Circuit board polishing device

Abstract

The utility model discloses a circuit board polishing device which comprises a rack, and the rack is sequentially provided with a feeding mechanism, a polishing mechanism and a cleaning mechanism. The feeding mechanism comprises a plurality of conveying rollers, and the conveying rollers are rotationally connected to the rack; the grinding mechanism comprises a grinding roller and a positioning assembly, the grinding roller is rotationally connected to the rack and used for grinding the circuit board, the positioning assembly comprises a driving part and two positioning plates, and the driving part is used for driving the two positioning plates to get close to each other; the cleaning mechanism comprises a cleaning box and a dust suction box, the cleaning box is provided with a water spraying pipe and an air knife, the water spraying pipe is used for spraying water to the circuit board, the air knife is used for blowing air to the circuit board, the dust suction box is provided with an air pump and an air collecting pipe, the two ends of the air collecting pipe are communicated with the dust suction box and the air pump respectively, and the air pump is used for sucking air to the dust suction box. According to the circuit board polishing device, the position deviation of the circuit board can be reduced, dust can be prevented from adhering to the circuit board, and the polishing quality of the circuit board is improved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing technology, and in particular to a circuit board polishing device. Background Technology

[0002] Before applying green solder mask to a circuit board, it is usually necessary to polish the circuit board to increase its roughness and make it easier for the solder mask to adhere to the board. Existing circuit board polishing equipment mainly uses polishing rollers to polish the circuit board. However, the position of the circuit board is prone to shift, which affects the polishing quality. Moreover, the dust generated during the polishing process tends to adhere to the surface of the circuit board, which not only affects subsequent processing but may also damage the performance of the circuit board. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a circuit board polishing device that can reduce the positional displacement of the circuit board and prevent dust from adhering to the circuit board, thereby improving the polishing quality of the circuit board.

[0004] According to a first aspect of the present invention, a circuit board polishing device includes a frame, wherein a feeding mechanism, a polishing mechanism, and a cleaning mechanism are sequentially arranged on the frame; the feeding mechanism includes multiple conveying rollers, which are rotatably connected to the frame, and the multiple conveying rollers are arranged parallel and spaced apart on the frame to convey circuit boards; the polishing mechanism includes a polishing roller and a positioning assembly, wherein the polishing roller is rotatably connected to the frame and arranged above the conveying rollers, and the polishing roller is used to polish the circuit board; the positioning assembly includes a driving component and two positioning plates. The positioning plates are arranged on both sides of the frame. The driving component is used to drive the two positioning plates to move closer to each other so that the positioning plates can abut against the circuit board. The cleaning mechanism includes a cleaning box and a dust collection box, which are arranged sequentially on the frame. The cleaning box is equipped with a water spray pipe and an air knife. The water spray pipe is used to spray water onto the circuit board, and the air knife is used to blow air onto the circuit board. The dust collection box is equipped with an air pump and an air collection pipe. The two ends of the air collection pipe are respectively connected to the dust collection box and the air pump. The air pump is used to draw air into the dust collection box.

[0005] The circuit board polishing device according to the embodiments of this utility model has at least the following beneficial effects: multiple conveying rollers are rotatably connected to the frame, and the multiple conveying rollers are arranged parallel and spaced on the frame. The circuit board is placed on the conveying rollers so that the multiple conveying rollers cooperate to drive the circuit board to pass through the polishing mechanism and the cleaning mechanism in sequence; two positioning plates are arranged on both sides of the frame, and the two positioning plates are driven to move closer to each other by a driving component so that the two positioning plates can abut against the circuit board, thereby positioning the circuit board in the axial direction of the conveying rollers, avoiding the circuit board from shifting during the conveying process, improving the positioning accuracy of the circuit board, and then polishing... The grinding roller polishes the surface of the circuit board to increase its roughness. Then, the circuit board enters the cleaning chamber, which is equipped with a water spray pipe and an air knife. Water is sprayed onto the circuit board through the water spray pipe to wet and wash away the dust. Then, the air knife blows air onto the circuit board to clean it. Finally, the circuit board enters the dust collection chamber. The two ends of the air collection pipe are connected to the dust collection chamber and the air pump, respectively. The air pump and the air collection pipe work together to suck up the dust in the dust collection chamber, preventing dust from adhering to the surface of the circuit board and improving the cleanliness of the circuit board.

[0006] According to some embodiments of the present invention, the cleaning box is further provided with a heating element, which is used to heat the circuit board.

[0007] According to some embodiments of this utility model, the number of gas collecting pipes is set to two, both of which are connected to the air pump, and the two gas collecting pipes are respectively arranged on both sides of the circuit board.

[0008] According to some embodiments of the present invention, the end of the gas collecting pipe away from the gas pump is connected to a gas guide cover, and the gas guide cover is arranged adjacent to the circuit board.

[0009] According to some embodiments of the present invention, the feeding mechanism further includes a conveyor belt and a rotating rod. The conveyor belt is arranged on the frame, and the rotating rod is rotatably connected to the frame. The conveyor belt and the rotating rod are arranged adjacent to each other. The rotating rod is fixedly connected to a feeding hook. The conveyor belt is used to drive the circuit board into the feeding hook, and the feeding hook is used to support the circuit board to transport the circuit board onto the conveyor roller.

[0010] According to some embodiments of the present invention, the feeding mechanism further includes a baffle, which is slidably connected to the frame. The frame is rotatably connected to a first adjusting rod, which is threadedly connected to the baffle so that the baffle can move up and down on the frame. The distance between the baffle and the conveying roller is matched with the thickness of the circuit board.

[0011] According to some embodiments of the present invention, the grinding mechanism further includes a connecting frame, the grinding roller is rotatably connected to the connecting frame, the frame is provided with a sliding groove in the vertical direction, the connecting frame is slidably connected in the sliding groove, the frame is rotatably connected to a second adjusting rod, the second adjusting rod is arranged in the vertical direction, and the second adjusting rod is threadedly connected to the connecting frame.

[0012] According to some embodiments of the present invention, the distance between the two positioning plates gradually decreases along the conveying direction of the conveying roller.

[0013] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0014] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0015] Figure 1 This is a schematic diagram of a circuit board polishing device according to an embodiment of the present utility model;

[0016] Figure 2 for Figure 1 A magnified view of part A;

[0017] Figure 3 This is a cross-sectional view of the polishing mechanism of the circuit board polishing device according to an embodiment of the present utility model;

[0018] Figure 4 This is a schematic diagram of the polishing mechanism of the circuit board polishing device according to an embodiment of the present utility model;

[0019] Figure 5 This is a schematic diagram of the cleaning box of the circuit board polishing device according to an embodiment of the present utility model;

[0020] Figure 6 This is a schematic diagram of the dust collection box of the circuit board polishing device according to an embodiment of the present invention.

[0021] Figure label:

[0022] Frame 100, slide 110;

[0023] Feeding mechanism 200, conveying roller 210, rotating rod 220, feeding hook 221, baffle 230, first adjusting rod 231;

[0024] Grinding mechanism 300, grinding roller 310, positioning component 320, driving component 321, positioning plate 322, connecting frame 330, second adjusting rod 331;

[0025] Cleaning mechanism 400, cleaning box 410, water spray pipe 411, air knife 412, heating element 413, dust collection box 420, air pump 421, air collection pipe 422, air guide cover 423. Detailed Implementation

[0026] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0027] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0028] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0029] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0030] Understandably, referring to Figures 1 to 6The circuit board polishing device of this utility model includes a frame 100, on which a feeding mechanism 200, a polishing mechanism 300, and a cleaning mechanism 400 are sequentially arranged. The feeding mechanism 200 includes multiple conveying rollers 210, which are rotatably connected to the frame 100 and are arranged in parallel and spaced on the frame 100 to convey circuit boards. The polishing mechanism 300 includes a polishing roller 310 and a positioning assembly 320. The polishing roller 310 is rotatably connected to the frame 100 and is arranged above the conveying rollers 210. The polishing roller 310 is used to polish the circuit board. The positioning assembly 320 includes a driving component 321 and two positioning plates 322. Positioning plates 322 are arranged on both sides of the frame 100. The driving component 321 is used to drive the two positioning plates 322 to move closer to each other so that the positioning plates 322 can abut against the circuit board. The cleaning mechanism 400 includes a cleaning box 410 and a dust collection box 420. The cleaning box 410 and the dust collection box 420 are arranged sequentially on the frame 100. The cleaning box 410 is equipped with a water spray pipe 411 and an air knife 412. The water spray pipe 411 is used to spray water onto the circuit board, and the air knife 412 is used to blow air onto the circuit board. The dust collection box 420 is equipped with an air pump 421 and an air collection pipe 422. The two ends of the air collection pipe 422 are connected to the dust collection box 420 and the air pump 421, respectively. The air pump 421 is used to draw air into the dust collection box 420.

[0031] Multiple conveyor rollers 210 are rotatably connected to the frame 100. These rollers are arranged parallel and spaced apart on the frame 100. Circuit boards are placed on the conveyor rollers 210 so that the rollers cooperate to drive the circuit boards sequentially through the grinding mechanism 300 and the cleaning mechanism 400. Two positioning plates 322 are arranged on both sides of the frame 100. A driving component 321 drives the two positioning plates 322 closer together so that they abut against the circuit board, thereby positioning the circuit board axially on the conveyor rollers 210. This prevents the circuit board from shifting during transport and improves its positional accuracy. Then, the surface of the circuit board is ground by the grinding rollers 310 to increase its roughness. This allows the green solder mask to adhere to the circuit board. The circuit board then enters the cleaning chamber 410, which is equipped with a water spray pipe 411 and an air knife 412. Water is sprayed onto the circuit board through the water spray pipe 411 to wet the dust and wash it away. The air knife 412 blows air onto the circuit board to clean it. Finally, the circuit board enters the dust collection chamber 420. One end of the air collection pipe 422 is connected to the air pump 421, and the other end is connected to the dust collection chamber 420. The air pump 421 and the air collection pipe 422 work together to remove dust from the dust collection chamber 420, keeping the circuit board surface clean and improving its cleanliness.

[0032] It should be noted that multiple conveyor rollers 210 are arranged in parallel at intervals on the frame 100 so that the multiple conveyor rollers 210 can work together to drive the circuit board to pass through the grinding mechanism 300 and the cleaning mechanism 400 in sequence. The multiple conveyor rollers 210 can be driven directly by a motor, or they can be driven by gear transmission, belt transmission, etc., which is not limited here.

[0033] The driving component 321 can be two linear cylinders, electric actuators, linear slide modules, etc., so that the driving component 321 can drive the two positioning plates 322 to move closer to each other, thereby improving the positional accuracy of the circuit board. No limitation is made here.

[0034] In addition, the grinding roller 310 can be driven directly by a motor, or by gear transmission, belt transmission, etc., which is not limited here. The number of grinding rollers 310 can be set to multiple, and the multiple grinding rollers 310 are arranged in parallel intervals in the horizontal direction to improve the grinding efficiency of the circuit board.

[0035] Understandably, referring to Figure 1 and Figure 5 The cleaning chamber 410 is also equipped with a heating element 413, which is used to heat the circuit board. The heating element 413 is located inside the cleaning chamber 410. By setting the heating element 413, the temperature of the cleaning chamber 410 can be increased, which can heat the circuit board, thereby accelerating the drying of the circuit board, reducing the moisture residue on the surface of the circuit board, and thus preventing dust from sticking to the circuit board and improving the cleanliness of the circuit board.

[0036] Understandably, referring to Figure 1 and Figure 6 Two air collection pipes 422 are provided, both of which are connected to the suction pump 421. The two air collection pipes 422 are respectively arranged on both sides of the circuit board. The two air collection pipes 422 are respectively arranged on both sides of the circuit board, and both ends of the two air collection pipes 422 are connected to the suction pump 421. The suction pump 421 draws air into the air collection pipes 422 so that the air collection pipes 422 can suck up the dust in the dust collection box 420, thereby facilitating the removal of dust adhering to the circuit board and automatically cleaning the dust adhering to the surface of the circuit board, improving the cleanliness of the circuit board.

[0037] It should be noted that the two air collection pipes 422 are respectively arranged above and below the conveying roller 210. The air collection pipes 422 can suck up the dust on the surface of the circuit board to automatically clean the circuit board and improve the cleaning efficiency of the circuit board.

[0038] Specifically, refer to Figure 1 and Figure 6An air guide shroud 423 is connected to the end of the air collecting pipe 422 away from the air pump 421. The air guide shroud 423 is arranged adjacent to the circuit board. The air guide shroud 423 is connected to the end of the air collecting pipe 422 away from the air pump 421. By setting the air guide shroud 423, the suction force generated by the air collecting pipe 422 can be closer to the circuit board, thereby making it easier for the air collecting pipe 422 to pick up the dust adhering to the surface of the circuit board, facilitating the cleaning of the circuit board and improving the cleanliness of the circuit board.

[0039] Understandably, referring to Figure 1 The feeding mechanism 200 also includes a conveyor belt and a rotating rod 220. The conveyor belt is arranged on the frame 100, and the rotating rod 220 is rotatably connected to the frame 100. The conveyor belt and the rotating rod 220 are arranged adjacent to each other. The rotating rod 220 is fixedly connected to a feeding hook 221. The conveyor belt is used to drive the circuit board to fall into the feeding hook 221. The feeding hook 221 is used to support the circuit board and transport the circuit board to the conveyor roller 210. The rotating rod 220 is rotatably connected to the frame 100, and the feeding hook 221 is fixedly connected to the rotating rod 220. The circuit board is arranged on the conveyor belt, and the conveyor belt drives the circuit board to move towards the feeding hook 221 so that the circuit board can fall into the feeding hook 221. The rotating rod 220 drives the feeding hook 221 to rotate so that the feeding hook 221 can hook the circuit board. Then the feeding hook 221 drives the circuit board to flip and make the circuit board abut against the conveyor roller 210, thereby realizing automatic feeding of circuit boards without the need for workers to manually handle the circuit boards and improving the polishing efficiency of the circuit boards.

[0040] It should be noted that the circuit boards are stacked vertically on the conveyor belt. The conveyor belt can drive the circuit boards to fall into the feeding hook 221, so that the feeding hook 221 can be driven to rotate by the rotating rod 220, so that the feeding hook 221 can hook the circuit board and place it on the conveyor roller 210, realizing automatic feeding of circuit boards, reducing labor intensity and improving grinding efficiency.

[0041] The thickness of the feeding hook 221 is matched with the thickness of the circuit board, so that the feeding hook 221 can transport one circuit board at a time, avoiding multiple circuit boards being stacked in the feeding hook 221 at the same time, realizing the one-by-one delivery of circuit boards and improving delivery stability.

[0042] Specifically, refer to Figure 1 , Figure 3 and Figure 4The feeding mechanism 200 also includes a baffle 230, which is slidably connected to the frame 100. The frame 100 is rotatably connected to a first adjusting rod 231, which is threadedly connected to the baffle 230 so that the baffle 230 can move up and down on the frame 100. The distance between the baffle 230 and the conveying roller 210 matches the thickness of the circuit board. The baffle 230 is slidably connected to the frame 100, and the frame 100 is rotatably connected to the first adjusting rod 231. By setting the first adjusting rod 231 and the baffle 230 to be threadedly connected, the baffle 230 can move along the axial direction of the first adjusting rod 231 when the first adjusting rod 231 is rotated. This allows the baffle 230 to move up and down on the frame 100 to adjust the distance between the baffle 230 and the conveying roller 210. The distance between the baffle 230 and the conveying roller 210 can match the thickness of the circuit board, thereby improving the stability of circuit board feeding, realizing the feeding of circuit boards one by one, and avoiding multiple circuit boards sticking together.

[0043] It should be noted that the distance between the baffle 230 and the conveying roller 210 can be easily adjusted by the first adjusting rod 231, which can accommodate circuit boards of different thicknesses, prevent multiple circuit boards from piling up at the same time and entering the grinding mechanism 300, and improve the grinding quality of the circuit boards.

[0044] Understandably, referring to Figure 1 and Figure 2 The grinding mechanism 300 also includes a connecting frame 330, a grinding roller 310 rotatably connected to the connecting frame 330, a slide groove 110 opened in the vertical direction on the frame 100, the connecting frame 330 slidably connected in the slide groove 110, and a second adjusting rod 331 rotatably connected to the frame 100. The second adjusting rod 331 is arranged in the vertical direction and is threadedly connected to the connecting frame 330. The grinding roller 310 is rotatably connected to the connecting frame 330, and the connecting frame 330 is slidably connected to the slide groove 110. The second adjusting rod 331 is rotatably connected to the frame 100, and the second adjusting rod 331 and the connecting frame 330 are threadedly connected. By driving the second adjusting rod 331 to rotate, the connecting frame 330 can move along the axial direction of the second adjusting rod 331, so that the connecting frame 330 can move up and down in the slide groove 110. This allows for convenient adjustment of the distance between the grinding roller 310 and the conveying roller 210, which can adapt to circuit boards of different thicknesses, expand the application range of the circuit board grinding device, and improve reliability.

[0045] It should be noted that the frame 100 and the connecting frame 330 can be connected by guide rails and sliders, or by guide posts and sliders, so that the connecting frame 330 can slide smoothly on the frame 100. These will not be elaborated on here.

[0046] Understandably, referring to Figure 3 and Figure 4The distance between the two positioning plates 322 gradually decreases along the conveying direction of the conveying roller 210. By setting the distance between the two positioning plates 322 to gradually decrease along the conveying direction of the conveying roller 210, the circuit board can abut against the positioning plates 322, and the circuit board can be positioned between the two positioning plates 322, reducing the positional offset of the circuit board, making the position of the circuit board accurate, and improving the polishing quality of the circuit board.

[0047] It should be noted that the shape of the positioning plate 322 can be trapezoidal or triangular, and the two positioning plates 322 are symmetrically arranged on the frame 100 so that when the conveyor roller 210 drives the circuit board to abut against the positioning plate 322, the circuit board can gradually align between the two positioning plates 322, thereby automatically adjusting the position of the circuit board, improving the positional accuracy of the circuit board, and improving the polishing quality of the circuit board.

[0048] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A circuit board polishing device, characterized in that, include: The frame is provided with a feeding mechanism, a grinding mechanism and a cleaning mechanism in sequence. The feeding mechanism includes multiple conveying rollers, which are rotatably connected to the frame. The multiple conveying rollers are arranged in parallel and spaced apart on the frame to convey circuit boards. The grinding mechanism includes a grinding roller and a positioning assembly. The grinding roller is rotatably connected to the frame and is arranged above the conveying roller. The grinding roller is used to grind the circuit board. The positioning assembly includes a driving component and two positioning plates. The two positioning plates are arranged on both sides of the frame. The driving component is used to drive the two positioning plates to move closer to each other so that the positioning plates can abut against the circuit board. The cleaning mechanism includes a cleaning box and a dust collection box, which are arranged sequentially on the frame. The cleaning box is equipped with a water spray pipe and an air knife. The water spray pipe is used to spray water onto the circuit board, and the air knife is used to blow air onto the circuit board. The dust collection box is equipped with an air pump and an air collection pipe. The two ends of the air collection pipe are connected to the dust collection box and the air pump, respectively. The air pump is used to draw air into the dust collection box.

2. The circuit board polishing device according to claim 1, characterized in that, The cleaning chamber is also equipped with a heating element, which is used to heat the circuit board.

3. The circuit board polishing device according to claim 1, characterized in that, The number of gas collection pipes is set to two, and both gas collection pipes are connected to the air pump. The two gas collection pipes are respectively arranged on both sides of the circuit board.

4. The circuit board polishing apparatus according to claim 3, characterized in that, The end of the gas collection pipe away from the gas pump is connected to a gas guide cover, and the gas guide cover is arranged adjacent to the circuit board.

5. The circuit board polishing apparatus according to claim 1, characterized in that, The feeding mechanism also includes a conveyor belt and a rotating rod. The conveyor belt is arranged on the frame, and the rotating rod is rotatably connected to the frame. The conveyor belt and the rotating rod are arranged adjacent to each other. The rotating rod is fixedly connected to a feeding hook. The conveyor belt is used to drive the circuit board into the feeding hook, and the feeding hook is used to support the circuit board to transport the circuit board onto the conveyor roller.

6. The circuit board polishing apparatus according to claim 5, characterized in that, The feeding mechanism also includes a baffle, which is slidably connected to the frame. The frame is rotatably connected to a first adjusting rod, which is threadedly connected to the baffle so that the baffle can move up and down on the frame. The distance between the baffle and the conveying roller is matched with the thickness of the circuit board.

7. The circuit board polishing apparatus according to claim 1, characterized in that, The grinding mechanism also includes a connecting frame, the grinding roller is rotatably connected to the connecting frame, the frame is provided with a sliding groove in the vertical direction, the connecting frame is slidably connected in the sliding groove, the frame is rotatably connected to a second adjusting rod, the second adjusting rod is arranged in the vertical direction, and the second adjusting rod is threadedly connected to the connecting frame.

8. The circuit board polishing apparatus according to claim 1, characterized in that, The distance between the two positioning plates gradually decreases along the conveying direction of the conveying roller.

Images