Detection device

By introducing a combination of pre-inspection and inspection components into wafer inspection equipment, and using a low-power beam for pre-inspection and a high-power beam for formal inspection, the problems of low inspection efficiency and secondary contamination in existing technologies are solved, achieving efficient and accurate wafer surface defect detection.

CN223581740UActive Publication Date: 2025-11-21SHENZHEN PLANCK SEMICON TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202520260538.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-18
Publication Date
2025-11-21
Estimated Expiration
2035-02-18

AI Technical Summary

Technical Problem

Existing wafer surface defect detection equipment based on optical inspection technology has low detection efficiency, and the irradiation of large particles by high-power beams may lead to prolonged detection time and secondary contamination.

Method used

A combination of a pre-detection component and a detection component is adopted. The pre-detection component uses a low-power beam to perform pre-detection and obtain the position and size of large particles, while the detection component uses a high-power beam for formal detection. The independently set pre-detection component and the detection component work in parallel in the same device, which shortens the detection time.

Benefits of technology

This improves wafer inspection efficiency, avoids secondary contamination from large particles, and ensures the accuracy and efficiency of inspection.

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Abstract

The utility model provides a detection device, which comprises a processing module, a pre-detection assembly and a detection assembly, and is characterized in that the processing module is used for processing a sample; the pre-detection assembly comprises a reference detection surface and is used for pre-detecting the surface of a sample positioned on the reference detection surface to obtain a first position of a to-be-detected target of which the inner size in a to-be-detected area of the surface of the sample is greater than or equal to a preset threshold value; the detection assembly is at least used for detecting a to-be-detected area outside a first position on the surface of the sample; the pre-detection assembly is located in the processing module; alternatively, the detection device has a transfer path for transferring the sample from the processing module to the detection assembly, and the reference detection surface is located in the transfer path. When the pre-detection assembly carries out pre-detection on the sample, the detection assembly can carry out formal detection on other samples, and the detection assembly only needs to carry out formal detection, so that the detection time of the sample is shortened, and the detection efficiency of the sample is improved.
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Description

Technical Field

[0001] This application relates to the field of semiconductor testing technology, and more specifically to a testing device. Background Technology

[0002] After wafer fabrication, defects may exist on the wafer surface. Common wafer surface defects include foreign particles, scratches, and pits. The presence of wafer surface defects can affect the performance and reliability of subsequently fabricated chips. Therefore, surface defect detection of wafers is necessary before chip fabrication. The most commonly used technique for wafer surface defect detection is optical inspection technology.

[0003] However, the detection efficiency of detection equipment based on optical detection technology still needs to be improved. Utility Model Content

[0004] To improve detection efficiency, this application provides a detection device.

[0005] This application provides a detection device, comprising: a processing module, a pre-detection component, and a detection component; the processing module is used to process a sample; the pre-detection component includes a reference detection surface, and the pre-detection component is used to pre-detect the sample surface located on the reference detection surface to obtain a first position of a target object with a size greater than or equal to a preset threshold within the test area of ​​the sample surface; the detection component is used to detect at least the test area outside the first position of the sample surface; the pre-detection component is located within the processing module; or, the detection device has a transfer path for transferring the sample from the processing module to the detection component, and the reference detection surface is located in the transfer path.

[0006] Optionally, both the pre-detection component and the detection component are optical detection components, and the detection optical power of the pre-detection component is less than the detection optical power of the detection component.

[0007] Optionally, the pre-detection component is adapted to form a strip-shaped detection area on the reference detection surface, wherein the size of the strip-shaped detection area along the extension direction of the strip-shaped detection area is greater than or equal to the size of the test area of ​​the sample.

[0008] Optionally, the pre-detection component includes a first emitting unit and a first detection component. The first emitting unit is adapted to emit a first detection light toward the sample. The first detection light passes through the test area of ​​the sample to form a first signal light. The first detection component is adapted to receive the first signal light and obtain the first position based on the first signal light.

[0009] Optionally, the first emitting part is adapted to form a strip-shaped irradiation area on the reference detection surface, and along the extension direction of the strip-shaped irradiation area, the size of the strip-shaped irradiation area is greater than or equal to the size of the to-be-detected area of the sample; the first detection assembly is adapted to form a strip-shaped field of view on the reference detection surface, and along the extension direction of the strip-shaped field of view, the size of the strip-shaped field of view is greater than or equal to the size of the to-be-detected area of the sample; the overlapping area of the strip-shaped irradiation area and the strip-shaped field of view constitutes a strip-shaped detection area.

[0010] Optionally, the pre-detection assembly is located in the processing module, and the processing module comprises: a bearing disc for bearing the sample, the first emitting part and the first detection assembly are located on the same side of the bearing disc and both face the bearing surface of the bearing disc; the bearing disc is further used to drive the sample to rotate around a rotation axis perpendicular to the bearing surface; and / or the bearing disc is further adapted to move along a direction intersecting the extension direction of the strip-shaped detection area.

[0011] Optionally, the pre-detection assembly is located in the processing module, and the first detection assembly is further used to obtain the edge position of the sample according to the first signal light and obtain the center position of the sample according to the edge position; the processing module further comprises a controller, and the controller is used to adjust the sample position according to the deviation between the center position and a preset center position.

[0012] Optionally, the reference detection surface is located in the transfer path, the to-be-detected area of the sample is adapted to pass through the reference detection surface along the transfer path, the moving direction of the sample is perpendicular to or has an acute angle with the extension direction of the strip-shaped detection area, and the first emitting part and the first detection assembly are located on the same side of the sample.

[0013] Optionally, the detection device further comprises: a transfer component for transferring the sample along the transfer path; the transfer component comprises a support part for supporting the sample, and the processing module is used to align the center of the sample with a preset center of the support part.

[0014] Optionally, the first detection assembly comprises a plurality of first detectors arranged in sequence, the fields of view of adjacent first detectors contact or partially overlap with each other, and the fields of view of the plurality of first detectors are arranged in sequence to form the strip-shaped field of view.

[0015] Optionally, the detection assembly comprises a second emitting part, the second emitting part is adapted to emit second detection light to the to-be-detected area of the sample surface, the second emitting part is a power-adjustable light source, and the light power of the second emitting part irradiated to the first position is less than the light power irradiated to the to-be-detected area other than the first position.

[0016] Optionally, the second emitting part irradiates light with zero power to the first position.

[0017] The technical solution of the present application has the following advantages:

[0018] The detection device provided by the present application shortens the detection time of the sample and improves the detection efficiency of the sample. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the specific embodiments or prior art of the present application, the drawings needed to be used in the specific embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0020] Figure 1 A block diagram of a detection device provided by an embodiment of the present application is provided.

[0021] Figure 2 A block diagram of a detection device provided by another embodiment of the present application is provided.

[0022] Figure 3 A top view of a pre-detection component provided by an embodiment of the present application is provided.

[0023] Figure 4 A working process schematic diagram of a pre-detection component provided by an embodiment of the present application is provided.

[0024] Explanation of reference signs:

[0025] 1 - processing module; 2 - pre-detection component; 21 - first emitting part; 22 - first detection component; 221 - first detector; 3 - detection component; 4 - transfer part; A - sample. DETAILED DESCRIPTION

[0026] The technical solutions of the present application will be described in detail below with reference to the drawings. Obviously, the described embodiments are some embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0027] In the description of the present application, it should be noted that the terms "center", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application. In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0028] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as there is no conflict between them.

[0029] In the wafer surface defect detection process, the particles on the wafer surface are usually detected by scattered light of the particles. The strength of the scattered light is related to the size of the particles, and the larger the size of the particles, the stronger the scattered light. When the size of the particles is too large, the scattered light is too strong, which not only leads to the inability to accurately obtain the size of the particles, but also easily leads to the explosion of the particles and causes secondary pollution to the wafer surface. Therefore, the related technology adds a pre-detection component in the detection chamber of the detection equipment. In the process of detecting the surface defects of the wafer, the pre-detection component first performs pre-detection on the wafer surface by using a low-power light beam to obtain the position and size of large particles, and then a detection component in the detection chamber performs formal detection on the wafer surface. In the formal detection process, the high-power light beam emitted by the detection component avoids irradiating the large particles or reduces the light power irradiated on the large particles, so as to obtain the defect information of the entire surface of the wafer. That is, the wafer needs to be sequentially subjected to the pre-detection and formal detection steps in the detection chamber, so that the detection time is long, which limits the detection efficiency of the wafer.

[0030] Embodiment 1

[0031] Referring to Figure 1 , the embodiment provides a detection device, which comprises a processing module 1, a pre-detection component 2 and a detection component 3. The processing module 1 is used for processing a sample; the pre-detection component 2 comprises a reference detection surface, and the pre-detection component 2 is used for pre-detecting a sample surface located on the reference detection surface to obtain a first position of a to-be-detected target with a size greater than or equal to a preset threshold in a to-be-detected area of the sample surface; and the detection component 3 is used for detecting at least the to-be-detected area outside the first position of the sample surface. The detection device has a transfer path for transferring the sample from the processing module 1 to the detection component 3, and the reference detection surface is located in the transfer path.

[0032] The detection device provided by the embodiment is characterized in that the pre-detection assembly 2 is independent of the detection assembly 3, so that the detection assembly 3 can perform formal detection on other samples while the pre-detection assembly 2 performs pre-detection on the sample, and the detection assembly 3 only needs to perform formal detection, thereby shortening the detection time of the sample and improving the detection efficiency of the sample.

[0033] The detection assembly 3 is used to obtain the size and position of the to-be-detected target with a size less than a preset threshold. The to-be-detected target is a defect such as a particle, a scratch, a pit, or a structure such as a solder ball or a circuit.

[0034] The pre-detection assembly 2 and the detection assembly 3 are optical detection assemblies 3, and the detection light power of the pre-detection assembly 2 is less than that of the detection assembly 3. The optical detection assembly 3 includes an emission part and a detection assembly. The emission part is adapted to emit detection light to the sample. The detection light forms signal light on the to-be-detected area of the sample surface. The detection assembly is adapted to receive the signal light and obtain detection information based on the signal light. The signal light includes but is not limited to scattered light and reflected light. Taking the to-be-detected target as a particle as an example, the pre-detection assembly 2 performs pre-detection on the sample surface with lower detection light power. Since a large particle with a size greater than or equal to the preset threshold has strong scattering ability, the detection assembly of the pre-detection assembly 2 can receive the scattered light scattered by the large particle and obtain the position of the large particle based on the scattered light. In addition, the irradiation of low-power detection light can avoid the explosion of the large particle and cause secondary pollution to the sample surface. The detection assembly 3 mainly detects small particles with a size less than the preset threshold in the area other than the position of the large particle in the to-be-detected area. Higher detection light power makes the scattered light scattered by the small particle reach a certain intensity, so that the detection assembly of the detection assembly 3 can receive the scattered light scattered by the small particle and obtain the size and position of the small particle based on the scattered light.

[0035] Specifically, referring to Figures 3-4 , the pre-detection assembly 2 includes a first emission part 21 and a first detection assembly 22. The first emission part 21 and the first detection assembly 22 are located on the same side of the sample A. The first emission part 21 is adapted to emit first detection light to the sample A. The first detection light forms first signal light on the to-be-detected area of the sample A surface. The first detection assembly 22 is adapted to receive the first signal light and obtain the first position based on the first signal light. The detection assembly 3 includes a second emission part and a second detection assembly. The second emission part is adapted to emit second detection light to the sample A. The second detection light forms second signal light on the to-be-detected area of the sample A surface. The second detection assembly is adapted to receive the second signal light and obtain the to-be-detected target information of the sample A surface based on the second signal light. The power of the first detection light is less than that of the second detection light.

[0036] In particular, in the embodiment, the first detection light is scattered by the sample A surface to be detected to form the first signal light. The incident angle of the first detection light is not equal to the exit angle of the first signal light. In other embodiments, the first detection light is reflected by the sample surface to form the first signal light. The exit angle of the first signal light is mirror symmetric to the incident angle of the first detection light about the surface normal of the region to be detected.

[0037] In the embodiment, the second detection light is scattered by the sample surface to be detected to form the second signal light. The incident angle of the second detection light is not equal to the exit angle of the second signal light. In other embodiments, the second detection light is reflected by the sample surface to form the second signal light. The exit angle of the second signal light is mirror symmetric to the incident angle of the second detection light about the surface normal of the region to be detected.

[0038] The second emitting part can be a power-adjustable light source. The light power of the second emitting part irradiating the first position is less than the light power of the second emitting part irradiating the region to be detected other than the first position. That is, in the formal detection process, the light power irradiating the first position is reduced. At this time, the detection assembly 3 can not only obtain the size and position of the target to be detected with a size less than the preset threshold, but also obtain the size and position of the target to be detected with a size greater than or equal to the preset threshold. Further, the light power irradiating the first position can be reduced to zero, that is, the second emitting part is turned off when detecting the first position. At this time, the detection assembly 3 can only obtain the size and position of the target to be detected with a size less than the preset threshold.

[0039] In some embodiments of the embodiment, the pre-detection assembly 2 is adapted to form a strip-shaped detection region on the reference detection surface. The size of the strip-shaped detection region along the extension direction of the strip-shaped detection region is greater than or equal to the size of the sample A surface to be detected, so as to facilitate the pre-detection assembly 2 to comprehensively scan the sample A surface.

[0040] In particular, the first emitting part 21 is adapted to form a strip-shaped irradiation region on the reference detection surface. The size of the strip-shaped irradiation region along the extension direction of the strip-shaped irradiation region is greater than or equal to the size of the sample A surface to be detected. The first detection assembly 22 is adapted to form a strip-shaped field of view on the reference detection surface. The size of the strip-shaped field of view along the extension direction of the strip-shaped field of view is greater than or equal to the size of the sample A surface to be detected. The overlapping region of the strip-shaped irradiation region and the strip-shaped field of view constitutes a strip-shaped detection region.

[0041] Referring to Figure 3The first detection assembly 22 can include a plurality of first detectors 221 arranged in sequence, the fields of view of adjacent first detectors 221 contact or partially overlap with each other, and the fields of view of the plurality of first detectors 221 are arranged in sequence to form the strip-shaped field of view. The first detector 221 can be a line detector or a surface detector, and the number of first detectors 221 can be 3-5 or other numbers.

[0042] For example, the pre-detection assembly in the embodiment can comprehensively scan the to-be-detected area of the sample surface in the following manner: referring to Figure 3 The to-be-detected area of the sample A is adapted to pass through the reference detection surface along the transfer path transferred by the processing module 1 to the detection assembly 3, and the extension direction of the strip-shaped detection area formed by the pre-detection assembly 2 on the reference detection surface intersects with the moving direction of the sample A, so that the strip-shaped detection area passes through the surface of the sample A along the moving direction of the sample A, and the comprehensive scanning of the to-be-detected area of the sample A surface is completed. Figure 3 The arrow in the figure indicates the moving direction of the sample A. The extension direction of the strip-shaped detection area can be perpendicular to the moving direction of the sample A or have an acute angle therebetween.

[0043] For example, the detection device further includes a transfer component 4 for transferring the sample along the transfer path; the transfer component 4 includes a support part (not shown) for supporting the sample. For example, the transfer component 4 includes a robot, and the support part is a mechanical hand. Figure 1

[0044] The processing module 1 includes a carrier disc (not shown) for carrying the sample and a driving member (not shown) for driving the carrier disc to move to adjust the position of the sample. The sample surface in the present application refers to the surface of the sample away from the carrier disc; and the carrier disc can be a chuck.

[0045] The processing module 1 further includes an alignment unit (not shown) for obtaining the edge position of the sample, and obtaining the center position of the sample according to the edge position, and driving the carrier disc to move or the support part to move based on the center position of the sample, so as to align the center of the sample with the preset center of the support part. The preset center of the support part refers to the position of the center of the support part in the processing module 1 when the support part clamps the sample from the processing module 1. By aligning the center of the sample with the preset center of the support part through the processing module 1, the center of the sample is aligned with the center of the support part when the support part clamps the sample from the processing module 1, so as to ensure that the pre-detection assembly 2 and the detection assembly 3 accurately detect the position of the to-be-detected target on the surface of the sample, and facilitate to improve the detection accuracy of the position of the to-be-detected target. The alignment unit can be an imaging unit or a line array in-situ sensor.

[0046] ​In some embodiments, the detection device further comprises a storage unit for storing the sample.

[0047] In some embodiments, the sample comprises, but is not limited to, a semiconductor element, which can be a semiconductor substrate such as a wafer. The sample can also be a glass. When the sample is a wafer, the processing module is further capable of adjusting the notch direction of the wafer so that it is arranged along a preset direction, and the storage unit is a wafer box.

[0048] In this embodiment, the surface of the sample refers to the surface of the side of the sample away from the carrier disc.

[0049] The detection method of the detection device provided in this embodiment is exemplarily described as follows: the support part takes out the sample from the storage unit and places it on the carrier disc of the processing module 1; the alignment unit scans the sample to obtain the edge position of the sample and determine the center position of the sample based on the edge position of the sample; the position of the sample and / or the support part is adjusted based on the center position of the sample so that the center of the sample is aligned with the preset center of the support part; the transfer part 4 transfers the sample to the detection assembly 3, and in the process of the sample passing through the reference detection surface, the pre-detection assembly 2 passes through the surface of the sample along the direction of movement of the sample in the strip-shaped detection area formed on the reference detection surface, to complete the full scan of the to-be-detected area of the surface of the sample to obtain the first position of the to-be-detected target in the to-be-detected area of the surface of the sample, which has a size greater than or equal to a preset threshold; after the transfer part 4 transfers the sample to the detection assembly 3, the detection assembly 3 performs full scan on the to-be-detected area of the surface of the sample with a detection light of high power, and appropriately reduces the light power irradiated to the first position in the process of full scan, to obtain the information of the to-be-detected target in the to-be-detected area of the surface of the sample.

[0050] Embodiment 2

[0051] Referring to Figure 2 , this embodiment provides a detection device, which is different from the detection device provided in Embodiment 1 in that the pre-detection assembly is located in the processing module 1. In the detection device provided in this embodiment, the pre-detection assembly is independently arranged from the detection assembly, and the detection assembly can perform formal detection on other samples while the pre-detection assembly performs pre-detection on the sample. The detection assembly only needs to perform formal detection, which shortens the detection time of the sample and improves the detection efficiency of the sample.

[0052] Specifically, the first emitting part and the first detection assembly in the pre-detection assembly are located on the same side of the carrier disc and both face the carrying surface of the carrier disc, and the surface of the side of the sample away from the carrying surface is located on the reference detection surface to form a strip-shaped detection area on the reference detection surface.

[0053] For example, the pre-detection assembly in the embodiment can comprehensively scan the area to be detected on the sample surface in the following manner: the carrier disc is a rotating carrier disc, the carrier disc is used to drive the sample to rotate around a rotation axis perpendicular to the carrier surface, the extension direction of the rotation axis of the carrier disc passes through the strip-shaped detection area formed by the pre-detection assembly on the area to be detected on the sample surface, and the pre-detection assembly can comprehensively scan the area to be detected on the sample surface when the carrier disc drives the sample to rotate around the rotation axis once. Alternatively, the carrier disc is adapted to move along a direction intersecting the extension direction of the strip-shaped detection area to drive the sample to move, so that the strip-shaped detection area passes through the sample surface along the direction in which the sample moves, thereby enabling the pre-detection assembly to complete the comprehensive scanning of the area to be detected on the sample surface. The moving direction of the carrier disc can be perpendicular to the extension direction of the strip-shaped detection area.

[0054] In an embodiment of the present application, the processing module 1 comprises an alignment unit, which is used to scan the edge of the sample to obtain the center position of the sample. The pre-detection assembly can be provided independently of the alignment unit. Specifically, the carrier disc can be a rotating carrier disc, which is used to drive the sample to rotate around a rotation axis perpendicular to the carrier surface. The extension direction of the rotation axis of the carrier disc passes through the strip-shaped detection area formed by the pre-detection assembly on the area to be detected on the sample surface. The pre-detection assembly can comprehensively scan the area to be detected on the sample surface when the carrier disc drives the sample to rotate around the rotation axis once. At the same time, the alignment unit can scan the edge of the sample to complete the detection of the edge of the sample and obtain the center position of the sample. The alignment unit is a bright field imaging module. The field of view of the alignment unit is smaller than that of the pre-detection assembly. The alignment unit is used to scan the edge of the sample to obtain a bright field image of the edge of the sample.

[0055] In another embodiment of the present application, the processing module 1 can not comprise a separate alignment unit, and the pre-detection assembly can also realize the function of the alignment unit. Specifically, the pre-detection assembly can also be used to obtain the edge position of the sample according to the first signal light and obtain the center position of the sample according to the edge position. The processing module 1 further comprises a controller, which is used to adjust the sample position according to the deviation between the center position and a preset center position to reduce the deviation. The pre-detection assembly in this embodiment can be the same as or different from the pre-detection assembly in the embodiment of the present application. Figure 3

[0056] ​The detection method of the detection device provided by the embodiment is exemplarily described as follows: the support unit takes out the sample from the storage unit and places it on the bearing disc of the processing module 1, the extension direction of the rotation axis of the bearing disc passes through the strip-shaped detection area formed by the pre-detection assembly on the sample surface to-be-detected area, the bearing disc is rotated to drive the sample to rotate around the rotation axis of the bearing disc for one round, the sample surface is scanned comprehensively by the detection light with a lower power, and the first position of the to-be-detected target with a size greater than or equal to a preset threshold in the sample surface to-be-detected area and the edge position of the sample are obtained; the center position of the sample is obtained according to the edge position, and the controller adjusts the sample position according to the deviation between the center position and a preset center position; the sample is transferred to the detection assembly 3 by the transfer component 4, the detection assembly 3 comprehensively scans the sample surface to-be-detected area by the detection light with a higher power, and the light power irradiated to the first position is appropriately reduced in the comprehensive scanning process, so as to obtain the information of the to-be-detected target in the sample surface to-be-detected area.

[0057] In other embodiments of the present application, the pre-detection assembly can include a first detector; the processing module further includes a driving assembly for driving the bearing disc to move in a spiral track to realize comprehensive scanning of the sample surface to-be-detected area. Specifically, the driving assembly includes a rotating member and a translating member, the rotating member is connected with the bearing disc and is used to drive the bearing disc to rotate around the rotation axis of the rotating member; the translating member is connected with the rotating member and is used to drive the rotating member to translate. The processing module 1 further includes a controller for controlling the rotating time, rotating time length and rotating speed of the rotating member, and controlling the translating time, translating direction and translating distance of the translating member. The first detector can be a line detector or a surface detector, and the first emission part can be a laser emitter to form a light spot on the sample surface.

[0058] Obviously, the above embodiments are only examples for clearly illustrating the present application, and are not intended to limit the embodiments. Based on the above description, other different forms of changes or modifications can be made by those skilled in the art. Here, all the embodiments are not required to be exhausted, and the obvious changes or modifications derived therefrom are still within the protection scope of the present application.

Claims

1. A detection device, characterized in that, The application relates to a detection device for detecting a sample, comprising: a processing module for processing the sample; a pre-detection assembly comprising a reference detection surface, the pre-detection assembly being used for pre-detecting a sample surface located on the reference detection surface to obtain a first position of a to-be-detected target in a to-be-detected area of the sample surface, wherein the size of the to-be-detected target is greater than or equal to a preset threshold value; a detection assembly used at least for detecting the to-be-detected area of the sample surface other than the first position; the pre-detection assembly is located in the processing module; or the detection device has a transfer path for transferring the sample from the processing module to the detection assembly, and the reference detection surface is located in the transfer path. The pre-detection assembly and the detection assembly are both optical detection assemblies, and the detection light power of the pre-detection assembly is less than that of the detection assembly.

2. The detection device of claim 1, wherein, The pre-detection assembly is adapted to form a strip-shaped detection area on the reference detection surface, and the size of the strip-shaped detection area along the extension direction of the strip-shaped detection area is greater than or equal to the size of the to-be-detected area of the sample.

3. The detection device of claim 1, wherein, The pre-detection assembly comprises a first emission part and a first detection assembly, the first emission part is adapted to emit first detection light to the sample, the first detection light forms first signal light through the to-be-detected area of the sample, and the first detection assembly is adapted to receive the first signal light and obtain the first position according to the first signal light.

4. The detection device according to claim 1 or 3, characterized in that The first emission part is adapted to form a strip-shaped irradiation area on the reference detection surface, and the size of the strip-shaped irradiation area along the extension direction of the strip-shaped irradiation area is greater than or equal to the size of the to-be-detected area of the sample; the first detection assembly is adapted to form a strip-shaped field of view on the reference detection surface, and the size of the strip-shaped field of view along the extension direction of the strip-shaped field of view is greater than or equal to the size of the to-be-detected area of the sample; and the overlapping area of the strip-shaped irradiation area and the strip-shaped field of view constitutes a strip-shaped detection area.

5. The detection device of claim 4, wherein, The pre-detection assembly is located in the processing module, and the processing module comprises a bearing disc for bearing the sample, the first emission part and the first detection assembly are located on the same side of the bearing disc and both face the bearing surface of the bearing disc; 6. The detection device of claim 4, wherein, the bearing disc is further used for rotating the sample around a rotation shaft perpendicular to the bearing surface; and / or the bearing disc is further adapted to move along a direction intersecting the extension direction of the strip-shaped detection area. The pre-detection assembly is located in the processing module, and the first detection assembly is further used for obtaining an edge position of the sample according to the first signal light and obtaining a center position of the sample according to the edge position; 7. The detection device of claim 4, wherein, the processing module further comprises a controller, and the controller is used for adjusting the sample position according to the deviation between the center position and a preset center position. The reference detection surface is located in the transfer path, the to-be-detected area of the sample is adapted to pass through the reference detection surface along the transfer path, the moving direction of the sample is perpendicular to or has an acute angle with the extension direction of the strip-shaped detection area, and the first emission part and the first detection assembly are located on the same side of the sample.

8. The detection device of claim 4, wherein, The application further relates to a detection device for detecting a sample, comprising:

9. The detection device of claim 1, wherein, ​ A transfer component is configured to transfer the sample along the transfer path; the transfer component comprises a support configured to support the sample, and the processing module is configured to align a center of the sample with a preset center of the support.

10. The detection device of claim 4, wherein, The first detection assembly comprises a plurality of first detectors arranged in sequence, and fields of view of adjacent first detectors are in contact or partially overlap with each other, and fields of view of the plurality of first detectors are arranged in sequence to form the strip-shaped field of view.

11. The detection device according to claim 1 or 2, characterized in that The detection assembly comprises a second emitting portion adapted to emit second detection light to a region to be detected on the sample surface, the second emitting portion is a power-adjustable light source, and a light power of the second emitting portion irradiated to the first position is less than a light power of the second emitting portion irradiated to the region to be detected outside the first position.

12. The detection device of claim 11, wherein, The light power of the second emitting portion irradiated to the first position is zero.