Electronic device

Abstract

The utility model provides an electronic device. The electronic equipment comprises a first shell, a second shell, a folding mechanism, a shaft penetrating assembly, a first sealant and a second sealant, the first mounting hole and the second mounting hole are located in the two sides of the folding mechanism, one end of the shaft penetrating assembly penetrates through the first mounting hole and the second mounting hole and is fixed to the second shell, the first sealant seals the shaft penetrating assembly and the hole wall of the first mounting hole, and the second sealant seals the shaft penetrating assembly and the hole wall of the second mounting hole; the shaft penetrating assembly comprises a circuit board assembly, a first fixing plate and a second fixing plate. The first fixing plate comprises a first plate body and a first convex part, the first plate body is arranged in the first mounting hole and fixed to the first shell, and the first convex part is arranged on the first plate body in a protruding mode and extends towards the inner wall, away from the second mounting hole, of the first mounting hole. According to the electronic equipment, the shaft penetrating assembly is designed to prevent the glue leakage phenomenon in the process of forming the sealant through glue dispensing / glue pouring, so that the waterproof effect of the electronic equipment is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of folding devices, and particularly relates to an electronic device. BACKGROUND

[0002] With the development of science and technology, various electronic devices have gradually become indispensable parts in life. Taking a mobile phone as an example, in order to improve user experience and increase the use function of the mobile phone, the display screen of the mobile phone is getting larger and larger. In order to reduce the size of the mobile phone under the premise of increasing the area of the display screen of the mobile phone, a folding mobile phone is produced. In the current folding mobile phone, the display screen is supported by two main bodies connected through a folding mechanism, and the display screen can be relatively opened or closed through the two main bodies, so as to realize the unfolded and folded states of the display screen. Different circuit modules are respectively arranged in the two main bodies. In order to electrically connect and communicate between the two circuit modules in the two main bodies, a flexible print circuit (FPC) is arranged in the current folding mobile phone to electrically connect the two circuit modules.

[0003] In order to ensure the waterproof of the electronic device at the folding mechanism, a steel sheet is usually used to press the FPC, and then point glue / pour glue is used for sealing. However, in the process of point glue / pour glue, glue leakage is prone to occur, thereby affecting the waterproof effect of the electronic device at the folding mechanism. CONTENT OF THE UTILITY MODEL

[0004] The present application provides an electronic device, which comprises a first shell, a second shell, a folding mechanism, a through-shaft assembly, a first sealing glue and a second sealing glue. The through-shaft assembly is designed to prevent glue leakage in the process of forming the first sealing glue by point glue / pour glue, thereby improving the waterproof effect of the electronic device.

[0005] The application provides an electronic device, which comprises a first shell, a second shell, a folding mechanism, a through shaft assembly, a first sealant and a second sealant. The folding mechanism is connected to the first shell and the second shell and is used to unfold or fold the first shell and the second shell relative to each other. The first shell has a first mounting hole, and the second shell has a second mounting hole. The first mounting hole and the second mounting hole are located on both sides of the folding mechanism. One end of the through shaft assembly passes through the first mounting hole and is fixed to the first shell. The other end of the through shaft assembly passes through the folding mechanism, the second mounting hole and is fixed to the second shell. The first sealant seals the hole wall of the through shaft assembly and the first mounting hole, and the second sealant seals the hole wall of the through shaft assembly and the second mounting hole. The through shaft assembly comprises a circuit board assembly, a first fixed plate and a second fixed plate. The first fixed plate and the second fixed plate are fixed to the circuit board assembly at intervals. The first fixed plate is fixed in the first mounting hole, and the second fixed plate is fixed in the second mounting hole. The first fixed plate comprises a first plate body and a first protruding part. The first plate body is arranged in the first mounting hole and is fixed to the first shell. The first protruding part is protrudingly arranged on the first plate body and is arranged to extend away from the inner wall of the first mounting hole and towards the second mounting hole.

[0006] In the application, the first fixed plate is used to fix the part of the circuit board assembly located in the first mounting hole, so that the structure of the part of the circuit board assembly located in the first mounting hole is stable during the folding and unfolding of the electronic device, and the reliability of the circuit board assembly is improved. The second fixed plate is used to fix the part of the circuit board assembly located in the second mounting hole, so that the structure of the part of the circuit board assembly located in the second mounting hole is stable during the folding and unfolding of the electronic device, and the reliability of the circuit board assembly is improved. The first protruding part is arranged to abut against the circuit board assembly, so that the first protruding part gives the circuit board assembly more extrusion relative to the first plate body. The circuit board assembly is extruded more tightly at the first protruding part, so that during the process of forming the first sealant by dispensing / gluing, the uncured glue is difficult to flow through between the circuit board assembly and the first protruding part, and the risk of glue leakage can be reduced.

[0007] In some possible implementation manners, the first mounting hole has a first inner wall, which is the inner wall of the first mounting hole away from the second mounting hole. The first fixed plate further comprises a first fixed part connected to one side of the first plate body. The first fixed part is fixed to the first shell and is located on one side of the circuit board assembly. The first plate body has a first fixed surface. The circuit board assembly is fixed between the first fixed surface and the first inner wall. The first sealant is arranged at the connection between the first fixed part and the first shell and seals the first fixed surface and the circuit board assembly. The first mounting hole has a first opening. The first protruding part is connected to the side of the first fixed surface away from the first opening and is connected to the side of the first fixed part close to the circuit board assembly. The first protruding part extends towards the first inner wall and abuts against the circuit board assembly.

[0008] In the present implementation, the first protrusion is arranged on the first plate body and located on the side of the first fixing surface away from the first opening. In the process of dispensing / casting the first sealant, the uncured glue flowing through the first plate body and the circuit board assembly is blocked by the first protrusion. The flow path of the glue is blocked by the first protrusion, thereby reducing the probability of glue leaking into the accommodation space, improving the sealing performance of the first mounting hole, and improving the reliability of the electronic device. The connection between the first fixing portion and the first housing can be considered as a glue injection position. The first sealant is formed by dispensing / casting at the glue injection position, thereby sealing the connection between the first fixing portion and the first housing, and improving the sealing performance of the first mounting hole. Due to the arrangement of the first protrusion, the uncured glue can be prevented from flowing from the connection between the first fixing portion and the first housing into the accommodation space, thereby reducing the risk of glue leakage and improving the sealing effect of the connection between the first fixing portion and the first housing, thereby improving the sealing effect between the first fixing surface and the circuit board assembly.

[0009] In some possible implementations, the circuit board assembly includes a flexible circuit board and a heat dissipation plate, and the heat dissipation plate is arranged in a stack with the flexible circuit board.

[0010] In the present implementation, the heat dissipation plate and the flexible circuit board are arranged in a stack, so that the heat dissipation plate can dissipate heat for the flexible circuit board, thereby preventing the flexible circuit board from overheating and affecting normal operation of the electronic device. In addition, a large number of components are arranged at the folding mechanism, which slows down the heat dissipation speed near the folding mechanism. The heat dissipation plate is arranged together with the flexible circuit board to surround the folding mechanism, so that the heat dissipation plate can assist the electronic device in dissipating heat at the folding mechanism, thereby preventing the electronic device from overheating near the folding mechanism and affecting normal operation.

[0011] In some possible implementations, the flexible circuit board includes a first mounting portion, the heat dissipation plate includes a second mounting portion, and the first mounting portion and the second mounting portion are located in the first mounting hole; the circuit board assembly further includes a first adhesive, and the first adhesive is attached between the first mounting portion and the second mounting portion.

[0012] In the present implementation, the first mounting portion is the part of the flexible circuit board located in the first mounting hole, and the second mounting portion is the part of the heat dissipation plate located in the first mounting hole. By arranging the first adhesive to attach the first mounting portion and the second mounting portion, the stability of the circuit board assembly fixedly installed at the first mounting hole is improved, and the consistency of deformation of the flexible circuit board and the heat dissipation plate during folding and unfolding of the electronic device is maintained.

[0013] The first adhesive can be back adhesive, which can improve the convenience of installing the first adhesive, and also enable the first adhesive to have certain elasticity, which is conducive to the first fixing plate to fix the circuit board assembly at the first mounting hole by extruding the circuit board assembly.

[0014] In some possible implementation manners, the second mounting portion is arranged close to the first fixing plate relative to the first mounting portion; and the circuit board assembly further comprises a second adhesive, which is attached between the second mounting portion and the first fixing plate.

[0015] In the implementation manner, the second adhesive can improve the bonding stability between the first fixing plate and the circuit board assembly, which is conducive to the first fixing plate to stably fix the circuit board assembly at the first mounting hole.

[0016] The second adhesive can be back adhesive, which can improve the convenience of installing the second adhesive, and also enable the second adhesive to have certain elasticity, which is conducive to the first fixing plate to fix the circuit board assembly at the first mounting hole by extruding the circuit board assembly.

[0017] In some possible implementation manners, the heat dissipation plate comprises a graphite layer and a protective layer, and the protective layer is attached to the opposite surfaces of the graphite layer.

[0018] In the implementation manner, the graphite layer is conducive to improving the heat dissipation capacity, thereby better providing heat dissipation for the flexible circuit board. The protective layer can reduce damage of the graphite layer caused by scratching during the process of arranging the shaft, prevent damage of the graphite layer caused by the adhesive during the process of arranging the first adhesive and the second adhesive, and avoid damage of the graphite layer caused by the first fixing plate when the first fixing plate is pressed against the circuit board assembly.

[0019] In some possible implementation manners, the protective layer is a metal layer, so that the protective layer not only has certain strength to protect the graphite layer, but also has good heat dissipation capacity to avoid affecting the heat dissipation capacity of the graphite layer. For example, the protective layer can be copper, aluminum, silver or the like, can be a metal foil attached to the opposite surfaces of the graphite layer, or can be a metal paint sprayed to the opposite surfaces of the graphite layer, which is not limited herein.

[0020] In some possible implementation manners, the first mounting hole has a first inner wall, the first inner wall is an inner wall of the first mounting hole away from the second mounting hole, and the first inner wall is provided with a first recess; the shaft assembly further comprises a first positioning plate, the first positioning plate is arranged in the first recess, and the circuit board assembly is fixed to the first positioning plate.

[0021] In the present implementation, the first recess is arranged on the first inner wall, and the circuit board assembly is fixed by the first positioning plate arranged in the first recess, so that the stability of the fixed installation of the circuit board assembly at the first mounting hole is improved. The first positioning plate is limited by the inner wall of the first recess, so that the movement of the first positioning plate is avoided, and the movement of the circuit board assembly is avoided, that is, the stability during the process of fixing the circuit board assembly by the first fixing plate is ensured, and the stability of the circuit board assembly at the first mounting hole during the folding and unfolding process of the electronic device is improved, so that the reliability of the electronic device is improved.

[0022] In some possible implementations, the shaft penetrating assembly further includes a first fixing adhesive, which is bonded between the bottom wall of the first recess and the first positioning plate, so as to further improve the stability of the first positioning plate in the first recess, and further improve the installation stability of the circuit board assembly at the first mounting hole.

[0023] The first fixing adhesive can be a back adhesive, which can improve the convenience of installing the first fixing adhesive, and also enable the first fixing adhesive to have a certain elasticity, which is conducive to the fixation of the circuit board assembly at the first mounting hole by the first fixing plate through extrusion.

[0024] In some possible implementations, the shaft penetrating assembly further includes a second fixing adhesive, which is bonded between the first positioning plate and the circuit board assembly, so that the circuit board assembly can be fixed to the first positioning plate at the first mounting hole.

[0025] The second fixing adhesive can be a back adhesive, which can improve the convenience of installing the second fixing adhesive, and also enable the second fixing adhesive to have a certain elasticity, which is conducive to the fixation of the circuit board assembly at the first mounting hole by the first fixing plate through extrusion.

[0026] In some possible implementations, the first inner wall has a first inclined surface, the first inclined surface is inclined away from the second mounting hole, and the opening of the first recess is formed in the first inclined surface.

[0027] In the present implementation, the first inclined surface is arranged to facilitate the fixation of the circuit board assembly on the first inner wall by the first fixing plate, and the inclination of the first inclined surface can increase the contact surface of the circuit board assembly and the first fixing plate, thereby providing good support for the extrusion fixation of the circuit board assembly by the first fixing plate. In addition, the arrangement of the first inclined surface is also conducive to slowing down the flowability of the glue towards the accommodation space during the process of forming the first sealing adhesive by dispensing / gluing, so as to reduce the risk of glue leakage.

[0028] In some possible implementation manners, the first shell and the second shell surround to form a receiving space, the receiving space is communicated with the first mounting hole and the second mounting hole, and the receiving space receives the folding mechanism; the first mounting hole has oppositely arranged first and second inner walls, the first inner wall is an inner wall of the first mounting hole away from the second mounting hole, and the first protruding portion extends towards the direction of the first inner wall; the first fixing plate further includes a second protruding portion, the second protruding portion is protruded from the first plate body, and the second protruding portion extends towards the direction of the second inner wall; and an inner wall of the receiving space includes a first limiting wall, the first limiting wall is arranged in connection with the second inner wall, and the second protruding portion abuts against the first limiting wall.

[0029] In the implementation manner, the folding mechanism is arranged at the receiving space, so that the first shell and the second shell have a large cavity at the receiving space, and the structural strength of the first shell and the second shell at the receiving space is weak; the second protruding portion of the first fixing plate abuts against the first limiting wall, so that the first fixing plate provides support for the first shell at the first limiting wall through the second protruding portion, and the structural strength of the first shell is improved.

[0030] The first fixing portion can be located on a side of the first plate body away from the second protruding portion, so that when the first fixing plate is fixedly installed on the first shell, the first fixing portion can fixedly connect the part of the first shell located on the side of the first shell away from the second mounting hole, so as to avoid connecting the part of the first shell forming the receiving space, and the part of the first shell located on the side of the first shell away from the second mounting hole is taken as a support, and the second protruding portion of the first fixing portion provides structural strength support for the part of the first shell between the first mounting hole and the second mounting hole.

[0031] In some possible implementation manners, the second fixing plate includes a second plate body and a third protruding portion, the second plate body is arranged in the second mounting hole and fixed to the second shell, and the third protruding portion is protruded from the second plate body and arranged to extend towards the circuit board assembly.

[0032] In the implementation manner, the third protruding portion is arranged to abut against the circuit board assembly, so that the third protruding portion gives the circuit board assembly more extrusion relative to the second plate body, so that the circuit board assembly is extruded more tightly at the third protruding portion, and in the process of forming the second sealing glue by dispensing / gluing, the uncured glue is difficult to flow between the circuit board assembly and the third protruding portion, and the risk of glue leakage can be reduced.

[0033] In some possible implementation manners, the second mounting hole has a third inner wall, the third inner wall is an inner wall of the second mounting hole away from the first mounting hole; the second fixing plate further includes a second fixing portion, the second fixing portion is connected to one side of the second plate body, the second fixing portion is fixed to the second shell, the second plate body has a second fixing surface, the circuit board assembly is fixed between the second fixing surface and the third inner wall, the second sealant is arranged at a connection position of the second fixing portion and the second shell, and the second fixing surface and the circuit board assembly are sealed.

[0034] In the implementation manner, the third protruding portion is arranged on the second plate body and located on the side of the second fixing surface away from the second opening, so that, in the process of dispensing / gluing to form the second sealant, the uncured glue flowing through the second plate body and the circuit board assembly is blocked by the third protruding portion, the flow path of the glue is blocked by the third protruding portion, the probability of the glue leaking into the accommodation space is reduced, and the sealing performance of the second mounting hole is improved, so that the electronic device has better waterproof performance at the second mounting hole and the reliability of the electronic device is improved. The connection position of the second fixing portion and the second shell can be regarded as a glue filling position, the second sealant is formed by dispensing / gluing at the connection position, so that the connection position of the second fixing portion and the second shell is sealed, and the sealing performance of the second mounting hole is improved. Because the third protruding portion is arranged, the uncured glue is prevented from flowing from the connection position of the second fixing portion and the second shell into the accommodation space, the risk of glue leakage is reduced, the sealing effect of the connection position of the second fixing portion and the second shell is improved, and the sealing effect between the second fixing surface and the circuit board assembly is improved.

[0035] In some possible implementation manners, the circuit board assembly includes a flexible circuit board, a heat dissipation plate and a third adhesive, the heat dissipation plate and the flexible circuit board are arranged in a stack; the flexible circuit board includes a third mounting portion, the heat dissipation plate includes a fourth mounting portion, the third mounting portion and the fourth mounting portion are located in the second mounting hole, and the third adhesive is arranged between the third mounting portion and the fourth mounting portion.

[0036] In the implementation manner, the third mounting portion is a part of the flexible circuit board located in the second mounting hole, the fourth mounting portion is a part of the heat dissipation plate located in the second mounting hole, the third adhesive is arranged between the third mounting portion and the fourth mounting portion, the stability of the circuit board assembly fixedly installed at the second mounting hole is improved, and the consistency of deformation of the flexible circuit board and the heat dissipation plate during folding and unfolding of the electronic device is improved.

[0037] The third adhesive can be back adhesive, which can improve the convenience of installing the third adhesive, and make the third adhesive have certain elasticity, so that the second fixing plate can fix the circuit board assembly at the second mounting hole by extruding the circuit board assembly.

[0038] In some possible implementation manners, the fourth mounting portion is arranged close to the second fixing plate relative to the third mounting portion; and the circuit board assembly further includes a fourth adhesive, which is attached between the fourth mounting portion and the second fixing plate.

[0039] In the implementation manner, the fourth adhesive can improve the stability of the attachment between the second fixing plate and the circuit board assembly, and facilitate the second fixing plate to stably fix the circuit board assembly at the second mounting hole.

[0040] The fourth adhesive can be back adhesive, which can improve the convenience of installing the fourth adhesive, and make the fourth adhesive have certain elasticity, so that the second fixing plate can fix the circuit board assembly at the second mounting hole by extruding the circuit board assembly.

[0041] In some possible implementation manners, the second mounting hole has a third inner wall, the third inner wall is an inner wall of the second mounting hole away from the first mounting hole, and the third inner wall is provided with a second groove; the shaft penetrating assembly further includes a second positioning plate, the second positioning plate is installed in the second groove, and the circuit board assembly is fixed to the second positioning plate.

[0042] In the implementation manner, the second groove is arranged on the third inner wall, and the circuit board assembly is fixed by the second positioning plate in the second groove, so that the stability of the installation of the circuit board assembly at the second mounting hole can be improved. The second positioning plate can be limited by the inner wall of the second groove, so that the second positioning plate is prevented from moving, and the circuit board assembly is prevented from moving, that is, the stability of the process of fixing the circuit board assembly by the second fixing plate can be ensured, and the stability of the circuit board assembly at the second mounting hole during folding and unfolding of the electronic device can be improved, so that the reliability of the electronic device is improved.

[0043] In some possible implementation manners, the shaft penetrating assembly further includes a third fixing adhesive, which is attached between the bottom wall of the second groove and the second positioning plate, so as to further improve the stability of the second positioning plate in the second groove, and further improve the installation stability of the circuit board assembly at the second mounting hole.

[0044] The third fixing adhesive can be back adhesive, which can improve the convenience of installing the third fixing adhesive, and make the third fixing adhesive have certain elasticity, so that the second fixing plate can fix the circuit board assembly at the second mounting hole by extruding the circuit board assembly.

[0045] In some possible implementation manners, the shaft penetrating assembly further includes a fourth fixing adhesive, which is bonded between the second positioning plate and the circuit board assembly, so that the circuit board assembly can be fixed to the second positioning plate at the second mounting hole.

[0046] In some possible implementation manners, the fourth fixing adhesive can be a back adhesive, which can improve the convenience of installing the fourth fixing adhesive, and also enable the fourth fixing adhesive to have a certain elasticity, thereby facilitating the second fixing plate to fix the circuit board assembly at the second mounting hole by extrusion.

[0047] In some possible implementation manners, the third inner wall has a second inclined surface, the second inclined surface is inclined away from the first mounting hole, and the opening of the second groove is formed in the second inclined surface.

[0048] In the implementation manner, the second inclined surface is arranged to facilitate the second fixing plate to fix the circuit board assembly on the third inner wall, and the inclination of the second inclined surface can increase the contact surface of the circuit board assembly and the second fixing plate, thereby providing good support for the second fixing plate to fix the circuit board assembly by extrusion. In addition, the arrangement of the second inclined surface also facilitates reducing the flowability of the glue towards the accommodation space during the dispensing / gluing of the second sealing adhesive, thereby reducing the risk of glue leakage.

[0049] In some possible implementation manners, the first shell and the second shell surround to form an accommodation space, the accommodation space is communicated with the first mounting hole and the second mounting hole, and the accommodation space accommodates the folding mechanism; the second mounting hole has oppositely arranged third and fourth inner walls, the third inner wall is an inner wall of the second mounting hole away from the first mounting hole, and the third protruding portion extends towards the third inner wall; the second fixing plate further includes a fourth protruding portion, the fourth protruding portion is protruded from the second plate body, the fourth protruding portion extends towards the fourth inner wall, the inner wall of the accommodation space includes a second limiting wall, the second limiting wall is arranged in connection with the fourth inner wall, and the fourth protruding portion abuts against the second limiting wall.

[0050] In the implementation manner, since the folding mechanism needs to be arranged at the accommodation space, the first shell and the second shell have a large cavity at the accommodation space, so that the structural strength of the first shell and the second shell at the accommodation space is weak. The fourth protruding portion on the second fixing plate abuts against the second limiting wall, so that the second fixing plate provides support for the second shell at the second limiting wall through the fourth protruding portion, thereby improving the structural strength of the second shell.

[0051] The second fixed part can be located on the side of the second plate body away from the fourth protruding part, so that when the second fixed plate is fixedly installed on the second shell, the second fixed part can fixedly connect the part of the second shell located on the side of the second mounting hole away from the first mounting hole, to avoid connecting the part of the second shell forming the accommodation space, and the part of the second shell located on the side of the second mounting hole away from the first mounting hole is used as a support, and the fourth protruding part of the second fixed part provides structural strength support for the part of the second shell located between the second mounting hole and the first mounting hole. BRIEF DESCRIPTION OF DRAWINGS

[0052] FIG. 1A is a structural schematic diagram of an electronic device in an open state according to some embodiments of the present application;

[0053] FIG. 1B is a structural schematic diagram of an electronic device in a closed state according to some embodiments of the present application; FIG. 1A

[0054] FIG. 1C is a structural schematic diagram of an electronic device in an intermediate state according to some embodiments of the present application; FIG. 1A

[0055] FIG. 2A is a partial internal structural schematic diagram of an electronic device according to some embodiments of the present application; FIG. 1A

[0056] FIG. 2B is a structural schematic diagram of a shell device in an electronic device according to some embodiments of the present application; FIG. 2A

[0057] FIG. 3 is a partial cross-sectional structural schematic diagram of a shell device according to some embodiments of the present application; FIG. 2B

[0058] FIG. 4 is a schematic diagram of a through-axle assembly fixed at a first mounting hole according to some embodiments of the present application;

[0059] FIG. 5 is a partial cross-sectional structural schematic diagram of a structure according to some embodiments of the present application; FIG. 4

[0060] FIG. 6A is a partial structural schematic diagram of a first shell in a structure according to some embodiments of the present application; FIG. 5

[0061] FIG. 6B is a partial structural schematic diagram of a structure in which a first positioning plate is installed according to some embodiments of the present application; FIG. 6A

[0062] FIG. 7 FIG. 6B ​​​​​​​​​A partial structure diagram of the structure shown in some embodiments of the circuit board assembly;

[0063] FIG. 8 is FIG. 7 A partial layer structure diagram of the heat dissipation plate in the structure shown in some embodiments;

[0064] FIG. 9A is FIG. 5 A structure diagram of the first fixing plate in the structure shown in some embodiments;

[0065] FIG. 9B is FIG. 9A A structure diagram of the first fixing plate shown in another view;

[0066] FIG. 10 is a schematic diagram of the through shaft assembly fixed at the second mounting hole in some embodiments;

[0067] FIG. 11 is FIG. 10 A partial cross-sectional structure diagram of the structure shown in some embodiments;

[0068] FIG. 12A is FIG. 11 A partial structure diagram of the second housing in the structure shown at the second mounting hole;

[0069] FIG. 12B is FIG. 12A A partial structure diagram of the structure shown in some embodiments of the second positioning plate;

[0070] FIG. 13 is FIG. 12B A partial structure diagram of the structure shown in some embodiments of the circuit board assembly;

[0071] FIG. 14A is FIG. 11 A structure diagram of the second fixing plate in the structure shown in some embodiments;

[0072] FIG. 14B is FIG. 14A A structure diagram of the second fixing plate shown in another view. DETAILED DESCRIPTION

[0073] The embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.

[0074] In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting" should be understood in a broad sense, for example, "connecting" can be detachable connection, or can be non-detachable connection; can be direct connection, or indirect connection through intermediate medium. "Multiple" means at least two.

[0075] The positional terms mentioned in the embodiments of the present application, such as "upper", "lower", "inner", "outer", "top", "bottom", "side", and the like, are only the directions of the drawings, and thus the positional terms are used for better and clearer illustration and understanding of the embodiments of the present application, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus cannot be understood as a limitation on the embodiments of the present application.

[0076] In the embodiments of the present application, the relative positional relationship mentioned, such as parallel, vertical, aligned, and the like, are all in view of the current process level, and are not absolute strict limits, and a small amount of deviation is allowed, and approximately parallel, approximately vertical, approximately aligned, and the like are all possible. For example, A is parallel to B, which means that A and B are parallel or approximately parallel, and the included angle between A and B can be between 0 degrees and 10 degrees. For example, A is vertical to B, which means that A and B are vertical or approximately vertical, and the included angle between A and B can be between 80 degrees and 100 degrees.

[0077] In the embodiments of the present application, the terms "first", "second", "third", "fourth" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features referred to. Therefore, the features defined with "first", "second", "third", "fourth" can explicitly or implicitly include one or more of the features.

[0078] Please refer to FIGS. 1A-1C , FIG. 1A is a structural schematic diagram of an electronic device 100 in an open state provided by an embodiment of the present application; FIG. 1B is FIG. 1A a structural schematic diagram of the electronic device 100 in a closed state shown in FIG. 1; FIG. 1C is FIG. 1A a structural schematic diagram of the electronic device 100 in an intermediate state shown in FIG. 1.

[0079] In some embodiments, the electronic device 100 can include a screen 10 and a housing device 20, and the screen 10 is mounted on the housing device 20. As shown in FIG. 2, the housing device 20 can be unfolded to an open state. As shown in FIG. 3, the housing device 20 can also be folded to a closed state. As shown in FIG. 4, the housing device 20 can also be in an intermediate state. FIG. 1A FIG. 1B FIG. 1C ​​As shown, the housing device 20 can also be unfolded or folded to an intermediate state, which can be any state between the open state and the closed state. The screen 10 moves with the housing device 20, and the housing device 20 can drive the screen 10 to unfold or fold, so that the electronic device 100 can be unfolded to the open state or folded to the closed state. When the electronic device 100 is in the closed state, the screen 10 is located outside the housing device 20.

[0080] In this embodiment, when the electronic device 100 is in the open state, the screen 10 is flat, and the screen 10 can perform full-screen display, so that the electronic device 100 has a large display area, thereby improving the user's viewing experience and operation experience. When the electronic device 100 is in the closed state, the planar size of the electronic device 100 is small, which is convenient for the user to carry and store.

[0081] For example, the housing device 20 can include a first housing 21, a second housing 22, and a folding mechanism 23. The folding mechanism 23 can be connected to the first housing 21 and the second housing 22, and is used to unfold or fold the first housing 21 and the second housing 22 relative to each other.

[0082] In some embodiments, the screen 10 can integrate display function and touch sensing function. The display function of the screen 10 is used to display images, videos, etc., and the touch sensing function of the screen 10 is used to sense the touch action of the user to realize human-computer interaction. For example, the screen 10 includes a display screen that can be bent. The display screen can be a liquid crystal display (LCD), an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a flexible light-emitting diode (FLED) display screen, a MiniLED display screen, a MicroLED display screen, a Micro-OLED display screen, a quantum dot light emitting diode (QLED) display screen, etc.

[0083] In some embodiments, the electronic device 100 can further include a plurality of components (not shown in the figure) mounted inside the housing apparatus 20. The plurality of components can include, for example, a processor, an internal memory, an external memory interface, a universal serial bus (USB) interface, a charging management module, a power management module, a battery, an antenna, a communication module, a camera, an audio module, a speaker, a receiver, a microphone, an earphone interface, a sensor module, a key, a motor, an indicator, and a subscriber identification module (SIM) card interface, and the like.

[0084] It should be understood that in the present embodiment, the electronic device 100 is taken as an example of a two-fold structure, i.e., the electronic device 100 includes two flat plate portions and a folding portion connecting the two flat plate portions; the two flat plate portions can be rotated towards each other to be stacked on each other (corresponding to the closed state described above), so that the electronic device 100 assumes a two-layered form; the two flat plate portions can also be rotated away from each other to be flat (corresponding to the open state described above). In other embodiments, the electronic device 100 can also have a three-fold or more structure, i.e., the electronic device 100 includes three or more flat plate portions, and adjacent two flat plate portions are connected by a folding portion, and adjacent two flat plate portions can be rotated towards each other to be stacked on each other or rotated away from each other to be flat. When the electronic device 100 has a three-fold or more structure, the structure of the electronic device 100 can be designed adaptively according to the description of the two-fold structure of the present embodiment, and the present application will not be described in detail.

[0085] Please refer to FIG. 2A and FIG. 2B , FIG. 2A is FIG. 1A a partial internal structure diagram of the electronic device 100 in some embodiments; FIG. 2B is FIG. 2A a structure diagram of the housing apparatus 20 in the electronic device 100 in some embodiments.

[0086] In some embodiments, the first housing 21 can have a first mounting hole 211, and the second housing 22 can have a second mounting hole 221, and the first mounting hole 211 and the second mounting hole 221 can be located on both sides of the folding mechanism 23. The electronic device 100 can further include a through shaft assembly 30, one end of the through shaft assembly 30 passing through the first mounting hole 211 and being fixed to the first housing 21, and the other end of the through shaft assembly 30 passing through the folding mechanism 23, the second mounting hole 221, and being fixed to the second housing 22.

[0087] In the present embodiment, by providing the through shaft assembly 30, the conduction between the circuit located in the first housing 21 and the circuit located in the second housing 22 can be achieved, so that the communication and power transmission can be realized.

[0088] In some prior art, in order to realize the sealing of the through shaft assembly 30 at the first mounting hole 211 and the second mounting hole 221, the through shaft assembly 30 is usually fixed at the first mounting hole 211 and the second mounting hole 221 by means of dispensing / gluing, and the sealing is realized. However, in the dispensing / gluing process, since the glue has fluidity before solidification, it is easy to flow to the folding mechanism 23 through the inner wall between the through shaft assembly 30 and the first mounting hole 211 / second mounting hole 221, resulting in poor sealing effect of the first mounting hole 211 and the second mounting hole 221 and the glue may affect the work of the folding mechanism 23, affecting the overall reliability and waterproof performance of the electronic device 100.

[0089] The present application aims at the glue leakage phenomenon, and provides a fixing plate, which is provided with a protrusion to block the leakage of glue when dispensing / gluing is used to seal the first mounting hole 211 and the second mounting hole 221, so as to reduce the risk of glue leakage and improve the overall reliability and waterproof performance of the electronic device 100. The specific design of the fixing plate is introduced below.

[0090] Please refer to FIG. 2A and FIG. 3 , FIG. 3 is a partial cross-sectional structure schematic view of the shell device 20 shown in FIG. 2B .

[0091] In some embodiments, the first shell 21 and the second shell 22 can surround to form a receiving space 24, and the receiving space 24 communicates with the first mounting hole 211 and the second mounting hole 221. The receiving space 24 receives the folding mechanism 23. The through shaft assembly 30 penetrates into the receiving space 24 from the first mounting hole 211 and bypasses the outer circumferential side of the folding mechanism 23 to penetrate out from the second mounting hole 221. The through shaft assembly 30 needs to be fixed and sealed at the first mounting hole 211 and the second mounting hole 221, so as to ensure the sealing performance of the electronic device 100 at the folding mechanism 23 and the stability of the through shaft assembly 30 during the folding and unfolding of the electronic device 100.

[0092] Next, the fixing and sealing of the through shaft assembly 30 at the first mounting hole 211 will be introduced.

[0093] Please refer to FIG. 4 and FIG. 5 , FIG. 4 is a schematic view of the fixing of the through shaft assembly 30 at the first mounting hole 211 in some embodiments; FIG. 5 is a partial cross-sectional structure schematic view of the structure shown in FIG. 4 .

[0094] In some embodiments, the through shaft assembly 30 can include a circuit board assembly 31 and a first fixing plate 32, the circuit board assembly 31 passes through the first mounting hole 211, and the first fixing plate 32 is fixed in the first mounting hole 211 to fix the part of the circuit board assembly 31 in the first mounting hole 211 to the inner wall of the first mounting hole 211.

[0095] In the present embodiment, the fixing of the part of the circuit board assembly 31 in the first mounting hole 211 is achieved by the first fixing plate 32, so that the structure of the part of the circuit board assembly 31 in the first mounting hole 211 is stable during folding and unfolding of the electronic device 100, and the reliability of the circuit board assembly 31 is improved.

[0096] For example, the first fixing plate 32 can be fixed to the first housing 21 so that the first fixing plate 32 can press the circuit board assembly 31 to achieve the fixing of the circuit board assembly 31 at the first mounting hole 211.

[0097] For example, the first fixing plate 32 can be fixed to the first housing 21 by screwing, and the circuit board assembly 31 can be pressed on the hole wall of the first mounting hole 211 by tightening the screw.

[0098] For example, the electronic device 100 can include a first sealant 40, and the first sealant 40 seals the through shaft assembly 30 and the hole wall of the first mounting hole 211. Specifically, the first sealant 40 can seal the area between the first fixing plate 32 and the circuit board assembly 31 to improve the waterproof performance at the first mounting hole 211. In addition, the first sealant 40 can also cover the screw fixing position of the first fixing plate 32 to further improve the waterproof performance at the first mounting hole 211.

[0099] For example, the first fixing plate 32 can include a first plate body 321 and a first protruding portion 322, the first plate body 321 is arranged in the first mounting hole 211 and fixed to the first housing 21, and the first protruding portion 322 is arranged on the first plate body 321 and extends away from the inner wall of the first mounting hole 211 to abut the circuit board assembly 31.

[0100] In the present embodiment, the first protruding portion 322 is arranged to abut the circuit board assembly 31, so that the first protruding portion 322 gives the circuit board assembly 31 more extrusion relative to the first plate body 321, so that the circuit board assembly 31 is extruded more tightly at the first protruding portion 322, and thus the uncured glue is difficult to flow between the circuit board assembly 31 and the first protruding portion 322 during the process of dispensing / gluing to form the first sealant 40, which can reduce the risk of glue leakage.

[0101] Exemplarily, the first mounting hole 211 can have oppositely arranged first and second inner walls 2111 and 2112, wherein the first inner wall 2111 is an inner wall of the first mounting hole 211 away from the second mounting hole 221, and the second inner wall 2112 is an inner wall of the first mounting hole 211 close to the second mounting hole 221. The first plate body 321 can have a first fixing surface 3211, and the circuit board assembly 31 is fixed between the first fixing surface 3211 and the first inner wall 2111. The first mounting hole 211 can have a first opening 2115, and the first sealant 40 is arranged at the first opening 2115 and seals the first fixing surface 3211 and the circuit board assembly 31. The first protrusion 322 is located on the side of the first fixing surface 3211 away from the first opening 2115, and the first protrusion 322 extends towards the first inner wall 2111 and abuts against the circuit board assembly 31.

[0102] In the embodiment, since the first protrusion 322 is arranged on the first plate body 321 and located on the side of the first fixing surface 3211 away from the first opening 2115, in the process of dispensing / adhesive pouring to form the first sealant 40, the uncured glue flowing through the first plate body 321 and the circuit board assembly 31 is blocked by the first protrusion 322, the flow path of the glue is blocked by the first protrusion 322, thereby reducing the probability of glue leaking into the accommodation space 24, and improving the sealing performance of the first mounting hole 211. After the glue is cured to form the first sealant 40, the electronic device 100 has better waterproof performance at the first mounting hole 211, and the reliability of the electronic device 100 is improved.

[0103] In the embodiment, the first inner wall 2111 can have a first inclined surface 2113 inclined towards the direction away from the second mounting hole 221.

[0104] In the embodiment, the first inclined surface 2113 is arranged to facilitate the first fixing plate 32 to fix the circuit board assembly 31 on the first inner wall 2111, and the inclined arrangement of the first inclined surface 2113 can increase the contact surface of the circuit board assembly 31 and the first fixing plate 32, thereby providing good support for the first fixing plate 32 to fix the circuit board assembly 31 by extrusion. In addition, the arrangement of the first inclined surface 2113 is also conducive to slowing down the flowability of the glue towards the accommodation space 24 in the process of dispensing / adhesive pouring to form the first sealant 40, thereby reducing the risk of glue leakage.

[0105] Exemplarily, the first fixing plate 32 can further include a first fixing portion 323 connected to one side of the first plate body 321, and the first fixing portion 323 is fixed to the first housing 21. The first fixing portion 323 can be located on one side of the circuit board assembly 31, and the first sealant 40 is arranged at the connection between the first fixing portion 323 and the first housing 21 and seals the first fixing surface 3211 and the circuit board assembly 31.

[0106] In the embodiment, the connection between the first fixing part 323 and the first housing 21 can be regarded as a glue filling position. The first sealing glue 40 is formed by dispensing glue at the position, so as to seal the connection between the first fixing part 323 and the first housing 21, thereby improving the sealing performance at the first mounting hole 211. Due to the first protrusion 322, the uncured glue is prevented from flowing from the connection between the first fixing part 323 and the first housing 21 into the accommodation space 24, the risk of glue leakage is reduced, the sealing effect of the connection between the first fixing part 323 and the first housing 21 is improved, and the sealing effect between the first fixing surface 3211 and the circuit board assembly 31 is improved.

[0107] Please refer to FIG. 5 , FIG. 6A and FIG. 6B , FIG. 6A are FIG. 5 the partial structural schematic diagram of the first housing 21 at the first mounting hole 211 in the structure shown in FIG. 6B is FIG. 6A the partial structural schematic diagram of the structure in some embodiments for installing the first positioning plate 38.

[0108] In some embodiments, the first inner wall 2111 can be provided with a first recess 2114, and the opening of the first recess 2114 can be formed in the first inclined surface 2113. The through shaft assembly 30 can further include a first positioning plate 38, which can be installed in the first recess 2114, and the circuit board assembly 31 can be fixed to the first positioning plate 38.

[0109] In the embodiment, by providing the first recess 2114 on the first inner wall 2111 and fixing the circuit board assembly 31 by the first positioning plate 38 in the first recess 2114, the stability of the fixed installation of the circuit board assembly 31 at the first mounting hole 211 can be improved. The inner wall of the first recess 2114 can limit the first positioning plate 38, so as to avoid the movement of the first positioning plate 38, thereby avoiding the movement of the circuit board assembly 31, that is, the stability during the process of fixing the circuit board assembly 31 by the first fixing plate 32 can be ensured, and the stability of the circuit board assembly 31 at the first mounting hole 211 during the folding and unfolding process of the electronic device 100 can be improved, thereby improving the reliability of the electronic device 100.

[0110] For example, the through shaft assembly 30 can further include a first fixing glue 33, which bonds between the bottom wall of the first recess 2114 and the first positioning plate 38, so as to further improve the stability of the first positioning plate 38 in the first recess 2114, thereby further improving the installation stability of the circuit board assembly 31 at the first mounting hole 211.

[0111] The first fixing glue 33 can be back glue, which can improve the convenience of installing the first fixing glue 33, and also enables the first fixing glue 33 to have a certain elasticity, which is beneficial to the fixing of the circuit board assembly 31 at the first mounting hole 211 by extruding the circuit board assembly 31 by the first fixing plate 32.

[0112] Please refer to FIG. 5 , FIG. 7 and FIG. 8 , FIG. 7 is FIG. 6B The structure shown in some embodiments is a partial structure diagram of the structure of the circuit board assembly 31; FIG. 8 is FIG. 7 The structure shown in some embodiments is a partial layer structure diagram of the heat dissipation plate 312.

[0113] In some embodiments, the through shaft assembly 30 can further include a second fixing glue 34, which can be bonded between the first positioning plate 38 and the circuit board assembly 31, so that the circuit board assembly 31 can be fixed to the first positioning plate 38 at the first mounting hole 211.

[0114] The second fixing glue 34 can be back glue, which can improve the convenience of installing the second fixing glue 34, and also enables the second fixing glue 34 to have a certain elasticity, which is beneficial to the fixing of the circuit board assembly 31 at the first mounting hole 211 by extruding the circuit board assembly 31 by the first fixing plate 32.

[0115] In some embodiments, the circuit board assembly 31 can include a flexible circuit board 311 and a heat dissipation plate 312, and the heat dissipation plate 312 and the flexible circuit board 311 can be stacked.

[0116] In this embodiment, the heat dissipation plate 312 and the flexible circuit board 311 are stacked to enable the heat dissipation plate 312 to dissipate heat for the flexible circuit board 311, so as to avoid overheating of the flexible circuit board 311 during the operation of the electronic device 100 and affect the normal operation. In addition, due to the large number of components designed at the folding mechanism 23, the heat dissipation speed near the folding mechanism 23 is slow, and the heat dissipation plate 312 is arranged together with the flexible circuit board 311 through the shaft to surround the folding mechanism, so that the heat dissipation plate 312 can assist the heat dissipation of the electronic device 100 at the folding mechanism, which is beneficial to prevent the electronic device 100 from overheating near the folding mechanism and affecting the normal operation.

[0117] Exemplarily, the flexible circuit board 311 can include a first mounting portion 3111, the heat dissipation plate 312 can include a second mounting portion 3121, and the first mounting portion 3111 and the second mounting portion 3121 can be located in the first mounting hole 211. The circuit board assembly 31 can further include a first adhesive 313, and the first adhesive 313 is attached between the first mounting portion 3111 and the second mounting portion 3121.

[0118] In this embodiment, the first mounting portion 3111 is a portion of the flexible circuit board 311 located in the first mounting hole 211, and the second mounting portion 3121 is a portion of the heat dissipation plate 312 located in the first mounting hole 211. By attaching the first adhesive 313 between the first mounting portion 3111 and the second mounting portion 3121, the stability of the fixed installation of the circuit board assembly 31 in the first mounting hole 211 is improved, and the consistency of the deformation of the flexible circuit board 311 and the heat dissipation plate 312 during the folding and unfolding of the electronic device 100 is maintained.

[0119] The first adhesive 313 can be a back adhesive, which can improve the convenience of installing the first adhesive 313 and also enable the first adhesive 313 to have a certain elasticity, so that the first fixing plate 32 can fix the circuit board assembly 31 in the first mounting hole 211 by extruding the circuit board assembly 31.

[0120] Exemplarily, the second mounting portion 3121 can be arranged close to the first fixing plate 32 relative to the first mounting portion 3111, and the circuit board assembly 31 can further include a second adhesive 314, which can be attached between the second mounting portion 3121 and the first fixing plate 32.

[0121] In this embodiment, by arranging the second adhesive 314, the adhesion stability between the first fixing plate 32 and the circuit board assembly 31 is improved, and the first fixing plate 32 can stably fix the circuit board assembly 31 in the first mounting hole 211.

[0122] The second adhesive 314 can be a back adhesive, which can improve the convenience of installing the second adhesive 314 and also enable the second adhesive 314 to have a certain elasticity, so that the first fixing plate 32 can fix the circuit board assembly 31 in the first mounting hole 211 by extruding the circuit board assembly 31.

[0123] Exemplarily, the heat dissipation plate 312 can include a graphite layer 3122 and a protective layer 3123, and the protective layer 3123 can be attached to the opposite surfaces of the graphite layer 3122.

[0124] In the embodiment, the graphite layer 3122 is arranged to improve the heat dissipation capacity, so as to better provide heat dissipation for the flexible circuit board 311. The protective layer 3123 is arranged to reduce the damage of the graphite layer 3122 caused by scratching during the process of penetrating the shaft, to prevent the damage of the graphite layer 3122 caused by the adhesive during the process of arranging the first adhesive 313 and the second adhesive 314, and to avoid the damage of the graphite layer 3122 caused by the first fixed plate 32 during the process of pressing the circuit board assembly 31.

[0125] The protective layer 3123 can be directly attached to the opposite surfaces of the graphite layer 3122, or can be sprayed on the surfaces of the graphite layer 3122.

[0126] The protective layer 3123 can be a metal layer, so that the protective layer 3123 not only has a certain strength to protect the graphite layer 3122, but also has good heat dissipation capacity to avoid affecting the heat dissipation capacity of the graphite layer 3122. For example, the protective layer 3123 can be copper, aluminum, silver or the like, and can be a metal foil attached to the opposite surfaces of the graphite layer 3122, or can be a metal paint sprayed on the opposite surfaces of the graphite layer 3122, which is not limited herein.

[0127] Please refer to FIG. 4 , FIG. 5 , FIG. 7 , FIG. 9A and FIG. 9B , FIG. 9A is a structural schematic view of the first fixed plate 32 in some embodiments shown in FIG. 5 . FIG. 9B FIG. 9A is a structural schematic view of the first fixed plate 32 from another perspective.

[0128] In some embodiments, the first fixed plate 32 can include a second protruding portion 324 protruding from the first plate body 321. The second protruding portion 324 and the first protruding portion 322 extend in different directions relative to the first plate body 321. The inner wall of the accommodation space 24 can include a first limiting wall 241 connected to the second inner wall 2112, and the second protruding portion 324 can abut against the first limiting wall 241.

[0129] ​In the embodiment, the folding mechanism is arranged at the accommodation space 24, so that the first shell 21 and the second shell 22 have a large cavity at the accommodation space 24, and the structural strength of the first shell 21 and the second shell 22 at the accommodation space 24 is weak. The second protrusion 324 on the first fixing plate 32 abuts against the first limiting wall 241, so that the first fixing plate 32 provides support for the first shell 21 at the first limiting wall 241 through the second protrusion 324, thereby improving the structural strength of the first shell 21.

[0130] The first plate body 321 can be provided with one or more first fixing portions 323, and the first plate body 321 can be fixedly installed to the first shell 21 through the first fixing portions 323.

[0131] The first fixing portion 323 can be located on the side of the first plate body 321 away from the second protrusion 324, so that when the first fixing plate 32 is fixedly installed to the first shell 21, the first fixing portion 323 can fixedly connect the part of the first shell 21 located away from the second mounting hole 221 on the side of the first mounting hole 211, so as to avoid connecting the part of the first shell 21 forming the accommodation space 24, and the part of the first shell 21 located away from the second mounting hole 221 on the side of the first mounting hole 211 is used as support, and the second protrusion 324 of the first fixing portion 323 provides structural strength support for the shell part of the first shell 21 located between the first mounting hole 211 and the second mounting hole 221.

[0132] The above describes the fixing and sealing of the shaft penetrating assembly 30 at the first mounting hole 211, and the fixing and sealing of the shaft penetrating assembly 30 at the second mounting hole 221 will be described next. It should be noted that the structural design of the shaft penetrating assembly 30 at the second mounting hole 221 can include the structural design of the shaft penetrating assembly 30 at the first mounting hole 211.

[0133] Please refer to FIG. 10 and FIG. 11 , FIG. 10 is a schematic view of the fixing of the shaft penetrating assembly 30 at the second mounting hole 221 in some embodiments; FIG. 11 is FIG. 10 a partial cross-sectional structural schematic view of the structure shown in some embodiments.

[0134] In some embodiments, the shaft penetrating assembly 30 can further include a second fixing plate 35, and the second fixing plate 35 can be fixedly spaced apart from the first fixing plate 32 on the circuit board assembly 31. The second fixing plate 35 can be fixed in the second mounting hole 221 to fix the part of the circuit board assembly 31 located in the second mounting hole 221 to the inner wall of the second mounting hole 221.

[0135] In the embodiment, the second fixing plate 35 is used to fix the part of the circuit board assembly 31 located in the second mounting hole 221, so that the structure of the circuit assembly located in the second mounting hole 221 is stable during folding and unfolding, and the reliability of the circuit assembly is improved.

[0136] For example, the second fixing plate 35 can be fixed to the second housing 22, so that the second fixing plate 35 can press the circuit board assembly 31 to fix the circuit board assembly 31 at the second mounting hole 221.

[0137] In the embodiment, the second fixing plate 35 can be fixed to the second housing 22 by screwing, so that the second fixing plate 35 can press the circuit board assembly 31 against the hole wall of the second mounting hole 221 by screwing.

[0138] In the embodiment, the second fixing plate 35 can be fixed to the second housing 22 by screwing, so that the second fixing plate 35 can press the circuit board assembly 31 against the hole wall of the second mounting hole 221 by screwing.

[0139] For example, the second fixing plate 35 can include a second plate body 351 and a third protruding portion 352. The second plate body 351 is arranged in the second mounting hole 221 and fixed to the second housing 22. The third protruding portion 352 is arranged on the second plate body 351 and extends away from the inner wall of the second mounting hole 221 to abut against the circuit board assembly 31.

[0140] In the embodiment, the third protruding portion 352 is arranged to abut against the circuit board assembly 31, so that the third protruding portion 352 gives the circuit board assembly 31 more extrusion relative to the second plate body 351. The circuit board assembly 31 is extruded more tightly at the third protruding portion 352, so that during the process of dispensing / adhesive forming the second sealing glue 50, the uncured glue is difficult to flow between the circuit board assembly 31 and the third protruding portion 352, and the risk of glue leakage is reduced.

[0141] Exemplarily, the second mounting hole 221 can have a third inner wall 2211 and a fourth inner wall 2212 oppositely arranged, wherein the third inner wall 2211 is an inner wall of the second mounting hole 221 away from the first mounting hole 211, and the fourth inner wall 2212 is an inner wall of the second mounting hole 221 close to the first mounting hole 211. The second plate body 351 can have a second fixing surface 3511, and the circuit board assembly 31 is fixed between the second fixing surface 3511 and the third inner wall 2211. The second mounting hole 221 can have a second opening 2215, and the second sealant 50 is arranged at the second opening 2215 and seals the second fixing surface 3511 and the circuit board assembly 31. The third protrusion 352 is located on the side of the second fixing surface 3511 away from the second opening 2215, and the third protrusion 352 extends towards the third inner wall 2211 and abuts against the circuit board assembly 31.

[0142] In the embodiment, since the third protrusion 352 is arranged on the second plate body 351 and located on the side of the second fixing surface 3511 away from the second opening 2215, in the process of dispensing / gelatinizing the second sealant 50, the unhardened glue flowing through the second plate body 351 and the circuit board assembly 31 is blocked by the third protrusion 352, the flow path of the glue is blocked by the third protrusion 352, so as to reduce the probability of the glue leaking into the accommodation space 24, thereby improving the sealing performance of the second mounting hole 221, and after the glue is hardened to form the second sealant 50, the electronic device 100 has better waterproof performance at the second mounting hole 221, and the reliability of the electronic device 100 is improved.

[0143] In the embodiment, the third inner wall 2211 can have a second inclined surface 2213 inclined towards the direction away from the first mounting hole 211.

[0144] In the embodiment, the arrangement of the second inclined surface 2213 is beneficial to fixing the circuit board assembly 31 on the third inner wall 2211 by the second fixing plate 35, and the arrangement of the second inclined surface 2213 can increase the contact surface of the circuit board assembly 31 and the second fixing plate 35, thereby providing good support for the second fixing plate 35 to fix the circuit board assembly 31 by extrusion. In addition, the arrangement of the second inclined surface 2213 is also beneficial to slowing down the flowability of the glue towards the accommodation space 24 in the process of dispensing / gelatinizing the second sealant 50, and the risk of glue leakage is reduced.

[0145] Exemplarily, the second fixing plate 35 can further include a second fixing portion 353 connected to one side of the second plate body 351, and the second fixing portion 353 is fixed to the second housing 22. The second fixing portion 353 can be located on one side of the circuit board assembly 31, and the second sealant 50 is arranged at the connection between the second fixing portion 353 and the second housing 22 and seals the second fixing surface 3511 and the circuit board assembly 31.

[0146] In the embodiment, the connection between the second fixing part 353 and the second housing 22 can be regarded as a glue filling position. The second sealing glue 50 is formed by dispensing glue at the position, so as to seal the connection between the second fixing part 353 and the second housing 22, thereby improving the sealing performance at the second mounting hole 221. Due to the third protrusion 352, the uncured glue is prevented from flowing from the connection between the second fixing part 353 and the second housing 22 into the accommodation space 24, the risk of glue leakage is reduced, and the sealing effect of the connection between the second fixing part 353 and the second housing 22 is improved, thereby improving the sealing effect between the second fixing surface 3511 and the circuit board assembly 31.

[0147] Please refer to FIG. 11 , FIG. 12A and FIG. 12B , FIG. 12A is FIG. 11 the partial structure diagram of the second housing 22 at the second mounting hole 221 in the structure shown in FIG. 12B is FIG. 12A the partial structure diagram of installing the second positioning plate 39 in some embodiments.

[0148] In some embodiments, the third inner wall 2211 can be provided with a second groove 2214, and the opening of the second groove 2214 can be formed on the second inclined surface 2213. The through shaft assembly 30 can further include a second positioning plate 39, which can be installed in the second groove 2214, and the circuit board assembly 31 can be fixed to the second positioning plate 39.

[0149] In the embodiment, by providing the second groove 2214 on the third inner wall 2211 and fixing the circuit board assembly 31 by the second positioning plate 39 in the second groove 2214, the stability of the fixed installation of the circuit board assembly 31 at the second mounting hole 221 can be improved. The inner wall of the second groove 2214 can limit the second positioning plate 39, so as to avoid the movement of the second positioning plate 39, thereby avoiding the movement of the circuit board assembly 31, that is, the stability during the process of fixing the circuit board assembly 31 by the second fixing plate 35 can be ensured, and the stability of the circuit board assembly 31 at the second mounting hole 221 during the folding and unfolding process of the electronic device 100 can be improved, thereby improving the reliability of the electronic device 100.

[0150] For example, the through shaft assembly 30 can further include a third fixing glue 36, which bonds between the bottom wall of the second groove 2214 and the second positioning plate 39, so as to further improve the stability of the second positioning plate 39 in the second groove 2214, thereby further improving the installation stability of the circuit board assembly 31 at the second mounting hole 221.

[0151] The third fixing glue 36 can be back glue, which can improve the convenience of installing the third fixing glue 36, and also enables the third fixing glue 36 to have a certain elasticity, which is beneficial to the second fixing plate 35 to fix the circuit board assembly 31 at the second mounting hole 221 by extruding the circuit board assembly 31.

[0152] Please refer to FIG. 11 and FIG. 13 , FIG. 13 is FIG. 12B The structure shown in FIG. 1 is a partial structure diagram of the electronic device 100 in some embodiments.

[0153] In some embodiments, the through shaft assembly 30 can further include a fourth fixing glue 37, which can be attached between the second positioning plate 39 and the circuit board assembly 31, so that the circuit board assembly 31 can be fixed to the second positioning plate 39 at the second mounting hole 221.

[0154] The fourth fixing glue 37 can be back glue, which can improve the convenience of installing the fourth fixing glue 37, and also enables the fourth fixing glue 37 to have a certain elasticity, which is beneficial to the second fixing plate 35 to fix the circuit board assembly 31 at the second mounting hole 221 by extruding the circuit board assembly 31.

[0155] For example, the flexible circuit board 311 can include a third mounting portion 3112, and the heat dissipation plate 312 can include a fourth mounting portion 3124, both of which can be located at the second mounting hole 221. The circuit board assembly 31 can further include a third adhesive 315, which is attached between the third mounting portion 3112 and the fourth mounting portion 3124.

[0156] In this embodiment, the third mounting portion 3112 is the part of the flexible circuit board 311 located at the second mounting hole 221, and the fourth mounting portion 3124 is the part of the heat dissipation plate 312 located at the second mounting hole 221. By attaching the third mounting portion 3112 and the fourth mounting portion 3124 with the third adhesive 315, it is beneficial to improve the stability of the fixed installation of the circuit board assembly 31 at the second mounting hole 221, and to keep the deformation consistency of the flexible circuit board 311 and the heat dissipation plate 312 during the folding and unfolding of the electronic device 100.

[0157] The third adhesive 315 can be back glue, which can improve the convenience of installing the third adhesive 315, and also enables the third adhesive 315 to have a certain elasticity, which is beneficial to the second fixing plate 35 to fix the circuit board assembly 31 at the second mounting hole 221 by extruding the circuit board assembly 31.

[0158] Exemplarily, the third mounting portion 3112 can be disposed close to the first fixed plate 32 relative to the fourth mounting portion 3124, and the circuit board assembly 31 can further include a fourth adhesive 316, which can be attached between the fourth mounting portion 3124 and the second fixed plate 35.

[0159] In this embodiment, by arranging the fourth adhesive 316, the adhesion stability between the second fixed plate 35 and the circuit board assembly 31 can be improved, which is beneficial to stably fixing the circuit board assembly 31 at the second mounting hole 221 by the second fixed plate 35.

[0160] The fourth adhesive 316 can be a back adhesive, which can improve the convenience of mounting the fourth adhesive 316, and also enable the fourth adhesive 316 to have a certain elasticity, which is beneficial to fixing the circuit board assembly 31 at the second mounting hole 221 by the second fixed plate 35 through extruding the circuit board assembly 31.

[0161] Please refer to FIG. 10 , FIG. 11 , FIG. 13 , FIG. 14A and FIG. 14B , FIG. 14A is a structural schematic view of the second fixed plate 35 in some embodiments shown in the structure of FIG. 11 . FIG. 14B is a structural schematic view of the second fixed plate 35 from another perspective shown in FIG. 14A .

[0162] In some embodiments, the second fixed plate 35 can include a fourth protruding portion 354 protruding from the second plate body 351. The fourth protruding portion 354 and the third protruding portion 352 extend in different directions relative to the second plate body 351. The inner wall of the accommodation space 24 can include a second limiting wall 242 connected to the fourth inner wall 2212, and the fourth protruding portion 354 can abut against the second limiting wall 242.

[0163] In this embodiment, since the folding mechanism 23 needs to be arranged at the accommodation space 24, so that the first shell 21 and the second shell 22 have a larger cavity at the accommodation space 24, thereby the structural strength of the first shell 21 and the second shell 22 at the accommodation space 24 is weaker. The fourth protruding portion 354 on the second fixed plate 35 abuts against the second limiting wall 242, so that the second fixed plate 35 provides support for the second shell 22 at the second limiting wall 242 through the fourth protruding portion 354, thereby improving the structural strength of the second shell 22.

[0164] The periphery of the second plate body 351 can be provided with one or more second fixing portions 353, and the second plate body 351 can be fixedly installed to the second shell 22 through the second fixing portions 353.

[0165] The second fixing portion 353 can be located on the side of the second plate body 351 away from the fourth protruding portion 354, so that when the second fixing plate 35 is fixedly installed to the second shell 22, the second fixing portion 353 can be fixedly connected to the part of the second shell 22 located away from the first installation hole 211 on the side of the second installation hole 221, so as to avoid being connected to the part of the second shell 22 forming the accommodation space 24, and the part of the second shell 22 located away from the first installation hole 211 on the side of the second installation hole 221 is used as a support, and the fourth protruding portion 354 of the second fixing portion 353 provides structural strength support for the part of the second shell 22 located between the second installation hole 221 and the first installation hole 211.

[0166] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict, and any combination of the features in different embodiments is also within the protection scope of the present application, that is, the above-described multiple embodiments can also be combined as needed.

[0167] It should be noted that all the above-mentioned drawings are exemplary drawings of the present application, and do not represent the actual size of the product. The size ratio relationship between the components in the drawings is not limited to the actual product of the present application.

[0168] The above is only part of the embodiments and implementation manners of the present application, and the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical range disclosed in the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An electronic device (100), characterized in that, It includes a first housing (21), a second housing (22), a folding mechanism (23), a through-shaft assembly (30), a first sealant (40), and a second sealant (50). The folding mechanism (23) connects the first housing (21) and the second housing (22) and is used to unfold or fold the first housing (21) and the second housing (22) relative to each other. The first housing (21) has a first mounting hole (211), and the second housing (22) has a second mounting hole (221). The first mounting hole (211) and the second mounting hole (221) are located on both sides of the folding mechanism (23). One end of the through-shaft assembly (30) passes through the first mounting hole (211) and is fixed to the first housing (21). The other end of the through-shaft assembly (30) passes through the folding mechanism (23) and the second mounting hole (221) and is fixed to the second housing (22). The first sealant (40) seals the hole wall of the through-shaft assembly (30) and the first mounting hole (211), and the second sealant (50) seals the hole wall of the through-shaft assembly (30) and the second mounting hole (221). The through-shaft assembly (30) includes a circuit board assembly (31), a first fixing plate (32) and a second fixing plate (35). The first fixing plate (32) and the second fixing plate (35) are fixed to the circuit board assembly (31) at intervals. The first fixing plate (32) is fixed in the first mounting hole (211) and the second fixing plate (35) is fixed in the second mounting hole (221). The first fixing plate (32) includes a first plate body (321) and a first protrusion (322). The first plate body (321) is disposed in the first mounting hole (211) and fixed to the first housing (21). The first protrusion (322) protrudes from the first plate body (321) and extends toward the inner wall of the first mounting hole (211) away from the second mounting hole (221).

2. The electronic device (100) as claimed in claim 1, characterized in that, The first mounting hole (211) has a first inner wall (2111), which is the inner wall of the first mounting hole (211) away from the second mounting hole (221); The first fixing plate (32) further includes a first fixing part (323), which is connected to one side of the first plate body (321) and fixed to the first housing (21). The first fixing part (323) is located on one side of the circuit board assembly (31). The first plate body (321) has a first fixing surface (3211). The circuit board assembly (31) is fixed between the first fixing surface (3211) and the first inner wall (2111). The first sealant (40) is disposed at the connection between the first fixing part (323) and the first housing (21) and seals the first fixing surface (3211) and the circuit board assembly (31). The first mounting hole (211) has a first opening (2115), the first protrusion (322) is connected to the side of the first fixing surface (3211) away from the first opening (2115), and the first protrusion (322) is connected to the side of the first fixing part (323) near the circuit board assembly (31). The first protrusion (322) extends toward the first inner wall (2111) and abuts against the circuit board assembly (31).

3. The electronic device (100) as claimed in claim 1, characterized in that, The circuit board assembly (31) includes a flexible circuit board (311) and a heat sink (312), wherein the heat sink (312) is stacked on top of the flexible circuit board (311).

4. The electronic device (100) as claimed in claim 3, characterized in that, The flexible circuit board (311) includes a first mounting portion (3111), and the heat sink (312) includes a second mounting portion (3121). Both the first mounting portion (3111) and the second mounting portion (3121) are located in the first mounting hole (211). The circuit board assembly (31) further includes a first adhesive (313) which is bonded between the first mounting portion (3111) and the second mounting portion (3121).

5. The electronic device (100) as claimed in claim 4, characterized in that, The second mounting part (3121) is disposed close to the first fixing plate (32) relative to the first mounting part (3111); The circuit board assembly (31) further includes a second adhesive (314), which is bonded between the second mounting portion (3121) and the first fixing plate (32).

6. The electronic device (100) as claimed in claim 4 or 5, characterized in that, The heat sink (312) includes a graphite layer (3122) and a protective layer (3123), the protective layer (3123) being attached to the opposite surfaces of the graphite layer (3122).

7. The electronic device (100) as claimed in claim 6, characterized in that, The protective layer (3123) is a metal layer.

8. The electronic device (100) as claimed in any one of claims 1 to 5, characterized in that, The first mounting hole (211) has a first inner wall (2111), which is the inner wall of the first mounting hole (211) away from the second mounting hole (221), and the first inner wall (2111) is provided with a first groove (2114); The through-shaft assembly (30) further includes a first positioning plate (38), which is installed in the first groove (2114), and the circuit board assembly (31) is fixed to the first positioning plate (38).

9. The electronic device (100) as claimed in claim 8, characterized in that, The through-shaft assembly (30) also includes a first fixing adhesive (33), which is bonded between the bottom wall of the first groove (2114) and the first positioning plate (38).

10. The electronic device (100) as claimed in claim 8, characterized in that, The through-shaft assembly (30) also includes a second fixing adhesive (34), which is bonded between the first positioning plate (38) and the circuit board assembly (31).

11. The electronic device (100) as claimed in claim 8, characterized in that, The first inner wall (2111) has a first inclined surface (2113) that is inclined away from the second mounting hole (221), and the opening of the first groove (2114) is formed on the first inclined surface (2113).

12. The electronic device (100) as claimed in any one of claims 1 to 5, characterized in that, The first housing (21) and the second housing (22) enclose a receiving space (24), the receiving space (24) connects the first mounting hole (211) and the second mounting hole (221), and the receiving space (24) receives the folding mechanism (23); The first mounting hole (211) has a first inner wall (2111) and a second inner wall (2112) disposed opposite to each other. The first inner wall (2111) is the inner wall of the first mounting hole (211) away from the second mounting hole (221). The first protrusion (322) extends toward the first inner wall (2111). The first fixing plate (32) further includes a second protrusion (324), which protrudes from the first plate body (321) and extends toward the second inner wall (2112). The inner wall of the receiving space (24) includes a first limiting wall (241), which is connected to the second inner wall (2112). The second protrusion (324) abuts against the first limiting wall (241).

13. The electronic device (100) as claimed in claim 1, characterized in that, The second fixing plate (35) includes a second plate body (351) and a third protrusion (352). The second plate body (351) is disposed in the second mounting hole (221) and fixed to the second housing (22). The third protrusion (352) protrudes from the second plate body (351) and extends toward the circuit board assembly (31).

14. The electronic device (100) as claimed in claim 13, characterized in that, The second mounting hole (221) has a third inner wall (2211), which is the inner wall of the second mounting hole (221) away from the first mounting hole (211); The second fixing plate (35) further includes a second fixing part (353), which is connected to one side of the second plate body (351) and fixed to the second housing (22). The second fixing part (353) is located on one side of the circuit board assembly (31). The second plate body (351) has a second fixing surface (3511). The circuit board assembly (31) is fixed between the second fixing surface (3511) and the third inner wall (2211). The second sealant (50) is disposed at the connection between the second fixing part (353) and the second housing (22) and seals the second fixing surface (3511) and the circuit board assembly (31). The second mounting hole (221) has a second opening (2215), the third protrusion (352) is connected to the side of the second fixing surface (3511) away from the second opening (2215), and the third protrusion (352) is connected to the side of the second fixing part (353) near the circuit board assembly (31), the third protrusion (352) extends toward the third inner wall (2211) and abuts against the circuit board assembly (31).

15. The electronic device (100) as claimed in claim 13, characterized in that, The circuit board assembly (31) includes a flexible circuit board (311), a heat sink (312) and a third adhesive (315), wherein the heat sink (312) and the flexible circuit board (311) are stacked together. The flexible circuit board (311) includes a third mounting portion (3112), and the heat sink (312) includes a fourth mounting portion (3124). Both the third mounting portion (3112) and the fourth mounting portion (3124) are located in the second mounting hole (221), and the third adhesive (315) is bonded between the third mounting portion (3112) and the fourth mounting portion (3124).

16. The electronic device (100) as claimed in claim 15, characterized in that, The fourth mounting part (3124) is disposed close to the second fixing plate (35) relative to the third mounting part (3112); The circuit board assembly (31) further includes a fourth adhesive (316) which is bonded between the fourth mounting portion (3124) and the second fixing plate (35).

17. The electronic device (100) as claimed in any one of claims 13 to 16, characterized in that, The second mounting hole (221) has a third inner wall (2211), which is the inner wall of the second mounting hole (221) away from the first mounting hole (211), and the third inner wall (2211) is provided with a second groove (2214); The through-shaft assembly (30) further includes a second positioning plate (39), which is installed in the second groove (2214), and the circuit board assembly (31) is fixed to the second positioning plate (39).

18. The electronic device (100) as claimed in claim 17, characterized in that, The through-shaft assembly (30) also includes a third fixing adhesive (36), which is bonded between the bottom wall of the second groove (2214) and the second positioning plate (39).

19. The electronic device (100) as claimed in claim 17, characterized in that, The through-shaft assembly (30) also includes a fourth fixing adhesive (37), which is bonded between the second positioning plate (39) and the circuit board assembly (31).

20. The electronic device (100) as claimed in claim 17, characterized in that, The third inner wall (2211) has a second inclined surface (2213) that is inclined away from the first mounting hole (211), and the opening of the second groove (2214) is formed on the second inclined surface (2213).

21. The electronic device (100) as claimed in any one of claims 13 to 16, characterized in that, The first housing (21) and the second housing (22) enclose a receiving space (24), the receiving space (24) connects the first mounting hole (211) and the second mounting hole (221), and the receiving space (24) receives the folding mechanism (23); The second mounting hole (221) has a third inner wall (2211) and a fourth inner wall (2212) disposed opposite to each other. The third inner wall (2211) is the inner wall of the second mounting hole (221) away from the first mounting hole (211), and the third protrusion (352) extends toward the third inner wall (2211). The second fixing plate (35) further includes a fourth protrusion (354), which protrudes from the second plate body (351) and extends toward the fourth inner wall (2212). The inner wall of the receiving space (24) includes a second limiting wall (242), which is connected to the fourth inner wall (2212). The fourth protrusion (354) abuts against the second limiting wall (242).

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