Adsorption device for wafer processing

Abstract

The utility model discloses an adsorption device for wafer processing, which comprises a wafer adsorption mounting assembly. The wafer adsorption mounting assembly comprises a mounting frame, a concave connecting frame arranged at the front end of the mounting frame, a connector arranged at the front end of the concave connecting frame, a second electric rotating shaft for connecting the concave connecting frame with the mounting frame, and a third electric rotating shaft for connecting the concave connecting frame with the connector; the switching adsorption assembly further comprises a circular pipe connected with the connector, an air suction pipe communicating with the circular pipe, a bearing plate connected to the side wall of the circular pipe and a fourth electric rotating shaft arranged on the bottom face of the bearing plate. According to the utility model, through the mutual cooperation of the wafer adsorption installation assembly and the switching adsorption assembly, when the adsorption head is damaged and the adsorption effect is influenced during use, the adsorption head automatically rotates and is switched, immediate shutdown for maintenance is not needed, and the use efficiency of the adsorption device is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer adsorption technical field, concretely is a kind of adsorption device for wafer processing. BACKGROUND

[0002] Wafer is also called silicon wafer or silicon wafer, and it is the basic material used in the process of semiconductor integrated circuit manufacturing. During production, the wafer needs to be adsorbed and transported by an adsorption device. In the prior art, if the adsorption head is blocked during use, the adsorption effect will be affected. At this time, maintenance is needed to stop the machine and maintain the adsorption head. This structure design leads to low work efficiency and affects the use effect. UTILITY MODEL CONTENT

[0003] Therefore, the utility model aims to provide an adsorption device for wafer processing. Through the cooperation of the wafer adsorption mounting assembly and the switching adsorption assembly, when the adsorption head is damaged and affects the adsorption effect during use, the adsorption head automatically rotates and switches, without the need for immediate maintenance, ensuring the use efficiency of the adsorption device.

[0004] To solve the above technical problems, according to one aspect of the utility model, the utility model provides the following technical scheme: an adsorption device for wafer processing, comprising:

[0005] A wafer adsorption mounting assembly is provided, which comprises a mounting frame, a concave connecting frame arranged at the front end of the mounting frame, a connecting head arranged at the front end of the concave connecting frame, a second electric rotating shaft connecting the concave connecting frame and the mounting frame, and a third electric rotating shaft connecting the concave connecting frame and the connecting head.

[0006] A switching adsorption assembly is further provided, which comprises a circular pipe connected to the connecting head, an air suction pipe in communication with the circular pipe, a receiving plate connected to the side wall of the circular pipe, a fourth electric rotating shaft arranged at the bottom surface of the receiving plate, an electric telescopic rod connected to the fourth electric rotating shaft, a bottom plate connected to the electric telescopic rod, a fifth electric rotating shaft arranged at the side surface of the bottom plate, a connecting plate connected to the fifth electric rotating shaft, a conical connecting head fixed to the connecting plate, a second suction disc in communication with the conical connecting head, and a first suction disc connected to the side surface of the bottom plate.

[0007] As a preferred scheme of the utility model, the wafer adsorption mounting assembly further comprises a vertical frame arranged at the side end of the mounting frame, a first electric rotating shaft connecting the vertical frame and the mounting frame, a flat plate fixed to the top end of the vertical frame, and a mounting hole opened in the surface of the flat plate.

[0008] As a preferred scheme of the wafer processing adsorption device, the connecting structure between the first suction cup and the bottom plate is the same as the structure between the second suction cup and the bottom plate.

[0009] As a preferred scheme of the wafer processing adsorption device, the taper connecting head and the circular pipe correspond to each other, and the taper connecting head and the circular pipe are mutually fitted.

[0010] As a preferred scheme of the wafer processing adsorption device, the adjusting assembly comprises a first sleeve communicated at the top end of the receiving plate, and a second sleeve communicated at the bottom surface of the first sleeve.

[0011] As a preferred scheme of the wafer processing adsorption device, the adjusting assembly further comprises a first threaded hole formed in the side wall of the first sleeve, a second threaded hole formed in the side wall of the second sleeve, and a threaded rod corresponding to the first threaded hole and the second threaded hole, respectively.

[0012] Compared with the prior art, the wafer processing adsorption device has the following advantages:

[0013] Firstly, the wafer adsorption mounting assembly and the switching adsorption assembly are matched, so that when the adsorption head is damaged and affects the adsorption effect, the adsorption head is automatically rotated and switched, without the need for immediate shutdown and maintenance, thereby ensuring the use efficiency of the adsorption device.

[0014] Secondly, based on the beneficial effect one, the adjusting assembly can freely adjust the position of the receiving plate, so that the electric telescopic rod of different strokes can be applied, thereby improving the applicability. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the present application will be described in detail below in combination with the drawings and detailed embodiments. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of these drawings. Among them:

[0016] Figure 1 is a first perspective view of the present application;

[0017] Figure 2 is a second perspective view of the present application;

[0018] Figure 3 is a position structure diagram of the taper connecting head of the present application;

[0019] Figure 4 It is a structural diagram of the adjusting assembly.

[0020] In the figure: 11, mounting frame; 12, first electric rotating shaft; 13, concave connecting frame; 14, connecting head; 15, second electric rotating shaft; 16, third electric rotating shaft; 17, vertical frame; 18, flat plate; 19, mounting hole; 21, fourth electric rotating shaft; 22, electric telescopic rod; 23, bearing plate; 24, round pipe; 25, air suction pipe; 26, connecting plate; 27, first suction disc; 28, second suction disc; 29, conical connecting head; 210, bottom plate; 211, fifth electric rotating shaft; 31, first sleeve; 32, second sleeve; 33, first threaded hole; 34, second threaded hole; 35, threaded rod. DETAILED DESCRIPTION

[0021] In order to make the above-mentioned purposes, features and advantages of the utility model more apparent and easy to understand, the specific embodiments of the utility model will be described in detail below with reference to the drawings.

[0022] In the following description, a lot of specific details are set forth in order to provide a thorough understanding of the utility model, but the utility model can also be implemented in other ways different from those described herein, and persons skilled in the art can make similar generalizations without departing from the connotation of the utility model, therefore the utility model is not limited by the specific embodiments disclosed below.

[0023] Secondly, the utility model is described in detail in combination with the schematic diagram, when the embodiments of the utility model are described in detail, for the convenience of description, the sectional view of the device structure will be partially enlarged without the general proportion, and the schematic diagram is only an example, which should not limit the scope of protection of the utility model herein. In addition, three-dimensional spatial dimensions including length, width and depth should be included in actual manufacturing.

[0024] In order to make the purposes, technical schemes and advantages of the utility model more clear, the embodiments of the utility model will be described in further detail below in combination with the drawings.

[0025] The utility model provides a kind of suction device for wafer processing, by the cooperation of the wafer suction mounting assembly and switching suction component of being set, reach when using, when adsorption head is damaged and affects adsorption effect, adsorption head is automatically rotated and switched, without immediate shutdown maintenance, ensure the use efficiency of adsorption device.

[0026] Figure 1 、 Figure 2 、 Figure 3 And Figure 4 It shows the overall structure schematic diagram of one embodiment of the utility model a kind of suction device for wafer processing, please refer to Figure 1 、 Figure 2 、 Figure 3 AndFigure 4 The main structure of the embodiment includes a wafer suction mounting assembly and a switching suction assembly.

[0027] The wafer suction mounting assembly is used in cooperation with the switching suction assembly. Specifically, the wafer suction mounting assembly includes a mounting frame 11, a concave connecting frame 13 arranged at the front end of the mounting frame 11, a connecting head 14 arranged at the front end of the concave connecting frame 13, a second electric rotating shaft 15 connecting the concave connecting frame 13 and the mounting frame 11, and a third electric rotating shaft 16 connecting the concave connecting frame 13 and the connecting head 14.

[0028] The wafer suction mounting assembly further includes a vertical frame 17 arranged at the side end of the mounting frame 11, a first electric rotating shaft 12 connecting the vertical frame 17 and the mounting frame 11, a flat plate 18 fixed at the top end of the vertical frame 17, and a mounting hole 19 arranged on the surface of the flat plate 18.

[0029] In specific use, the first electric rotating shaft 12 drives the mounting frame 11 to swing, and the second electric rotating shaft 15 and the third electric rotating shaft 16 respectively drive the concave connecting frame 13 and the connecting head 14 to swing, so as to complete the switching of the suction cups in cooperation with the switching suction assembly. The mounting can be completed by penetrating the expansion bolts through the mounting hole 19.

[0030] The switching suction assembly is used for automatic switching and improves the suction efficiency of the wafer. Specifically, the switching suction assembly further includes a circular tube 24 connected with the connecting head 14, a suction pipe 25 communicated with the circular tube 24, a receiving plate 23 connected with the side wall of the circular tube 24, a fourth electric rotating shaft 21 arranged on the bottom surface of the receiving plate 23, an electric telescopic rod 22 connected with the fourth electric rotating shaft 21, a bottom plate 210 connected with the electric telescopic rod 22, a fifth electric rotating shaft 211 arranged on the side surface of the bottom plate 210, a connecting plate 26 connected with the fifth electric rotating shaft 211, a conical connecting head 29 fixed with the connecting plate 26, a second suction cup 28 communicated with the conical connecting head 29, and a first suction cup 27 connected with the side surface of the bottom plate 210.

[0031] When the first suction cup 27 is damaged or affects the suction effect of the wafer, the electric telescopic rod 22 is extended to drive the first suction cup 27 to separate from the circular tube 24, and then the fourth electric rotating shaft 21 drives the electric telescopic rod 22 to rotate. At this time, the first suction cup 27 and the second suction cup 28 are switched with each other, the fifth electric rotating shaft 211 drives the second suction cup 28 to overturn, and the first suction cup 27 and the second suction cup 28 are flush. At this time, the electric telescopic rod 22 is retracted to drive the second suction cup 28 to move, and the conical connecting head 29 is sleeved with the circular tube 24. At this time, the circular tube 24 can be communicated with the second suction cup 28. After the communication, the first suction cup 27 is overturned, and the first suction cup 27 and the second suction cup 28 are overturned and dislocated. In this way, the suction pipe 25 is matched with the circular tube 24, and the suction is directly performed through the second suction cup 28.

[0032] Further, by setting the adjusting assembly, the position of the receiving plate 23 can be freely adjusted, so that the electric telescopic rod 22 of different stroke can be applied, improving the applicability.

[0033] Specifically, the adjusting assembly comprises a first sleeve 31 communicated with the top end of the receiving plate 23, and a second sleeve 32 communicated with the bottom surface of the first sleeve 31.

[0034] The adjusting assembly further comprises a first threaded hole 33 opened in the side wall of the first sleeve 31, a second threaded hole 34 opened in the side wall of the second sleeve 32, and a threaded rod 35 corresponding to the first threaded hole 33 and the second threaded hole 34 respectively.

[0035] In specific use, the receiving plate 23 is displaced along the circular tube 24, and when moved to the required position, the user rotates the threaded rod 35 at the corresponding position, and the threaded rod 35 is directly screwed in the first threaded hole 33 and the second threaded hole 34, so as to lock the receiving plate 23 at the required position.

[0036] Although the utility model has been described above with reference to the embodiments, various improvements can be made and equivalent parts can be replaced without departing from the scope of the utility model. In particular, as long as there is no structural conflict, each feature in the embodiments disclosed by the utility model can be combined with each other in any way, and the combinations are not exhaustively described in the specification only for the consideration of saving space and resources. Therefore, the utility model is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. An adsorption device for wafer processing, characterized in that, include: A wafer adsorption mounting assembly includes a mounting frame (11), a concave connecting frame (13) at the front end of the mounting frame (11), a connector (14) at the front end of the concave connecting frame (13), a second electric rotating shaft (15) connecting the concave connecting frame (13) to the mounting frame (11), and a third electric rotating shaft (16) connecting the concave connecting frame (13) to the connector (14). The switching adsorption assembly further includes a round tube (24) connected to the connector (14), an air suction pipe (25) communicating with the round tube (24), a receiving plate (23) connected to the side wall of the round tube (24), a fourth electric rotating shaft (21) disposed on the bottom surface of the receiving plate (23), an electric telescopic rod (22) connected to the fourth electric rotating shaft (21), a base plate (210) connected to the electric telescopic rod (22), a fifth electric rotating shaft (211) disposed on the side of the base plate (210), a connecting plate (26) connected to the fifth electric rotating shaft (211), a conical connector (29) fixed to the connecting plate (26), a second suction cup (28) communicating with the conical connector (29), and a first suction cup (27) connected to the side of the base plate (210).

2. The adsorption device for wafer processing according to claim 1, characterized in that, The wafer adsorption mounting assembly also includes a vertical frame (17) disposed on the side of the mounting frame (11), a first electric rotating shaft (12) connecting the vertical frame (17) to the mounting frame (11), a plate (18) fixed at the top of the vertical frame (17), and mounting holes (19) formed on the surface of the plate (18).

3. The adsorption device for wafer processing according to claim 2, characterized in that, The connection structure between the first suction cup (27) and the base plate (210) is the same as the structure between the second suction cup (28) and the base plate (210).

4. The adsorption device for wafer processing according to claim 3, characterized in that, The tapered connector (29) corresponds to the round tube (24), and the tapered connector (29) and the round tube (24) fit together.

5. The adsorption device for wafer processing according to claim 4, characterized in that, It also includes an adjustment assembly, which includes a first sleeve (31) connected to the top of the receiving plate (23) and a second sleeve (32) connected to the bottom of the first sleeve (31).

6. The adsorption device for wafer processing according to claim 5, characterized in that: The adjustment assembly also includes a first threaded hole (33) on the side wall of the first sleeve (31), a second threaded hole (34) on the side wall of the second sleeve (32), and threaded rods (35) corresponding to the first threaded hole (33) and the second threaded hole (34) respectively.

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