotating shaft, which is beneficial to the structural simplification of the swing arm cleaning assembly, and is more beneficial to the miniaturization of the cleaning device.

[0018] The utility model integrates the ion fan on the top cover, which can not only effectively eliminate the static electricity in the wafer and the cleaning machine, and lay a foundation for the subsequent safe processing of the wafer, but also improve the cleaning quality.

[0019] The cleaning machine is provided with the second cleaning mechanism, can cooperate with the carrying mechanism to clean the bottom surface of the wafer, so as to realize the double-sided cleaning of the wafer.

[0020] The second cleaning mechanism adopts the pneumatic motor as the power source, without the need of power connection, which can effectively avoid the interference on the power connection during cleaning, and is more convenient for the stable and safe operation of the second cleaning mechanism. DRAWINGS

[0021] Figure 1 It is the perspective view of the cleaning device of the utility model;

[0022] Figure 2 It is the partial perspective view of the semiconductor device processing equipment of the utility model;

[0023] Figure 3 It is the perspective view of the second cleaning mechanism of the utility model;

[0024] Figure 4 It is the exploded view of the second cleaning mechanism of the utility model. DETAILED DESCRIPTION

[0025] The purposes, advantages and characteristics of the utility model will be illustrated and explained through the following non-restrictive description of preferred embodiments. These embodiments are only typical examples of application of the technical scheme of the utility model, and any technical scheme formed by equivalent replacement or equivalent transformation falls within the scope of protection required by the utility model.

[0026] In the description of the schemes, it should be noted that the orientations or position relationships indicated by the terms "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer" and the like are based on the orientations or position relationships shown in the drawings, and are only for the convenience of description and simplification of the description, and are not intended to indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0027] The cleaning device disclosed by the utility model will be described below in combination with the drawings, as shown in the drawings Figure 1 The utility model discloses a cleaning device, including the cleaning bucket body 100 and the by rotating drive assembly 200 drive self-rotation's suction piece platform 300 of setting in the cleaning bucket body 100, the top of the cleaning bucket body 100 is provided with the top cover 400 that is driven by drive assembly (not shown in the drawing) and is turned over or is lifted to realize the opening and closing of the cleaning bucket body 100, the top cover 400 is provided with the swing arm cleaning assembly 500, and the power component 510 of the swing arm cleaning assembly 500 is located on the upside of the top cover 400.

[0028] Specifically, the specific structure of the top cover 400 driven by the drive assembly to rotate and open and close the cleaning bucket 100 is a known technology, for example, one side of the front and rear sides of the top cover 400 is connected to the cleaning bucket through a hinge, at least one side of the other two sides of the top cover 400 is hinged to one end of the air cylinder, the other end of the air cylinder is hinged to the side of the cleaning bucket 100, and preferably the air cylinder is hinged to the outside of the cleaning bucket 100. The air cylinder, i.e. the drive assembly, when the cylinder shaft of the air cylinder is extended, the top cover 400 is opened, and when the cylinder shaft of the air cylinder is retracted, the top cover 400 is closed. The structure for driving the top cover 400 to lift is also a known technology, which will not be described here. At this time, in order to facilitate the taking and placing of materials, the top of the side plate of at least one side of the cleaning bucket is lower than the top of the suction piece platform.

[0029] The suction piece platform 300 sucks and takes wafers by vacuum adsorption and drives the wafers to rotate to achieve cleaning. The structure of the suction piece platform 300 driven by the rotating drive assembly 200 is also a known technology, which will not be described here. In addition, in order to ensure the stability of adsorption, the suction piece platform 300 uses a ceramic suction cup to adsorb wafers.

[0030] The power unit 510 is a rotary cylinder or a motor, preferably a rotary cylinder. The rotating disk of the rotary cylinder passes through the top cover 400 and is connected to a swing arm (not shown in the figure) located inside the top cover. The swing arm is equipped with a first nozzle 520 and a second nozzle 530. The first nozzle 520 is connected to a liquid supply system for spraying water, and the second nozzle 530 is connected to an air supply system for blowing air. The power unit 510 drives the swing arm to reciprocate above the wafer suction stage 300. At the same time, the wafer suction stage 300 drives the wafers on it to rotate, thereby achieving cleaning.

[0031] Furthermore, an ion fan 600 is provided on the top cover 400, and the air outlet of the ion fan 600 is located inside the top cover 400, so that the wafer can be blown by ion wind to eliminate static electricity during cleaning.

[0032] Meanwhile, the side of the cleaning tub 100 is connected to a lifting drive 700 and a set of guides 800. The lifting drive 700 is, for example, a cylinder, a hydraulic cylinder, an electric cylinder, or other feasible device. The guide 800 includes a bushing fixed to the outside of the cleaning tub 100, and a guide rod is inserted through the bushing. The position of the guide rod is fixed.

[0033] Example 2

[0034] This embodiment discloses a semiconductor device processing equipment, as shown in the attached figure. Figure 2 As shown, it includes the cleaning apparatus 10 as described above. The semiconductor device processing equipment also includes a transport mechanism (not shown) for transferring wafers on the wafer stage 20 into the cleaning apparatus 10. The specific structure of the transport mechanism can adopt a known feasible structure, such as the structure disclosed in the patent with authorization publication number CN217766703U or application publication number CN117912999A, which will not be described in detail here.

[0035] As attached Figure 2 As shown, the semiconductor device processing equipment also includes a second cleaning mechanism 30. The conveying mechanism can transfer the wafer it picks up to the second cleaning mechanism 30 below the wafer and cooperate with the second cleaning mechanism 30 to clean the bottom surface of the wafer.

[0036] As attached Figure 3 Appendix Figure 4 As shown, the second cleaning mechanism 30 includes a oscillating brush assembly 301 disposed in a drainage tank 40 of a semiconductor device processing equipment and a nozzle (not shown in the figure) located below a brush 302 of the oscillating brush assembly 301 and spraying liquid upward.

[0037] Specifically, the oscillating brush assembly 301 comprises a support frame 303, the bottom of the top plate of the support frame 303 is provided with a power source 304, the power output shaft of the power source 304 is concentrically connected with one end of a shaft coupling 305, the other end of the shaft coupling 305 is connected with a drive shaft 306, the drive shaft 306 is rotatably arranged on a U-shaped groove 309 provided on the support frame 303 through a bearing 307 and a bearing seat 308, the top of the U-shaped groove 309 is also connected with a waterproof cover 310 with an open bottom, the waterproof cover 310 covers the bearing 307, the bearing seat 308, the shaft coupling 305 and the like, the drive shaft 306 can be arranged above the top plate of the waterproof cover 310 and connected with the brush 302, or the drive shaft 306 can be connected with a transmission shaft rotatably arranged on the top plate of the waterproof cover 310, the drive shaft 306 or the transmission shaft is concentrically connected with a mounting seat 311 located at the top of the waterproof cover 310, a carrier plate 312 is adjustably arranged on the mounting seat 311, the carrier plate 312 is adjustably arranged on the top of the mounting seat along the length direction, and the brush 302 is arranged on the carrier plate 312.

[0038] Further, the top surface of the waterproof cover 310 is also connected with a circular water baffle 314 through a group of supports 313, the water baffle 314 is concentrically arranged with the drive shaft 306, and the nozzle is arranged on the connecting plate 315 inside the water baffle 314, of course, the nozzle can also be arranged on the waterproof cover 310.

[0039] Embodiment 3

[0040] The embodiment discloses a cleaning machine, in the embodiment, the cleaning machine can be a separate device, which can be used for centralized cleaning of thinned or scribed wafers. It comprises a cleaning device 10 as described above, and the cleaning machine can also comprise a conveying mechanism and a second cleaning mechanism 30. The difference between the cleaning machine and the above-mentioned semiconductor device processing equipment is that the conveying mechanism in the cleaning machine can adopt the structure disclosed in the invention patent application with the application publication number CN113058874A, and the cleaning machine can not be provided with a wafer supporting table 20, but a supporting table for placing a box is provided. The second cleaning mechanism can be provided with an independent drainage groove.

[0041] The utility model still has a plurality of implementation manners, all technical schemes formed by using equivalent transformation or equivalent transformation fall within the protection scope of the utility model.

Claims

1. A cleaning device, comprising a cleaning tank and a suction table disposed within the cleaning tank and driven to rotate by a rotary drive assembly, wherein the top of the cleaning tank is provided with a top cover that is driven by the drive assembly to rotate or rise relative to the cleaning tank to achieve opening and closing, characterized in that: The top cover is provided with a swing arm cleaning assembly, a power component of the swing arm cleaning assembly is located on the upper side of the top cover, the power component is a rotary air cylinder or a motor, and the top cover is provided with an ion fan.

2. The cleaning apparatus of claim 1, wherein: The side of the cleaning barrel body is connected with a lifting driver and a guide.

3. The cleaning apparatus of claim 1, wherein: The suction piece table adopts a ceramic suction disc.

4. A cleaning machine characterised in that: The cleaning device comprises the cleaning device as claimed in any one of claims 1-3.

5. The cleaning machine of claim 4, wherein: Further comprising a carrying mechanism for transferring a wafer at a predetermined position into the cleaning device, the carrying mechanism can transfer the wafer grabbed thereby to a second cleaning mechanism below the wafer and cooperate with the second cleaning mechanism to clean the bottom surface of the wafer.

6. The cleaning machine of claim 5, wherein: The second cleaning mechanism comprises a swing brush assembly arranged in a drain groove and a nozzle for spraying liquid upward below the brush of the swing brush assembly.

7. The cleaning machine of claim 6, wherein: The driving source for driving the brush of the swing brush assembly to rotate is a pneumatic motor.

8. A semiconductor device processing apparatus, characterized by: The cleaning device comprises the cleaning device as claimed in any one of claims 1-3 or the cleaning machine as claimed in any one of claims 4-7.

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