Heating structure of planting device and planting device

Abstract

The utility model provides a heating structure of a planting device and the planting device, and belongs to the technical field of garden gardening equipment. The technical problem of how to uniformly heat plants is solved. According to the heating structure of the planting device and the planting device, the planting device comprises a bottom shell, a cover plate is fixedly or detachably connected to the bottom shell, planting holes are formed in the cover plate, the heating structure is characterized in that a substrate layer is arranged in or on the bottom shell, the heating structure comprises a heating layer, the heating layer covers the substrate layer, and the heating layer is arranged on the substrate layer. The bottom shell, the substrate layer, the heating layer and the cover plate are sequentially overlapped, at least one part of the substrate layer is located in the planting hole, and all or part of the heating layer is located on the periphery of the planting hole. The substrate layer is covered with the heating layer, so that the substrate layer can be heated, plants on the substrate layer can be uniformly heated, cold is avoided, and normal growth of the plants is protected.

Description

TECHNICAL FIELD

[0001] The utility model belongs to garden horticulture equipment technical field relates to a kind of heating structure of planting device. BACKGROUND

[0002] At present, the existing outdoor garden plants are easily caused to death by low temperature in cold, and then need to spend funds and manpower to re-supplement new plants by garden maintenance personnel, and when indoor temperature is low, plants grow slowly, or even die, although many families will open air conditioner to adjust indoor temperature, but indoor temperature is still significantly lower than the normal growth temperature of plants, and opening air conditioner consumes a large amount of electric energy, which causes resource waste and increases greening maintenance cost.

[0003] The patent with application number 202121634224.X discloses a heating planting system for heating plants at low temperature, which comprises a planting device having a plurality of mutually superimposed planting components, and a heat dissipation assembly, which at least includes a heat source component for guiding heat conducting medium and dissipating heat on the heat conducting medium to the planting components.

[0004] The heating system in the above document realizes heating for plants in the system by additionally increasing the heat dissipation assembly and delivering the heat source component to each plant, but still has deficiencies, the above heating system only delivers one heat source component to each plant, the delivery temperature is slow, and each plant on the planting device cannot be uniformly heated. SUMMARY

[0005] The utility model provides a kind of heating structure of planting device for the above problems existing in prior art, and the technical problems to be solved by the utility model are how to make plants be uniformly heated.

[0006] The purpose of the utility model can be realized by the following technical solutions:

[0007] A kind of heating structure of planting device, the planting device includes bottom shell, the bottom shell is fixed or detachably connected with cover plate, the cover plate is equipped with planting hole, it is characterized in that, substrate layer is equipped in or on the bottom shell, the heating structure includes heating layer, the heating layer is covered on substrate layer, the bottom shell, substrate layer, heating layer and cover plate are overlapped in sequence, at least a part of substrate layer is located in the planting hole, and the heating layer is all or part located in the periphery of the planting hole.

[0008] The working principle is as follows: the bottom shell is fixed or detachably connected with a cover plate, so that the two can be disassembled and assembled, the cover plate is provided with a planting hole, the planting hole enables the plants in the cover plate to grow outward, the bottom shell is provided with a substrate layer, the substrate layer is used for planting plants, and the heating layer can heat the substrate layer, so that the plants on the substrate layer are warmed, the heating layer covers the substrate layer, so that the plants on the substrate layer can be uniformly heated, the plants are protected from cold and grow normally, the bottom shell, the substrate layer, the heating layer and the cover plate are stacked in sequence, at least a part of the substrate layer is located in the planting hole, so that the plants on the substrate layer can grow, the heating layer is located outside the periphery of the planting hole, so that the heating layer can uniformly heat the periphery of the plants on the substrate layer, or the heating layer is partially located outside the periphery of the planting hole, so that the speed of temperature delivery is increased, the plants can be heated faster, the bottom shell, the substrate layer, the heating layer and the cover plate are stacked in sequence, so that the heat emitted by the heating layer can only be delivered upward and transmitted outward through the planting hole, thereby promoting the growth of the plants.

[0009] In the heating structure of the planting device, the heating layer comprises a heating wire and a heat-conducting layer fixedly connected or detachably connected with the heating wire, the bottom surface of the heat-conducting layer is attached to the substrate layer, the top surface of the heat-conducting layer is attached to the heating wire, and the heat-conducting layer is located outside the periphery of the planting hole in whole or in part.

[0010] The bottom surface of the heat-conducting layer is attached to the substrate layer, so that the heat on the heat-conducting layer can be transmitted to the substrate layer, the temperature can be delivered faster and uniformly heated, the top surface of the heat-conducting layer is attached to the heating wire, so that the temperature of the heating wire can be directly transmitted to the heat-conducting layer, the temperature can be delivered faster and uniformly heated, the heat-conducting layer is warmed by the heating wire, so that the substrate layer is heated by the heat-conducting layer, the heat-conducting layer has the function of heat conduction, so that the temperature on the heating wire can be uniformly distributed to the heat-conducting layer, the plants on the substrate layer are uniformly heated by the heat-conducting layer, so that the plants grow normally, the heat-conducting layer is located outside the periphery of the planting hole in whole or in part, so that the heat-conducting layer can uniformly heat the periphery of the plants on the substrate layer, or the heat-conducting layer is partially located outside the periphery of the planting hole, so that the speed of temperature delivery is increased, and the plants can be heated faster.

[0011] In the heating structure of the planting device, the area ratio of the heat-conducting layer covering the substrate layer is 45%-80%, and the heat-conducting layer is a heat-conducting film, a heat-conducting soft plate or a heat-conducting soft sheet capable of freely deforming.

[0012] The area ratio of the heat-conducting layer covering the matrix layer is 45%-80%. In this range, the heat-conducting layer can sufficiently and uniformly heat the matrix layer, so that the plants on the matrix layer can be heated, so that they are not cold and can grow well. The heat-conducting layer is a heat-conducting film, which can increase the efficiency of temperature transmission and make the plants heat faster and more uniformly. Or the heat-conducting layer is a heat-conducting soft plate, which has a long service life and high heat transfer efficiency. Or the heat-conducting layer is a heat-conducting soft sheet that can freely deform, which has stable heat-conducting performance and is easy to install.

[0013] In the heating structure of the planting device, the heat-conducting layer has a plurality of through holes one, which are arranged in a matrix or irregularly. The through holes one correspond to the positions of the planting holes. The part of the heat-conducting layer between the left and right adjacent through holes one forms a heat-conducting section one. The part of the heat-conducting layer between the upper and lower adjacent through holes one forms a heat-conducting section two. The heat-conducting section one and the heat-conducting section two are vertically distributed.

[0014] The heat-conducting layer has a plurality of through holes one corresponding to the planting holes. Each through hole one is arranged in a matrix or irregularly. The plants are located in the through holes one, which are heated uniformly and the temperature reaches the planting holes. The part between the left and right adjacent through holes one forms a heat-conducting section one. The part between the upper and lower adjacent through holes one forms a heat-conducting section two. The heat-conducting section one and the heat-conducting section two are vertically distributed, which can accelerate the temperature transmission of the heat-conducting section and heat the surrounding plants uniformly.

[0015] In the heating structure of the planting device, the heating wire includes a heating section one and a heating section two. The heat-conducting section one is attached to one heating section one or two parallel heating section ones or three parallel heating section ones. The heat-conducting section two is attached to one heating section two or two parallel heating section twos or three parallel heating section twos. The heating section one and the heating section two are vertically distributed.

[0016] The heat-conducting section one is attached to one heating section one. The heat-conducting section two is attached to two heating section twos, which accelerates the efficiency of temperature transmission and makes the plants heat faster. The heat-conducting section one is attached to two or three parallel heating section ones. The heat-conducting section two is attached to two or three parallel heating section twos. The two or three parallel heating section ones can heat the plants on the left and right sides of the heat-conducting section one, respectively. The two or three parallel heating section twos can heat the plants on the upper and lower sides of the heat-conducting section two, respectively. This can accelerate the temperature transmission and heat the surrounding plants uniformly. The heating section one and the heating section two are vertically distributed, which can accelerate the temperature transmission of the heating section one and the heating section two and heat the surrounding plants.

[0017] In the heating structure of the planting device, the heat-conducting layer is provided with a bonding layer on the surface, the bonding layer is located on the bottom surface of the heat-conducting layer, and the heat-conducting layer is stably connected to the substrate layer through the bonding layer, so that the substrate layer is heated.

[0018] The heat-conducting layer is provided with a bonding layer on the surface, the bonding layer is located on the bottom surface of the heat-conducting layer, and the heat-conducting layer is stably connected to the substrate layer through the bonding layer, so that the substrate layer is heated.

[0019] In the heating structure of the planting device, the substrate layer comprises a plurality of substrate blocks which are spliced and bonded to a plurality of heat-conducting sections one and a plurality of heat-conducting sections two.

[0020] The plurality of substrate blocks are spliced and bonded to the plurality of heat-conducting sections one and the plurality of heat-conducting sections two, so that the plants planted on the substrate blocks are uniformly heated and the temperature delivery efficiency is improved.

[0021] In the heating structure of the planting device, the substrate layer is provided with a through hole two which corresponds to the position of the planting hole.

[0022] The through hole two is located in the substrate layer and can place soil and plants therein, the heat-conducting layer uniformly heats the substrate layer around the through hole two, so that the plants in the through hole two are uniformly heated, and the through hole two corresponds to the planting hole, so that the internal plants can grow.

[0023] In the heating structure of the planting device, the substrate layer is provided with a through slot one, the heat-conducting layer is provided with a through slot two, the through slot one and the through slot two are in communication, the bottom shell is provided with a slot, the slot passes through the through slot one and the through slot two, the cover plate is provided with a plug, and the plug can be inserted into the slot.

[0024] The through slot one on the substrate layer and the through slot two on the heat-conducting layer are in communication, the bottom shell is provided with a slot, the slot can pass through the through slot one and the through slot two, so that the heat-conducting layer and the substrate layer are more stably connected, the plants on the substrate layer are better insulated, the cover plate is provided with a plug, and the plug can be inserted into the slot, so that the cover plate and the bottom shell are connected, and the two are stably connected and easy to disassemble.

[0025] In the heating structure of the planting device, the planting device comprises a planting cup, the cover plate is connected with the planting cup, the planting cup is inclined upward, the top of the planting cup is provided with an opening, and the opening corresponds to the planting hole.

[0026] The planting cup can place soil for planting plants and the planted plants, the planting cup is arranged in an upward inclination, so that the temperature inside is conveyed upward, the opening of the planting cup corresponds to the planting hole, so that the heat inside reaches the planting cup to heat the plants on the planting cup, and the temperature is conveyed upward through the opening.

[0027] In the heating structure of the planting device, the heat-conducting layer is made of aluminum foil, copper, silver, gold or galvanized, and the heating wire is attached to the heat-conducting layer by heat bonding, ultrasonic connection or adhesive bonding.

[0028] The heat-conducting layer is made of aluminum foil, which can make the heat-conducting layer have better heat conductivity, and the aluminum foil itself is relatively soft, so that the heat-conducting layer can adapt to various uneven surfaces; the heat-conducting layer is made of copper, which has good heat conductivity and is not easy to be oxidized and corroded, so that the service life of the heat-conducting layer is improved; the heat-conducting layer is made of silver, which has good heat conductivity and can quickly transfer heat; the heat-conducting layer is made of gold, which can uniformly heat the heat-conducting layer; the heat-conducting layer is made of galvanized, which can have good corrosion resistance to increase the service life of the heat-conducting layer.

[0029] In the heating structure of the planting device, the substrate layer is made of substrate soil, fiber soil, rock wool or carbon wool.

[0030] The substrate layer is made of substrate soil, which can have good water retention and aeration, and can promote the growth of plants on the substrate layer; the substrate layer is made of fiber soil, which can withstand a large pressure, so that the plants can be stably planted on the substrate layer; the substrate layer is made of rock wool, which has good heat preservation performance and can well preserve the temperature on the heat-conducting layer, so that the plants can grow in a good temperature.

[0031] Another purpose of the present application is to provide a planting device, which comprises any one of the above heating structures.

[0032] Compared with the prior art, the present application has the following advantages:

[0033] 1. The heating layer of the heating structure of the planting device covers the substrate layer, so that the substrate layer can be heated, and the plants on the substrate layer can be uniformly heated, avoiding cold and protecting the normal growth of the plants.

[0034] 2. In the heating structure of this planting device, the portion between two adjacent through holes on the left and right forms a heat-conducting section one, and the portion between two adjacent through holes on the top and bottom forms a heat-conducting section two. The heat-conducting sections one and two are distributed perpendicularly, which can accelerate the temperature transfer of the heat-conducting section and heat the surrounding plants evenly.

[0035] 3. The cross-shaped heating structure of this planting device can accelerate the temperature transfer of the heat-conducting section, so that the surrounding plants are heated evenly. Both heat-conducting section one and heat-conducting section two are in contact with the substrate layer, so that the plants on the substrate layer are heated evenly. Attached Figure Description

[0036] Figure 1 This is an exploded view of the heating structure of this planting device.

[0037] Figure 2 This is a schematic diagram of the heating structure of this planting device.

[0038] Figure 3 This is a partial structural diagram of the heating structure of this planting device.

[0039] Figure 4 This is a partial structural diagram of the heating structure of this planting device.

[0040] Figure 5 This is a schematic diagram of the structure of Embodiment 2.

[0041] Figure 6 This is a schematic diagram of the structure of Embodiment 2.

[0042] Figure 7 This is an exploded view from Example 2.

[0043] Figure 8 This is a structural view of Embodiment 2.

[0044] In the diagram: 1. Bottom shell; 2. Cover plate; 3. Planting hole; 4. Substrate layer; 5. Heating layer; 6. Heating wire; 7. Heat-conducting layer; 8. Through hole one; 9. Heat-conducting section one; 10. Heat-conducting section two; 11. Heating section one; 12. Heating section two; 13. Adhesive layer; 17. Substrate block; 18. Through hole two; 19. Through groove one; 20. Through groove two; 21. Slot; 22. Insert block; 23. Planting cup; 24. Opening. Detailed Implementation

[0045] The following are specific embodiments of the present invention, which are described in conjunction with the accompanying drawings. However, the present invention is not limited to these embodiments.

[0046] Example 1

[0047] like Figure 1and 2 As shown, a cover plate 2 is fixedly or detachably connected to the bottom shell 1. The cover plate 2 has planting holes 3. A substrate layer 4 is provided inside or on the bottom shell 1. The heating structure includes a heating layer 5, which covers the substrate layer 4. The bottom shell 1, substrate layer 4, heating layer 5, and cover plate 2 are stacked sequentially. At least a portion of the substrate layer 4 is located within the planting holes 3, and all or part of the heating layer 5 is located around the planting holes 3. The cover plate 2 is fixedly or detachably connected to the bottom shell 1 for easy assembly and disassembly. The planting holes 3 on the cover plate 2 allow plants located inside the cover plate 2 to grow outwards. The substrate layer 4 is provided inside or on the bottom shell 1 for planting plants. The substrate layer 4 is connected to the heating layer 5, which heats the substrate layer 4, raising the temperature of the plants on it. The heating layer 5 covers the substrate layer 4, ensuring that all parts of the substrate layer 4 are heated evenly, preventing them from getting cold and protecting their normal growth. The bottom shell 1, substrate layer 4, heating layer 5, and cover plate 2 are stacked in sequence. At least part of the substrate layer 4 is located inside the planting hole 3 to facilitate the growth of plants on the substrate layer 4. The heating layer 5 is entirely located around the planting hole 3 so that it can evenly heat the area around the plants on the substrate layer 4. Alternatively, part of the heating layer 5 is located around the planting hole 3, which increases the speed of temperature transmission and allows the plants to be heated more quickly. The stacking of the bottom shell 1, substrate layer 4, heating layer 5, and cover plate 2 ensures that the heat emitted by the heating layer 5 can only be transported upwards and transferred outwards through the planting hole 3, thereby promoting plant growth.

[0048] like Figure 3 and 4 As shown, the heating layer 5 includes a heating wire and a heat-conducting layer 7 that is fixedly or detachably connected to the heating wire. The bottom surface of the heat-conducting layer 7 is in contact with the matrix layer 4, and the top surface of the heat-conducting layer 7 is in contact with the heating wire. All or part of the heat-conducting layer 7 is located around the planting hole 3. The bottom surface of the heat-conducting layer 7 is in contact with the substrate layer 4, facilitating the transfer of heat from the heat-conducting layer 7 to the substrate layer 4, resulting in faster and more uniform temperature distribution. The top surface of the heat-conducting layer 7 is in contact with the heating wire, facilitating the direct transfer of temperature from the heating wire to the heat-conducting layer 7, resulting in faster and more uniform temperature distribution. The heating wire heats the heat-conducting layer 7, thereby heating the substrate layer 4. The heat-conducting layer 7 has a heat-conducting function, allowing the temperature from the heating wire to be evenly distributed on the heat-conducting layer 7. This ensures that the plants on the substrate layer 4 are evenly heated, promoting normal plant growth. The entire heat-conducting layer 7 is located around the planting hole 3, allowing it to evenly heat the area around the plants on the substrate layer 4. Alternatively, a portion of the heat-conducting layer 7 may be located around the planting hole 3, increasing the speed of temperature transfer and facilitating faster heating of the plants.

[0049] like Figure 3 and 4As shown in the drawings, the area ratio of the heat-conducting layer 7 covering on the substrate layer 4 is 45%-80%, the heat-conducting layer 7 is a heat-conducting film or a heat-conducting soft plate or a heat-conducting soft sheet capable of free deformation. The area ratio of the heat-conducting layer 7 covering on the substrate layer 4 is 45%-80%, in this range, the heat-conducting layer 7 can sufficiently and uniformly heat the substrate layer 4, so that the plants located on the substrate layer 4 can be heated, so that they are not cold and grow well. The heat-conducting layer 7 is a heat-conducting film, which can increase the efficiency of temperature transmission and make it heat uniformly faster. Or the heat-conducting layer 7 is a heat-conducting soft plate, which has a long service life and high heat transfer efficiency. Or the heat-conducting layer 7 is a heat-conducting soft sheet capable of free deformation, which has stable heat-conducting performance and the advantage of easy installation. The substrate layer 4 is made of substrate soil or fiber soil or rock wool or carbon wool. The substrate layer 4 is made of substrate soil, which can have good water retention and aeration, which can promote the growth of plants on the substrate layer 4; the substrate layer 4 is made of fiber soil, which can withstand a large pressure and facilitate the stable planting of plants on the substrate layer 4; the substrate layer 4 is made of rock wool, which has good heat preservation performance and can well preserve the temperature on the heat-conducting layer 7, so that the plants grow in a good temperature.

[0050] As shown in the drawings, Figure 3 and 4 The heat-conducting layer 7 has a plurality of through holes 8 corresponding to the planting holes, each through hole 8 is arranged in a matrix or irregularly, the heat-conducting layer 7 is located between the left and right adjacent two through holes 8 to form a heat-conducting section 9, and the heat-conducting layer 7 is located between the upper and lower adjacent two through holes 8 to form a heat-conducting section 10, and the heat-conducting section 9 and the heat-conducting section 10 are vertically distributed. The heat-conducting layer 7 has a plurality of through holes 8 corresponding to the planting holes, each through hole 8 is arranged in a matrix or irregularly, the plants are located in the through holes 8, which is convenient for the plants to be uniformly heated and the temperature to reach the planting holes, the heat-conducting layer 7 is located between the left and right adjacent two through holes 8 to form a heat-conducting section 9, and the heat-conducting layer 7 is located between the upper and lower adjacent two through holes 8 to form a heat-conducting section 10, and the heat-conducting section 9 and the heat-conducting section 10 are vertically distributed, which can accelerate the temperature transmission of the heat-conducting section and heat the surrounding plants uniformly.

[0051] As shown in the drawings, Figure 3 and 4As shown in the drawings, the heating wire 6 comprises heating section one 11 and heating section two 12, one heating section one 11 or two parallel heating section one 11 or three parallel heating section one 11 is attached to the heat conducting section one 9, one heating section two 12 or two parallel heating section two 12 or three parallel heating section two 12 is attached to the heat conducting section two 10, and the heating section one 11 and the heating section two 12 are vertically distributed. One heating section one 11 is attached to the heat conducting section one 9, and two heating section two 12 is attached to the heat conducting section two 10, which accelerates the efficiency of temperature delivery and enables the plants to be heated faster. Two or three parallel heating section one 11 is attached to the heat conducting section one 9, and two or three parallel heating section two 12 is attached to the heat conducting section two 10, which enables the plants on the left and right sides of the heat conducting section one 9 to be heated respectively by the two or three parallel heating section one 11, and the plants on the upper and lower sides of the heat conducting section two 10 to be heated respectively by the two or three parallel heating section two 12, which accelerates the delivery of temperature and enables the heating to be uniform. The heating section one 11 and the heating section two 12 are vertically distributed, which accelerates the temperature transmission of the heating section one 11 and the heating section two 12 and enables the surrounding plants to be heated.

[0052] As shown in the drawings, Figure 4 and 8 The heat conducting layer 7 has an adhesive layer 13, which is located on the bottom surface of the heat conducting layer 7 and is attached to the substrate layer 4. The heat conducting layer 7 has an adhesive layer 13, which is located on the bottom surface of the heat conducting layer 7 and enables the heat conducting layer 7 to be stably connected to the substrate layer 4, thereby facilitating the heating of the substrate layer 4. The adhesive layer 13 is located on the bottom surface, which facilitates the stable connection of the heat conducting layer 7. The heat conducting layer 7 is made of aluminum foil, copper, silver, gold, or galvanized zinc. The heating wire is attached to the heat conducting layer 7 by heat bonding, ultrasonic connection, or adhesive. The heat conducting layer 7 is made of aluminum foil, which enables the heat conducting layer 7 to have better heat conductivity and be flexible, thereby enabling the heat conducting layer 7 to adapt to various uneven surfaces. The heat conducting layer 7 is made of copper, which has good heat conductivity and is not easily oxidized or corroded, thereby increasing the service life of the heat conducting layer 7. The heat conducting layer 7 is made of silver, which has good heat conductivity and quickly transmits heat. The heat conducting layer 7 is made of gold, which enables the heat conducting layer 7 to be uniformly heated. The heat conducting layer 7 is made of galvanized zinc, which has good corrosion resistance and increases the service life of the heat conducting layer 7. The heating wire is attached to the heat conducting layer 7 by heat bonding, which enables the two to have good adhesion. The heating wire is connected to the heat conducting layer 7 by ultrasonic connection, which has fast connection speed and low cost. The heating wire is attached to the heat conducting layer 7 by adhesive, which makes the two more stable.

[0053] As shown in the drawings, Figure 8As shown in the figure, the substrate layer 4 includes a plurality of substrate blocks 17 spliced together, and the substrate blocks 17 are bonded with a plurality of heat-conducting sections one 9 and a plurality of heat-conducting sections two 10. The plurality of substrate blocks 17 are spliced together, and the substrate blocks 17 are bonded with the plurality of heat-conducting sections one 9 and the plurality of heat-conducting sections two 10, so that the plants planted on the substrate blocks 17 can be uniformly heated respectively, and the temperature delivery efficiency is accelerated.

[0054] As shown in the figure, Figure 7 and 8 As shown in the figure, the substrate layer 4 is provided with a through groove one 19, the heat-conducting layer 7 is provided with a through groove two 20, the through groove one 19 and the through groove two 20 are communicated, the bottom shell 1 is provided with an insertion slot 21, the insertion slot 21 passes through the through groove one 19 and the through groove two 20, and the cover plate 2 is provided with an insertion block 22 which can be inserted into the insertion slot 21. The through groove one 19 on the substrate layer 4 and the through groove two 20 on the heat-conducting layer 7 are communicated, the bottom shell 1 is provided with the insertion slot 21 which can pass through the through groove one 19 and the through groove two 20, so that the heat-conducting layer 7 and the substrate layer 4 are more stably connected, the plants on the substrate layer 4 are better insulated, the cover plate 2 is provided with the insertion block 22 which can be inserted into the insertion slot 21, so that the cover plate 2 and the bottom shell 1 are connected, and the two are stably connected and convenient to assemble and disassemble.

[0055] Embodiment two

[0056] The embodiment has the same content as embodiment 1, except that, as shown in the figure, Figure 5 the substrate layer 4 is provided with a through hole two 18 which corresponds to the position of the planting hole 3. The through hole two 18 is located in the substrate layer 4, and the soil for planting plants and the plants can be placed in the through hole two 18, the heat-conducting layer 7 can uniformly heat the substrate layer 4 around the through hole two 18, so that the plants in the through hole two 18 are uniformly heated, and the through hole two 18 corresponds to the planting hole 3, so that the internal plants can grow.

[0057] As shown in the figure, Figure 6 the cover plate 2 is connected with a planting cup 23 which is upwardly inclined, the top of the planting cup 23 is provided with an opening 24 which corresponds to the planting hole 3. The soil for planting plants and the plants can be placed on the planting cup 23, the planting cup 23 is upwardly inclined, so that the internal temperature is upwardly delivered, the opening 24 of the planting cup 23 corresponds to the planting hole 3, so that the internal heat enters the planting cup 23 to heat the plants on the planting cup 23, and the temperature is upwardly delivered through the opening 24.

[0058] Embodiment three

[0059] The embodiment has the same content as embodiment 1, except that a planting device is provided, and the planting device includes any heating structure in embodiment 1.

[0060] The specific embodiments described herein are merely illustrative of the spirit of the present application. Those skilled in the art of the present application can make various modifications or supplements to the described specific embodiments or replace them with similar ways, but will not deviate from the spirit of the present application or exceed the scope defined by the appended claims.

Claims

1. A heating structure of a planting device, the planting device comprising a bottom shell (1), a cover plate (2) is fixed or detachably connected on the bottom shell (1), and a planting hole (3) is formed in the cover plate (2), characterized in that, The bottom shell (1) is provided with a substrate layer (4) inside or on the top, the heating structure comprises a heating layer (5) covering on the substrate layer (4), the bottom shell (1), the substrate layer (4), the heating layer (5) and the cover plate (2) are stacked in sequence, at least part of the substrate layer (4) is located in the planting hole (3), and the heating layer (5) is located at the periphery of the planting hole (3) in whole or in part.

2. A heating structure for a planting device according to claim 1, wherein The heating layer (5) comprises a heating wire (6) and a heat-conducting layer (7) fixedly connected or detachably connected with the heating wire (6), the bottom surface of the heat-conducting layer (7) is attached to the substrate layer (4), the top surface of the heat-conducting layer (7) is attached to the heating wire (6), and the heat-conducting layer (7) is located at the periphery of the planting hole (3) in whole or in part.

3. A heating structure for a planting device according to claim 2, wherein The area ratio of the heat-conducting layer (7) covering on the substrate layer (4) is 45%-80%, the heat-conducting layer (7) is a heat-conducting film or a heat-conducting soft plate or a heat-conducting soft sheet capable of free deformation, and the substrate layer (4) is made of substrate soil or fiber soil or rock wool or carbon wool.

4. A heating structure for a planting device according to claim 3, wherein The heat-conducting layer (7) is made of aluminum foil or copper or silver or gold or galvanized, and the heating wire (6) is attached to the heat-conducting layer (7) through thermal bonding or ultrasonic bonding or through glue.

5. The heating structure of a planting device according to claim 2, wherein, The heat-conducting layer (7) has a plurality of through holes (8), each through hole (8) is arranged in a matrix or irregularly, the through holes (8) correspond to the positions of the planting holes (3), the part of the heat-conducting layer (7) between two adjacent through holes (8) forms a heat-conducting section (9), the part of the heat-conducting layer (7) between two adjacent through holes (8) forms a heat-conducting section (10), and the heat-conducting section (9) and the heat-conducting section (10) are vertically distributed.

6. A heating structure for a planting device according to claim 5, wherein The heating wire (6) comprises a heating section (11) and a heating section (12), one heating section (11) or two parallel heating sections (11) or three parallel heating sections (11) are attached to the heat-conducting section (9), one heating section (12) or two parallel heating sections (12) or three parallel heating sections (12) are attached to the heat-conducting section (10), and the heating section (11) and the heating section (12) are vertically distributed.

7. The heating structure of a planting device according to claim 2, wherein The heat-conducting layer (7) has an adhesive layer (13), the adhesive layer (13) is located on the bottom surface of the heat-conducting layer (7), and the adhesive layer (13) is attached to the substrate layer (4).

8. The heating structure of a planting device according to claim 5, wherein, The substrate layer (4) comprises a plurality of substrate blocks (17) spliced together, the substrate blocks (17) are attached to a plurality of heat-conducting sections (9) and a plurality of heat-conducting sections (10), the substrate layer (4) is provided with a through groove (19), the heat-conducting layer (7) is provided with a through groove (20), the through groove (19) and the through groove (20) are communicated, the bottom shell (1) is provided with an insertion slot (21) penetrating through the through groove (19) and the through groove (20), and the cover plate (2) is provided with an insertion block (22) capable of being inserted into the insertion slot (21).

9. The heating structure of a planting device according to claim 1, wherein The substrate layer (4) is provided with a through hole two (18), the through hole two (18) corresponds to the position of the planting hole (3), the planting device includes a planting cup (23), the cover plate (2) is connected with the planting cup (23), the planting cup (23) is inclined upward, the top of the planting cup (23) is provided with an opening (24), the opening (24) corresponds to the planting hole (3).

10. A planting device characterized by The planting device comprises the heating structure according to any one of claims 1-9.

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