Crimping device and test handler

Abstract

The utility model relates to a crimping device and a test sorting machine, and the crimping device comprises a connecting structure which is provided with an air inlet channel; the pressing head comprises a connecting part, an air outlet part and a picking part which are connected in sequence; the connecting part is arranged in the connecting structure, and the air outlet part and the picking part both extend out of the connecting structure; an air outlet channel communicated with the air inlet channel is formed in the pressure head; the pickup part picks up the electronic component through the end face away from the air outlet part, the air outlet part is provided with a first end face and a second end face which are connected with the connecting part and the pickup part respectively, and an air outlet of the air outlet channel is formed in the side face, used for connecting the first end face and the second end face, of the air outlet part; the airflow can exchange heat with the pressure head when flowing through the air outlet channel so as to transfer heat to the electronic component picked up by the picking-up part. The air outlet is not formed in the end face of the air outlet part, airflow cannot be directly blown to the electronic component when blown out of the air outlet, the electronic component cannot fall off from the picking part, and the material taking and placing effect is guaranteed.

Description

TECHNICAL FIELD

[0001] The utility model relates to test sorting equipment technical field, in particular to a kind of crimping device and test sorting machine. BACKGROUND

[0002] Electronic component (such as chip) before shipment, need to test its performance, and the performance test of electronic component is generally completed on test sorting machine. Test sorting machine has crimping device, when testing electronic component, the pressure head of crimping device picks up electronic component and crimps electronic component on test seat to test.

[0003] Crimping device is equipped with airflow channel, gas flows through airflow channel and exchanges heat with the pressure head of crimping device, thereby controlling the temperature of pressure head, and further controlling the temperature of electronic component in contact with pressure head.

[0004] In traditional technology, when pressure head picks up and places electronic component, if gas flows out through airflow channel to control the temperature of pressure head, gas will blow to the surface of electronic component, giving electronic component a downward blowing force, and electronic component is easy to fall off from pressure head under the action of blowing force. When pressure head picks up and places electronic component, if the gas supply of airflow channel is cut off, pressure head exchanges heat with the surrounding environment during movement, causing the temperature of pressure head to rise, resulting in unstable temperature control of electronic component, which affects test results. UTILITY MODEL CONTENTS

[0005] Therefore, it is necessary to provide a crimping device and test sorting machine capable of improving the above problems.

[0006] A kind of crimping device, comprising:

[0007] Connecting structure is equipped with air inlet channel;

[0008] Pressure head, comprising connection part, gas outlet part and pickup part connected in sequence;The connection part is arranged in the interior of the connecting structure, and the gas outlet part and the pickup part all extend out of the connecting structure;Gas outlet channel is formed in the pressure head and communicated with the air inlet channel;

[0009] The pickup part picks up electronic component through the end face away from the gas outlet part, the gas outlet part has first end face and second end face connected with the connection part and the pickup part respectively, and the gas outlet of the gas outlet channel is arranged on the side face of the gas outlet part for connecting the first end face and the second end face;

[0010] When airflow flows through the gas outlet channel, it can exchange heat with the pressure head to heat the electronic component picked up by the pickup part.

[0011] In one of the embodiments, the air outlet channel has a plurality of air outlet openings, which are arranged on the side surface of the air outlet part.

[0012] In one of the embodiments, the air outlet channel has a plurality of air outlet groups.

[0013] In the connecting direction of the connecting part and the pickup part, each air outlet group includes a plurality of air outlet openings, and each air outlet group is uniformly arranged along a surrounding direction around the connecting direction.

[0014] In one of the embodiments, the connecting structure is made of thermal insulation material.

[0015] In one of the embodiments, the connecting structure includes a shell and a first cover plate, the shell is provided with a mounting cavity with a first opening, and the first cover plate is provided with a through hole.

[0016] The connecting part is arranged in the mounting cavity, the first cover plate is arranged on the shell and closes the first opening, and the pickup part and the air outlet part pass through the through hole.

[0017] The air inlet channel is arranged on the shell.

[0018] In one of the embodiments, the connecting part is provided with a first inner cavity in communication with the air inlet channel, the air outlet part is provided with a second inner cavity, the second inner cavity is in communication with the first inner cavity and the air outlet opening, and the first inner cavity, the second inner cavity and the air outlet opening jointly form the air outlet channel.

[0019] In one of the embodiments, the pressure head further includes a vacuum assembly arranged in the first inner cavity and the second inner cavity.

[0020] The connecting structure, the vacuum assembly and the pickup part jointly form a vacuum air path, a vacuum suction port of the vacuum air path is arranged in the pickup part, and the pickup part absorbs electronic components by vacuum suction.

[0021] In one of the embodiments, the pressure head includes at least one drainage plate arranged in the first inner cavity, each drainage plate extends from one end of the first inner cavity in communication with the air inlet channel to one end of the second inner cavity.

[0022] The drainage plate can exchange heat with the airflow flowing to the first inner cavity and guide the airflow entering the first inner cavity into the second inner cavity.

[0023] In one of the embodiments, the connecting part comprises a connecting plate and a second cover plate, the connecting plate is connected with the air outlet part, and the second cover plate is arranged on the connecting plate to form the first inner cavity together with the connecting plate.

[0024] A test sorting machine comprises a feeding device, a conveying device, a test seat, a collecting device and the crimping device as described above.

[0025] The feeding device is used to provide electronic components to the conveying device, the conveying device is used to convey electronic components between the feeding device and the crimping device, the crimping device is used to pick up electronic components conveyed by the conveying device and crimp them on the test seat for testing, and the conveying device can also convey electronic components after testing to the collecting device for collection.

[0026] The crimping device and the test sorting machine described above, when the pressing head crimps electronic components on the test seat for testing, the airflow flows through the air outlet passage to exchange heat with the pressing head, and the heat is transmitted to the electronic components through the pressing head to preferably control the temperature of the electronic components. At the same time, during the process of picking and placing electronic components by the pressing head, the airflow continuously flows through the air outlet passage to exchange heat with the pressing head, which will not cause the pressing head to exchange heat with the surrounding environment and return to normal temperature, so that the electronic components can still be stably temperature-controlled to ensure the accuracy of the test results. Moreover, since the air outlet of the air outlet passage is arranged on the side surface connecting the first end surface and the second end surface of the air outlet part, i.e., the air outlet is not arranged on the end surface of the air outlet part, the airflow blown out from the air outlet will not directly blow to the electronic components, which will not cause the electronic components to fall off from the pickup part, thereby ensuring the effect of picking and placing materials. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 The structural diagram of the crimping device provided in one embodiment of the present application Figure 1 In the figure, the pickup part picks up electronic components;

[0028] Figure 2 The structural diagram of the crimping device provided in one embodiment of the present application Figure 1 In the figure, the pickup part does not pick up electronic components; Figure 2

[0029] The structural diagram of the crimping device provided in one embodiment of the present application Figure 3 In the figure, the pickup part picks up electronic components; Figure 1

[0030] The structural diagram of the crimping device provided in one embodiment of the present application Figure 4 In the figure, the pickup part picks up electronic components; Figure 1 The structural diagram of the crimping device provided in one embodiment of the present application In the figure, the pickup part picks up electronic components;

[0031] In the figure, the pickup part picks up electronic components; Figure 5 The cross-sectional view of the crimping device provided in one embodiment of the present application crimps the picked electronic components on the test seat;

[0032] Figure 6 For Figure 1 An exploded view of the crimping device shown in FIG.

[0033] Figure 7 For Figure 3 A sectional view of the structure shown in FIG.

[0034] Figure 8 For Figure 4 An exploded view of the ram shown in FIG.

[0035] Figure 9 For Figure 8 A structural view of the ram shown in FIG.

[0036] BRIEF DESCRIPTION OF DRAWINGS

[0037] 100, crimping device; 10, connecting structure; 11, air inlet channel; 12, shell; 121, mounting cavity; 13, first cover plate; 131, through hole; 20, ram; 21, pickup part; 22, connecting part; 221, first inner cavity; 2211, air inlet; 222, connecting plate; 223, second cover plate; 23, air outlet part; 231, second end face; 232, second inner cavity; 24, air outlet channel; 241, air outlet; 25, drainage plate; 26, vacuum assembly; 200, test seat; 201, test cavity; 30, vacuum air path; 300, air outlet gap; 400, electronic component. DETAILED DESCRIPTION

[0038] In order to make the above-mentioned purposes, features and advantages of the present application more apparent and easy to understand, the specific embodiments of the present application will be described in detail below with reference to the drawings. In the following description, many specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a variety of ways other than those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application, so the present application is not limited to the specific embodiments disclosed below.

[0039] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0040] In addition, the terms "first", "second", "third", etc. are used herein for descriptive purposes only and are not to be construed as indicating or implying relative importance or an ordered sequence. Thus, features defined with "first", "second" or "third" can include at least one of the features, explicitly or implicitly. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0041] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0042] In the present application, unless otherwise specifically defined and limited, the first feature is "on" or "under" the second feature. The first and second features can be in direct contact, or the first and second features can be in indirect contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0043] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there can be a middle element. When an element is referred to as "connected to" another element, it can be directly connected to the other element or there can be a middle element. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are for illustrative purposes only and are not the only implementation.

[0044] Referring to Figures 1-3 An embodiment of the present application provides a crimping device 100 for picking up electronic components 400 and capable of crimping the picked-up electronic components 400 on a test seat 200 for testing the electronic components 400. Optionally, the electronic components 400 are chips. Of course, in some other embodiments, the type of electronic components 400 is not limited, such as transistors or diodes.

[0045] With reference to Figure 1 and Figure 2 , the crimping device 100 comprises a connecting structure 10 and a crimping head 20, the crimping head 20 is connected to the connecting structure 10, and the crimping head 20 has a pickup portion 21 for picking up electronic components 400. The connecting structure 10 is connected to a driving assembly, and the driving assembly is used to drive the connecting structure 10 to move, so that the pickup portion 21 crimps the picked-up electronic components 400 on the test seat 200 for testing. In some embodiments, the crimping device 100 comprises the above-mentioned driving assembly, that is, the driving assembly belongs to the part of the crimping device 100, and the driving assembly of the crimping device 100 drives the connecting structure 10 to move, and the connecting structure 10 drives the pickup portion 21 to move, and crimps the electronic components 400 on the test seat 200. In other embodiments, the driving assembly can also be an external structure of the crimping device 100, that is, the external driving assembly drives the connecting structure 10 to move, and crimps the electronic components 400 on the test seat 200.

[0046] The driving assembly is connected to a mechanical arm, and the mechanical arm can drive the driving assembly to move, and the driving assembly drives the crimping device 100 to move, so as to transfer the electronic components 400 from one position to another position, facilitating the testing of the electronic components 400.

[0047] Further, with reference to Figure 4 , the crimping head 20 further comprises a connecting portion 22 and an air outlet portion 23, and the connecting portion 22, the air outlet portion 23 and the pickup portion 21 are connected in sequence. Alternatively, the connecting portion 22, the air outlet portion 23 and the pickup portion 21 are connected in sequence along a first direction, and the first direction is parallel to the crimping direction in which the connecting structure 10 drives the pickup portion 21 to move to crimp the electronic components 400 on the test seat 200. The connecting portion 22 is arranged inside the connecting structure 10, and the air outlet portion 23 and the pickup portion 21 both extend out of the connecting structure 10. Since the connecting portion 22 is arranged inside the connecting structure 10, the connecting structure 10 plays a role of protecting the crimping head 20.

[0048] With reference to Figure 5 , the connecting structure 10 is provided with an air inlet channel 11, and the crimping head 20 is formed with an air outlet channel 24 in communication with the air inlet channel 11, and the air inlet channel 11 and the air outlet channel 24 jointly form an air flow channel. The air outlet channel 24 in the crimping head 20 is in communication with the air source through the air inlet channel 11 on the connecting structure 10, and compared with the mode in which the air outlet channel 24 is in communication with the air source through a copper pipe and a corrugated pipe, the internal space of the machine is released, and the use of the pipeline is reduced, not only reducing the cost of the pipeline, but also reducing the risk of leakage caused by repeated bending of the pipeline.

[0049] With reference to Figure 2The air outlet 23 has a first end surface and a second end surface 231 connected with the connecting portion 22 and the pickup portion 21 respectively, and the air outlet 241 of the air outlet channel 24 is arranged on a side surface of the air outlet 23 connecting the first end surface and the second end surface 231. The pickup portion 21 picks up the electronic component 400 through the end surface away from the air outlet 23. Specifically, the first end surface and the second end surface 231 are respectively the end surfaces of the air outlet 23 at two ends in the first direction, and the side surface is the surface connecting the first end surface and the second end surface 231. When the air outlet 23 is in a columnar shape, the side surface is the circumferential surface of the air outlet 23.

[0050] The gas flow can exchange heat with the pressure head 20 when flowing through the air outlet channel 24, so as to transfer heat to the electronic component 400 picked up by the pickup portion 21, thereby controlling the temperature of the electronic component 400. Optionally, the gas flow flowing in the gas flow channel can be a hot gas flow or a cold gas flow. When the gas flow is a hot gas flow, the temperature of the pressure head 20 increases after heat exchange. When the gas flow is a cold gas flow, the temperature of the pressure head 20 decreases after heat exchange. Generally, the crimping device 100 further comprises a heating member arranged in the pressure head 20, for heating the pressure head 20. At this time, the cold gas flow and the heating member control the temperature of the pressure head 20 through cold and hot confrontation, thereby precisely controlling the temperature of the electronic component 400.

[0051] The crimping device 100 provided by the embodiment of the present application can exchange heat between the gas flow and the pressure head 20 when the gas flow flows through the air outlet channel 24 during the process that the pressure head 20 tests the electronic component 400 crimped on the test seat 200. The heat is transferred to the electronic component 400 through the pressure head 20, so as to preferably control the temperature of the electronic component 400. At the same time, the gas flow can continuously exchange heat with the pressure head 20 through the air outlet channel 24 during the process that the pressure head 20 picks up and places the electronic component 400, so as to not cause the pressure head 20 to exchange heat with the surrounding environment and return to the normal temperature, and still stably control the temperature of the electronic component 400, thereby ensuring the accuracy of the test result. Moreover, since the air outlet 241 of the air outlet channel 24 is arranged on the side surface of the air outlet 23 connecting the first end surface and the second end surface 231, that is, the air outlet 241 is not arranged on the end surface of the air outlet 23, the gas flow blown out from the air outlet 241 will not directly blow to the electronic component 400, so as to not cause the electronic component 400 to fall off from the pickup portion 21, thereby ensuring the pick-and-place effect.

[0052] Optionally, the direction in which the gas flow is blown out from the air outlet 241 is parallel to the plane in which the electronic component 400 is located, so as to ensure that the gas flow will not blow to the electronic component 400, thereby not causing the electronic component 400 to fall off from the pickup portion 21, and ensuring the pick-and-place effect.

[0053] In some embodiments, continuing to refer to Figure 2The air outlet passage 24 has a plurality of air outlet openings 241 which are arranged on the side surface of the air outlet portion 23. By arranging the plurality of air outlet openings 241, the air flow in the air flow passage can be increased, and the heat exchange effect between the air flow and the pressure head 20 can be improved, so as to control the temperature of the electronic components 400.

[0054] Optionally, the air outlet passage 24 has a plurality of groups of air outlet openings. In the connecting direction of the connecting portion 22 and the pickup portion 21, i.e. in the first direction, each group of air outlet openings 241 includes a plurality of air outlet openings 241, and each group of air outlet openings is uniformly arranged along a surrounding direction which surrounds the connecting direction. In this way, the number of air outlet openings 241 can be further increased, the air flow in the air flow passage can be further increased, and the heat exchange effect between the air flow and the pressure head 20 can be further improved, so as to control the temperature of the electronic components 400.

[0055] In some embodiments, the connecting structure 10 is made of a heat preservation material, so as to preserve the temperature of the pressure head 20, reduce the heat exchange between the hot gas in the pressure head 20 and the external environment, and thus reduce the energy consumption.

[0056] Referring to Figure 6 and Figure 7 The connecting structure 10 includes a housing 12 and a first cover plate 13 which are arranged separately. The housing 12 is provided with a mounting cavity 121 having a first opening, and the first cover plate 13 is provided with a through hole 131. The connecting portion 22 is arranged in the mounting cavity 121, the first cover plate 13 is arranged on the housing 12 and covers the first opening, and the pickup portion 21 and the air outlet portion 23 pass through the through hole 131. The air inlet passage 11 is arranged on the housing 12. In this way, the connecting portion 22 can be conveniently arranged in the connecting structure 10, and the pickup portion 21 and the air outlet portion 23 can conveniently extend out of the connecting structure 10.

[0057] It should be understood that in other embodiments, the connecting structure 10 can also be arranged in other manners, as long as the connecting structure 10 can be assembled with the pressure head 20 and does not interfere with the arrangement of the pressure head 20.

[0058] In some specific embodiments, the housing 12 is a hollow cuboid structure with one end open, and the first cover plate 13 is a flat plate. When the first cover plate 13 is arranged on the housing 12, the connecting structure 10 forms a hollow cuboid.

[0059] Of course, in other specific embodiments, the shapes of the housing 12 and the first cover plate 13 are not limited.

[0060] In some embodiments, referring to Figure 5 and Figure 8The connecting portion 22 is provided with a first inner cavity 221, and the air outlet portion 23 is provided with a second inner cavity 232. The first inner cavity 221 is in communication with the air inlet channel 11, and the second inner cavity 232 is in communication with the first inner cavity 221 and the air outlet 241. The first inner cavity 221, the second inner cavity 232 and the air outlet 241 jointly form an air outlet channel 24. Referring to Figure 8 and Figure 9 The pressure head 20 further comprises a flow guide plate 25 arranged in the first inner cavity 221. The flow guide plate 25 can exchange heat with the air flow flowing into the first inner cavity 221 and guide the air flow flowing into the first inner cavity 221 into the second inner cavity 232.

[0061] Since the first inner cavity 221 is arranged in the connecting portion 22 and the second inner cavity 232 is arranged in the air outlet portion 23, the air flow flowing into the first inner cavity 221 and the second inner cavity 232 can exchange heat with the connecting portion 22 and the air outlet portion 23 respectively, so as to conduct more heat to the pressure head 20. Meanwhile, since the flow guide plate 25 is arranged in the first inner cavity 221, the flow guide plate 25 can not only increase the heat exchange area with the air flow, so as to conduct more heat to the pressure head 20, but also guide the air flow in the first inner cavity 221 into the second inner cavity 232, so as to make the air flow flow smoothly in the air outlet channel 24.

[0062] Optionally, the pickup portion 21 is opposite to the second inner cavity 232, and the second inner cavity 232 is opposite to the middle part of the first inner cavity 221. In this way, the air flow flowing into the first inner cavity 221 is gathered to the middle part under the action of the flow guide plate 25 and flows into the second inner cavity 232. When the air flow flows into the second inner cavity 232, since the pickup portion 21 is opposite to the second inner cavity 232, the heat of the air outlet portion 23 is easily conducted to the pickup portion 21 to control the temperature of the electronic components 400.

[0063] Continuously referring to Figure 8 The first inner cavity 221 has an air inlet 2211 in communication with the air inlet channel 11, and the pressure head 20 comprises a plurality of flow guide plates 25. Each flow guide plate 25 extends from one end of the first inner cavity 221 having the air inlet 2211 to one end of the first inner cavity 221 in communication with the second inner cavity 232, so as to improve the flow guiding effect of the flow guide plate 25. Optionally, the flow guide plate 25 is in an arc shape, so as to more smoothly guide the air flow in the first inner cavity 221 into the second inner cavity 232.

[0064] It should be noted that when the pressure head 20 comprises a plurality of flow guide plates 25, a flow channel is formed between the adjacent two flow guide plates 25 and between the flow guide plate 25 and the cavity wall of the first inner cavity 221. The air flow flows into the flow channel through the air inlet 2211 of the first inner cavity 221 and flows into the second inner cavity 232 through the flow channel. When the pressure head 20 comprises only one flow guide plate 25, a flow channel is formed between the flow guide plate 25 and the cavity wall of the first inner cavity 221.

[0065] In some embodiments, referring back to Figure 8 The connecting portion 22 includes a connecting plate 222 and a second cover plate 223. The connecting portion 22 is connected to the air outlet portion 23. The second cover plate 223 is arranged on the connecting plate 222 and forms a first inner cavity 221 together with the connecting plate 222. In this way, the first inner cavity 221 is easy to form, and the drainage plate 25 is easy to arrange.

[0066] In some embodiments, the connecting plate 222, the air outlet portion 23, the pickup portion 21, and the drainage plate 25 are integrally formed. In other embodiments, the connecting plate 222, the air outlet portion 23, the pickup portion 21, and the drainage plate 25 can be separately manufactured and then assembled together.

[0067] In some embodiments, the pressure head 20 further includes a vacuum assembly 26 arranged in the first inner cavity 221 and the second inner cavity 232. Specifically, the vacuum assembly 26 has a columnar structure and extends in the first direction. The drainage plate 25 surrounds the vacuum assembly 26. The connecting structure 10, the vacuum assembly 26, and the pickup portion 21 form a vacuum air path 30. The vacuum suction port of the vacuum air path 30 is arranged on the pickup portion 21. The pickup portion 21 picks up the electronic component 400 by vacuum suction.

[0068] It is conceivable that in other embodiments, the pickup portion 21 can pick up the electronic component 400 by a non-vacuum suction method, such as by clamping.

[0069] Another embodiment of the present application further provides a test handler including a feeding device, a conveying device, the test seat 200, a collecting device, and the above-mentioned crimping device 100.

[0070] The feeding device is used to provide the electronic component 400 to the conveying device. The conveying device is used to convey the electronic component 400 between the feeding device and the crimping device 100. The crimping device 100 is used to pick up the electronic component 400 conveyed by the conveying device and crimp the electronic component 400 on the test seat 200 for testing. The conveying device can further convey the tested electronic component 400 to the collecting device for collection. Since the above-mentioned crimping device 100 has the beneficial effects, the test handler including the above-mentioned crimping device 100 has the same beneficial effects, which will not be described in detail here.

[0071] Specifically, the test seat 200 has a test cavity 201, when the pressure head 20 is pressed on the electronic component 400, the outlet part 23 and the pickup part 21 are both accommodated into the test cavity 201. At this time, the gas flow flowing out of the outlet 241 enters the test cavity 201, reducing the temperature difference between the surrounding environment and the pressure head 20, so as to facilitate the temperature control of the electronic component 400. The outlet gap 300 is formed between the connecting structure 10 and the test seat 200, and the gas flow in the test cavity 201 can flow out through the outlet gap 300, so that the gas flow can continuously flow out through the outlet 241, ensuring the temperature control effect of the electronic component 400.

[0072] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, all possible combinations of the technical features in the above-described embodiments are not described, but as long as the combinations of the technical features do not contradict, they should be considered within the scope of the present disclosure.

[0073] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the present application. It should be pointed out that for those skilled in the art, without departing from the concept of the present application, some modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. A crimping device characterized by, The utility model relates to a kind of electronic component pick-up device, including: Connecting structure (10) is equipped with air inlet channel (11); Pressure head (20) includes sequentially connected connecting portion (22), air outlet portion (23) and pickup portion (21);The connecting portion (22) is located in the inside of the connecting structure (10), and the air outlet portion (23) and the pickup portion (21) both extend outside the connecting structure (10);Air outlet channel (24) is formed on the pressure head (20) and is communicated with the air inlet channel (11); The pickup portion (21) picks up electronic component (400) by the end face away from the air outlet portion (23), and the air outlet portion (23) has first end face and second end face (231) connected with the connecting portion (22) and the pickup portion (21) respectively, and the air outlet (241) of the air outlet channel (24) is located on the side of the air outlet portion (23) for connecting the first end face and the second end face (231); Air flow can exchange heat with the pressure head (20) when flowing through the air outlet channel (24), to heat to the electronic component (400) picked up by the pickup portion (21).

2. The crimping device of claim 1, wherein The air outlet channel (24) has a plurality of air outlet openings (241), and the plurality of air outlet openings (241) are spaced apart on the side of the air outlet portion (23).

3. The crimping device of claim 2, wherein The air outlet channel (24) has a plurality of air outlet groups; In the connecting direction of the connecting portion (22) and the pickup portion (21), each air outlet group includes a plurality of air outlet openings (241), and each air outlet group is uniformly spaced along a surrounding direction around the connecting direction.

4. The crimping device of claim 1, wherein The connecting structure (10) is made of thermal insulation material.

5. The crimping device of claim 1, wherein The connecting structure (10) includes a housing (12) and a first cover plate (13) arranged separately, the housing (12) is provided with a mounting cavity (121) having a first opening, and the first cover plate (13) is provided with a through hole (131); The connecting portion (22) is arranged in the mounting cavity (121), the first cover plate (13) is arranged on the housing (12) and covers the first opening, and the pickup portion (21) and the air outlet portion (23) pass through the through hole (131); The air inlet channel (11) is arranged on the housing (12).

6. Crimping device according to any one of claims 1-5, characterized in that The connecting portion (22) is provided with a first inner cavity (221) communicated with the air inlet channel (11), the air outlet portion (23) is provided with a second inner cavity (232), the second inner cavity (232) communicates the first inner cavity (221) and the air outlet (241), and the first inner cavity (221), the second inner cavity (232) and the air outlet (241) jointly form the air outlet channel (24).

7. The crimping device of claim 6, wherein The pressure head (20) further includes a vacuum assembly (26), and the vacuum assembly (26) is arranged in the first inner cavity (221) and the second inner cavity (232). The connecting structure (10), the vacuum assembly (26) and the pickup part (21) jointly form a vacuum air path (30), a vacuum suction port of the vacuum air path (30) is arranged on the pickup part (21), and the pickup part (21) is used for sucking the electronic component (400) by vacuum suction.

8. The crimping device of claim 6, wherein, The pressure head (20) comprises at least one drainage plate (25) arranged in the first inner cavity (221), each drainage plate (25) extends from one end of the first inner cavity (221) communicated with the air inlet channel (11) to the other end communicated with the second inner cavity (232). The drainage plate (25) can exchange heat with the air flow flowing to the first inner cavity (221) and is used for guiding the air flow entering the first inner cavity (221) into the second inner cavity (232).

9. The crimping device of claim 6, wherein, The connecting part (22) comprises a connecting plate (222) and a second cover plate (223), the connecting plate (222) is connected with the air outlet part (23), and the second cover plate (223) is arranged on the connecting plate (222) to jointly form the first inner cavity (221) with the connecting plate (222).

10. A test handler characterized by, The device comprises a feeding device, a conveying device, a test seat (200), a collecting device and the crimping device according to any one of claims 1-9. The feeding device is used for providing the electronic component (400) to the conveying device, the conveying device is used for conveying the electronic component (400) between the feeding device and the crimping device, the crimping device is used for picking up the electronic component (400) conveyed by the conveying device and crimping the electronic component (400) on the test seat (200) for testing, and the conveying device can also convey the electronic component (400) after testing to the collecting device for collection.

Images