Wafer jacking equipment
By designing X, Y, and Z axis fine-tuning mechanisms and lifting equipment, the problems of damage and identification errors in the separation and picking process of thin semiconductor wafers are solved, achieving efficient and precise wafer handling.
Patent Information
- Application Number
- CN202422829918.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-20
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2034-11-20
AI Technical Summary
Thin semiconductor wafers are easily damaged during separation and pick-up, leading to breakage, fragmentation, and identification errors. Traditional methods such as crystal spikes and direct crystal tops have instability and misidentification problems.
Employing X, Y, and Z axis fine-tuning mechanisms and lifting mechanisms, combined with a cam box, motor, vacuum tank, and ejector pin, it achieves precise positioning and efficient pickup, while sensors and limit slots enhance operational accuracy.
It enables precise picking and positioning of thin semiconductor wafers, improving operational efficiency and reducing wafer damage and identification errors.
Smart Images
Figure CN223566606U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a wafer lifting equipment. BACKGROUND
[0002] With the recent miniaturization of electronic components, semiconductor wafers also have a trend of thinning, and thinning semiconductor elements with a thickness of 100 μm or less have been produced. However, such thinning semiconductor elements are easily damaged and difficult to handle. In particular, it is very difficult to perform a procedure for taking out a single semiconductor wafer cut from a wafer. The procedure repeatedly performs an operation to pick up a semiconductor wafer adhered to a blue film with a suction nozzle while separating each wafer.
[0003] In this case, conventional methods for separating semiconductor wafers from the above-mentioned thinning semiconductor wafers include piercing and direct lifting. Piercing is a method of pushing a semiconductor wafer upward from below a blue film using a needle. However, since the piercing operation is unstable, the semiconductor wafer can be broken or cracked. Similarly, direct lifting also has the same problem. In addition, individual semiconductor wafers can be bent or deformed. Therefore, in a step of picking up an image of a semiconductor wafer to be aligned, the bent or deformed semiconductor wafer can be misidentified as a defective product having a crack, resulting in inaccurate wafer picking.
[0004] In view of the above-mentioned defects, the present inventor actively researches and innovates to create a wafer lifting equipment with a novel structure, which has more industrial value. CONTENT OF THE UTILITY MODEL
[0005] To solve the above-mentioned technical problem, the purpose of the utility model is to provide a wafer lifting equipment.
[0006] To achieve the above-mentioned purpose, the utility model adopts the following technical solution:
[0007] A wafer lifting equipment includes an X, Y axis fine adjustment mechanism, a Z axis lifting mechanism, and a lifting mechanism. The X, Y axis fine adjustment mechanism is connected with a lifting connection plate. The lifting connection plate is connected with the Z axis lifting mechanism. The Z axis lifting mechanism is connected with the lifting mechanism moving along the X, Y, and Z axes.
[0008] The lifting mechanism includes a cam box. A motor is connected to the outside of the cam box through a motor fixing plate. The driving shaft of the motor extends into the cam box and is connected with a lifting block. One side of the cam box is connected with the Z axis lifting mechanism. The other side of the cam box is connected with a vacuum tank above. A transmission rod is inserted into the vacuum tank. The bottom of the transmission rod extends into the cam box and contacts the lifting block. The top end of the transmission rod is connected with a lifting seat. The lifting seat is connected with a needle.
[0009] Preferably, the wafer lifting device has a limiting slot on the side of the cam box opposite to the motor, and the transmission rod is connected with a limiting column movably arranged in the limiting slot.
[0010] Preferably, the wafer lifting device has a sensor arranged in the cam box for detecting the height of the transmission rod, and the driving shaft of the motor is connected with a sensor sheet matched with the sensor.
[0011] Preferably, the wafer lifting device has an adjusting support arranged in the cam box, and the sensor is connected with the adjusting support.
[0012] Preferably, the wafer lifting device has an adjusting support arranged in the cam box through an adjusting guide rod, and the cam box is penetrated with an adjusting rod connected with the adjusting support through the cam box, and the adjusting guide rod is sleeved with an adjusting spring.
[0013] Preferably, the wafer lifting device has an X-axis fine adjustment mechanism and a Y-axis fine adjustment mechanism driven by a DC motor through a belt wheel, the Y-axis fine adjustment mechanism is connected with the X-axis fine adjustment mechanism, and the lifting connecting plate is connected with the Y-axis fine adjustment mechanism.
[0014] Preferably, the wafer lifting device has a Z-axis lifting mechanism driven by a DC motor through a belt wheel.
[0015] Preferably, the wafer lifting device has a lifting sensor arranged outside the cam box, and a lifting sensor sheet matched with the lifting sensor is arranged on the Z-axis lifting mechanism.
[0016] By the above scheme, the wafer lifting device has at least the following advantages:
[0017] The wafer lifting device can precisely position the product through the movement of the X, Y and Z axes, and can quickly and efficiently work on the product through the lifting mechanism, thereby effectively improving the work efficiency.
[0018] The above description is only a summary of the technical scheme of the wafer lifting device, in order to more clearly understand the technical means of the wafer lifting device, and the wafer lifting device can be implemented according to the content of the description, and the following will be described in detail with the preferred embodiments of the wafer lifting device and the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS
[0019] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the premise of the drawings.
[0020] Figure 1 is a structural schematic diagram of the present application;
[0021] Figure 2 is Figure 1 an exploded view. DETAILED DESCRIPTION
[0022] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the following will combine the drawings in the embodiments of the present application to clearly and completely describe the technical scheme in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, not all of the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.
[0023] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of the present application.
[0024] EMBODIMENT
[0025] As Figure 1 and Figure 2 shown, a wafer lifting device includes an X, Y axis fine adjustment mechanism 1, a Z axis lifting mechanism 2 and a lifting mechanism 3, the X, Y axis fine adjustment mechanism 1 is connected with a lifting connecting plate 4, the lifting connecting plate 4 is connected with the Z axis lifting mechanism 2, the Z axis lifting mechanism 2 is connected with the lifting mechanism 3 moving along the X, Y, Z axis;
[0026] The lifting mechanism 3 includes a cam box 31, the outer side of the cam box 31 is connected with a motor 35 through a motor fixing plate 34, the driving shaft of the motor 35 extends into the cam box 31 and is connected with a lifting block 317, one side of the cam box 31 is connected with the Z axis lifting mechanism 2, the other side of the cam box 31 is connected with a vacuum tank 32 above, a transmission rod 33 is inserted into the vacuum tank 32, the bottom of the transmission rod 33 extends into the cam box 31 and contacts with the lifting block 317, the top end of the transmission rod 33 is connected with a lifting seat 36, and a thimble 37 is connected on the lifting seat 36.
[0027] The cam box 31 opposite to the motor is provided with a limiting groove on one side, and a limiting column 38 movably connected in the limiting groove is connected to the transmission rod 33, so that the transmission rod is prevented from moving too much and the precision is improved.
[0028] The cam box 31 is connected with a sensor 39 for detecting the height of the transmission rod, the driving shaft of the motor 35 is connected with a sensing sheet 310 matched with the sensor, the cam box 31 is connected with an adjusting support 311, the sensor 39 is connected to the adjusting support 311, the adjusting support 311 is connected to the cam box 31 through an adjusting guide rod 312, the cam box 31 is connected with an adjusting rod 313, the adjusting rod 313 is connected to the adjusting support through the cam box, and the adjusting guide rod is sleeved with an adjusting spring 314, so that the displacement distance of the transmission rod can be adjusted according to the need.
[0029] The X, Y axis fine adjustment mechanism 1 comprises an X axis fine adjustment platform and a Y axis fine adjustment platform driven by a belt pulley of a direct current motor, the Y axis fine adjustment platform is connected to the X axis fine adjustment platform, the jacking connecting plate 4 is connected to the Y axis fine adjustment platform, and the Z axis lifting mechanism 2 is an axis lifting platform driven by a belt pulley of a direct current motor. All are driven by a lead screw, and the structure is a known technology known to those skilled in the art, which will not be described in detail.
[0030] The cam box 31 is connected with a lifting sensor 315, and the Z axis lifting mechanism 2 is connected with a lifting sensing sheet 316 matched with the lifting sensor 315.
[0031] The working principle of the utility model is as follows:
[0032] In specific work, according to the position of the product, the displacement of the Z axis lifting mechanism is realized through the X, Y axis fine adjustment mechanism, and the jacking mechanism is moved together, then the jacking mechanism is lifted through the Z axis lifting mechanism, then the transmission rod is lifted through the motor, the position of the transmission rod is sensed through the sensor in the lifting process, and after the sensor senses the sensing sheet, the probe pin contacts the wafer and the product is lifted to the set height (the height is set by those skilled in the art).
[0033] It should be noted that: similar labels and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.
[0034] In the description of the present application, it should be noted that the terms "vertical", "horizontal", "inner", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly used when the product of the application is used, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and the like are only used to distinguish the description and cannot be understood as indicating or implying relative importance.
[0035] In addition, the terms "horizontal", "vertical", and the like do not mean that the components must be absolutely horizontal or vertical, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.
[0036] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "arrangement", "installation", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0037] The above is only the preferred embodiment of the present application, and is not used to limit the present application. It should be noted that for those skilled in the art, without departing from the technical principles of the present application, a number of improvements and modifications can be made, and these improvements and modifications should also be considered as the protection scope of the present application.
Claims
1. A wafer lift apparatus, characterized by: Including X, Y axis fine adjustment mechanism (1), Z axis lifting mechanism (2) and jacking mechanism (3), the X, Y axis fine adjustment mechanism (1) is connected with jacking connecting plate (4), the jacking connecting plate (4) is connected with Z axis lifting mechanism (2), the Z axis lifting mechanism (2) is connected with jacking mechanism (3) in along X, Y, Z axis movement; The jacking mechanism (3) includes cam box (31), the outer side of the cam box (31) is connected with motor (35) through motor fixed plate (34), the driving shaft of the motor (35) extends into the cam box (31) and is connected with jacking block (317), one side of the cam box (31) is connected with Z axis lifting mechanism (2), the other side of the cam box (31) is connected with vacuum tank (32) above, the transmission rod (33) is inserted into the cam box (31) and is in contact with the jacking block (317), the top end of the transmission rod (33) is connected with jacking seat (36), the jacking seat (36) is connected with the needle (37).
2. A wafer lift apparatus as claimed in claim 1, wherein: The side of the cam box (31) opposite to the motor is provided with a limiting groove, the transmission rod (33) is connected with a limiting column (38) movably arranged in the limiting groove.
3. The wafer lift apparatus of claim 1, wherein: The cam box (31) is connected with a sensor (39) for detecting the height of the transmission rod, and the driving shaft of the motor (35) is connected with a sensor sheet (310) matched with the sensor.
4. A wafer lift apparatus as claimed in claim 3, wherein: The cam box (31) is connected with an adjusting bracket (311), and the sensor (39) is connected to the adjusting bracket (311).
5. A wafer lift apparatus as claimed in claim 4, wherein: The adjusting bracket (311) is connected in the cam box (31) through an adjusting guide rod (312), the cam box (31) is connected with an adjusting rod (313), the adjusting rod (313) passes through the cam box and is connected with the adjusting bracket, and the adjusting guide rod is sleeved with an adjusting spring (314).
6. The wafer lift apparatus of claim 1, wherein: The X, Y axis fine adjustment mechanism (1) includes an X axis fine adjustment platform and a Y axis fine adjustment platform driven by a DC motor and a belt pulley, the Y axis fine adjustment platform is connected to the X axis fine adjustment platform, and the jacking connecting plate (4) is connected to the Y axis fine adjustment platform.
7. The wafer lift apparatus of claim 1, wherein: The Z axis lifting mechanism (2) is an axis lifting platform driven by a DC motor and a belt pulley.
8. The wafer lift apparatus of claim 1, wherein: The outer part of the cam box (31) is connected with a lifting sensor (315), and the Z axis lifting mechanism (2) is connected with a lifting sensor sheet (316) matched with the lifting sensor (315).