Visible light and laser integrated imaging device

Abstract

The utility model relates to the technical field of optical imaging, in particular to a visible light and laser integrated imaging device, which comprises a mounting frame, a laser transmitting module and an imaging module, and the imaging module comprises a spectroscope group, a common lens group, a laser receiving module and a visible light receiving module. An imaged object reflects dot matrix laser cloud emitted by the laser emitting module to a shared light path of the imaging module, the spectroscope group can divide incident light in the shared light path into laser beams and visible light beams, and the laser beams and the visible light beams are respectively received by the laser receiving module and the visible light receiving module to form images. According to the imaging device provided by the utility model, laser imaging and visible light imaging are integrated on the same imaging device through the spectroscope group, so that the structure is simplified, the size is reduced, and meanwhile, the imaging area error between the visible light imaging and the laser imaging is eliminated.

Description

TECHNICAL FIELD

[0001] The utility model relates to optical imaging technical field, specifically provide a visible light and laser integrated imaging device. BACKGROUND

[0002] The development of laser radar technology can be traced back to the 1960s, initially used for ocean depth measurement. With the development of global positioning system (GPS) and inertial navigation system (INS), laser radar technology has made significant progress in precise real-time positioning and attitude determination, and since the late 1990s, laser radar has been applied to land terrain survey, and with the progress of technology, its application field is expanding, including but not limited to autonomous vehicles, terrain mapping, forestry, agriculture, environmental research and protection, urban planning and management, archaeology, disaster management and emergency response and aerospace, etc.

[0003] The existing technical solutions of laser radar mainly include the following types:

[0004] Mechanical laser radar: the receiving and transmitting array is driven by a motor to rotate as a whole, realizing the rotation of the space horizontal 360° field of view. This scheme is widely used in the field of unmanned driving, but due to its internal mechanical structure, it leads to large product size, high maintenance cost and short service life.

[0005] Hybrid solid-state laser radar: including rotating mirror type and micro-electro-mechanical system (MEMS) technology mirror scheme. Rotating mirror type scheme rotates the mirror surface by motor to realize laser scanning, and MEMS mirror scheme integrates micro mirror on chip to realize scanning by chip control mirror reciprocating motion. Hybrid solid-state laser radar is easier to control in cost and volume, suitable for mass production in automotive field. But its system complexity is high, leading to high cost, stability and reliability are not as good as mechanical laser radar.

[0006] All-solid-state laser radar: including single photon avalanche diode direct time of flight laser radar (SPADOT, SPAD-based Direct Time of Flight Lidar) and optical phased array laser radar (OPA, Optical Phased Array) and the like. The SPADOT laser radar is a laser radar using a single photon avalanche diode (SPAD, Single Photon Avalanche Diode) as a photosensitive device, which converts the distance of photon flight by directly measuring the time of flight (ToF, Time of Flight) of the photon, thereby realizing high-precision 3D imaging and ranging. The OPA laser radar controls the light beam by controlling the phase and amplitude of the light emitted by the element array to realize scanning. The all-solid-state laser radar has no moving parts inside, is more stable and reliable, but the current technical maturity is low.

[0007] In the existing laser radar system, the image acquisition device has low integration, laser receiving and visible light receiving are often designed with independent lenses, multiple devices need to be used jointly to achieve the effect, laser and visible light use separate optical systems, occupy a large space, and a single laser radar needs to detect a large scene with rich content, which often requires more energy consumption.

[0008] When laser receiving and visible light receiving are designed with independent lenses, in the case of more accurate depth information and image information discrimination in space, the relative position error of laser receiving and visible light receiving often leads to imaging information error, and part of the information can be compensated by algorithm, but the compensation algorithm is long, complex and professional, and cannot completely compensate for the error. Practical new type content

[0009] The utility model discloses a visible light and laser integrated imaging device, which integrates laser imaging and visible light imaging in the same imaging device, so that the same optical path is shared by the two, the overall size is reduced, the structure is simplified, and the imaging area error between visible light imaging and laser imaging is eliminated.

[0010] The utility model provides a visible light and laser integrated imaging device, which comprises:

[0011] The mounting frame, the laser emitting module and the imaging module are respectively installed on both sides in the mounting frame.

[0012] The imaging module comprises a common optical path mirror group, a light splitting mirror group, a laser receiving module and a visible light receiving module.

[0013] The optical axis of the common-path mirror group coincides with the optical axis of the visible light receiving module or the laser light receiving module, and the optical axis of the laser light receiving module is perpendicular to the optical axis of the visible light receiving module.

[0014] The beam splitter group is located at the intersection of the optical axis of the laser light receiving module and the optical axis of the visible light receiving module.

[0015] The beam splitter group can split the light beam received by the common-path mirror group into two beams, one of which is received by the visible light receiving module and the other of which is received by the laser light receiving module.

[0016] Preferably, the common-path mirror group comprises a first lens, a second lens, a third lens 313 and a fourth lens, and the optical axes of the first lens, the second lens, the third lens and the fourth lens coincide.

[0017] Preferably, the first lens, the second lens and the third lens are all meniscus lenses, and the fourth lens is a convex lens.

[0018] Preferably, the aperture of the first lens is larger than the apertures of the second lens and the third lens.

[0019] Preferably, the beam splitter group comprises a first beam splitter and a second beam splitter, and the first beam splitter and the second beam splitter are both right-angle prisms.

[0020] Preferably, at least one of the first beam splitter and the second beam splitter is coated with a beam splitting film on the inclined surface.

[0021] Preferably, the beam splitting film can transmit visible light and reflect laser light or transmit laser light and reflect visible light.

[0022] Preferably, the inclined edges of the first beam splitter and the second beam splitter are glued to form the beam splitter group.

[0023] Preferably, the laser light receiving module comprises a laser light receiving mirror group and a laser light receiving detector, and the laser light receiving detector is located behind the laser light receiving mirror group.

[0024] The laser light receiving detector comprises a first PCB circuit board and a laser light photosensitive chip, and can perform imaging processing on the received laser light beam.

[0025] Preferably, the visible light receiving module comprises a visible light receiving mirror group and a visible light receiving detector, and the visible light receiving detector is located behind the visible light receiving mirror group.

[0026] The visible light receiving detector comprises a second PCB circuit board and a visible light photosensitive chip, and can perform imaging processing on the received visible light beam.

[0027] Compared with the prior art, the utility model can achieve the following beneficial effects:

[0028] The imaging device provided by the utility model, through the light splitting mirror set, the received light beams are divided into laser and visible light and are received by the laser receiving module and the visible light receiving module respectively, laser imaging and visible light imaging are integrated on the same device, so that two imaging devices share the same incident light receiving light path, the integration degree is high, the volume is small, and it is more suitable for application in scenes with requirements on space size; visible light imaging and laser imaging are integrated in the same imaging device, the imaging area error between visible light imaging and laser imaging can be better eliminated, the situation that redundant algorithm is needed for error compensation is avoided, and then the content identified through the image is more accurate and more convenient.

[0029] Meanwhile, the utility model discloses the common light path mirror set in the common light path front end, can realize the field curvature correction, reduce the air gap and the size's effect, and further will the incident light converge, make the incident light quality is more, energy is higher, and the imaging is more clear. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 It is the imaging device structure schematic diagram that visible light and laser are integrated according to the utility model embodiment provides;

[0031] Figure 2 It is the imaging module structure schematic diagram according to the utility model embodiment provides;

[0032] Figure 3 It is the common light path mirror set structure schematic diagram according to the utility model embodiment provides.

[0033] The reference signs in it include:

[0034] Mounting frame 1, laser emission module 2, imaging module 3, common light path mirror set 31, first lens 311, second lens 312, third lens 313, fourth lens 314, light splitting mirror set 32, first light splitting mirror 321, second light splitting mirror 322, laser receiving module 33, laser receiving mirror set 331, laser receiving detector 332, visible light receiving module 34, visible light receiving mirror set 341, visible light receiving detector 342. DETAILED DESCRIPTION

[0035] For the purpose of making the object, technical solutions and advantages of the present application more clear, the present application is further described in detail below in combination with the drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, and do not constitute a limitation on the present application. In different embodiments, similar elements are associated with similar element labels. In the following embodiments, many details are described in order to make the present application better understood. However, those skilled in the art can easily recognize that some features can be omitted in different cases, or can be replaced by other elements, materials, methods. In some cases, some operations related to the present application are not shown or described in the specification in order to avoid the core part of the present application being overwhelmed by too much description, and it is not necessary for those skilled in the art to describe these related operations in detail according to the description in the specification and general technical knowledge in the art.

[0036] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other to form various embodiments without conflict. At the same time, each step or action in the method description can also be sequentially adjusted or adjusted in a manner obvious to those skilled in the art. Therefore, the various sequences in the specification and drawings are only for the purpose of clearly describing a certain embodiment, and do not mean a necessary sequence, unless otherwise stated that a certain sequence must be followed.

[0037] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" and the like are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited by "first", "second" and the like can explicitly or implicitly include one or more features. In the description of the present application, unless otherwise stated, the meaning of "a plurality of" is two or more.

[0038] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected, it can be mechanically connected, or it can be electrically connected, it can be directly connected, or indirectly connected through an intermediate medium, it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0039] The present application will be described in detail below with reference to the drawings and in conjunction with the embodiments.

[0040] As Figure 1 shown, the utility model provides a visible light and laser integrated imaging device, and the specific as follows:

[0041] The imaging device provided by the utility model, including mounting frame 1, laser emission module 2 and imaging module 3, laser emission module 2 and imaging module 3 are installed in mounting frame 1 side by side, in the utility model embodiment, laser emission module 2 is installed on the right side, and imaging module 3 is installed on the left side.

[0042] As Figure 2 shown, imaging module 3 includes common optical path mirror group 31, light splitting mirror group 32, laser receiving module 33 and visible light receiving module 34, wherein the optical axis of common optical path mirror group 31 coincides with the optical axis of visible light receiving module 34, that is, the optical axis of common optical path mirror group 31 and the optical axis of visible light receiving module 34 are on the same straight line, the optical axis of laser receiving module 33 intersects with the optical axis of visible light receiving module 34 and is perpendicular to each other, that is, the optical axis of common optical path mirror group 31, the optical axis of visible light receiving module 34 and the optical axis of laser receiving module 33 are in the same plane and form a "T" shape.

[0043] As Figure 3 shown, common optical path mirror group 31 includes a plurality of lenses, the utility model embodiment is four lenses, specifically first lens 311, second lens 312, third lens 313 and fourth lens 314, and the optical axis of first lens 311, second lens 312, third lens 313 and fourth lens 314 coincides, wherein first lens 311 is a meniscus lens, which is used to receive the reflected light of the imaged object, second lens 312 and third lens 313 are both meniscus lenses with an aperture smaller than first lens 311, second lens 312 and third lens 313 are used to correct field curvature, reduce air gap and reduce size, fourth lens 314 is a double convex lens, which is used to converge incident light. Through common optical path mirror group, the incident light is further converged, so that the quality of the incident light is better, the energy is higher, and the imaging is clearer.

[0044] The beam splitter set 32 is arranged between the common-path mirror set 31 and the visible light receiving module 34, and at the intersection of the optical axis of the common-path mirror set 31, the optical axis of the visible light receiving module 34 and the optical axis of the laser receiving module 33.

[0045] The beam splitter set 32 comprises a first beam splitter 321 and a second beam splitter 322, both of which are right-angle prisms and can be of the same size or different sizes. Both the first beam splitter 321 and the second beam splitter 322 have an inclined surface opposite to the right angle, and in the embodiment of the utility model, the inclined surfaces of the first beam splitter 321 and the second beam splitter 322 are glued to form the beam splitter set 32. At least one of the inclined surfaces of the first beam splitter 321 and the second beam splitter 322 is coated with a beam splitting film, and in the embodiment of the utility model, the beam splitting film can transmit visible light and reflect laser, thereby completing the beam splitting of visible light and laser.

[0046] In the embodiment of the utility model, the wavelength range of visible light is 400nm-760nm, but is not limited to this wavelength, and the wavelength of laser is 905nm, also not limited to this wavelength. The specific type of beam splitting film used can be determined according to the actual wavelength of visible light and laser. In addition, in the embodiment of the utility model, the laser receiving module 33 and the visible light receiving module 34 can be interchanged in position according to requirements, that is, the optical axis of the common-path mirror set 31 coincides with the optical axis of the laser receiving module 33, at which time the type of beam splitting film needs to be adjusted so that the beam splitting film can transmit laser and reflect visible light. That is, if the beam splitting film reflects visible light and transmits laser, the laser receiving module 33 and the visible light receiving module 34 can be interchanged in position.

[0047] The laser receiving module 33 comprises a laser receiving mirror set 331 and a laser receiving detector 332, and the laser receiving detector 332 is located behind the laser receiving mirror set 331. The laser receiving detector 332 comprises a first PCB circuit board and a laser photosensitive chip, and the first PCB circuit board can drive the laser photosensitive chip to perform imaging processing on the laser beam received by the laser receiving mirror set 331.

[0048] The visible light receiving module 34 comprises a visible light receiving mirror set 341 and a visible light receiving detector 342, and the visible light receiving detector 342 is located behind the visible light receiving mirror set 341. The visible light receiving detector 342 comprises a second PCB circuit board and a visible light photosensitive chip, and the second PCB circuit board can drive the visible light photosensitive chip to perform imaging processing on the visible light beam received by the visible light receiving mirror set 341.

[0049] The imaging device of the embodiment of the utility model, when working, laser emission module 2 sends dot matrix laser to the object to be imaged, and the reflected light of the object to be imaged is received by common light path mirror group 31 of imaging module 3, and the reflected light is taken as the incident light of the imaging device and enters imaging module 3 through common light path, that is, the space between common light path mirror group 31 and beamsplitter group 32.

[0050] After the incident light passes through the common light path, it is incident on beamsplitter group 32, and after being separated into two beams by the beamsplitting film, one is a laser beam, and the other is a visible light beam. After being reflected by the beamsplitting film, the laser beam enters laser receiving module 33, and after passing through laser receiving lens group 331, it is incident on laser receiving detector 332. The first PCB circuit board on laser receiving detector 332 drives the laser photosensitive chip to perform imaging processing on the laser beam received by laser receiving lens group 331. In the embodiment of the utility model, the laser photosensitive chip is a distance image sensor. The visible light beam passes through the beamsplitting film and enters visible light receiving module 34, and after passing through visible light receiving lens group 341, it is incident on visible light receiving detector 342. The second PCB circuit board on visible light receiving detector 342 drives the visible light photosensitive chip to perform imaging processing on the visible light beam received by visible light receiving lens group 341. In the embodiment of the utility model, the visible light photosensitive chip is a CMOS. After the above process, a visible light image and a laser image are formed.

[0051] Although the embodiments of the utility model have been shown and described above, it should be understood that the above embodiments are exemplary and cannot be understood as limiting the utility model. Those skilled in the art can make changes, modifications, replacements and modifications to the above embodiments within the scope of the utility model.

[0052] The specific embodiments of the utility model above do not constitute a limitation on the protection scope of the utility model. Any other corresponding changes and modifications made according to the technical concept of the utility model should be included in the protection scope of the claims of the utility model.

Claims

1. An imaging device integrating visible light and laser, characterized in that, include: The mounting frame, laser emission module, and imaging module are respectively mounted on both sides of the mounting frame. The imaging module includes: a common-path mirror group, a beam splitter group, a laser receiving module, and a visible light receiving module; The optical axis of the common-optical path mirror group coincides with the optical axis of the visible light receiving module or the laser receiving module, and the optical axis of the laser receiving module is perpendicular to the optical axis of the visible light receiving module. The beam splitter group is located at the intersection of the optical axis of the laser receiving module and the optical axis of the visible light receiving module. The beam splitter group can split the light beam received by the common-path mirror group into two beams, one of which is received by the visible light receiving module and the other of which is received by the laser receiving module.

2. The imaging device integrating visible light and laser as described in claim 1, characterized in that, The common-path mirror group includes a first lens, a second lens, a third lens, and a fourth lens, with the optical axes of the first lens, the second lens, the third lens, and the fourth lens coinciding.

3. The imaging device integrating visible light and laser as described in claim 2, characterized in that, The first lens, the second lens, and the third lens are all meniscus lenses, and the fourth lens is a convex lens.

4. The imaging device integrating visible light and laser as described in claim 3, characterized in that, The aperture of the first lens is larger than that of the second and third lenses.

5. The imaging device integrating visible light and laser as described in claim 1, characterized in that, The beam splitter group includes a first beam splitter and a second beam splitter, both of which are right-angle prisms.

6. The imaging device integrating visible light and laser as described in claim 5, characterized in that, The inclined surface of at least one of the first and second beam splitters is coated with a beam splitting film.

7. The imaging device integrating visible light and laser as described in claim 6, characterized in that, The beam splitter can transmit visible light and reflect laser light, or transmit laser light and reflect visible light.

8. The imaging device integrating visible light and laser as described in claim 5, characterized in that, The beveled edges of the first and second beam splitters are glued together to form the beam splitter assembly.

9. The imaging device integrating visible light and laser as described in claim 1, characterized in that, The laser receiving module includes a laser receiving mirror group and a laser receiving detector, with the laser receiving detector located behind the laser receiving mirror group; The laser receiver detector includes a first PCB circuit board and a laser photosensitive chip, which can perform imaging processing on the received laser beam.

10. The imaging device integrating visible light and laser as described in claim 1, characterized in that, The visible light receiving module includes a visible light receiving mirror group and a visible light receiving detector, wherein the visible light receiving detector is located behind the visible light receiving mirror group; The visible light receiver detector includes a second PCB circuit board and a visible light photosensitive chip, which can perform imaging processing on the received visible light beam.

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