PCIE to SDIO module
By designing a PCIE to SDIO module, the problem of poor compatibility of the SDIO interface of the WIFI module was solved, realizing driver compatibility and efficient transmission between modules, and simplifying the development process of production testing programs.
Patent Information
- Application Number
- CN202423321441.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2034-12-31
AI Technical Summary
The existing SDIO interface of the WIFI module has poor compatibility and cannot be compatible with the official drivers of different modules, which affects the development stability of production testing programs.
Design a PCIe to SDIO module, including a PCIe card slot, an EVB board, and an SDIO adapter board. It connects to the computer via the PCIe bus, uses a main chip and DC-DC circuit for voltage conversion, supports USB interface conversion, and achieves compatibility and stability between modules.
It achieves official driver compatibility for different modules, simplifies the development of production testing programs, improves transmission rate and stability, and reduces the use of electronic components.
Smart Images
Figure CN223582480U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to automatic test technical field especially relates to a PCIE turns SDIO module. BACKGROUND
[0002] At present, the WIFI module on the market is mostly serial communication interface, and the WIFI module with SDIO interface has the advantages of fast transmission speed, strong compatibility, low power consumption and the like. To realize SDIO communication, the commonly used method is to use MCU simulation, which adopts a dedicated and matched communication mode, and the production and measurement programs cannot be universal, and the compatibility is poor.
[0003] Therefore, the prior art has defects and needs to be improved. INVENTION CONTENTS
[0004] The utility model solves the technical problem that: provide a kind of PCIE turns SDIO module, can be compatible with the official drive of different module, facilitate the development of production and measurement program, good stability.
[0005] The technical scheme of the utility model is as follows: provide a kind of PCIE turns SDIO module, comprising: the computer of being provided with PCIE card slot, the PCIE card of being installed on PCIE card slot, with the EVB board of being connected to the computer, the SDIO adapter board of being installed on the EVB board;The EVB board includes: first DC-DC circuit, USB2.0 interface turns TTL circuit, with the pad point circuit of being connected to the measured Socket needle of being electrically connected to the USB2.0 interface turns TTL circuit, with the mini-PCIE interface of being electrically connected to the pad point circuit of being connected to the measured Socket needle, with the first USB3.0 interface of being electrically connected to the mini-PCIE interface, the first DC-DC circuit is electrically connected with USB2.0 interface turns TTL circuit, measured Socket needle connection pad point circuit, mini-PCIE interface, first USB3.0 interface respectively;The PCIE card includes second USB3.0 interface;The PCIE card is connected with the EVB board electrically by first USB3.0 interface and second USB3.0 interface connection;The computer is electrically connected with the EVB board by USB2.0 interface.In the scheme, by PCIE bus turns SDIO, can be compatible with the official drive of different module, facilitate the development of production and measurement program, good stability.
[0006] Further, the SDIO adapter board is on the EVB through the mini-PCIE interface.
[0007] Further, the EVB board and the SDIO adapter board are arranged in a shielded box.
[0008] Further, the PCIE card comprises a second DC-DC circuit, a second USB3.0 interface and a PCIEX1 interface; the second DC-DC circuit obtains DC 5V voltage from DC 12V voltage obtained from a PCIE card slot of a computer; the second USB3.0 interface is used for a first USB3.0 interface of an external EVB board; and the PCIEX1 interface is a standard defined interface.
[0009] Further, the SDIO adapter board comprises a main chip, a third DC-DC circuit and an input / output interface, which are electrically connected to the main chip respectively; and the input / output interface is matched with the mini-PCIE interface.
[0010] By adopting the above scheme, the PCIE-to-SDIO module has the following technical effects:
[0011] 1. The circuit is simple, and the electronic components are few.
[0012] 2. The adapter transmission rate of the PCIE bus is high, and the compatibility is good.
[0013] 3. The main chip of the SDIO is Windows driver-free, and only needs to install the driver of the measured module. DETAILED DESCRIPTION
[0014] Figure 1 It is a functional framework of the utility model;
[0015] Figure 2 It is a circuit principle diagram of the first DC-DC circuit;
[0016] Figure 3 It is a circuit principle diagram of the USB2.0 interface-to-TTL circuit;
[0017] Figure 4 It is a circuit principle diagram of the pad point circuit connected by the measured Socket needle;
[0018] Figure 5 It is a circuit connection diagram of the mini-PCIE interface;
[0019] Figure 6 It is a circuit connection diagram of the first USB3.0 interface;
[0020] Figure 7 It is a circuit connection diagram of the second USB3.0 interface;
[0021] Figure 8 It is a circuit principle diagram of the second DC-DC circuit;
[0022] Figure 9 It is a circuit connection diagram of the PCIEX1 interface;
[0023] Figure 10 circuit connection diagram of the main chip;
[0024] Figure 11 circuit schematic diagram of the third DC-DC circuit;
[0025] Figure 12 circuit connection diagram of the input and output interface. DETAILED DESCRIPTION
[0026] The utility model will be described in detail below in combination with the drawings and specific embodiments.
[0027] Please refer to Figures 1-12 The embodiment provides a PCIE to SDIO module, which comprises a computer 10 provided with a PCIE card slot, a PCIE card 11 installed in the PCIE card slot, an EVB board 12 connected with the computer 10, and an SDIO adapter board 13 installed on the EVB board 12. The EVB board 12 comprises a first DC-DC circuit 14, a USB2.0 interface to TTL circuit 15, a pad point circuit 16 connected with a measured Socket pin and electrically connected with the USB2.0 interface to TTL circuit 15, a mini-PCIE interface 17 electrically connected with the pad point circuit 16 connected with the measured Socket pin, a first USB3.0 interface 18 electrically connected with the mini-PCIE interface 17, and the first DC-DC circuit 14 is electrically connected with the USB2.0 interface to TTL circuit 15, the pad point circuit 16 connected with the measured Socket pin, the mini-PCIE interface 17 and the first USB3.0 interface 18 respectively. The PCIE card 11 comprises a second USB3.0 interface 19. The PCIE card 11 is electrically connected with the EVB board 12 through the first USB3.0 interface 18 and the second USB3.0 interface 19. The computer 10 is electrically connected with the EVB board 12 through a USB2.0 interface. The pad point circuit connected with the measured Socket pin adopts a 12*12 packaging specification.
[0028] In the embodiment, the SDIO adapter board 13 is connected with the EVB through the mini-PCIE interface 17.
[0029] In the embodiment, the EVB board 12 and the SDIO adapter board 13 are arranged in a shielding box 20.
[0030] In the embodiment, the PCIE card 11 comprises a second DC-DC circuit 21, a second USB3.0 interface 19 and a PCIEX1 interface 22; the second DC-DC circuit 21 converts the DC 12V voltage obtained from the PCIE card slot of the computer 10 into a DC 5V voltage; the second USB3.0 interface 19 is used for connecting the first USB3.0 interface 18 of the EVB board 12; and the PCIEX1 interface 22 is a standard defined interface and is used for connecting the PCIE card slot of the computer.
[0031] In the embodiment, the SDIO adapter board 13 comprises a main chip 23, a third DC-DC circuit 24 and an input / output interface 25, which are electrically connected to the main chip 23; and the input / output interface 25 cooperates with the mini-PCIE interface 17.
[0032] The SDIO adapter board comprises a clock line CLK, a command line CMD and four data lines D0-D3.
[0033] The main chip is a card reader chip with a model number of UA330 or UA332; the bus host end (HOST) of the SDIO adapter board is the chip; and the device end (DEVICE) is a module to be tested.
[0034] All the communications are started by the HOST end sending a command; as long as the DEVICE end can analyze the command of the HOST, the DEVICE end can communicate with the HOST.
[0035] The downlink interface of the main chip comprises CLK, CMD, D0, D1, D2, D3 and a module to be tested; the uplink interface comprises a group of clock lines, two groups of communication lines, a reset control line, a power supply and a GND, and thus the USB3.0 interface and the matching wire are used as the adapter wire.
[0036] The drive recognition of the SDIO adapter board is provided by the Windows system; the drive of the module to be tested is provided by the official of the chip of the module; and the loading of the module and the release of the resource are completed by using the reset control line.
[0037] The WIFI & Bluetooth module is tested by using the communication mode of the PCIE to SDIO interface, and the effect is very good; the test pass rate is more than 95%, and the computer does not appear blue screen.
[0038] In conclusion, the PCIE to SDIO module has the following technical effects:
[0039] 1. The circuit is simple, and the electronic components are few.
[0040] 2. The adapter transmission rate of the PCIE bus is high, and the compatibility is good.
[0041] 3. The main chip of the SDIO is installed in Windows without driver, and only the driver of the measured module needs to be installed.
[0042] The preferred embodiments of the present application have been described above with the preferred embodiments, but the present application is not limited to the above, and any modification, equivalent replacement, and improvement within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A PCIE to SDIO module, characterized in that, The application relates to a computer provided with a PCIE card slot, a PCIE plug-in card installed in the PCIE card slot, an EVB board connected with the computer and an SDIO adapter plate installed on the EVB board. The EVB board comprises a first DC-DC circuit, a USB2.0 interface-TTL circuit, a pad point circuit connected with a measured Socket pin, a mini-PCIE interface electrically connected with the pad point circuit connected with the measured Socket pin and a first USB3.0 interface electrically connected with the mini-PCIE interface; the first DC-DC circuit is electrically connected with the USB2.0 interface-TTL circuit, the pad point circuit connected with the measured Socket pin, the mini-PCIE interface and the first USB3.0 interface respectively; the PCIE plug-in card comprises a second USB3.0 interface; the PCIE plug-in card is electrically connected with the EVB board through the first USB3.0 interface and the second USB3.0 interface; the computer is electrically connected with the EVB board through the USB2.0 interface. The SDIO adapter plate is connected with the EVB through the mini-PCIE interface.
2. The PCIE to SDIO module of claim 1, wherein, The EVB board and the SDIO adapter plate are arranged in a shielding box.
3. The PCIE to SDIO module of claim 1, wherein, The PCIE plug-in card comprises a second DC-DC circuit, a second USB3.0 interface and a PCIEX1 interface; the second DC-DC circuit converts DC 12V voltage obtained from the PCIE card slot of the computer into DC 5V voltage; the second USB3.0 interface is used for connecting the first USB3.0 interface of the EVB board; and the PCIEX1 interface is a standard defined interface.
4. The PCIE to SDIO module of claim 1, wherein, The SDIO adapter plate comprises a main chip, a third DC-DC circuit electrically connected with the main chip and an input-output interface; and the input-output interface is matched with the mini-PCIE interface.
5. The PCIE to SDIO module of claim 1, wherein,