Thermal management device with totally-closed structure

Abstract

The utility model discloses a heat management device with a totally-enclosed structure, which comprises a sealed box body, a semiconductor chilling plate is assembled on the outer wall of the sealed box body, and radiating fins are assembled on the outer wall of the semiconductor chilling plate; a heat collection plate is assembled on the inner wall of the sealed box body; a module converter, an image processing module, a temperature control module, a power supply module a and a power supply module b are assembled on the side wall of the heat collection plate; five rotary tables are uniformly and equidistantly assembled at the bottom end in the sealed box body, and an optical camera is assembled at the top end of each rotary table; a U-shaped seat is assembled at the upper end of the rotary table, a mounting shaft is assembled in the U-shaped seat, a bearing column is assembled at the bottom end of the optical camera, and the bearing column is mounted on the mounting shaft through a connecting structure; the heat management device with the totally-closed structure is simple in structure, easy to operate and convenient to operate, and can be used under the low-temperature condition and the high-temperature condition at the same time due to the fact that the heat management device can heat and refrigerate.

Description

TECHNICAL FIELD

[0001] The utility model relates to small -size, high -power closed box temperature control technical field, concretely is a kind of thermal management device of full-closed structure. BACKGROUND

[0002] Prior art of similar products in front market features and defects (can quote others prior art deficiencies)

[0003] Heat dissipation mode has three modes of conduction, convection and radiation, heat conduction occurs between directly contacted objects, heat is transferred from high-temperature object to low-temperature object, convection occurs in gas and liquid, and the transfer efficiency is mainly affected by the movement speed of fluid, and radiation does not rely on medium, which is the main way of heat transfer in vacuum.

[0004] At present, the main heat dissipation mode of high-power closed box adopts water (including other liquids) cooling and compressor refrigeration, and the water cooling mode needs external water tank and circulating pump, which has large volume, complex structure, high cost and high failure rate, once water (liquid) leaks, it will cause damage to other equipment, and there is certain risk.

[0005] Although the compressor refrigeration has high refrigeration efficiency, the compressor refrigeration source utilization rate is low, and there is noise and vibration in the working process, which also pollutes the environment, so a full-closed structure thermal management device is needed to solve the above problems. UTILITY MODEL CONTENTS

[0006] The utility model aims at providing a kind of full-closed structure's thermal management device to solve the problems presented in the above background art.

[0007] To achieve the above object, the utility model provides the following technical scheme: a kind of full-closed structure's thermal management device, including sealed box, the outer wall of the sealed box is equipped with semiconductor refrigeration piece, the outer wall of the semiconductor refrigeration piece is equipped with radiating fin;

[0008] The inner wall of the sealed box is equipped with heat collection plate, the side wall of the heat collection plate is equipped with module converter, image processing module, temperature control module, power module a and power module b;

[0009] The inside bottom end of the sealed box is evenly equipped with five turntables, and the top end of each turntable is equipped with optical camera;

[0010] The upper end of the turntable is equipped with U-shaped seat, the U-shaped seat is equipped with mounting shaft, the bottom end of the optical camera is equipped with bearing column, and the bearing column is mounted on the mounting shaft through connecting structure;

[0011] The connecting structure includes connecting portion, L-shaped slot, groove, first limiting block and spring.

[0012] The connecting part is installed on a bearing column, the L-shaped slot is arranged on the connecting part, the mounting shaft is arranged in the L-shaped slot, the groove is arranged on the L-shaped slot, the first limiting block is arranged in the groove, the spring is arranged between the groove and the first limiting block, and the first limiting block abuts against the L-shaped slot.

[0013] Preferably, the spring is internally provided with a cylinder, the cylinder is provided with a clamping block, the groove is provided with a clamping groove, and the clamping block is clamped in the clamping groove.

[0014] Preferably, the clamping block is provided with an annular groove, the clamping groove is provided with elastic members, the number of the elastic members is not less than six, the elastic members are annularly and equidistantly distributed in the clamping groove, and the elastic members are clamped in the annular groove.

[0015] Preferably, the L-shaped slot is provided with a slot, and the first limiting block is inserted into the slot.

[0016] Preferably, the temperature control module comprises a control logic interface, a control device, an execution mechanism and a controlled object.

[0017] Preferably, the top end of the rotary table is provided with mounting structures on both sides, and the rotary table is mounted on the sealed box body through the mounting structures.

[0018] Preferably, the mounting structure comprises a bolt body, the top end of the rotary table is provided with threaded holes on both sides, the inner wall of the sealed box body is provided with a threaded groove in the threaded hole, the bottom end of the bolt body is provided with a circular groove, the bottom end of the circular groove is provided with a bolt rod, and the bolt rod is screwed into the threaded hole and the threaded groove.

[0019] Preferably, the outer upper end of the bolt rod is provided with a fixing ring, the circumferential surface of the bolt rod is provided with an annular pressing piece, a second spring and an annular rubber piece, the upper end edge of the annular rubber piece is provided with a pressing block, and the outer wall of the bolt body is provided with a circular arc surface.

[0020] Preferably, the mounting structure comprises a second limiting block mounted on the side wall of the rotary table and a limiting groove arranged on the inner wall of the sealed box body, and the second limiting block is clamped in the limiting groove.

[0021] Preferably, the second limiting block is internally provided with a filling layer.

[0022] Compared with the prior art, the present scheme designs a heat management device with a fully-closed structure, which has the following beneficial effects:

[0023] In view of the above, the product uses semiconductor refrigeration for temperature control. Semiconductor refrigeration, also known as thermoelectric refrigeration, uses a P-N junction formed of semiconductor material to form a thermocouple pair. When a direct current is passed through the thermocouple pair, the thermocouple pair can be heated or refrigerated. The semiconductor refrigeration has no moving parts, can be well applied in limited space, and has high reliability, no pollution, and other characteristics.

[0024] The product has simple structure, easy operation, and is convenient to operate. The product can be heated and refrigerated at the same time, and can be used under low-temperature and high-temperature conditions. The product is completely sealed, has high protection level, and can be used in harsh weather such as sand, rain and snow. The product has small size, light weight, is convenient to carry, is easy to use, and can be used in various scenes. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 FIG. 1 is a structural schematic diagram of the utility model;

[0026] Figure 2 FIG. 2 is a schematic diagram of a turntable and an optical camera of the utility model;

[0027] Figure 3 FIG. 3 is a schematic diagram of a U-shaped seat of the utility model;

[0028] Figure 4 FIG. 4 is a sectional view of the U-shaped seat of the utility model;

[0029] Figure 5 FIG. 5 is a structural schematic diagram of part A of the utility model;

[0030] Figure 6 FIG. 6 is a temperature control module temperature control principle diagram of the utility model;

[0031] Figure 7 FIG. 7 is a schematic diagram of an installation structure of a first embodiment of the utility model;

[0032] Figure 8 FIG. 8 is a schematic diagram of an installation structure of a second embodiment of the utility model.

[0033] In the figure: 1 heat dissipation fin, 2 semiconductor refrigeration sheet, 3 heat collecting plate, 4 sealed box body, 5 optical camera, 6 turntable, 7 module converter, 8 power module a, 9 power module b, 10 image processing module, 11 temperature control module, 12 U-shaped seat, 13 bolt main body, 14 bearing column, 17 connecting structure, 18 clamping block, 19 clamping groove, 20 annular groove, 21 elastic piece, 22 cylinder, 23 mounting shaft, 24 mounting structure, 25 insertion slot. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.

[0035] Please refer to Figures 1 to 7 The first technical scheme provided by the utility model: a heat management device of full-closed structure, including sealed box body 4, the outer wall of sealed box body 4 is equipped with semiconductor refrigeration fin 2, the outer wall of semiconductor refrigeration fin 2 is equipped with radiating fin 1;The inner wall of sealed box body 4 is equipped with heat collection plate 3, and the side wall of heat collection plate 3 is equipped with module converter 7, image processing module 10, temperature control module 11, power module a 8 and power module b 9;The inside bottom end of sealed box body 4 is evenly equipped with five rotating tables 6, and the top end of each rotating table 6 is equipped with optical camera 5;The upper end of rotating table 6 is equipped with U-shaped seat 12, and the inside of U-shaped seat 12 is equipped with mounting shaft 23;

[0036] 1 radiating fin is used to radiate the heat end of semiconductor refrigeration fin, and the heat dissipation performance of semiconductor refrigeration fin is directly affected by the heat dissipation performance of the heat end, and a fan can be installed at one end of the radiating fin according to needs.

[0037] 2 semiconductor refrigeration fin is a new type of refrigeration technology, which has the advantages of small size, light weight, no pollution and the like, and its structure is as shown in the drawing, which is composed of P-type semiconductor and N-type semiconductor arranged alternately, and the NP-type semiconductor is connected to form a complete circuit through conductor 2-2 (generally copper, aluminum and other materials with good conductivity), and is packaged by 2-1 cold end and 2-2 hot end, and the cold and hot end packaging generally adopts insulating ceramic. Another significant feature of semiconductor refrigeration fin is that the cold and hot end direction can be changed by changing the current direction, that is, after changing the current direction, the original cold end becomes the hot end, and the original hot end becomes the cold end. According to the characteristics of semiconductor refrigeration fin, the sealed box can be heated or refrigerated according to the external environment.

[0038] 3 heat collection plate is an aluminum plate (or other material with good heat conductivity), because the heat sources in the sealed box are distributed dispersedly and there are moving parts, heat dissipation is difficult, therefore, high-power electronic devices are installed on the heat collection plate for heat conduction, the heat generated by the moving parts (camera and rotating table) is conducted to the heat collection plate through flexible heat conduction cable, and the heat is radiated outwardly through the heat collection plate. And the heat collection plate is provided with a temperature sensor, the temperature sensor collects the temperature information of the heat collection plate and feeds back the information to the temperature control module, and the temperature control module controls the semiconductor refrigeration fin to heat or refrigerate according to the information collected by the temperature sensor.

[0039] 4 The sealed box is the outer contour of the device, sealed by a sealing strip and sealing glue to ensure that the box is dustproof, rainproof and moistureproof. The sealed box contains a layer of thermal insulation material, which can be polystyrene, polystyrene board foam board, etc.

[0040] 5 Optical camera, 6 turntable, 7 module converter, 8, 9 power module, 10 image processing module is a functional implementation module, which is the main heat dissipation device in the sealed box.

[0041] The bottom end of the optical camera 5 is equipped with a bearing column 14, which is installed on a mounting shaft 23 through a connecting structure 17. The connecting structure 17 includes a connecting part 171, an L-shaped groove 172, a groove 173, a first limiting block 174 and a first spring 175. The connecting part 171 is installed on the bearing column 14, the L-shaped groove 172 is opened on the connecting part 171, the mounting shaft 23 is placed in the L-shaped groove 172, the groove 173 is opened on the L-shaped groove 172, the first limiting block 174 is placed in the groove 173, the first spring 175 is installed between the groove 173 and the first limiting block 174, the first limiting block 174 is tightly closed in the L-shaped groove 172, and the L-shaped groove 402 on the connecting part 401 of the bearing body 14 is rotated along the mounting shaft 23 on the U-shaped seat 2, so that the angle of the bearing column 14 can be adjusted at will, and the other end of the bearing column 14 is connected to fix the bearing column 14.

[0042] A cylindrical column 22 is installed in the first spring 175, a clamping block 18 is installed on the cylindrical column 22, a clamping groove 19 is opened on the groove 173, and the clamping block 18 is clamped in the clamping groove 19. An annular groove 20 is opened on the clamping block 18, an elastic piece 20 is installed in the clamping groove 19, the number of elastic pieces 20 is not less than six, the elastic pieces 20 are annularly and equidistantly distributed in the clamping groove 19, the elastic piece 20 is clamped in the annular groove 20, and an insertion groove 25 is opened on the L-shaped groove 172, and the first limiting block 174 is inserted into the insertion groove 25.

[0043] The first limiting block 174 is moved upward in the groove 173, the first limiting block 174 is inclined, the first limiting block 174 is removed, and the first spring 175 is removed for replacement. The cylindrical column 22 is inserted into the first spring 175, the clamping block 18 on the cylindrical column 22 is clamped into the clamping groove 19, the elastic piece 21 is clamped into the annular groove 20, the first limiting block 174 is inclined and extends into the groove 173, and is installed on the first spring 175. The first limiting block 174 is moved upward, the first limiting block 174 is pressed in the groove 173, the first spring 175 is compressed, the L-shaped groove 172 is clamped on the mounting shaft 23 on the U-shaped seat 2, and vice versa. The L-shaped groove 172 on the connecting part 171 of the bearing column 14 is rotated along the mounting shaft 23 on the U-shaped seat 2, so that the angle of the bearing column 14 can be adjusted at will, and the other end of the bearing column 14 is connected to fix the bearing column 14.

[0044] The temperature control module comprises a control logic interface, a control device, an actuator and a controlled object; the function of the temperature control module is to realize closed-loop control of the temperature in the sealed box; each component in the sealed box has a suitable working temperature range; in order to ensure that each component works in the suitable temperature range, the temperature of the heat collecting plate needs to be controlled, that is, the upper and lower limits of the temperature are set; the temperature sensor collects the temperature of the heat collecting plate and feeds back to the temperature control unit; the temperature control unit compares the collected temperature with the set temperature value; if the collected temperature is lower than the lower limit of the set temperature, the temperature control module controls the semiconductor refrigeration piece to heat; if the collected temperature value is higher than the upper limit of the set temperature, the temperature control module controls the semiconductor refrigeration piece to refrigerate; the refrigeration and heating of the semiconductor refrigeration piece are realized by changing the cold end and the hot end by changing the current direction.

[0045] Both side walls of the top end of the rotating table 6 are provided with mounting structures 24, and the rotating table 6 is mounted on the sealed box body 4 through the mounting structures 24.

[0046] The mounting structure 24 comprises a bolt body 13; both sides of the top end of the rotating table 6 are provided with threaded holes; a threaded groove is formed in the inner wall of the sealed box body 4 and located in the threaded hole; a circular groove 131 is formed in the bottom end of the bolt body 13; a bolt rod 133 is mounted at the bottom end of the circular groove 131; and the bolt rod 133 is screwed in the threaded hole and the threaded groove.

[0047] A fixing ring 136 is mounted on the outer upper end of the bolt rod 133; an annular pressing piece 135, a second spring 137 and an annular rubber sheet 132 are sleeved on the circumferential surface of the bolt rod 133; an extrusion block 134 is mounted at the upper end edge of the annular rubber sheet 132; a circular arc surface 138 is arranged on the outer wall of the bolt body 13; and anti-skid lines are arranged on the surface of the circular arc surface 138.

[0048] Please refer to Figures 1 to 8 The second technical scheme of the utility model provides a heat management device with a fully-closed structure, which comprises a sealed box body 4; a semiconductor refrigeration piece 2 is arranged on the outer wall of the sealed box body 4; and heat dissipation fins 1 are arranged on the outer wall of the semiconductor refrigeration piece 2; a heat collecting plate 3 is arranged on the inner wall of the sealed box body 4; a module converter 7, an image processing module 10, a temperature control module 11, a power module a 8 and a power module b 9 are arranged on the side wall of the heat collecting plate 3; five rotating tables 6 are uniformly and equidistantly arranged on the inner bottom end of the sealed box body 4; an optical camera 5 is arranged on the top end of each rotating table 6; a U-shaped seat 12 is arranged on the upper end of the rotating table 6; and a mounting shaft 23 is arranged in the U-shaped seat 12.

[0049] 1 The heat dissipation fins are used for dissipating heat from the hot end of the semiconductor refrigeration piece; the heat dissipation performance of the semiconductor refrigeration piece is directly affected by the heat dissipation performance of the hot end; and a fan can be additionally arranged at one end of the heat dissipation fins according to needs.

[0050] 2Semiconductor refrigeration piece is a new type of refrigeration technology, which has the advantages of small size, light weight, no pollution and the like. The structure thereof is shown in the above figure, which is composed of P-type semiconductor and N-type semiconductor arranged alternately. The NP-type semiconductor is connected by a conductor 2-2 (generally copper, aluminum or other materials with good electrical conductivity) to form a complete circuit, which is packaged by a cold end 2-1 and a hot end 2-2. The cold and hot end packaging generally adopts insulating ceramic. Another significant feature of the semiconductor refrigeration piece is that the cold and hot end directions can be changed by changing the current direction, that is, after changing the current direction, the original cold end becomes the hot end, and the original hot end becomes the cold end. According to the characteristics of the semiconductor refrigeration piece, the sealed box can be heated or refrigerated according to the external environment.

[0051] 3The heat collecting plate is an aluminum plate (or other material with good heat conductivity). Because the heat source in the sealed box is distributed dispersedly and there are moving parts, heat dissipation is difficult, so the heat collecting plate is used to install the high-power electronic device for heat conduction. The heat generated by the moving parts (camera and turntable) is conducted to the heat collecting plate through flexible heat conducting ropes, and the heat is dissipated outwardly through the heat collecting plate. In addition, a temperature sensor is arranged on the heat collecting plate, which collects the temperature information of the heat collecting plate and feeds back the information to the temperature control module. The temperature control module controls the semiconductor refrigeration piece to heat or refrigerate according to the information collected by the temperature sensor.

[0052] 4The sealed box is the outer contour of the device, which is sealed by a sealing strip and sealing glue to prevent dust, rain and moisture. The sealed box has a layer of thermal insulation material, which can be polystyrene, polyphenyl board foam board or the like.

[0053] 5Optical camera, 6turntable, 7module converter, 8, 9power module, 10image processing module are functional modules, which are the main heat dissipation devices in the sealed box.

[0054] The bottom end of the optical camera 5 is provided with a bearing column 14, which is installed on a mounting shaft 23 through a connecting structure 17. The connecting structure 17 includes a connecting part 171, an L-shaped groove 172, a groove 173, a first limiting block 174 and a first spring 175. The connecting part 171 is installed on the bearing column 14, the L-shaped groove 172 is formed on the connecting part 171, the mounting shaft 23 is arranged in the L-shaped groove 172, the groove 173 is formed on the L-shaped groove 172, the first limiting block 174 is arranged in the groove 173, the first spring 175 is installed between the groove 173 and the first limiting block 174, and the first limiting block 174 abuts against the L-shaped groove 172. The L-shaped groove 402 on the connecting part 401 of the bearing main body 14 rotates along the mounting shaft 23 on the U-shaped seat 2, so that the angle of the bearing column 14 can be adjusted at will, and the other end of the bearing column 14 is connected to fix the bearing column 14.

[0055] The first spring 175 is internally provided with a cylinder 22, the cylinder 22 is provided with a clamping block 18, the groove 173 is provided with a clamping groove 19, and the clamping block 18 is clamped in the clamping groove 19; the clamping block 18 is provided with an annular groove 20, the clamping groove 19 is provided with an elastic piece 20, the number of the elastic piece 20 is not less than six, the elastic piece 20 is annularly and equidistantly distributed in the clamping groove 19, and the elastic piece 20 is clamped in the annular groove 20; the L-shaped groove 172 is provided with an insertion groove 25, and the first limiting block 174 is inserted into the insertion groove 25.

[0056] The first limiting block 174 is moved upwards in the groove 173, the first limiting block 174 is inclined, the first limiting block 174 can be taken off, the first spring 175 is taken off and replaced, the cylinder 22 is inserted into the first spring 175, the clamping block 18 on the cylinder 22 is clamped into the clamping groove 19, the elastic piece 21 is clamped into the annular groove 20, the first limiting block 174 is inclined and extends into the groove 173, and the first limiting block 174 is mounted on the first spring 175; the first limiting block 174 is moved upwards, the first limiting block 174 is pressed in the groove 173, the first spring 175 is compressed, the L-shaped groove 172 is clamped on the mounting shaft 23 on the U-shaped seat 2, and vice versa. The bearing column 14 can be disassembled, the L-shaped groove 172 on the connecting portion 171 of the bearing column 14 is rotated along the mounting shaft 23 on the U-shaped seat 2, the bearing column 14 can be adjusted at will, and the other end of the bearing column 14 is connected to fix the bearing column 14.

[0057] The temperature control module comprises a control logic interface, a control device, an actuator and a controlled object; the function of the temperature control module is to realize closed-loop control of the temperature in the sealed box, and each component in the sealed box has a suitable working temperature range; in order to ensure that each component works in the suitable temperature range, the temperature of the heat collecting plate needs to be controlled, that is, the upper and lower limits of the temperature are set, the temperature sensor collects the temperature of the heat collecting plate and feeds back to the temperature control unit, the temperature control unit compares the collected temperature with the set temperature value, if the collected temperature is lower than the lower limit of the set temperature, the temperature control module controls the semiconductor refrigerating sheet to heat, and if the collected temperature value is higher than the upper limit of the set temperature, the temperature control module controls the semiconductor refrigerating sheet to refrigerate. The refrigeration and heating of the semiconductor refrigerating sheet are realized by changing the current direction to change the cold end and the hot end.

[0058] The top end of the rotating table 6 is provided with mounting structures 24 on both sides of the wall, and the rotating table 6 is mounted on the sealed box body 4 through the mounting structures 24.

[0059] The mounting structure 24 comprises a second limiting block 138 mounted on the side wall of the rotating table 6 and a limiting groove 139 provided in the inner wall of the sealed box body 4, and the second limiting block 138 is clamped in the limiting groove 139.

[0060] The second limiting block 138 is internally provided with a filling layer 140.

[0061] The difference between the first technical solution and the second technical solution is that the first embodiment is fixed by the threaded connection of the bolt body, and the second embodiment is fixed by the cooperation of the limiting block and the limiting groove.

[0062] The other components in the second technical solution are the same as those in the first technical solution.

[0063] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A fully enclosed thermal management device, comprising a sealed housing (4), characterized in that: The outer wall of the sealed box (4) is equipped with a semiconductor cooling chip (2), and the outer wall of the semiconductor cooling chip (2) is equipped with heat dissipation fins (1). The inner wall of the sealed box (4) is equipped with a heat collection plate (3), and the side wall of the heat collection plate (3) is equipped with a module converter (7), an image processing module (10), a temperature control module (11), a power supply module a (8) and a power supply module b (9). Five turntables (6) are evenly spaced at the bottom of the sealed box (4), and an optical camera (5) is mounted on the top of each turntable (6). The upper end of the turntable (6) is equipped with a U-shaped seat (12), and the U-shaped seat (12) is equipped with a mounting shaft (23). The bottom end of the optical camera (5) is equipped with a support column (14), and the support column (14) is mounted on the mounting shaft (23) through a connecting structure (17). The connecting structure (17) includes a connecting part (171), an L-shaped groove (172), a recess (173), a first limiting block (174), and a first spring (175). The connecting part (171) is installed on the bearing column (14), the L-shaped groove (172) is opened on the connecting part (171), the mounting shaft (23) is placed in the L-shaped groove (172), the groove (173) is opened on the L-shaped groove (172), the first limiting block (174) is placed in the groove (173), the first spring (175) is installed between the groove (173) and the first limiting block (174), and the first limiting block (174) abuts against the L-shaped groove (172).

2. The thermal management device with a fully enclosed structure according to claim 1, characterized in that: A cylinder (22) is installed inside the first spring (175), and a locking block (18) is installed on the cylinder (22). A slot (19) is opened on the groove (173), and the locking block (18) is engaged in the slot (19).

3. The thermal management device with a fully enclosed structure according to claim 2, characterized in that: The card block (18) has an annular groove (20), and an elastic element (21) is installed in the card groove (19). The number of elastic elements (21) is not less than six. The elastic elements (21) are distributed in an annular shape at equal intervals in the card groove (19), and the elastic elements (21) are engaged in the annular groove (20).

4. The thermal management device with a fully enclosed structure according to claim 1, characterized in that: The L-shaped groove (172) has a slot (25) and the first limiting block (174) is inserted into the slot (25).

5. A fully enclosed thermal management device according to claim 1, characterized in that: The temperature control module includes a control logic interface, a control device, an actuator, and a controlled object.

6. A thermal management device with a fully enclosed structure according to claim 1, characterized in that: The top two side walls of the turntable (6) are equipped with mounting structures (24), and the turntable (6) is mounted on the sealed box (4) through the mounting structures (24).

7. A fully enclosed thermal management device according to claim 6, characterized in that: The installation structure (24) includes a bolt body (13), threaded holes are provided on both sides of the top of the turntable (6), and a threaded groove is provided in the inner wall of the sealing box (4) within the threaded hole. A circular groove (131) is provided at the bottom of the bolt body (13), and a bolt rod (133) is installed at the bottom of the circular groove (131). The bolt rod (133) is screwed into the threaded hole and the threaded groove.

8. A fully enclosed thermal management device according to claim 7, characterized in that: A retaining ring (136) is installed on the upper outer end of the bolt rod (133). An annular pressure plate (135), a second spring (137) and an annular rubber sheet (132) are fitted on the circumferential surface of the bolt rod (133). An extrusion block (134) is installed at the upper edge of the annular rubber sheet (132). The outer wall of the bolt body (13) is provided with an arc surface.

9. A fully enclosed thermal management device according to claim 7, characterized in that: The installation structure (24) includes a second limiting block (138) installed on the side wall of the turntable (6) and a limiting groove (139) opened on the inner wall of the sealed box (4), wherein the second limiting block (138) is engaged in the limiting groove (139).

10. A fully enclosed thermal management device according to claim 9, characterized in that: The second limiting block (138) has a filling layer (140) installed inside.

Images