Photomask plate based on bidirectional exposure wafer

Abstract

The utility model provides a photomask plate based on a bidirectional exposure wafer, and relates to the technical field of photomask plates. According to the photomask plate, a plurality of mark points are arranged on a lower photomask plate, mark rings in one-to-one correspondence are arranged on an upper photomask plate, the positions of the mark points relative to the mark rings are monitored through cameras above the mark rings, the deviation of the lower photomask plate relative to the upper photomask plate can be found in time, and the deviation can be automatically corrected through a micrometer lead screw propeller; economic losses caused by the fact that exposure deviation is not found in time are effectively avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to a mask plate technical field, concretely relates to a mask plate based on bidirectional exposure wafer. BACKGROUND

[0002] The mask plate is the equipment commonly used in the manufacture of semiconductor devices by the photoetcher, and the essence of the photoetcher is to expose the wafer through the mask plate and copy the pattern of the mask plate onto the wafer.

[0003] For the wafer exposed in two directions, the upper mask plate and the lower mask plate need to be arranged on the two sides of the wafer respectively to ensure that the wafer, the lower mask plate and the upper mask plate are aligned during the whole exposure process.

[0004] At present, in the production process of the wafer exposed in two directions, the wafer cannot be fixed when placed on the lower mask plate, and the slight movement of the wafer when the upper and lower mask plates are attached will cause exposure deviation. In addition, the lower mask plate is fixed by negative pressure, and the negative pressure will be released when the upper and lower mask plates are separated after exposure is completed. After a certain number of times, the displacement of the lower mask plate will also cause exposure deviation.

[0005] However, in the production process of the wafer exposed in two directions, the exposure deviation cannot be discovered in time, and it can only be discovered when the last process passes through the bidirectional cutting machine, but the material has been scrapped at the time of discovery, which will cause great loss. CONTENT OF THE UTILITY MODEL

[0006] In view of the defects of the prior art, the utility model provides a mask plate based on a wafer exposed in two directions, which solves the problem that the mask plate of the wafer exposed in two directions cannot be discovered in time when exposure deviation occurs.

[0007] To achieve the above purpose, the utility model is implemented by the following technical solutions:

[0008] A mask plate based on a wafer exposed in two directions, the mask plate comprises a lower mask plate, an upper mask plate, a PLC controller and four micrometer screw rod pushers;

[0009] The lower mask plate is provided with a plurality of mark points in the non-pattern area, the upper mask plate is provided with mark rings corresponding to the mark points one by one, the outer diameter of the mark points is the same as the inner diameter of the mark rings, and a corresponding camera is arranged above the mark rings;

[0010] The four micrometer screw rod pushers are respectively aligned with the four side walls of the lower mask plate and are used for correcting the position of the lower mask plate;

[0011] The PLC controller is electrically connected with all the cameras and micrometer screw rod pushers respectively.

[0012] Preferably, the camera is matched with a viso visual system for real-time monitoring of the relative positions of the mark points and the corresponding mark circles.

[0013] Preferably, the PLC controller is further electrically connected with an audible and visual alarm, when a mark point does not coincide with the corresponding mark circle, the audible and visual alarm alarms and suspends the operation of the equipment; when all mark points coincide with the corresponding mark circles, the audible and visual alarm cancels the alarm and drives the equipment to operate again.

[0014] Preferably, the lower mask plate is provided with a plurality of negative pressure holes in the non-pattern area; the bottom end of the negative pressure hole is communicated with the first pneumatic system, and the top end can be in contact with the wafer placed on the lower mask plate, so that the first pneumatic system can perform negative pressure adsorption on the wafer through the negative pressure hole.

[0015] Preferably, the lower mask plate is matched with a second pneumatic system, and the second pneumatic system can perform negative pressure adsorption and fixation on the lower mask plate.

[0016] Preferably, the number of mark points on the lower mask plate is not less than two.

[0017] Preferably, the number of negative pressure holes on the lower mask plate is not less than three, and is arranged in a circular peripheral array with the center of the pattern as the center.

[0018] Preferably, the mask plate based on the bidirectional exposure wafer includes:

[0019] S1. After placing the wafer on the lower mask plate at a specified position, start the first pneumatic system to adsorb the wafer at the correct position;

[0020] S2. When the upper mask plate is aligned with the lower mask plate, that is, the camera monitors that the corresponding mark points are offset relative to the mark circles, the audible and visual alarm is controlled by the PLC controller to alarm and suspend the operation of the equipment;

[0021] S3. Taking the center of the mark circle as the origin, the offset coordinates of the corresponding mark points are collected by the camera, and the positions that the four side walls of the lower mask plate should be in after correction are calculated through the offset coordinates of all mark points;

[0022] S4. Drive the four micrometer screw rod pushers to make the free surfaces of the push plates of the four micrometer screw rod pushers coincide with the positions that the four side walls of the lower mask plate should be in after correction, so as to realize the position correction of the lower mask plate;

[0023] S5. When the corresponding mark points coincide with the mark circles are monitored by the camera, the audible and visual alarm is controlled by the PLC controller to be closed and the equipment is driven to operate.

[0024] The utility model provides a kind of mask plate based on bidirectional exposure wafer.Compared with prior art, it has the following beneficial effects:

[0025] The utility model discloses a plurality of mark points are set up on the lower light cover plate, and the corresponding mark ring is set up on the upper light cover plate, the position of mark point is monitored to mark ring through the camera above mark ring, can find the deviation of lower light cover plate relative to upper light cover plate in time, and can correct the deviation through the micrometer screw rod propeller automatically, effectively avoid the economic loss caused by not finding exposure deviation in time. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical scheme in the embodiment of the utility model or prior art, the following will be briefly introduced the drawing needed to be used in the embodiment or prior art description, obviously, the drawing in the following description is only some embodiments of the utility model, for ordinary skilled person in the art, under the premise of not paying creative labor, still can obtain other drawings according to these drawings.

[0027] Figure 1 It is the structure schematic view of the light cover plate in the embodiment of the utility model.

[0028] Figure 2 It is the structure schematic view of the lower light cover plate in the embodiment of the utility model.

[0029] Figure 3 It is the structure schematic view of the upper light cover plate in the embodiment of the utility model.

[0030] The figure mark is set up as follows: lower light cover plate 10, mark point 11, negative pressure hole 12, upper light cover plate 20, mark ring 21, camera 22, micrometer screw rod propeller 30. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical scheme and advantage of the embodiment of the utility model more clear, the technical scheme in the embodiment of the utility model is clearly and completely described, obviously, the described embodiment is a part of the embodiment of the utility model, not all the embodiment. Based on the embodiment in the utility model, all other embodiments obtained by ordinary skilled person in the art without making creative labor belong to the scope of the utility model protection.

[0032] The embodiment of the application provides a light cover plate based on bidirectional exposure wafer, solves the problem that the light cover plate of bidirectional exposure wafer cannot find in time when exposure deviation.

[0033] In order to better understand the above technical scheme, the above technical scheme will be described in detail in the following in conjunction with the drawings in the specification and specific implementation.

[0034] Embodiment:

[0035] AsFigures 1-3 The utility model provides a mask plate based on bidirectional exposure wafer, the mask plate includes: lower mask plate 10, upper mask plate 20, PLC controller and four micrometer screw rod propellers 30,

[0036] The lower mask plate 10 is provided with a plurality of mark points 11 in the non-pattern area, the upper mask plate 20 is provided with mark circles 21 corresponding to the mark points 11 one by one, the outer diameter of the mark point 11 is same with the inner diameter of the mark circle 21, and a corresponding camera 22 is arranged above the mark circle 21.

[0037] Four micrometer screw rod propellers 30 are respectively aligned with four side walls of the lower mask plate 10, and are used for correcting the position of the lower mask plate 10.

[0038] The PLC controller is electrically connected with all the cameras 22 and micrometer screw rod propellers 30 respectively.

[0039] The camera 22 is matched with a viso visual system, which is used for monitoring the relative position of the mark point 11 and the corresponding mark circle 21 in real time, when the mark point 11 does not coincide with the corresponding mark circle 21, the PLC controller drives the appropriate micrometer screw rod propeller 30 to correct the position of the lower mask plate 10 according to the relative position of the two.

[0040] The PLC controller is also electrically connected with an audible and visual alarm, when there is a mark point 11 that does not coincide with the corresponding mark circle 21, the audible and visual alarm alarms and suspends the operation of the equipment, when all the mark points 11 coincide with the corresponding mark circles 21, the audible and visual alarm cancels the alarm and drives the equipment to operate again.

[0041] As shown in the figure, Figure 2 The lower mask plate 10 is provided with a plurality of negative pressure holes 12 in the non-pattern area; the bottom end of the negative pressure hole 12 is communicated with the first pneumatic system, and the top end can be in contact with the wafer placed on the lower mask plate 10, so that the first pneumatic system can adsorb the wafer by negative pressure through the negative pressure hole 12, to prevent the wafer from being deviated relative to the lower mask plate 10.

[0042] The lower mask plate 10 is matched with a second pneumatic system, which can adsorb and fix the lower mask plate 10 by negative pressure.

[0043] As shown in the figure, Figure 2 The number of mark points 11 on the lower mask plate 10 is not less than two.

[0044] As shown in the figure, Figure 2 The number of negative pressure holes 12 on the lower mask plate 10 is not less than three, and is arranged in a circular array with the pattern center as the center.

[0045] The deviation correction method of the mask plate based on bidirectional exposure wafer includes:

[0046] S1. After placing the wafer on the designated position of the lower mask plate 10, start the first pneumatic system to adsorb the wafer in the correct position;

[0047] S2. When the upper mask plate 20 is aligned with the lower mask plate 10 with a deviation, that is, the camera 22 monitors that the corresponding mark point 11 deviates from the mark circle 21, the PLC controller controls the sound-light alarm to alarm and suspends the operation of the equipment;

[0048] S3. Taking the center of the mark circle 21 as the origin, the deviation coordinates of the corresponding mark point 11 are collected by the camera 22, and the positions where the four side walls of the lower mask plate 10 should be after being corrected are calculated through the deviation coordinates of all mark points 11;

[0049] S4. Drive the four micrometer screw rod pushers 30, so that the free surfaces of the push plates of the four micrometer screw rod pushers 30 coincide with the positions where the four side walls of the lower mask plate 10 should be after being corrected, and the position correction of the lower mask plate 10 is realized;

[0050] S5. When the corresponding mark point 11 is coincided with the mark circle 21 monitored by the camera 22, the PLC controller controls the sound-light alarm to be turned off and drives the equipment to operate.

[0051] Compared with the prior art, the utility model has the following beneficial effects:

[0052] 1. In the embodiment of the utility model, a plurality of mark points 11 are arranged on the lower mask plate 10, and a corresponding mark circle 21 is arranged on the upper mask plate 20, the position of the mark point 11 relative to the mark circle 21 is monitored through the camera 22 above the mark circle 21, the deviation of the lower mask plate 10 relative to the upper mask plate 20 can be found in time, and the deviation can be automatically corrected through the micrometer screw rod pusher 30, so that the economic loss caused by not finding the exposure deviation in time is effectively avoided.

[0053] 2. In the embodiment of the utility model, a plurality of negative pressure holes 12 are arranged in the non-pattern area of the lower mask plate 10, so that the wafer can be firmly fixed in the correct position without affecting the exposure, and the deviation of the wafer relative to the lower mask plate 10 is effectively prevented.

[0054] 3. In the embodiment of the utility model, the sound-light alarm is used to remind the staff to pay attention to the position of the lower mask plate 10, remind the staff to maintain the position that deviates frequently, and avoid the frequent downtime affecting the production efficiency.

[0055] It is to be noted that, in the present text, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element preceded by "comprises a" does not, without more constraints, foreclose the existence of additional identical elements in the process, method, article, or apparatus that comprises the recited element.

[0056] The above embodiments are only used to illustrate the technical solutions of the present application, but not limit the present application; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A photomask based on a bidirectional exposure wafer, characterized in that, The photomask includes: a lower photomask (10), an upper photomask (20), a PLC controller, and four micrometer lead screw actuators (30); The lower photomask (10) has multiple marker points (11) in the non-pattern area, and the upper photomask (20) has a marker ring (21) that corresponds to the marker points (11) one by one. The outer diameter of the marker point (11) is the same as the inner diameter of the marker ring (21), and a camera (22) that corresponds to the marker ring (21) is provided above the marker ring (21). The four micrometer lead screw pushers (30) are respectively aligned with the four side walls of the lower photomask (10) to correct the position of the lower photomask (10); The PLC controller is electrically connected to all cameras (22) and micrometer screw actuators (30).

2. The photomask based on a bidirectional exposure wafer as described in claim 1, characterized in that, The camera (22) is equipped with a Viso vision system for real-time monitoring of the relative position of the marker point (11) and the corresponding marker circle (21).

3. The photomask based on a bidirectional exposure wafer as described in claim 1, characterized in that, The PLC controller is also electrically connected to an audible and visual alarm. When a marker point (11) does not coincide with the corresponding marker circle (21), the audible and visual alarm will sound and the equipment will stop operating. When all marker points (11) coincide with the corresponding marker circles (21), the audible and visual alarm will cancel the alarm and drive the equipment to start operating again.

4. The photomask based on a bidirectional exposure wafer as described in claim 1, characterized in that, The lower photomask (10) has multiple negative pressure holes (12) in the non-patterned area; the bottom end of the negative pressure hole (12) is connected to the first pneumatic system, and the top end can contact the wafer placed on the lower photomask (10), so that the first pneumatic system can perform negative pressure adsorption on the wafer through the negative pressure hole (12).

5. The photomask based on a bidirectional exposure wafer as described in claim 1, characterized in that, The lower photomask (10) is equipped with a second pneumatic system, which can perform negative pressure adsorption and fixation on the lower photomask (10).

6. The photomask based on a bidirectional exposure wafer as described in claim 1, characterized in that, The number of marking points (11) on the lower photomask (10) is not less than two.

7. The photomask based on a bidirectional exposure wafer as described in claim 4, characterized in that, The number of negative pressure holes (12) on the lower photomask (10) is not less than three, and they are arranged in a circular array with the center of the pattern as the center.

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