Double-shaft swing type copper polishing machine
By designing a dual-axis swing-type copper polishing machine, and utilizing a dressing ring and a dual-axis linkage structure, the problems of poor polishing effect and low efficiency of existing polishing devices have been solved, achieving a highly efficient and precise mirror polishing effect.
Patent Information
- Application Number
- CN202422743510.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-11
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2034-11-11
AI Technical Summary
The existing polishing equipment does not have dual-axis linkage, so it cannot achieve oscillating polishing, resulting in poor polishing effect. In addition, the lack of dual polishing components leads to low polishing efficiency. Furthermore, it is difficult to correct the flatness of the copper polishing plate during the polishing process, which affects the polishing accuracy.
A dual-axis oscillating copper polishing machine was designed, comprising a working platform, a copper polishing disc, a feeding assembly, a copper polishing assembly, and a trimming ring. The copper polishing disc is cut by setting a grooving mechanism, and the flatness of the copper polishing disc is corrected by the trimming ring during the polishing process. At the same time, the horizontal and vertical movement of the suction cup is realized, thereby achieving dual-axis oscillating polishing.
It improves polishing effect and precision, enhances polishing efficiency, ensures the flatness of the copper polishing disc, and achieves efficient mirror polishing.
Smart Images
Figure CN223572894U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to wafer polishing technical field more specifically, relate to a double -shaft swing formula copper polishing machine. BACKGROUND
[0002] The manufacturing procedure of silicon wafer includes: single crystal growth procedure, the single crystal growth procedure is used for manufacturing single crystal ingot, slicing procedure, the slicing procedure obtains thin disc -shaped wafer by slicing single crystal ingot, edge grinding procedure, the edge grinding procedure is used for machining the outer peripheral portion of wafer to prevent the wafer obtained by the slicing procedure from cracking and deforming, fine grinding procedure, the fine grinding procedure is used to remove the damage remaining on wafer due to machining, polishing procedure, the polishing procedure is used for mirror polishing wafer, the existing polishing device does not set up double -shaft linkage, cannot realize swing formula polishing, and the polishing effect is poor, and does not set up double -sleeve polishing assembly, causes the low polishing efficiency, in addition, does not set up the trimming ring in the polishing process, is difficult to correct the flatness of copper polishing disc, influences the polishing accuracy. SUMMARY
[0003] In order to solve the at least one technical problem, the utility model provides a double -shaft swing formula copper polishing machine.
[0004] The utility model discloses a double -shaft swing formula copper polishing machine, including: work platform and the copper polishing disc of setting at work platform top,
[0005] The top of the work platform is provided with a first feeding assembly and a second feeding assembly, and the first feeding assembly and the second feeding assembly are used for feeding and transporting the ceramic disc.
[0006] The top of the work platform is provided with an X sliding module, and the X sliding module is provided with a first copper polishing assembly and a second copper polishing assembly side by side.
[0007] The first copper polishing assembly and the second copper polishing assembly are used for adsorbing the ceramic disc to move to the top of the copper polishing disc, and the top of the copper polishing disc is provided with a trimming ring between the two ceramic discs.
[0008] One side of the work platform is provided with a slotting mechanism, one end of the slotting mechanism is provided with a cutter, and the cutter is located at the top of the copper polishing disc.
[0009] In a preferred embodiment of the utility model, the first feeding assembly and the second feeding assembly are symmetrically arranged on both sides of the copper polishing disc.
[0010] In a preferred embodiment of the utility model, the first feeding assembly includes a first Y sliding module fixedly installed on the work platform, and a first sliding block is connected to the first Y sliding module.
[0011] In a preferred embodiment of the utility model, the second feeding assembly comprises a second Y sliding module, the second Y sliding module is arranged on the top of the work platform, a second sliding block is connected with the second Y sliding module in a matched mode, jigs are arranged on one side of the first sliding block and the second sliding block, and the ceramic disc is placed on the jigs.
[0012] In a preferred embodiment of the utility model, the first copper polishing assembly comprises a first Z sliding module connected with one side of the X sliding module in a matched mode, a first pressing module is arranged on one side of the first Z sliding module, a first rotating mechanism is arranged on the bottom of the first pressing module, a first pressing motor is arranged on the top of the first Z sliding module, and the first pressing motor is used for controlling the first pressing module to move along the Z direction.
[0013] In a preferred embodiment of the utility model, the second copper polishing assembly comprises a second Z sliding module connected with one side of the X sliding module in a matched mode, a second pressing module is arranged on one side of the second Z sliding module, a second rotating mechanism is arranged on the bottom of the second pressing module, a second pressing motor is arranged on the top of the second Z sliding module, the second pressing motor is used for controlling the second pressing module to move along the Z direction, and a horizontal sliding motor is arranged on one end of the X sliding module, and the horizontal sliding motor is used for controlling the first Z sliding module and the second Z sliding module to slide synchronously or individually.
[0014] In a preferred embodiment of the utility model, the first rotating mechanism and the second rotating mechanism are both provided with suction cups on the bottom, a gas source mechanism is arranged on one side of the work platform, and the gas source mechanism is used for controlling the suction force of the suction cups on the ceramic disc.
[0015] In a preferred embodiment of the utility model, a plurality of wafers are arranged on the ceramic disc, and the plurality of wafers are distributed in a circumferential direction.
[0016] In a preferred embodiment of the utility model, an electric control box is arranged on one side of the work platform, a rotatable connecting frame is arranged on the top of the electric control box, and an operation screen is connected with one end of the connecting frame.
[0017] In a preferred embodiment of the utility model, a supporting leg is arranged on the bottom of the work platform.
[0018] Compared with the prior art, the above technical scheme of the utility model has the following advantages:
[0019] The application cuts the polishing groove on the copper polishing disc through the slotting mechanism, guarantees the polishing function of the copper polishing disc, corrects the flatness of the surface of the copper polishing disc through the correction ring arranged on the copper polishing disc during polishing, improves the polishing precision, and realizes the horizontal and vertical movement of the suction disc through the parallel first and second pressing mechanisms, realizes the double-shaft swing polishing, and improves the polishing effect. BRIEF DESCRIPTION OF DRAWINGS
[0020] In order to more clearly illustrate the above-mentioned purposes, features and advantages of the present application, the following will further describe the present application in combination with specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.
[0021] Figure 1 is a front view of the double-shaft swing type copper polishing machine of the present application;
[0022] Figure 2 is a side view of the double-shaft swing type copper polishing machine of the present application;
[0023] Figure 3 is a top view of the double-shaft swing type copper polishing machine of the present application;
[0024] Figure 4 is a schematic view of the internal structure of the double-shaft swing type copper polishing machine of the present application.
[0025] In the figure: 1, housing, 2, protection door, 3, air source mechanism, 4, working platform, 5, supporting leg, 6, operation screen, 7, connecting frame, 8, slotting mechanism, 9, first copper polishing assembly, 901, first Z sliding module, 902, first pressing module, 903, first rotating mechanism, 904, first pressing motor; 10, second copper polishing assembly, 1001, second Z sliding module, 1002, second pressing motor, 1003, second pressing module, 1004, second rotating mechanism; 11, electric control box, 12, X sliding module, 13, copper polishing disc, 14, ceramic disc, 15, first sliding block, 16, first Y sliding module, 17, suction disc, 18, jig, 19, second sliding block, 20, second Y sliding module. DETAILED DESCRIPTION
[0026] In order to more clearly illustrate the above-mentioned purposes, features and advantages of the present application, the following will further describe the present application in combination with specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.
[0027] Many specific details are set forth in the following description in order to provide a thorough understanding of the present application. However, the present application can be practiced according to other embodiments that are not specifically described herein, and the present application is not limited to the specific embodiments described herein.
[0028] Embodiment one
[0029] Referring to Figures 1-4 The utility model provides a double -shaft swing formula copper polishing machine, include: work platform 4 and set up in work platform 4 top copper polishing disc 13, workbench top is provided with the casing 1, the one side of casing 1 is provided with the protective door 2;
[0030] Work platform 4 top is provided with first feeding assembly and second feeding assembly, and the first feeding assembly and the second feeding assembly are used for feeding and transporting the ceramic disc 14.
[0031] Work platform 4 top is provided with X sliding module 12, and the X sliding module 12 is provided with the first copper polishing assembly 9 and the second copper polishing assembly 10 side by side.
[0032] The first copper polishing assembly 9 and the second copper polishing assembly 10 are used for adsorbing the ceramic disc 14 (with wafer) to move to the top of the copper polishing disc 13, and the copper polishing disc 13 is provided with a trimming ring on the top and between the two ceramic discs 14.
[0033] Work platform 4 side is provided with slotting mechanism 8, and the slotting mechanism 8 one end is provided with cutter, and the cutter is located on the top of copper polishing disc 13.
[0034] According to the utility model embodiments, the first feeding assembly and the second feeding assembly are symmetrically arranged on the two sides of the copper polishing disc 13.
[0035] According to the utility model embodiments, the first feeding assembly comprises a first Y sliding module 16 fixedly installed on the work platform 4, and the first Y sliding module 16 is connected with a first sliding block 15 in a matching mode.
[0036] According to the utility model embodiments, the second feeding assembly comprises a second Y sliding module 20, and the second Y sliding module 20 is arranged on the top of the work platform 4, and the second Y sliding module 20 is connected with a second sliding block 19 in a matching mode, and the first sliding block 15 and the second sliding block 19 are provided with a jig 18 on one side, and the ceramic disc 14 is placed on the jig 18.
[0037] According to the embodiment of the utility model, first copper throw component 9 including cooperation connection in X slide module 12 one side's first Z slide module 901, first Z slide module 901 one side is provided with first lower pressure module 902, first lower pressure module 902 bottom is provided with first rotating mechanism 903, first Z slide module 901 top is provided with first lower pressure motor 904, and first lower pressure motor 904 is used for controlling first lower pressure module 902 moves along Z direction.
[0038] According to the embodiment of the utility model, second copper throw component 10 including cooperation connection in X slide module 12 one side's second Z slide module 1001, second Z slide module 1001 one side is provided with second lower pressure module 1003, second lower pressure module 1003 bottom is provided with second rotating mechanism 1004, second Z slide module 1001 top is provided with second lower pressure motor 1002, and second lower pressure motor 1002 is used for controlling second lower pressure module moves along Z direction, and X slide module 12 one end is provided with horizontal slide motor, and horizontal slide motor is used for controlling first Z slide module 901 and second Z slide module 1001 synchronous or independently slide.
[0039] According to the embodiment of the utility model, first rotating mechanism 903 and second rotating mechanism 1004 bottom are all provided with sucking disc 17, and one side of work platform 4 is provided with gas source mechanism 3, and gas source mechanism 3 is used for controlling the adsorption force of sucking disc 17 to ceramic disc 14.
[0040] According to the embodiment of the utility model, ceramic disc 14 is provided with a plurality of wafers, and the plurality of wafers are evenly distributed along the circumference.
[0041] According to the embodiment of the utility model, one side of work platform 4 is provided with electric control box 11, and the top of electric control box 11 is provided with rotatable connecting frame 7, and one end of connecting frame 7 is connected with operation screen 6.
[0042] According to the embodiment of the utility model, the bottom of work platform 4 is provided with supporting leg 5.
[0043] In summary, the application is cut to the polishing groove on the copper polishing disc 13 by setting the slotting mechanism 8, to ensure that the copper polishing disc 13 has polishing function, in addition, in the polishing process, the flatness of the surface of the copper polishing disc 13 is corrected by the trimming ring arranged on the copper polishing disc 13, the polishing precision is improved, by setting the first lower pressure mechanism and the second lower pressure mechanism side by side, the horizontal movement of the sucking disc 17 can be realized while the vertical movement is realized, the double-shaft swing polishing is realized, and the polishing effect is improved.
[0044] The technical features of the above embodiments can be combined arbitrarily, and to make the description concise, not all possible combinations of the technical features in the above embodiments are described, however, as long as the combinations of the technical features do not exist contradictory, it should be considered that it is within the scope of the present application.
[0045] The above description of disclosed embodiments enables one of ordinary skill in the art to make or use the application. Various modifications to the above described embodiments will be readily apparent to those of ordinary skill in the art, and the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
[0046] The above description is merely illustrative of the application and is not intended to limit the scope of the application that is defined by the appended claims.
Claims
1. A twin-axle swing-type copper polishing machine comprising: A work platform and a copper polishing disc arranged on the top of the work platform, characterized in that The top of the work platform is provided with a first feeding assembly and a second feeding assembly, and the first feeding assembly and the second feeding assembly are used for feeding and transporting ceramic plates. The top of the work platform is provided with an X sliding module, and one side of the X sliding module is provided with a first copper polishing assembly and a second copper polishing assembly. The first copper polishing assembly and the second copper polishing assembly are used for adsorbing ceramic plates and moving the ceramic plates to the top of the copper polishing disc, and a trimming ring is arranged on the top of the copper polishing disc and between the two ceramic plates. One end of the slotting mechanism is provided with a cutter, and the cutter is located on the top of the copper polishing disc.
2. The dual-axis oscillating copper polishing machine of claim 1, wherein, The first feeding assembly and the second feeding assembly are symmetrically arranged on both sides of the copper polishing disc.
3. The dual-axis oscillating copper polishing machine of claim 2, wherein, The first feeding assembly comprises a first Y sliding module fixedly installed on the work platform, and a first sliding block is connected to the first Y sliding module.
4. The dual-axis swing-type copper polishing machine according to claim 3, wherein The second feeding assembly comprises a second Y sliding module arranged on the top of the work platform, and a second sliding block is connected to the second Y sliding module, and jigs are arranged on one side of the first sliding block and the second sliding block, and the ceramic plate is placed on the jigs.
5. The dual-axis oscillating copper polishing machine of claim 1, wherein, The first copper polishing assembly comprises a first Z sliding module connected to one side of the X sliding module, and a first pressing module is arranged on one side of the first Z sliding module, a first rotating mechanism is arranged on the bottom of the first pressing module, a first pressing motor is arranged on the top of the first Z sliding module, and the first pressing motor is used to control the first pressing module to move in the Z direction.
6. A twin-axial swing-type copper polishing machine according to claim 5, wherein The second copper polishing assembly comprises a second Z sliding module connected to one side of the X sliding module, and a second pressing module is arranged on one side of the second Z sliding module, a second rotating mechanism is arranged on the bottom of the second pressing module, a second pressing motor is arranged on the top of the second Z sliding module, and the second pressing motor is used to control the second pressing module to move in the Z direction, and a horizontal sliding motor is arranged at one end of the X sliding module, and the horizontal sliding motor is used to control the first Z sliding module and the second Z sliding module to slide synchronously or individually.
7. A twin-axle swing-type copper polishing machine according to claim 6, wherein The bottom of the first rotating mechanism and the second rotating mechanism is provided with a suction cup, and the side of the work platform is provided with an air source mechanism, and the air source mechanism is used to control the adsorption force of the suction cup on the ceramic plate.
8. The dual-axis swing-type copper polishing machine according to claim 1, wherein The ceramic plate is provided with a plurality of wafers, and the plurality of wafers are evenly distributed in the circumferential direction.
9. The dual-axis oscillating copper polishing machine of claim 1, wherein, The side of the work platform is provided with an electric control box, the top of the electric control box is provided with a rotatable connecting frame, and one end of the connecting frame is connected with an operation screen.
10. The double-shaft swing copper polishing machine of claim 1, characterized in that The bottom of the work platform is provided with a supporting leg.