Mould temperature controller suitable for semiconductor industry
By designing a temperature control system and a circulation system, combined with precision filters and sensors, the problem of water corrosion in mold temperature controllers was solved, enabling long lifespan and high-precision aging testing of mold temperature controllers.
Patent Information
- Application Number
- CN202520033907.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-08
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2035-01-08
AI Technical Summary
Existing mold temperature controllers lack high-precision filtration and water quality testing functions, resulting in turbid water that corrodes the equipment and affects the accuracy of component aging tests.
The system includes a temperature control system, an internal circulation and drainage system, and an external circulation system. It employs a precision filter, water quality and water level monitoring devices to enable rapid switching between internal and external circulation, and is equipped with pneumatic valves and sensors for real-time monitoring and automatic drainage.
It extends the service life of the mold temperature controller, improves the accuracy of component aging tests, reduces manual operation, lowers costs, and ensures precise temperature control and sealing performance.
Smart Images

Figure CN223582385U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to temperature control equipment technical field, especially a kind of mould temperature controller suitable for semiconductor industry. BACKGROUND
[0002] Mould temperature controller as the equipment of changing ambient temperature, is one of necessary equipment to guarantee ambient temperature when semiconductor industry is in device aging test.The mould temperature controller of prior art lacks high-precision filtration, and does not have the function of detecting water quality, in long-term use, it can cause the water of mould temperature controller to be muddy, long time contact turbid water can corrode mould temperature controller itself, and contact device also can contaminate device, also can cause device aging test inaccurate. INVENTION CONTENTS
[0003] In view of the above-mentioned needs, the utility model provides a kind of mould temperature controller suitable for semiconductor industry, structural design prolongs the service life of mould temperature controller, improves its device aging test accuracy.
[0004] To achieve the above-mentioned purpose, the technical scheme adopted by the utility model is as follows:
[0005] A kind of mould temperature controller suitable for semiconductor industry, including temperature control system, inner circulation and drainage system and outer circulation system, the temperature control system includes water tank, heating wire in water tank and the cooling water inlet and outlet pipe connected with water tank, water inlet pipe is sequentially provided with ball valve A, Y type filter A and proportional regulating valve, water outlet pipe is provided with ball valve B, proportional regulating valve is connected by bypass between water outlet pipe.The inner circulation and drainage system includes the inner circulation pipeline connected with water tank, sequentially provided with inner circulation water pump, pneumatic angle valve A, precision filter and check valve A on it.The outer circulation system includes the outer circulation pipeline connected with water tank, sequentially provided with variable frequency magnetic pump, ball valve C, Y type filter B, ball valve D, ball valve E and Y type filter C on it, ball valve D and ball valve E are connected with load.
[0006] Wherein, the outer circulation pipeline before Y type filter B is connected with first gas source pipeline, sequentially provided with gas source processor, hand slide valve, pneumatic solenoid valve and check valve B on it, can be used for pressure test, detects the sealing effect of external load, can be water through rear, prevent water leakage.
[0007] As preferred, conductivity meter and direct insertion type liquid level meter are arranged in the water tank, respectively real-time monitoring water quality and water level in water tank.
[0008] As preferred, temperature sensor A is arranged in the water tank, temperature sensor B is arranged on water inlet pipe between Y type filter A and proportional regulating valve, for detecting water temperature.
[0009] As preferred, a drain pipeline is connected to the inner circulation pipeline between the inner circulation water pump and the pneumatic angle valve A, and a pneumatic angle valve B is arranged on the drain pipeline, and when the water quality is detected to be unqualified, the water in the water tank is drained through the drain pipeline.
[0010] As preferred, a pneumatic angle valve C and a pressure sensor A are arranged on the inner circulation pipeline between the pneumatic angle valve A and the precision filter, and the pneumatic angle valve C is connected to the inner circulation pipeline after the one-way valve A through a bypass.
[0011] As preferred, the outer circulation system further comprises a second air source pipeline, a gas solenoid valve is arranged on the second air source pipeline, a bypass connected to the water tank is arranged on the outer circulation pipeline between the variable frequency magnetic pump and the ball valve C, a pneumatic angle valve D is arranged on the bypass, a pneumatic angle valve E is arranged on the outer circulation pipeline after the ball valve C, a pneumatic angle valve F is arranged on the outer circulation pipeline after the Y-shaped filter C, the gas solenoid valve is connected to the pneumatic angle valve D, the pneumatic angle valve E and the pneumatic angle valve F through pipelines, and the switching of the valves is realized through the gas solenoid valve.
[0012] As preferred, a water pressure gauge and a flow meter are arranged on the outer circulation pipeline between the ball valve C and the pneumatic angle valve E, for monitoring the water pressure and flow in the pipeline.
[0013] As preferred, a pressure sensor B is arranged on the outer circulation pipeline between the pneumatic angle valve E and the Y-shaped filter B, and a temperature sensor C is arranged on the outer circulation pipeline between the Y-shaped filter C and the pneumatic angle valve F.
[0014] As preferred, an air pressure gauge is arranged on the first air source pipeline between the hand slide valve and the pneumatic electromagnetic valve, and a pressure switch is connected to the gas solenoid valve.
[0015] The advantages of the utility model lie in that: 1, the structure design of the mold temperature controller prolongs the service life of the mold temperature controller and improves the accuracy of device aging test,
[0016] 2, the filter in the mold temperature controller, such as the precision filter of the inner circulation system, improves the filtering precision and reduces the influence of the filter on flow control,
[0017] 3, real-time monitoring of water quality and water level, water replacement becomes reliable, and the device is linked with water replenishment, reducing manual operation,
[0018] 4, optimization of the outer circulation system, with pressure maintaining test, the sealing effect of external load can be detected, water can pass through the rear, preventing water leakage, and the water in the pipeline can be blown back to the water tank,
[0019] 5, the drain pump and the inner circulation pump are integrated into one, improving the use rate of the pump, reducing the cost and improving the use rate of space,
[0020] 6. The cooling water circuit is equipped with a proportional regulating valve, which optimizes the temperature control system and makes the temperature control more accurate.
[0021] 7. The internal and external circulation can be quickly switched without adjusting the flow, which can meet the short time test requirements in the aging test. BRIEF DESCRIPTION OF DRAWINGS
[0022] Figure 1 It is a structural schematic view of the utility model.
[0023] Explanation of main element symbols in the figure:
[0024] Temperature control system: 11, water tank; 12, heating wire; 13, ball valve A; 14, Y-type filter A; 15, proportional regulating valve; 16, ball valve B; 17, conductivity meter; 18, straight insertion type liquid level meter; 19, temperature sensor A; 110, temperature sensor B;
[0025] Internal circulation and drainage system: 21, internal circulation water pump; 22, pneumatic angle valve A; 23, precision filter; 24, one-way valve A; 25, pneumatic angle valve B; 26, pneumatic angle valve C; 27, pressure sensor A;
[0026] External circulation system: 31, variable frequency magnetic drive pump; 32, ball valve C; 33, Y-type filter B; 34, ball valve D; 35, ball valve E; 36, Y-type filter C; 37, gas source processor; 38, hand slide valve; 39, pneumatic electromagnetic valve; 310, one-way valve B; 311, pneumatic electromagnetic valve; 312, pneumatic angle valve D; 313, pneumatic angle valve E; 314, pneumatic angle valve F; 315, water pressure gauge; 316, flowmeter; 317, pressure sensor B; 318, temperature sensor C; 319, air pressure gauge; 320, pressure switch. DETAILED DESCRIPTION
[0027] In order to more clearly describe the utility model, the utility model will be further described below in combination with the drawings.
[0028] Example one: as shown in a kind of mold temperature controller suitable for semiconductor industry, including temperature control system, internal circulation and drainage system and external circulation system. Figure 1
[0029] The temperature control system includes water tank 11, heating wire 12 in water tank 11 and cooling water inlet and outlet pipe connected with water tank 11, ball valve A 13, Y-type filter A 14 and proportional regulating valve 15 are sequentially arranged on water inlet pipe, and ball valve B 16 is arranged on water outlet pipe.
[0030] The internal circulation and drainage system includes internal circulation pipeline connected with water tank 11, and internal circulation water pump 21, pneumatic angle valve A 22, precision filter 23 and one-way valve A 24 are sequentially arranged on the internal circulation pipeline.
[0031] The outer circulation system comprises an outer circulation pipeline connected with the water tank 11, on which a variable frequency magnetic pump 31, a ball valve C 32, a Y-type filter B 33, a ball valve D 34, a ball valve E 35 and a Y-type filter C 36 are sequentially arranged, and a load is connected between the ball valve D 34 and the ball valve E 35. Among them, the outer circulation pipeline before the Y-type filter B 33 is connected with a first gas source pipeline, on which a gas source processor 37, a hand slide valve 38, a pneumatic electromagnetic valve 39 and a one-way valve B 310 are sequentially arranged.
[0032] Example two: as shown in the figure, on the basis of example one, the water tank 11 is provided with an electric conductivity instrument 17 and a straight-in liquid level instrument 18. Figure 1
[0033] Among them, the water tank 11 is provided with a temperature sensor A 19, and a temperature sensor B 110 is arranged on the water inlet pipe between the Y-type filter A 14 and the proportional regulating valve 15.
[0034] Example three: as shown in the figure, on the basis of example two, the inner circulation pipeline between the inner circulation water pump 21 and the pneumatic angle valve A 22 is connected with a drainage pipeline, on which a pneumatic angle valve B 25 is arranged. Figure 1
[0035] Among them, the inner circulation pipeline between the pneumatic angle valve A 22 and the precision filter 23 is provided with a pneumatic angle valve C 26 and a pressure sensor A 27, and the inner circulation pipeline after the pneumatic angle valve C 26 and the one-way valve A 24 is connected through a bypass.
[0036] Example four: as shown in the figure, on the basis of example one, example two or example three, the outer circulation system further comprises a second gas source pipeline, on which a gas electromagnetic valve 311 is arranged, a bypass connected with the water tank 11 is arranged on the outer circulation pipeline between the variable frequency magnetic pump 31 and the ball valve C 32, on which a pneumatic angle valve D 312 is arranged, a pneumatic angle valve E 313 is arranged on the outer circulation pipeline after the ball valve C 32, a pneumatic angle valve F 314 is arranged on the outer circulation pipeline after the Y-type filter C 36, and the gas electromagnetic valve 311 is connected with the pneumatic angle valve D 312, the pneumatic angle valve E 313 and the pneumatic angle valve F 314 through pipelines respectively. Figure 1 Example five: as shown in the figure, on the basis of example four, a water pressure gauge 315 and a flowmeter 316 are arranged on the outer circulation pipeline between the ball valve C 32 and the pneumatic angle valve E 313.
[0037] Figure 1
[0038] The pressure sensor B317 is arranged on the outer circulation pipeline between the pneumatic angle valve E313 and the Y-type filter B33, and the temperature sensor C318 is arranged on the outer circulation pipeline between the Y-type filter C36 and the pneumatic angle valve F314. In addition, the air pressure gauge 319 is arranged on the first air source pipeline between the hand slide valve 38 and the pneumatic electromagnetic valve 39, and the pneumatic electromagnetic valve 311 is connected with the pressure switch 320.
[0039] The above merely describes the specific embodiments of the present application, but the structural features of the present application are not limited to this, and the present application can be used in similar products. Any changes or modifications made by those skilled in the art within the field of the present application are covered by the patent range of the present application.
Claims
1. A mold temperature controller suitable for use in the semiconductor industry, characterized by: The temperature control system, the internal circulation and drainage system and the external circulation system are included. The temperature control system includes a water tank (11), heating wires (12) in the water tank (11) and cooling water inlet and outlet pipes connected with the water tank (11), a ball valve A (13), a Y-type filter A (14) and a proportional regulating valve (15) are sequentially arranged on the water inlet pipe, and a ball valve B (16) is arranged on the water outlet pipe. The internal circulation and drainage system includes an internal circulation pipeline connected with the water tank (11), an internal circulation water pump (21), a pneumatic angle valve A (22), a precision filter (23) and a one-way valve A (24) are sequentially arranged on the internal circulation pipeline. The external circulation system includes an external circulation pipeline connected with the water tank (11), a variable frequency magnetic pump (31), a ball valve C (32), a Y-type filter B (33), a ball valve D (34), a ball valve E (35) and a Y-type filter C (36) are sequentially arranged on the external circulation pipeline, and the ball valve D (34) and the ball valve E (35) are connected with a load. A first air source pipeline is connected with the external circulation pipeline before the Y-type filter B (33), and an air source processor (37), a hand slide valve (38), a pneumatic electromagnetic valve (39) and a one-way valve B (310) are sequentially arranged on the first air source pipeline.
2. The mold temperature controller for semiconductor industry as claimed in claim 1 wherein: The water tank (11) is provided with an electric conductivity instrument (17) and a direct insertion type liquid level instrument (18).
3. The mold temperature controller for semiconductor industry as claimed in claim 2 wherein: The water tank (11) is provided with a temperature sensor A (19), and a temperature sensor B (110) is arranged on the water inlet pipe between the Y-type filter A (14) and the proportional regulating valve (15).
4. The mold temperature machine for semiconductor industry as claimed in claim 2 wherein: A drainage pipeline is connected with the internal circulation pipeline between the internal circulation water pump (21) and the pneumatic angle valve A (22), and a pneumatic angle valve B (25) is arranged on the drainage pipeline.
5. The mold temperature machine for semiconductor industry as claimed in claim 4 wherein: A pneumatic angle valve C (26) and a pressure sensor A (27) are arranged on the internal circulation pipeline between the pneumatic angle valve A (22) and the precision filter (23), and the pneumatic angle valve C (26) is connected with the internal circulation pipeline after the one-way valve A (24) through a bypass.
6. The mold temperature machine for semiconductor industry as claimed in claim 1 wherein: The external circulation system further includes a second air source pipeline, and a gas electromagnetic valve (311) is arranged on the second air source pipeline, a bypass connected with the water tank (11) is arranged on the external circulation pipeline between the variable frequency magnetic pump (31) and the ball valve C (32), a pneumatic angle valve D (312) is arranged on the bypass, a pneumatic angle valve E (313) is arranged on the external circulation pipeline after the ball valve C (32), a pneumatic angle valve F (314) is arranged on the external circulation pipeline after the Y-type filter C (36), and the gas electromagnetic valve (311) is connected with the pneumatic angle valve D (312), the pneumatic angle valve E (313) and the pneumatic angle valve F (314) through pipelines respectively.
7. A mold temperature machine suitable for use in the semiconductor industry according to claim 6, wherein: A water pressure gauge (315) and a flowmeter (316) are arranged on the external circulation pipeline between the ball valve C (32) and the pneumatic angle valve E (313).
8. The mold temperature machine for semiconductor industry as claimed in claim 7 wherein: A pressure sensor B (317) is arranged on the external circulation pipeline between the pneumatic angle valve E (313) and the Y-type filter B (33), and a temperature sensor C (318) is arranged on the external circulation pipeline between the Y-type filter C (36) and the pneumatic angle valve F (314).
9. A mold temperature machine suitable for use in the semiconductor industry according to any one of claims 6-8, characterized in that: A gas pressure gauge (319) is arranged on the first gas source pipeline between the hand slide valve (38) and the pneumatic electromagnetic valve (39), and the gas electromagnetic valve (311) is connected with a pressure switch (320).