Injection mold for processing plastic shell of electronic component

Abstract

The utility model discloses an injection mold for processing a plastic shell of an electronic component, which comprises a base, a lower mold is fixed at the upper end of the base, an upper mold is mounted at the upper end of the lower mold in a matched manner, a filter plate is mounted on the left side of the base, a baffle is mounted in the base, a fan is mounted on the baffle, and a fan is mounted on the fan. The interior of the base is divided into a first cavity and a second cavity through a baffle, the first cavity is located on the left side of the second cavity, and a refrigerator is installed in the first cavity. A first introducing assembly is installed between the right end of the second cavity and the lower die and used for introducing cold air into the lower die, and a guide pipe is installed in the base in an up-down sliding mode. According to the injection mold for machining the plastic shell of the electronic component, cooling of the plastic shell is achieved through the first electromagnetic valve and the second electromagnetic valve, the forming speed is increased, and automatic mold stripping of the plastic shell is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to injection mold technical field, concretely is a kind of electronic component plastic shell processing is used injection mold. BACKGROUND

[0002] Some industrial instruments usually need to be assembled by plastic shell to the internal electronic components, and the plastic shell of the electronic components is generally made by injection molding, and an excessive amount of plastic raw materials is often injected in the injection molding process to ensure the integrity of the injection molded part. However, the overflow problem may occur during the injection molding process, which increases the difficulty of demolding and requires trimming of the excess material after demolding, which is time-consuming and labor-intensive, and reduces the production efficiency.

[0003] In the patent application with the name of "an injection mold for processing electronic component plastic shell" and the authorization publication number CN220903960U and the authorization publication date of May 7, 2024, the upper mold and the lower mold are cooperated with each other by the driving system during the processing process, the guide shaft is inserted into the guide slot, the upper mold and the lower mold are mutually docked, and then the material is injected from the injection channel. After the material enters the injection cavity, the material is formed by the molding effect of the mold core. However, in the actual use process of the above device, the molding of the plastic product is accelerated, and an external cooling device is usually required for cooling. The cooling means needs to be improved, and it is not convenient to automatically demold after injection molding.

[0004] Therefore, we propose an injection mold for processing electronic component plastic shell to solve the problems mentioned above. UTILITY MODEL CONTENTS

[0005] 1. The technical problem to be solved by the utility model is:

[0006] The utility model aims to provide an injection mold for processing electronic component plastic shell to solve the problems in the above background technology.

[0007] 2. Technical solution:

[0008] To achieve the above purpose, the utility model provides the following technical scheme: an injection mold for processing electronic component plastic shell, comprising a base, the upper end of the base is fixed with a lower mold, the upper end of the lower mold is cooperatively installed with an upper mold, the left side of the base is installed with a filter plate, the inside of the base is installed with a baffle, and a fan is installed on the baffle, the inside of the base is divided into a first cavity and a second cavity by the baffle, the first cavity is located on the left side of the second cavity, and a refrigerator is installed in the inside of the first cavity.

[0009] The right end of the second cavity is installed between the lower die and a passing-in assembly one, the passing-in assembly one is used for passing cold air into the inside of the lower die, and the upper end of the second cavity is installed with a passing-in assembly two, and the upper end of the passing-in assembly two is provided with a guide pipe, the guide pipe is slidably installed in the inside of the base in an up-down mode, the upper end of the guide pipe is fixed with a movable plate, the upper end of the movable plate is fixed with a top rod, and the top rod is used for jacking up the plastic shell of the formed electronic component.

[0010] Further, the passing-in assembly one comprises a dispersion cavity fixedly installed on the right side inner wall of the second cavity, the right end of the dispersion cavity is installed in communication with a plurality of passing-in pipes, the left end of the dispersion cavity is installed in communication with a first outflow pipe, the first outflow pipe is installed with a first electromagnetic valve, and the upper end of the passing-in pipe is in communication with the heat dissipation cavity in the inside of the lower die.

[0011] Through the above technical scheme, when the first electromagnetic valve is opened, the gas can enter the passing-in pipe through the first outflow pipe.

[0012] Further, the passing-in pipe is provided with a third outflow pipe in one-to-one correspondence, the upper end of the third outflow pipe is in communication with the heat dissipation cavity in the inside of the lower die, and the lower end of the third outflow pipe is located on the left side of the filter plate.

[0013] Through the above technical scheme, the gas after heat exchange can be guided.

[0014] Further, the passing-in assembly two comprises a second outflow pipe in communication with the inside of the second cavity, and the second cavity is installed with a second electromagnetic valve.

[0015] Through the above technical scheme, when the second electromagnetic valve is opened, the gas can enter the second outflow pipe.

[0016] Further, the second outflow pipe is sleeved on the outside of the guide pipe, and the guide pipe is rectangularly arranged.

[0017] Through the above technical scheme, the guide pipe can move up and down after being stressed.

[0018] Further, the upper end of the movable plate is installed with a guide rod, and the guide rod is slidably installed in the inside of the lower die in an up-down mode.

[0019] Through the above technical scheme, under the action of the guide rod, the up-down movement stability of the movable plate can be improved.

[0020] 3. Beneficial effects:

[0021] Compared with the prior art, the injection mold for processing the plastic shell of electronic components and devices has the advantages that the first electromagnetic valve and the second electromagnetic valve are used to realize the cooling of the plastic shell, the forming speed is improved, and the plastic shell is automatically ejected, and the specific content is as follows.

[0022] After the pressure maintaining is completed, the refrigerator and the fan are started, and the first electromagnetic valve is opened, under the action of the fan, external air is filtered by the filter plate and then enters the inside of the first cavity, then is cooled by the refrigerator, and then enters the inside of the first outflow pipe from the second cavity, then the first outflow pipe disperses the cold air into each inlet pipe, the cold air then enters the inside of the lower mold through the inlet pipe, cools and speeds up the forming speed of the material being made, improves the production efficiency, the quick cooling helps to reduce the residence time of the mold under high temperature, reduces the thermal fatigue of the mold, thereby prolongs the service life of the mold, and reduces the production cost.

[0023] When the forming is completed, the first electromagnetic valve and the refrigerator are closed, and the second electromagnetic valve is opened, the wind generated by the fan enters the second outflow pipe through the first cavity and the second cavity, as the gas increases, the pressure in the second outflow pipe gradually increases, the guide pipe is pushed to move upward, and then the movable plate pushes the ejector rod to move upward, the ejector rod moves upward, the shell after forming is pushed out, manual intervention is not needed, the automation degree of production is improved, the labor cost is reduced, the production efficiency is improved, and the stability and consistency of product demolding can be ensured. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is a whole side view three-dimensional structure schematic diagram of the utility model;

[0025] Figure 2 It is a base front cut structure schematic diagram of the utility model;

[0026] Figure 3 It is a movable plate side cut three-dimensional structure schematic diagram of the utility model;

[0027] Figure 4 It is a base side cut three-dimensional structure schematic diagram of the utility model;

[0028] Figure 5 It is a lower mold side view three-dimensional structure schematic diagram of the utility model.

[0029] In the drawing: 1, base; 2, lower mold; 3, upper mold; 4, filter plate; 5, first cavity; 6, refrigerator; 7, fan; 8, second cavity; 9, inlet assembly one; 91, dispersion cavity; 92, inlet pipe; 93, first outflow pipe; 94, first electromagnetic valve; 10, inlet assembly two; 101, second outflow pipe; 102, second electromagnetic valve; 11, third outflow pipe; 12, movable plate; 13, guide pipe; 14, ejector rod. DETAILED DESCRIPTION

[0030] In order to facilitate the understanding of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0031] In the description of the present application, it should be understood that the orientations or positional relationships indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "page", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0032] In addition, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0033] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing", "provided with" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication between two elements inside. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances. EMBODIMENT

[0034] Please refer to Figures 1-5The utility model provides an injection mold for electronic component plastic shell processing, including base 1, the upper end of base 1 is fixed with lower mould 2, and the upper end of lower mould 2 is fitted and is installed with upper mould 3, the left side of base 1 is installed with filter plate 4, and the inside of base 1 is installed with baffle, and the fan 7 is installed on the baffle, and the inside of base 1 is divided into first cavity 5 and second cavity 8 through the baffle, and first cavity 5 is located the left side of second cavity 8, and the inside of first cavity 5 is installed with refrigerator 6, the right end between second cavity 8 and lower mould 2 is installed with into component no.

[0035] After the pressure is kept, start refrigerator 6 and fan 7, and open first solenoid valve 94, under the action of fan 7, the outside air is filtered after passing through filter plate 4 and enters the inside of first cavity 5, then is refrigerated by refrigerator 6, and then enters the inside of first flow-out pipe 93 from second cavity 8, then first flow-out pipe 93 disperses the cold air into each into pipe 92, and the cold air then enters the inside of lower mould 2 through into pipe 92, and the material in production is cooled to accelerate the forming speed and improve the production efficiency;

[0036] Into component no. 10 includes the second flow-out pipe 101 that communicates with the inside of second cavity 8, and second cavity 8 is installed with second solenoid valve 102, and the second flow-out pipe 101 is set on the outside of guide pipe 13, and guide pipe 13 is rectangularly arranged, and the upper end of movable plate 12 is installed with guide rod, and the guide rod is slidably installed in the inside of lower mould 2;

[0037] When the molding is finished, the first electromagnetic valve 94 and the refrigerator 6 are closed, and the second electromagnetic valve 102 is opened, the air generated by the fan 7 enters the second outflow pipe 101 through the first cavity 5 and the second cavity 8, and the pressure in the second outflow pipe 101 gradually increases with the increase of the gas, so that the guide pipe 13 is pushed to move upward, and then the movable plate 12 pushes the ejector rod 14 to move upward, and the ejector rod 14 is pushed out of the shell during the upward movement, so that the automatic demolding is realized.

[0038] Working principle: when the electronic component plastic shell processing injection mold is used, as shown in the figure, Figures 1-5 When the molding is finished, the first electromagnetic valve 94 and the refrigerator 6 are closed, and the second electromagnetic valve 102 is opened, the air generated by the fan 7 enters the second outflow pipe 101 through the first cavity 5 and the second cavity 8, and the pressure in the second outflow pipe 101 gradually increases with the increase of the gas, so that the guide pipe 13 is pushed to move upward, and then the movable plate 12 pushes the ejector rod 14 to move upward, and the ejector rod 14 is pushed out of the shell during the upward movement, so that the automatic demolding is realized.

[0039] The contents not described in detail in the specification belong to the prior art known to those skilled in the art.

[0040] Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part of the technical features, and any modification, equivalent replacement, improvement, etc. within the spirit and principles of the utility model should be included in the protection scope of the utility model.

Claims

1. An injection mold for processing plastic housings of electronic components, characterized in that: Includes a base (1), a lower mold (2) is fixed at the upper end of the base (1), and an upper mold (3) is installed at the upper end of the lower mold (2). A filter plate (4) is installed on the left side of the base (1), and a baffle is installed inside the base (1), and a fan (7) is installed on the baffle. The interior of the base (1) is divided into a first cavity (5) and a second cavity (8) by the baffle. The first cavity (5) is located to the left of the second cavity (8), and a cooler (6) is installed inside the first cavity (5). A first inlet assembly (9) is installed between the right end of the second cavity (8) and the lower mold (2). The first inlet assembly (9) is used to introduce cold air into the lower mold (2). A second inlet assembly (10) is installed at the upper end of the second cavity (8). A guide tube (13) is provided at the upper end of the second inlet assembly (10). The guide tube (13) is slidably installed inside the base (1). At the same time, a movable plate (12) is fixed at the upper end of the guide tube (13). A push rod (14) is fixed at the upper end of the movable plate (12). The push rod (14) is used to lift the plastic shell of the formed electronic components.

2. The injection mold for processing plastic housings of electronic components according to claim 1, characterized in that: The inlet assembly (9) includes a dispersion cavity (91) fixedly installed on the inner wall of the right side of the second cavity (8). The right end of the dispersion cavity (91) is connected to a plurality of inlet pipes (92), and the left end of the dispersion cavity (91) is connected to a first outlet pipe (93). A first solenoid valve (94) is installed on the first outlet pipe (93), and the upper end of the inlet pipe (92) is connected to the heat dissipation cavity inside the lower mold (2).

3. The injection mold for processing plastic housings of electronic components according to claim 2, characterized in that: The inlet pipe (92) is provided with a third outlet pipe (11) in a one-to-one correspondence, and the upper end of the third outlet pipe (11) is connected to the heat dissipation cavity inside the lower mold (2), and the lower end of the third outlet pipe (11) is located on the left side of the filter plate (4).

4. The injection mold for processing plastic housings of electronic components according to claim 1, characterized in that: The inlet component 2 (10) includes a second outlet pipe (101) communicating with the interior of the second cavity (8), and a second solenoid valve (102) is installed on the second cavity (8).

5. The injection mold for processing plastic housings of electronic components according to claim 4, characterized in that: The second outflow pipe (101) is sleeved on the outside of the guide pipe (13), and the guide pipe (13) is rectangular.

6. The injection mold for processing plastic housings of electronic components according to claim 1, characterized in that: The upper end of the movable plate (12) is equipped with a guide rod, which is slidably installed inside the lower mold (2).

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