Laser grinding machine

Abstract

The laser grinding machine comprises a body, a grinding assembly is arranged in the body, the grinding assembly comprises a portal frame, the portal frame is fixed to a base, one side of the top of the portal frame is provided with a Z-axis module, the Z-axis module comprises a side plate, the side plate is provided with a galvanometer module and a baffle, and the galvanometer module and the baffle are arranged on the base. A through hole is formed in the middle of the baffle, the moving part is fixed to the base through a middle part, an objective table is arranged at the position, away from the base, of the moving part, the objective table is used for containing a workpiece to be machined, and light emitted by the galvanometer module penetrates through the through hole of the baffle to fall on the surface of the workpiece to be machined. And the galvanometer module is used as a machining head, so that the machining precision of a workpiece made of a diamond material is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser processing, in particular to a laser grinding machine for processing diamond material workpieces. BACKGROUND

[0002] Traditional plane processing technology is mostly milling or grinding using tools with higher hardness relative to the workpiece being processed. Recently, there have been some surface ablation using lasers, but the processing efficiency is not high for diamond material workpieces.

[0003] Therefore, there is a need for a new laser grinding machine. CONTENT OF THE INVENTION

[0004] To overcome the above-mentioned shortcomings, the purpose of the present application is to provide a new laser grinding machine which improves efficiency, reduces manual participation and processing cost when in operation.

[0005] In order to achieve the above purpose, the present application adopts the following technical solutions:

[0006] A laser grinding machine comprises:

[0007] a body, wherein a grinding assembly is arranged in the body,

[0008] the grinding assembly comprises:

[0009] a gantry fixed on a base, wherein a Z-axis module is arranged on one side of the top of the gantry, the Z-axis module comprises a side plate, a galvanometer module and a baffle plate are mounted on the side plate, and a through hole is arranged in the middle of the baffle plate,

[0010] a moving part fixed on the base through an intermediate part, wherein a worktable is arranged on the moving part away from the base, and the worktable is used for placing a workpiece to be processed,

[0011] the light emitted by the galvanometer module falls on the surface of the workpiece to be processed through the through hole of the baffle plate. The galvanometer module is used as a processing head to improve the processing precision of the workpiece made of diamond material.

[0012] In an embodiment, a fixing part is arranged on the worktable, and the fixing part accommodates the workpiece to be processed. Preferably, a rotating part comprising a driving motor is further included, and an output end of the driving motor is connected to the worktable, and the worktable is used for placing the workpiece to be processed.

[0013] In an embodiment, the workpiece is a diamond compact, and in an embodiment, the gantry is a U-shaped gantry.

[0014] In an embodiment, the Z-axis module further comprises a driving part, and the driving part comprises a driving motor fixed on one side of the top of the gantry through an intermediate part,

[0015] The output end of the driving motor is connected with a screw rod, a thread is arranged on the screw rod, and a shaft sleeve is arranged on the screw rod and fixed to the side plate,

[0016] The side of the side plate, on which the shaft sleeve is arranged, is provided with a sliding block, the sliding block is slidably mounted on a guide rail, the screw rod is driven to rotate based on the driving of the driving motor, and the side plate is driven to move based on the rotation of the screw rod.

[0017] In an embodiment, the moving part includes a laminated X displacement module and a Y displacement module, the rotating part is fixed to the X displacement module or the Y displacement module, a linear motor is arranged in each of the X displacement module and the Y displacement module, and each linear motor is electrically connected with the control module.

[0018] The control module drives the moving part to move in the x / y direction.

[0019] In an embodiment, the laser grinding machine is provided with a sensor for sensing light and / or sound generated by the light beam at the cutting point.

[0020] In an embodiment, the sensor is mounted on the side plate.

[0021] In an embodiment, the baffle is fixed to the side plate by a connecting piece, or the baffle is fixed to the gantry by a connecting piece, or the baffle is fixed to the column of the gantry by a connecting piece.

[0022] In an embodiment, the side plate further includes a measuring mechanism for scanning the surface height of the workpiece based on an instruction and feeding back scanning information to the control module, or the measuring mechanism includes an optical range finder for measuring the processing size.

[0023] Advantages:

[0024] The laser grinding machine provided in the application improves the cutting head, adopts the combination of a galvanometer module and a baffle, and uses the baffle to block the particulate matter generated during processing, thereby improving the economy of processing. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the application, and for those skilled in the art, other drawings can also be obtained without creative labor based on these drawings, wherein:

[0026] Figure 1 FIG. 1 is a structural schematic view of a grinding assembly of a laser grinding machine according to an embodiment of the application;

[0027] Figure 2 for Figure 1 A schematic diagram of the grinding assembly in the embodiment from one perspective;

[0028] Figure 3 This is a schematic diagram of the grinding assembly of a laser grinding machine according to another embodiment of this application;

[0029] Figure 4 This is a schematic diagram of the fabrication of the galvanometer module according to an embodiment of this application. Detailed Implementation

[0030] The above-described solution will be further illustrated below with reference to specific embodiments. It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of this application. The implementation conditions used in the embodiments may be further adjusted according to the conditions of specific manufacturers, and the implementation conditions not specified are generally those in routine experiments.

[0031] This application discloses a laser grinding machine, including a grinding assembly comprising: a gantry frame fixed to a base; a Z-axis module disposed on one side of the top of the gantry frame; the Z-axis module including a side plate; a galvanometer module and a baffle mounted on the side plate; a moving component fixed to the base via an intermediate component; a rotating component disposed on the moving component; the rotating component being connected to a stage for placing a workpiece to be processed; and light emitted from the galvanometer module passing through perforations in the baffle and falling onto the surface of the workpiece. Using the galvanometer module as a processing head / working head, it can be used for grinding diamond surfaces and can improve the processing accuracy of diamond workpieces.

[0032] Next, we will combine the appendix Figures 1-4 The present application describes in detail the grinding assembly of the embodiment, which is used in a laser grinding machine to grind (surface treat) workpieces such as diamond.

[0033] A laser polishing machine, comprising: a body,

[0034] The body contains a grinding assembly 100, which includes a gantry frame 110 fixed to a base 120.

[0035] The moving component 130 is fixed to the base 120 via an intermediate component 133. The moving component 130 includes stacked X-displacement modules 131 and Y-displacement modules 132, each containing a linear motor electrically connected to a control module (not shown). Driven by the control module, the stage moves to the target position in the X / Y directions.

[0036] The moving part 130 is provided with a worktable, which is fixed to the moving part 130 through the middle base 140. Preferably, the moving part 130 is provided with a rotating part 150, which includes a driving motor (such as a DD motor), and the output end 151 of the driving motor has a worktable, on which a workpiece to be processed is placed. The workpiece is a diamond compact (PCD). The rotating part 150 is electrically connected to a control module (not shown in the figure) and rotates based on the control of the control module. The rotating part 150 is fixed to the X displacement module 131, and in other embodiments, the rotating part 150 can be fixed to the Y displacement module 132. Preferably, the worktable is provided with a fixing part (such as a jaw), which accommodates the workpiece to be processed.

[0037] One side of the top of the gantry 110 is provided with a Z-axis module, which includes a driving part 160, and the driving part 160 includes a driving motor 161, which is fixed to one side of the top of the U-shaped gantry 110 through the intermediate piece 111.

[0038] The driving motor 161 is fixed to a base 162, which is fixed to the intermediate piece 111, and the base 162 is provided with two parallel guide rails 162. The output end of the driving motor 121 is connected to a lead screw 164, which is provided with a thread 164a. The lead screw 164 is provided with a shaft sleeve (not shown in the figure), which is fixed to a side plate 170. The same side of the side plate 170, on which the shaft sleeve is provided, is provided with a sliding block 171, which is slidably mounted on the guide rail 162. Based on the driving of the driving motor 161, the lead screw is rotated, and the rotation of the lead screw drives the side plate 170 to move (i.e., to move in the Z direction).

[0039] The side plate 170 is provided with a galvanometer module 180, and the output end (light emitting end) 181 of the galvanometer module 180 emits light 182, which passes through the focal point of the perforation 191 of the baffle 190 and falls on the surface of the workpiece 200 (such as a diamond material) to be processed, so as to ablate the surface of the workpiece. The baffle 190 is fixed to the side plate through the connecting piece 192. In an embodiment, the baffle 190 is fixed to the gantry 110 (such as the upright column 112 of the gantry 110) through the connecting piece. The diameter of the perforation is between 5mm and 2cm, which ensures that the light is emitted while the particulate matter generated during the processing process floats and falls on the light emitting end of the galvanometer, affecting the light emitting efficiency.

[0040] During grinding, the workpiece 200 is placed on the worktable, the rotating part 150 is rotated based on the control of the control module to drive the workpiece 200 to rotate, and based on the driving of the driving motor 161, the galvanometer module 180 moves in the Z direction and combines the movement of the X displacement module 131 and the Y displacement module 132 to achieve the grinding of a certain thickness of the surface of the workpiece.

[0041] The laser grinding machine is also provided with a control module electrically connected with the moving part 140, the driving part 120 and the laser, which controls the operation of the laser grinding machine.

[0042] In an embodiment, the side plate 130 is also provided with a measuring mechanism for measuring the processing size. Preferably, the measuring mechanism comprises an optical distance meter, which scans the surface height of the workpiece based on the instruction and feeds back the scanning information to the control module. Preferably, the optical distance meter comprises a 0.1 micron grating ruler.

[0043] An embodiment of the present application provides a laser grinding machine, which comprises the grinding assembly as described above.

[0044] In an embodiment, the laser grinding machine is provided with a sensor for sensing the light and / or sound generated by the light beam at the cutting point. Preferably, the sensor is installed on the side plate.

[0045] In the present application, the terms "upper", "lower", "inner", "middle" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are mainly used for better describing the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0046] The above embodiments are only for illustrating the technical concept and characteristics of the present application, and the purpose is to enable those skilled in the art to understand the content of the present application and implement it, and cannot limit the protection scope of the present application. Any equivalent transformation or modification made in the spirit and essence of the present application should be covered within the protection scope of the present application.

Claims

1. A laser lapping machine characterized by, Comprising: a body, a grinding assembly is arranged in the body, the grinding assembly comprises: a gantry is fixed on a base, one side of the top of the gantry is provided with a Z-axis module, the Z-axis module comprises a side plate, a galvanometer module and a baffle are installed on the side plate, a through hole is arranged in the middle of the baffle, a moving part is fixed on the base through an intermediate piece, a worktable is arranged on the moving part away from the base, and the worktable is used for placing a workpiece to be processed, the light emitted by the galvanometer module passes through the through hole of the baffle and falls on the surface of the workpiece to be processed.

2. The laser grinding machine of claim 1, wherein the baffle is fixed on the side plate through a connecting piece, or the baffle is fixed on the gantry through a connecting piece, or the gantry is fixed on the column.

3. The laser grinding machine of claim 2, wherein the diameter of the through hole is between 5mm and 2cm.

4. The laser grinding machine of claim 1, wherein the workpiece to be processed is a diamond compact.

5. The laser grinding machine of claim 1, wherein the gantry is a U-shaped gantry.

6. The laser grinding machine of claim 1, wherein the Z-axis module further comprises a driving part, the driving part comprises a driving motor, and the driving motor is fixed on the top of the gantry through an intermediate piece, an output end of the driving motor is connected with a lead screw, a thread is arranged on the lead screw, a shaft sleeve is arranged on the lead screw, and the shaft sleeve is fixed on the side plate, a sliding block is arranged on the same side of the side plate as the shaft sleeve, the sliding block is slidably installed on a guide rail, the lead screw is driven to rotate based on the driving of the driving motor, and the side plate is driven to move based on the rotation of the lead screw.

7. The laser grinding machine of claim 1, wherein the moving part comprises a stacked X-displacement module and a Y-displacement module, a rotating part is fixed on the X-displacement module or the Y-displacement module, a linear motor is arranged in each of the X-displacement module and the Y-displacement module, and the linear motors are electrically connected with a control module, the worktable moves in the x / y direction based on the driving of the control module.

8. The laser grinding machine of claim 1, wherein the laser grinding machine has a sensor for sensing light and / or sound generated by the light beam at the cutting point.

9. The laser grinding machine of claim 8, wherein the sensor is installed on the side plate.

10. The laser grinding machine of claim 1, wherein the side plate further comprises a measuring mechanism for scanning the surface height of the workpiece based on instructions and feeding back scanning information to the control module, or the measuring mechanism comprises an optical range finder for measuring the processing size.

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