Cleaning equipment for semiconductor processing
By employing a flow divider assembly and an L-shaped flow divider plate in the semiconductor processing cleaning equipment, combined with the differentiated orifice design of multiple cleaning tubes and nozzles, the problem of batch cleaning equipment being unable to thoroughly clean has been solved, achieving efficient cleaning and saving cleaning fluid.
Patent Information
- Application Number
- CN202423012200.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-06
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2034-12-06
AI Technical Summary
Existing batch cleaning equipment cannot completely remove particles and chemical residues when cleaning multiple wafers, resulting in incomplete cleaning, increased production costs, and extended production cycles.
A cleaning device for semiconductor processing was designed, which adopts a flow divider assembly and an L-shaped flow divider plate, combined with multiple cleaning tubes and nozzles to ensure sufficient gaps between each wafer. Full-coverage cleaning is achieved through different nozzle orifice designs. Combined with filters and recycled cleaning fluid, the cleaning effect is improved.
It significantly improves wafer cleaning performance, shortens production cycles, reduces cleaning fluid usage, and lowers production costs.
Smart Images
Figure CN223566586U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of cleaning equipment for semiconductor processing, and particularly relates to a cleaning equipment for semiconductor processing. BACKGROUND
[0002] In the process of semiconductor processing, CMP is a crucial link, and the main purpose is to make the wafer surface reach the required flatness. Although CMP can significantly improve the flatness of the wafer surface, in this process, the wafer surface inevitably contacts particles and various chemical residues in the polishing liquid, resulting in pollution, and the existence of these pollutants will seriously affect the subsequent processing quality and yield. To solve this problem, an effective cleaning step must be carried out after CMP to ensure the cleanliness of the wafer
[0003] The cleaning method of the wafer can be divided into batch type and single piece type, wherein the batch type cleaning method can simultaneously process multiple wafers, and is most widely used in actual production.
[0004] At present, the batch cleaning equipment is provided with a cleaning pipe on the cabinet, and the wafer surface is cleaned by spraying cleaning liquid through the cleaning pipe. However, since multiple wafers will block each other, the particles and chemical residues on the wafer surface cannot be completely washed away. Such unclean wafers need to be cleaned again, which not only increases the production cost, but also prolongs the production cycle. In addition, the cost of cleaning liquid used in the cleaning process will also increase.
[0005] Therefore, in view of the above technical problems, it is necessary to provide a cleaning equipment for semiconductor processing.
[0006] The information disclosed in this background section is only intended to increase the understanding of the general background of the present utility model, and should not be considered as recognition or in any form as implying that this information constitutes prior art known to those skilled in the art. UTILITY MODEL CONTENT
[0007] The utility model aims to provide a cleaning equipment for semiconductor processing, which can be used to solve the above problems.
[0008] In order to achieve the above purpose, a cleaning equipment for semiconductor processing is provided in a specific embodiment of the utility model, which comprises a cabinet, a workbench is arranged on the cabinet, a water pump is installed in the cabinet, a water supply pipe is fixedly connected to the water pump, and the utility model further comprises:
[0009] A through slot is arranged on the workbench, and the through slot penetrates the workbench.
[0010] The shunt assembly is detachably installed in the through groove, and the shunt assembly comprises a pair of shunt plates, a plurality of cleaning pipes are installed between the pair of shunt plates, the plurality of cleaning pipes are symmetrically installed on opposite side walls of the pair of shunt plates, a plurality of fixing blocks are fixedly connected on the cleaning pipes, an insertion slot is formed in the fixing block, and a spray head matched with the fixing block is fixedly connected on the cleaning pipe.
[0011] In one or more embodiments of the utility model, the shunt plate is L-shaped, a water storage groove is formed in the shunt plate, and the plurality of cleaning pipes are communicated with the water storage groove.
[0012] In one or more embodiments of the utility model, a limiting groove matched with the shunt plate is formed in the groove wall of the through groove, the shunt plate is lapped on the groove bottom wall of the limiting groove, and a taking plate is fixedly connected on the shunt plate.
[0013] In one or more embodiments of the utility model, the water supply pipe penetrates the groove bottom wall of the limiting groove at the end away from the water pump, and a through hole matched with the water supply pipe is formed in the shunt plate.
[0014] In one or more embodiments of the utility model, a plurality of water spraying holes are formed in the spray head, and the aperture of the water spraying hole close to one end of the cleaning pipe is larger than the aperture of the water spraying hole away from the other end of the cleaning pipe.
[0015] In one or more embodiments of the utility model, the water spraying hole away from one end of the cleaning pipe opens towards the fixing block.
[0016] In one or more embodiments of the utility model, a filter is installed in the cabinet, a flow guide pipe is fixedly connected on the filter, and the flow guide pipe is fixedly connected on the lower panel of the workbench at the end away from the filter.
[0017] In one or more embodiments of the utility model, the water pump is installed on the filter, and the water pump delivers the cleaning liquid filtered by the filter into the shunt plate.
[0018] In one or more embodiments of the utility model, a pair of fixing strips are fixedly connected on the upper panel of the workbench, a sliding slot is formed in the fixing strip, and a baffle is slidingly connected in the sliding slot.
[0019] In one or more embodiments of the utility model, an observation window is formed in the baffle, and glass is inlaid in the observation window.
[0020] Compared with the prior art, the cleaning equipment for semiconductor processing can significantly improve the cleaning effect of the wafer, effectively shorten the production cycle, greatly reduce the use amount of the cleaning liquid, and thus reduce the production cost. BRIEF DESCRIPTION OF DRAWINGS
[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments described in the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.
[0022] Figure 1 Structure diagram of the cleaning equipment for semiconductor processing in an embodiment of the present application Figure 1 ;
[0023] Figure 2 Structure diagram of the cleaning equipment for semiconductor processing in an embodiment of the present application Figure 2 ;
[0024] Figure 3 Sectional view of the cleaning equipment for semiconductor processing in an embodiment of the present application
[0025] Figure 4 Structure diagram of the water distribution assembly of the cleaning equipment for semiconductor processing in an embodiment of the present application
[0026] Figure 5 Partial sectional view of the water distribution pipe of the cleaning equipment for semiconductor processing in an embodiment of the present application
[0027] Figure 6 Sectional view of the spray head of the cleaning equipment for semiconductor processing in an embodiment of the present application
[0028] Main drawing mark explanation:
[0029] 1, cabinet; 11, workbench; 111, through slot; 112, limiting slot; 12, filter; 121, flow guide pipe; 13, water pump; 131, water supply pipe; 2, fixed strip; 21, sliding groove; 22, baffle; 221, observation window; 3, flow distribution plate; 301, through hole; 31, water storage tank; 32, taking plate; 33, cleaning pipe; 331, fixed block; 3311, slot; 332, spray head; 3321, water spray hole. DETAILED DESCRIPTION
[0030] To enable those skilled in the art to better understand the technical solutions of this utility model, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.
[0031] like Figure 1 As shown in the figure, a semiconductor processing cleaning device according to one embodiment of the present invention is used for cleaning wafers. The semiconductor processing cleaning device includes a cabinet 1, a worktable 11 on the cabinet 1, a water pump 13 installed inside the cabinet 1, and a water supply pipe 131 welded to the water pump 13. When cleaning the wafer, the wafer is placed on the through slot 111, and the water pump 13 is started to spray cleaning fluid to clean the surface of the wafer.
[0032] In actual production, to improve production efficiency, multiple wafers need to be placed together for batch cleaning. However, there is a possibility that some wafers may not be cleaned thoroughly.
[0033] In order to ensure the cleaning quality of multiple wafers, such as Figures 1 to 3 As shown. A through slot 111 is provided on the worktable 11, the through slot 111 extends through the worktable 111, and a shunt assembly is detachably installed in the through slot 111. Multiple wafers can be evenly placed in the shunt assembly. The shunt assembly is connected to the water pump 13. When the water pump 13 is working, the shunt assembly sprays cleaning fluid to clean the wafers.
[0034] Specifically, the diversion assembly includes a pair of diversion plates 3, with multiple cleaning pipes 33 installed between the pair of diversion plates 3. The multiple cleaning pipes 33 are symmetrically installed on the opposite side walls of the pair of diversion plates 3. Multiple fixing blocks 331 are integrally formed on the cleaning pipes 33, and slots 3311 are provided on the fixing blocks 331.
[0035] Specifically, when the wafer is inserted into the slot 3311, there is a certain gap between two adjacent wafers, allowing the cleaning fluid flowing from the water supply pipe 131 to clean the wafer surface. This improves the cleaning effect.
[0036] It is worth noting that, due to the limited diffusion effect of the water supply pipe 131, the distribution of the cleaning fluid cannot cover all the wafers in the shunt assembly, and a small number of wafer surfaces will still not be cleaned properly, leaving particle residue.
[0037] In order to ensure that all the wafers within the shunt assembly are thoroughly cleaned. For example... Figures 2 to 5As shown, the water pump 13 is L-shaped, and the shunt plate 3 is provided with a water storage groove 31, and a plurality of cleaning pipes 33 are connected to the water storage groove 31, and the cleaning pipes 33 are welded with spray heads 332 matched with the fixing blocks 331. The slot wall of the through slot 111 is provided with a limiting slot 112 matched with the shunt plate 3. The water supply pipe 131 penetrates the slot bottom wall of the limiting slot 112, and the shunt plate 3 is provided with a through hole 301 matched with the water supply pipe 131.
[0038] Specifically, the shunt assembly is placed in the through slot 111, and the L-shaped end of the shunt plate 3 is lapped on the slot bottom wall of the limiting slot 112 and will not fall from the through slot 111. When the shunt plate 3 is lapped in the limiting slot 112, the water supply pipe 131 can be inserted into the through hole 301. At this time, the water pump 13 is started, the cleaning liquid in the water supply pipe 131 enters the through hole 301, flows into the plurality of cleaning pipes 33 after shunting through the through hole 301, and is sprayed from the spray head 332. Because the number of cleaning pipes 33 is multiple, the number of spray heads 332 on the cleaning pipes 33 is also multiple, and each wafer surface inserted into the insertion slot 3311 has a corresponding spray head 332, which can clean the wafer surface.
[0039] Further, the shunt plate 3 is welded with a taking plate 32, which can be held when placed, and the shunt assembly in the through slot 111 can be conveniently taken.
[0040] In order to strengthen the cleaning effect of the wafer, as shown in Figure 5 and Figure 6 As shown, the spray head 332 is provided with a plurality of water spray holes 3321, and the aperture of the water spray hole 3321 near one end of the cleaning pipe 33 is larger than the aperture of the water spray hole 3321 far from the other end of the cleaning pipe 33.
[0041] Specifically, when the cleaning liquid in the cleaning pipe 33 flows into the water spray hole 3321, due to the different apertures of the two ends of the water spray hole 3321 and the relatively small spray port of the water spray hole 3321, the cleaning liquid sprayed from the water spray hole 3321 has a longer distance, which can be sprayed to the center position of the wafer, and fully covers the wafer. Further, the water spray hole 3321 is obliquely provided on the spray head 332. Specifically, the aperture of the water spray hole 3321 far from the other end of the cleaning pipe 33 is opened towards the fixing block 331, and the cleaning liquid sprayed from the water spray hole 3321 can be sprayed on the surface of the wafer, and the cleaning effect of the wafer surface is strengthened.
[0042] In order to recycle the cleaning liquid and save production cost, as shown in Figure 3As shown, the filter 12 is installed in the cabinet 1, and a flow guide pipe 121 is welded on the filter 12, the end of the flow guide pipe 121 away from the filter 12 is welded on the lower panel of the workbench 11 and surrounds the through slot 111. The water pump 13 is installed on the filter 12, and the water pump 13 delivers the cleaning liquid filtered by the filter 12 into the distribution plate 3.
[0043] Specifically, the cleaning liquid sprayed by the spray head 332 flows into the filter 12 from the through slot 111, is output into the cleaning pipe 33 by the water pump 13 after being filtered by the filter 12, and is sprayed by the spray head 332 again, which realizes recycling and saves the cleaning liquid and reduces the production cost.
[0044] Further, a pair of fixed strips 2 is bonded on the upper panel of the workbench 11, a sliding slot 21 is formed in the fixed strip 2, and a baffle 22 is slidably connected in the sliding slot 21. When the wafer is cleaned, the baffle 22 is inserted into the sliding slot 21 to prevent the cleaning liquid from splashing on the workbench 11. Further, an observation window 221 is formed in the baffle 22, and glass is inlaid in the observation window 221.
[0045] Preferably, the glass inlaid in the observation window 221 is quartz glass. The quartz glass has the characteristics of high temperature resistance, high corrosion resistance, no discoloration after long time use, and high transparency.
[0046] In use, a plurality of wafers are inserted into the insertion slots 3311 respectively, the distribution assembly is placed into the through slot 111 by holding the taking plate 32, and the water supply pipe 131 is inserted into the through hole 301 at this time. Then the baffle 22 is pushed to block the through slot 111, the water pump 13 is started, the water pump 13 delivers the cleaning liquid filtered by the filter 12 into the distribution plate 3, the cleaning liquid is finally sprayed from the spray head 332 after being distributed by the distribution plate 3, and batch cleaning of the wafers is realized.
[0047] It is apparent for those skilled in the art that the present application is not limited to the details of the foregoing exemplary embodiments, and the present application can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered as exemplary and non-limiting, and the scope of the present application is defined by the appended claims rather than the foregoing description, and all changes falling within the meaning and range of equivalent elements of the claims are intended to be embraced therein. Any reference signs in the claims should not be considered as limiting the claims involved.
[0048] Furthermore, it should be understood that although the specification is described in terms of embodiments, not every embodiment includes every feature or implementation described herein. The specification can include implicit combinations of explicitly mentioned features and / or implicit combinations of implicitly mentioned features. Such combinations are also expressly included within the scope of the specification and an embodiment.
Claims
1. A cleaning device for semiconductor processing, comprising a cabinet, a workbench is arranged on the cabinet, a water pump is installed in the cabinet, and a water supply pipe is fixedly connected to the water pump, characterized in that, Also include: The through groove is opened in the workbench, and the through groove penetrates the workbench; The shunt assembly is connected with the water supply pipe, the shunt assembly is detachably installed in the through groove, the shunt assembly includes a pair of shunt plates, a plurality of cleaning pipes are installed between the pair of shunt plates, the plurality of cleaning pipes are symmetrically installed on the opposite side walls of the pair of shunt plates, a plurality of fixed blocks are fixedly connected on the cleaning pipes, an insertion slot is opened in the fixed block, and a spray head matched with the fixed block is fixedly connected on the cleaning pipe.
2. The cleaning apparatus for semiconductor processing according to claim 1, wherein The shunt plate is L-shaped, a water storage groove is opened in the shunt plate, and the plurality of cleaning pipes are communicated with the water storage groove.
3. The cleaning apparatus for semiconductor processing according to claim 2, wherein The groove wall of the through groove is provided with a limiting groove matched with the shunt plate, the shunt plate is lapped on the groove bottom wall of the limiting groove, and a taking plate is fixedly connected on the shunt plate.
4. The cleaning apparatus for semiconductor processing according to claim 3, wherein The end of the water supply pipe away from the water pump penetrates the groove bottom wall of the limiting groove, and a through hole matched with the water supply pipe is opened in the shunt plate.
5. The cleaning apparatus for semiconductor processing according to claim 1, wherein A plurality of water spray holes are opened in the spray head, the aperture of the water spray hole close to the one end of the cleaning pipe is larger than the aperture of the water spray hole away from the one end of the cleaning pipe.
6. The semiconductor processing cleaning apparatus of claim 5, wherein The opening of the water spray hole away from the one end of the cleaning pipe faces the fixed block.
7. The semiconductor processing cleaning apparatus of claim 1, wherein A filter is installed in the cabinet, a flow guide pipe is fixedly connected on the filter, and the end of the flow guide pipe away from the filter is fixedly connected on the lower panel of the workbench.
8. The semiconductor processing cleaning apparatus of claim 7, wherein The water pump is installed on the filter, and the water pump delivers the cleaning liquid filtered by the filter into the shunt plate.
9. The cleaning apparatus for semiconductor processing according to Claim 1, wherein A pair of fixed strips are fixedly connected on the upper panel of the workbench, a sliding groove is opened in the fixed strip, and a baffle is slidably connected in the sliding groove.
10. The semiconductor processing cleaning apparatus of claim 9, wherein An observation window is opened in the baffle, and glass is inlaid in the observation window.