Chip pin testing device

By designing a chip pin testing device, and utilizing a combination of clamping posts, damping shafts, and baffles, the problem that existing chip clamps cannot adapt to different sizes is solved, achieving stable clamping and protection of chip pins and avoiding pin deformation and damage.

CN223582085UActive Publication Date: 2025-11-21WUXI FUTURE SEMICON CO LTD
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Patent Information

Application Number
CN202423055669.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-11
Publication Date
2025-11-21
Estimated Expiration
2034-12-11

AI Technical Summary

Technical Problem

Existing chip fixtures cannot be flexibly adjusted to accommodate different chip sizes, and handheld multimeter testing can easily lead to pin deformation or damage.

Method used

A chip pin testing device was designed, including a first cover plate, a second cover plate, a base plate and a conductive metal plate. Through the combination of a clamping post, a damping shaft and a baffle, it can flexibly clamp and protect chips of different models, and avoid the test probes from directly contacting the pins.

Benefits of technology

It achieves stable clamping of the pins of different chip models, avoiding pin deformation and damage, and improving test adaptability and reliability.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of chip testing, in particular to a chip pin testing device which comprises a first cover plate and a second cover plate, a first bottom plate is hinged to the lower end of the first cover plate, a second bottom plate is hinged to the lower end of the second cover plate, and conductive metal plates are embedded in one side of the front end face of the first cover plate and one side of the front end face of the second cover plate. First springs are fixedly connected to the lower ends of the conductive metal plates, one ends of the first springs are fixed to one side of the first cover plate and one side of the second cover plate, connecting plates are embedded in the middle of one side of the first bottom plate and the middle of one side of the first cover plate, and one sides of the two connecting plates are fixedly connected to one side of the second bottom plate and one side of the second cover plate correspondingly; second hole grooves are evenly formed in the middle of the front end face of the connecting plate, clamping columns are embedded in the centers of the corners of the sides, away from each other, of the first cover plate and the first bottom plate, the distance between the first bottom plate and the second bottom plate is adjusted by pulling the clamping columns, and a chip is conveniently and flexibly clamped to test chip pins.
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Description

TECHNICAL FIELD

[0001] The utility model relates to chip testing technical field, specifically a kind of chip pin testing device. BACKGROUND

[0002] Chip pin is the metal pin on chip for connecting external circuit or device, these pins are usually located at the external edge of chip, the number and arrangement of chip pin depend on the packaging type and functional requirement of chip, through these pins, chip can be connected with external circuit or device, realize data transmission, control signal transmission function, chip pin testing device is a kind of equipment for testing the function and performance of chip pin, by connecting chip pin and testing fixture, then by testing instrument and test software are tested, to verify the connectivity, electrical characteristics and function of chip pin.

[0003] Chip and its pin are usually inconvenient to test due to small size, existing chip pin testing device is usually customized chip clamp according to chip size, chip is placed in chip clamp, at the same time, artificial hand-held multimeter connector is contacted with evenly arranged pin on both sides of chip one by one, and the connectivity of chip pin is determined by viewing multimeter data when contacting.

[0004] Existing chip clamp is usually customized clamp according to chip model, there may be no flexible adjustment of chip clamp according to chip thickness and size, and the method of handheld multimeter detection may cause pin deformation due to improper operation, which is easy to affect chip in use, therefore, a kind of chip pin testing device is proposed for the above problems. UTILITY MODEL CONTENT

[0005] In order to make up for the shortcomings of the prior art, in view of the problems existing in the prior art, the utility model provides a kind of chip pin testing device.

[0006] The utility model discloses a technical scheme that solves its technical problem adopts a kind of chip pin testing device, it include: first cover plate and second cover plate, the first cover plate lower end is hinged with first bottom plate, the second cover plate lower end is hinged with second bottom plate, the first bottom plate and second bottom plate upper end face one side are evenly provided with plate groove, the plate groove inside one side is fixed with damping pivot, the damping pivot is fixed with baffle, the first cover plate and second cover plate front end face one side are embedded with conductive metal plate, the conductive metal plate lower end is fixedly connected with first spring, the first spring one end is fixed on the first cover plate and second cover plate one side, the first cover plate and second cover plate opposite side are fixed with two spring plates, the first bottom plate and first cover plate one side middle part position are embedded with connecting plate, two the connecting plate one side is fixedly connected in second bottom plate and second cover plate one side, the connecting plate front end face middle part is evenly provided with second hole slot, the first cover plate and first bottom plate mutually distant one side corner center is embedded with clamping column, first cover plate and first bottom plate hinged connection, second cover plate and second bottom plate hinged connection, first cover plate and second cover plate, first bottom plate and second bottom plate are connected through connecting plate, by pulling clamping column, clamping column is pulled out from second hole slot, first bottom plate and second bottom plate are pulled out simultaneously, according to the first chip size size flexible fixing various models first chip, by the first hole slot of the lower end of conductive metal plate, not only convenient for testing the first pin of first chip both sides, while avoiding the deformation and fracture of first pin.

[0007] Preferably, the first bottom plate and the second bottom plate are embedded with a first chip in the middle, the first chip is evenly fixed with a first pin on both sides, the first pin is embedded between the evenly arranged baffles, the evenly arranged baffles are used to space apart the evenly arranged first pins, which can protect the first pins from being deformed due to improper placement and facilitate the testing of the first pins.

[0008] Preferably, the lower end of the conductive metal plate is provided with a first hole slot, and a multimeter test needle is inserted into the first hole slot for testing to avoid damaging the first pin due to improper operation.

[0009] Preferably, the first bottom plate and the second bottom plate are fixed with a support plate on the opposite side, and the support plate is designed in a stair shape to better fit the convex first pin.

[0010] Preferably, the two clamping columns are provided with a ring buckle on the outer side shaft, which is used to adjust the distance between the first bottom plate and the second bottom plate, the first cover plate and the second cover plate, and the ring buckle on the upper end of the first cover plate is buckled on the clamping column on the side of the first bottom plate to fix the chip.

[0011] Preferably, two said clamping columns are sleeved with lug springs on the shafts inside the first bottom plate and the first cover plate, and the lug springs facilitate the clamping columns to be clamped with the second hole slots on the connecting plate after being pulled.

[0012] The utility model discloses the beneficial effect lies in: through the connecting plate, the distance between the first cover plate and the second cover plate, the first bottom plate and the second bottom plate is conveniently adjusted, and the chips of different models and thicknesses are conveniently clamped, and the number of the baffle that stands up is conveniently adjusted through the damping pivot and the plate groove, the adaptability of testing the pins of different models of chips in different arrangements is increased, the test needle of the multimeter is inserted into the first hole slot on the conductive metal plate, direct contact of the test needle with the first pin is avoided, improper operation causes the first pin to be damaged is avoided, different model chips pins are conveniently tested, and the chips pins are better protected from being damaged. BRIEF DESCRIPTION OF DRAWINGS

[0013] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained according to these drawings without the creative labor.

[0014] Figure 1 It is the side view schematic diagram of the utility model;

[0015] Figure 2 It is the side view schematic diagram of the utility model;

[0016] Figure 3 It is the half cut schematic diagram of the first cover plate and the first bottom plate of the utility model;

[0017] Figure 4 It is the utility model Figure 2 The enlarged schematic diagram of A in the utility model;

[0018] Figure 5 It is the utility model Figure 3 The enlarged schematic diagram of B in the utility model.

[0019] Legend:

[0020] 1, the first cover plate;2, the second cover plate;3, the first bottom plate;4, the second bottom plate;5, the first chip;6, the first pin;7, the support plate;8, the baffle;9, the conductive metal plate;10, the first hole slot;11, the spring pressing plate;12, the connecting plate;13, the clamping column;14, the ring buckle;15, the lug spring;16, the second hole slot;17, the damping pivot;18, the plate groove;19, the first spring. DETAILED DESCRIPTION

[0021] Clearly, the described embodiments are merely a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0022] Please refer to Figures 1-5 As shown in FIG. 1, a chip pin testing device comprises a first cover plate 1 and a second cover plate 2, the lower end of the first cover plate 1 is hingedly connected with a first bottom plate 3, the lower end of the second cover plate 2 is hingedly connected with a second bottom plate 4, the upper end face of the first bottom plate 3 and the second bottom plate 4 is uniformly provided with a plate slot 18 on one side, a damping rotating shaft 17 is fixedly arranged in the plate slot 18 on one side, a baffle 8 is fixedly arranged on the damping rotating shaft 17, a conductive metal plate 9 is embeddedly arranged on the front end face of the first cover plate 1 and the second cover plate 2 on one side, a first spring 19 is fixedly connected with the lower end of the conductive metal plate 9, one end of the first spring 19 is fixed on one side of the first cover plate 1 and the second cover plate 2, two spring pressing plates 11 are fixed on the opposite side of the first cover plate 1 and the second cover plate 2, a connecting plate 12 is embeddedly arranged in the middle position of one side of the first bottom plate 3 and the first cover plate 1, the connecting plate 12 is fixedly connected with one side of the second bottom plate 4 and the second cover plate 2 respectively, a second hole slot 16 is uniformly provided in the front end face of the connecting plate 12, a clamping column 13 is embeddedly arranged in the center of the side corner of the opposite side of the first cover plate 1 and the first bottom plate 3.

[0023] When performing chip pin testing, pull the locking post 13 to separate the first base plate 3 and the second base plate 4, the first cover plate 1 and the second cover plate 2. Adjust the size of the grooves in the middle of the first base plate 3 and the second base plate 4 according to the size of the first chip 5. When adjusted to a suitable size, two protrusions are fixed on the shaft of the locking post 13. These protrusions engage with the outermost annular holes of the lug spring 15. Under the rebound of the lug spring 15, the locking post 13 engages with the second slot 16 evenly spaced on one side of the connecting plate 12. Based on the number of first pins 6 on both sides of the first chip 5 and the teaching aids, flexibly adjust the number of upright baffles 8 by rotating the damping shaft 17 through the plate slot 18. The baffles 8 and the support plate 7 provide horizontal and vertical support for the first pins 6, preventing deformation of the first pins 6 during testing. The first cover plate 1 and the second cover plate 2 are closed, and the ring 14 of the upper end of the first cover plate 13 is fitted onto the clamping post 13 on one side of the front end face of the first base plate 3. The first chip 5 is pressed by the spring pressure plate 11, forming a stable clamping of the first chip 5. The conductive metal plate 9 is staggered with the baffle 8. The conductive metal plate 9 is set on the upper end of the first pin 6. The first pin 6 is tested by inserting the multimeter test probe into the first hole 10 opened in the conductive metal plate 9. The connecting plate 12 facilitates flexible adjustment of the clamping of the first chip 5, increasing the suitability for testing different types of chips. By inserting the multimeter test probe into the first hole 10 on the conductive metal plate 9, the test probe is prevented from directly contacting the first pin 6, avoiding damage to the first pin 6 due to improper operation.

[0024] A first chip 5 is embedded in the middle of the first base plate 3 and the second base plate 4. First pins 6 are evenly fixed on both sides of the first chip 5. The first pins 6 are embedded between evenly arranged baffles 8. The evenly arranged baffles 8 keep the evenly arranged first pins 6 apart from each other, which protects the first pins 6 from deformation due to improper placement and facilitates testing of the evenly arranged first pins 6. The lower end of each conductive metal plate 9 is provided with a first hole groove 10. By closing the first cover plate 1 and the first base plate 3, the evenly arranged conductive metal plates 9 are staggered on the first pins 6 between the baffles 8. The first spring 19 keeps the conductive metal plates 9 in stable contact with the first pins 6. When testing the first pins 6, the multimeter test probe is inserted into the first hole groove 10 to avoid direct contact between the test probe and the first pins 6, thus avoiding damage to the first pins 6 due to improper operation. Support plates 7 are fixed on opposite sides of the first base plate 3 and the second base plate 4. The support plates 7 are designed in a staircase shape to better fit the convex first pins 6.

[0025] Two clamping columns 13 are provided with ring buckles 14 on the shafts outside the first bottom plate 3 and the first cover plate 1, which are convenient for pulling the clamping columns 13 to adjust the distance between the first bottom plate 3 and the second bottom plate 4 and the distance between the first cover plate 1 and the second cover plate 2, and when the first cover plate 1 and the first bottom plate 3 need to be closed, the ring buckle 14 on the clamping column 13 at the upper end of the first cover plate 1 is buckled on the clamping column 13 at one side of the first bottom plate 3 to form a closed clamping action on the first chip 5. Two clamping columns 13 are provided with hanging ear springs 15 on the shafts inside the first bottom plate 3 and the first cover plate 1, the shafts of the clamping columns 13 are fixed with two protruding columns, one end of the hanging ear spring 15 is fixedly connected with the inside of the first bottom plate 3, and the other end is fixed with two ring holes. The protruding columns on the clamping column 13 are connected with the outermost ring holes of the hanging ear spring 15, and the clamping column 13 is clamped in the second hole groove 16 uniformly opened on one side of the connecting plate 12 under the rebound of the hanging ear spring 15. The clamping column 13 is clamped in the second hole groove 16 on one side of the connecting plate 12 under the rebound of the hanging ear spring 15.

[0026] Working principle: when testing the chip pins, pull the clamping column 13 to separate the first bottom plate 3 and the second bottom plate 4 and the first cover plate 1 and the second cover plate 2, flexibly adjust the size of the recess in the middle of the first bottom plate 3 and the second bottom plate 4 according to the size of the first chip 5, adjust to the appropriate size, the shafts of the clamping columns 13 are fixed with two protruding columns, the protruding columns are connected with the outermost ring holes of the hanging ear spring 15, and the clamping column 13 is clamped in the second hole groove 16 uniformly opened on one side of the connecting plate 12 under the rebound of the hanging ear spring 15. According to the number of first pins 6 on both sides of the first chip 5 and the teaching aid, the number of vertical baffles 8 is flexibly adjusted by rotating the damping shaft 17 through the plate groove 18, the baffles 8 and the support plates 7 horizontally and vertically support the first pins 6 to avoid deformation of the first pins 6 during testing. At the same time, the first cover plate 1 and the second cover plate 2 are closed, the ring buckle 14 of the clamping column 13 at the upper end of the first cover plate 1 is sleeved on the clamping column 13 at one side of the front end surface of the first bottom plate 3, the first chip 5 is extruded by the spring pressing plate 11 to form a stable clamping on the first chip 5. The conductive metal plate 9 is arranged on the upper end of the first pin 6, and the test needle of the multimeter is inserted into the first hole groove 10 of the conductive metal plate 9 to test the first pin 6. The connecting plate 12 is convenient for flexibly adjusting the clamping of the first chip 5, and the adaptability to different types of chips is increased. By inserting the test needle of the multimeter into the first hole groove 10 on the conductive metal plate 9, the test needle is prevented from directly contacting the first pin 6, and the first pin 6 is prevented from being damaged due to improper operation.

[0027] In the description of the specification, the description of the terms "one embodiment", "an example", "a specific example" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the utility model. In the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0028] The basic principle, main features and advantages of the utility model are shown and described above. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and the description in the specification are only to illustrate the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model can also have various changes and improvements, and these changes and improvements all fall within the scope of the utility model claimed.

Claims

1. A chip pin testing apparatus, characterized by: The utility model provides a cover plate (1) and second cover plate (2) including, first cover plate (1) lower end hinged first bottom plate (3), second cover plate (2) lower end hinged second bottom plate (4), first bottom plate (3) and second bottom plate (4) upper end face one side all even all set up board groove (18), board groove (18) inside one side all are fixed with damping pivot (17), damping pivot (17) are fixed with baffle (8), first cover plate (1) and second cover plate (2) front end face one side all embed and set up conductive metal plate (9), the conductive metal plate (9) lower end all are fixedly connected with first spring (19), first spring (19) one end is fixed on first cover plate (1) and second cover plate (2) one side, first cover plate (1) and second cover plate (2) opposite one side all are fixed with two spring pressure plates (11), first bottom plate (3) and first cover plate (1) one side middle part position all embed and set up connecting plate (12), two connecting plate (12) one side are fixedly connected in second bottom plate (4) and second cover plate (2) one side respectively, connecting plate (12) front end face middle part all even set up second hole groove (16), first cover plate (1) and first bottom plate (3) mutually far away one side edge corner center embed and set up clamping column (13).

2. The chip pin testing device according to claim 1, wherein: First bottom plate (3) and second bottom plate (4) middle part embed first chip (5), first chip (5) both sides all even fixed with first pin (6), first pin (6) embed in even arranged baffle (8) between.

3. The chip pin testing apparatus of claim 1, wherein: The conductive metal plate (9) lower end all are penetrated and set up first hole groove (10).

4. The chip pin testing apparatus of claim 1, wherein: First bottom plate (3) and second bottom plate (4) opposite one side all are fixed with support plate (7).

5. The chip pin testing apparatus of claim 1, wherein: Two clamping columns (13) are located on the outer side of the shaft of the first bottom plate (3) and the first cover plate (1) and are penetrated by a ring buckle (14).

6. The chip pin testing apparatus of claim 1, wherein: Two clamping columns (13) are located on the inner side of the shaft of the first bottom plate (3) and the first cover plate (1) and are sleeved with a hanging ear spring (15).