Network additional memory

Abstract

The utility model relates to the technical field of network additional memories, in particular to a network additional memory. The network additional memory comprises a shell, and a hard disk inner frame, a circuit board, a fan and a heat dissipation assembly which are arranged in the shell, the hard disk inner frame is used for installing a hard disk of the network additional memory; the heat dissipation assembly comprises a heat dissipation substrate, a heat conduction pipe and heat dissipation fins, and a heat source component is arranged on the circuit board. The fan is installed at the rear end of the shell and electrically connected with the circuit board. The cooling fins are installed between the fan and the rear end of the hard disk inner frame. The heat dissipation substrate is arranged close to or attached to the heat source component and is connected with the heat dissipation fins through the heat conduction pipe. According to the utility model, the heat dissipation effect of heat source components is better.

Description

TECHNICAL FIELD

[0001] The utility model relates to network attached storage technology field, especially a network attached storage. BACKGROUND

[0002] Network attached storage (NAS) is a kind of device connected on network, with data storage function, also called "network storage".It is a kind of special data storage server, data-centered, completely separates storage device and server, centrally manages data, thereby releasing bandwidth, improving performance.Network attached storage can automatically backup and synchronize photos and files on terminal device, ensures data security.User can conveniently access the file stored on network attached storage through network.

[0003] Network attached storage circuit board is provided with heat source components such as CPU, and heat source components will generate a large amount of heat in use process, at present, only simple blowing or air extraction heat dissipation is carried out through fan, and heat dissipation effect is poor. UTILITY MODEL CONTENT

[0004] The utility model embodiment provides a kind of network attached storage, to solve the problem that network attached storage in prior art only carries out simple heat dissipation through fan and heat dissipation fin, and heat dissipation effect is poor.

[0005] The utility model discloses a kind of network attached storage, including shell, and hard disk inner frame, circuit board, fan and heat dissipation component being set in shell;Hard disk inner frame is used to install the hard disk of network attached storage;Heat dissipation component includes heat dissipation base plate, heat pipe and heat dissipation fin, and heat source component is set on circuit board;

[0006] Fan is installed in the rear end of shell and is electrically connected with circuit board, and heat dissipation fin is installed between fan and the rear end of hard disk inner frame;Heat dissipation base plate is close to or adhered on heat source component, and is connected with heat dissipation fin by heat pipe.

[0007] Optionally, circuit board is installed below hard disk inner frame.

[0008] Optionally, the bottom of hard disk inner frame is equipped with the first mounting column extending towards circuit board, and heat dissipation base plate is installed on the first mounting column.

[0009] Optionally, heat dissipation base plate includes main body part and side wing connecting part being set on both sides of main body part;The thickness of main body part is greater than the thickness of side wing connecting part;Side wing connecting part is installed on the first mounting column.

[0010] Optionally, the side of main body part towards circuit board is equipped with mounting slot, and one end of heat pipe is installed in mounting slot.

[0011] Optionally, the heat dissipation base plate is provided with a leading gap on the side facing the heat dissipation fins, and the heat conduction pipe is led out from the leading gap and connected with the heat dissipation fins.

[0012] Optionally, a connecting stud is arranged on the side of the heat dissipation base plate facing the circuit board, and the connecting stud is screwed on the circuit board by a screw.

[0013] Optionally, a second mounting column extending towards the circuit board is arranged on the bottom of the hard disk inner frame, and the circuit board is mounted on the second mounting column.

[0014] Optionally, an extension is arranged on the bottom of the hard disk inner frame and extends towards the rear end of the shell, and a first opening is arranged on the extension, and the heat conduction pipe passes through the first opening on the bottom of the hard disk inner frame and is connected with the heat dissipation fins.

[0015] Optionally, the heat dissipation base plate is a copper plate or an aluminum plate, the heat dissipation fins are made of copper or aluminum, and the heat conduction pipe is a solid copper pipe.

[0016] Compared with the prior art, the network attached storage provided by the embodiment of the present application has the following beneficial effects: the network attached storage of the present application is provided with a fan at the rear end of the shell and a heat dissipation assembly, the heat dissipation base plate is arranged close to or in contact with the heat source component, the heat dissipation fins are arranged between the fan and the rear end of the hard disk inner frame, the hard disk inner frame existing in the network attached storage is fully considered, the space utilization is ensured, the heat dissipation fins are connected with the heat dissipation base plate through the heat conduction pipe, the heat generated by the heat source component can be directly and quickly conducted to the heat dissipation base plate, and then conducted through the heat dissipation base plate, the heat conduction pipe and the heat dissipation fins in sequence, and finally blown out of the shell by the fan, so that the heat dissipation effect of the heat source component is better. BRIEF DESCRIPTION OF DRAWINGS

[0017] The technical scheme of the present application will be further described in detail below with reference to the drawings and embodiments, and in the drawings:

[0018] Figure 1 is a schematic view of the network attached storage of the embodiment of the present application;

[0019] Figure 2 is a sectional view of the network attached storage of the embodiment of the present application;

[0020] Figure 3 is an internal view of the network attached storage of the embodiment of the present application;

[0021] Figure 4 is a schematic view of the hard disk inner frame, the heat dissipation assembly, the circuit board and the fan of the embodiment of the present application;

[0022] Figure 5 is a schematic view of the heat dissipation assembly, the circuit board and the fan of the embodiment of the present application;

[0023] Figure 6 This is a schematic diagram of the circuit board of an embodiment of this utility model;

[0024] Figure 7 This is a schematic diagram of the heat dissipation assembly according to an embodiment of the present utility model;

[0025] Figure 8 This is a schematic diagram of the heat dissipation substrate according to an embodiment of the present invention;

[0026] Figure 9 This is another schematic diagram of the heat dissipation substrate according to an embodiment of the present invention.

[0027] The labels for the attached figures are as follows:

[0028] 1. Housing; 2. Hard drive inner frame; 21. First mounting post; 22. Second mounting post; 23. Extension; 231. First opening; 3. Circuit board; 31. Heat source components; 4. Fan; 5. Heat dissipation assembly; 51. Heat dissipation base plate; 511. Main body; 511a. Mounting slot; 511b. Lead-out notch; 512. Side wing connection; 513. Connecting stud; 52. Heat pipe; 53. Heat dissipation fins; 6. Hard drive. Detailed Implementation

[0029] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The preferred embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0030] This utility model embodiment provides a network-attached storage device, such as... Figures 1 to 6 As shown, the network attached storage includes a housing 1, and a hard disk drive frame 2, a circuit board 3, a fan 4, and a heat dissipation assembly 5 disposed within the housing 1. The hard disk drive frame 2 is used to mount the hard disk 6 of the network attached storage. The heat dissipation assembly 5 includes a heat dissipation substrate 51, heat pipes 52, and heat dissipation fins 53. A heat source component 31 is disposed on the circuit board 3. The fan 4 is mounted at the rear end of the housing 1 and electrically connected to the circuit board 3. The heat dissipation fins 53 are mounted between the fan 4 and the rear end of the hard disk drive frame 2. The heat dissipation substrate 51 is disposed close to or attached to the heat source component 31 and is connected to the heat dissipation fins 53 through the heat pipes 52.

[0031] The network additional memory of the utility model is installed fan 4 at the rear end of casing 1, and is provided with heat dissipation assembly 5, wherein, heat dissipation base plate 51 is arranged close to or pastes on heat source component 31, and heat dissipation fin 53 is installed between fan 4 and hard disk inner frame 2 rear end, fully consider the hard disk inner frame 2 existing in network additional memory, guarantee the space utilization condition, heat dissipation fin 53 is connected with heat dissipation base plate 51 through heat conduction pipe 52, the heat generated by heat source component 31 can directly, quickly be conducted to heat dissipation base plate 51, and is conducted in turn through heat dissipation base plate 51, heat conduction pipe 52 and heat dissipation fin 53, and is finally blown to casing 1 outside by fan 4, and the heat dissipation effect of heat source component 31 is better.

[0032] Specifically, by installing fan 4 at the rear end of casing 1, and establishing effective heat conduction path between heat dissipation base plate 51, heat conduction pipe 52 and heat dissipation fin 53, the heat generated by heat source component 31 can be quickly conducted to heat dissipation base plate 51, and then dissipated through heat conduction pipe 52 and heat dissipation fin 53, and finally discharged outside casing 1 by fan 4, while ensuring effective utilization of the internal space of NAS, in combination with the existence of hard disk inner frame 2 in network additional memory, the layout of heat dissipation assembly 5 is optimized, the heat dissipation efficiency is improved through more direct and fast heat conduction path, which helps to protect the internal elements of network additional memory and prolong the service life of the equipment.

[0033] Hard disk inner frame 2 is used to insert hard disk 6 in network additional memory, and can have multiple hard disk 6 insertion positions, and multiple hard disks 6 are respectively inserted in the hard disk 6 insertion positions. Circuit board 3 controls the normal operation of network additional memory, and is provided with various necessary components, circuits, interfaces and the like, and heat source component 31 can be a CPU or other components on circuit board 3 that are prone to heat. For the specific arrangement of heat dissipation base plate 51, heat dissipation base plate 51 is arranged close to heat source component 31, that is, there is no contact between heat dissipation base plate 51 and heat source component 31, but there is a gap between them. Heat dissipation base plate 51 is arranged on heat source component 31, that is, heat dissipation base plate 51 and heat source component 31 are in contact, and there is no gap between them. Arranging heat dissipation base plate 51 close to or pasting on heat source component 31 can ensure that the distance between heat dissipation base plate 51 and heat source component 31 is small, so that the heat generated by heat source component 31 can be timely, quickly and accurately conducted to heat dissipation base plate 51, improving the speed and effect of heat dissipation.

[0034] Heat dissipation base plate 51 is a copper plate or an aluminum plate, and the material of heat dissipation fin 53 is copper or aluminum, and the use of copper plate or aluminum plate has good heat conduction performance. Heat conduction pipe 52 is a solid copper pipe. Heat conduction pipe 52 adopts a solid copper pipe, which can provide a more direct and fast heat conduction path compared with a hollow copper pipe.

[0035] Specifically, the circuit board 3 is installed below the hard disk inner shelf 2. By installing the circuit board 3 below the hard disk inner shelf 2, the space inside the NAS device can be more effectively utilized, making the NAS device more compact. The circuit board 3 located below the hard disk inner shelf 2 can be installed on the bottom of the hard disk inner shelf 2 or on the shell 1 in a position below the hard disk inner shelf 2.

[0036] The bottom of the hard disk inner shelf 2 is provided with a first mounting column 21 extending towards the circuit board 3, and the heat dissipation substrate 51 is mounted on the first mounting column 21. The first mounting column 21 provides a fixed mounting point, facilitating the installation of the heat dissipation substrate 51 and making the installation of the heat dissipation substrate 51 more stable. This design can reduce the displacement of the heat dissipation substrate 51 during operation due to vibration or other factors, improving overall stability. The first mounting column 21 can also make the heat dissipation substrate 51 in a suspended state on one side of the hard disk inner shelf 2, avoiding the heat of the heat dissipation substrate 51 being conducted to the hard disk inner shelf 2, causing the hard disk 6 to be high in temperature. Specifically, the first mounting column 21 is a bolt, one end of which can be installed on the bottom of the hard disk inner shelf 2 by a screw.

[0037] As shown in Figures 7 to 9 , the heat dissipation substrate 51 includes a main body part 511 and side wing connecting parts 512 arranged on both sides of the main body part 511; the thickness of the main body part 511 is greater than the thickness of the side wing connecting parts 512; the side wing connecting parts 512 are mounted on the first mounting column 21. The main body part 511 is thicker, which can provide greater heat capacity and higher heat conduction efficiency, and heat can be quickly conducted from the heat source components 31 to the main body part 511 of the heat dissipation substrate 51, which can significantly improve the heat dissipation efficiency. The heat dissipation substrate 51 is fixed on the first mounting column 21 through the side wing connecting parts 512 with thinner thickness, which facilitates the connection and installation with the first mounting column 21, for example, the side wing connecting parts 512 are installed on the first mounting column 21 by a screw.

[0038] As shown in Figures 7 to 9 , the side of the main body part 511 facing the circuit board 3 is provided with a mounting groove 511a, and one end of the heat pipe 52 is installed in the mounting groove 511a. The side of the main body part 511 facing the circuit board 3 is provided with a mounting groove 511a, and one end of the heat pipe 52 is installed in the mounting groove 511a. This design allows the heat pipe 52 to directly contact the main body part 511 of the heat dissipation substrate 51 and face the heat source components 31, which is more conducive to heat absorption by the heat pipe 52, thereby achieving rapid and efficient heat conduction. Heat can be quickly conducted from the heat source components 31 to the heat dissipation substrate 51 and then rapidly dispersed through the heat pipe 52, improving the overall heat dissipation efficiency. Moreover, the mounting groove 511a can facilitate the installation and positioning of the heat pipe 52, improving the installation stability of the heat pipe 52. The heat pipe 52 can be press-fitted in the mounting groove 511a.

[0039] AsFigures 7 to 9 As shown in the drawings, the heat dissipation base plate 51 is provided with a leading gap 511b on the side facing the heat dissipation fin 53, and the heat conduction pipe 52 is led out from the leading gap 511b and connected with the heat dissipation fin 53. The present scheme is provided with the leading gap 511b on the side of the heat dissipation base plate 51 facing the heat dissipation fin 53, so that the heat conduction pipe 52 can be conveniently led out from the heat dissipation base plate 51 and directly and smoothly connected to the heat dissipation fin 53 after being led out.

[0040] Further, as shown in the drawings, Figure 9 As shown in the drawings, the heat dissipation base plate 51 is provided with a connecting stud 513 on the side facing the circuit board 3, and the connecting stud 513 is screwed on the circuit board 3. The connecting stud 513 can be used as a support to support the heat dissipation base plate, so that there is a gap between the circuit board 3 and the heat dissipation base plate 51, avoiding the heat dissipation base plate 51 directly pressing on the heat source component 31 or causing pressure on the heat source component 31, which can cause damage to the heat source component 31. At the same time, by screwing on the circuit board 3, the heat dissipation base plate 51, the circuit board 3 and the hard disk inner frame 2 are connected with each other to form a whole, improving the connection and installation stability of the heat dissipation base plate 51 and the circuit board 3.

[0041] On the other hand, as shown in the drawings, Figure 4 and Figure 5 As shown in the drawings, the bottom of the hard disk inner frame 2 is provided with a second mounting column 22 extending towards the circuit board 3, and the circuit board 3 is mounted on the second mounting column 22. The second mounting column 22 provides a mounting position for the circuit board 3, ensuring convenient and firm installation of the circuit board 3. The second mounting column 22 can also keep the circuit board 3 away from the hard disk inner frame 2 by a certain distance, avoiding heat transfer between the hard disk 6 and the circuit board 3, which can cause heat concentration and temperature rise. In addition, the second mounting column 22 can provide a space between the circuit board 3 and the bottom of the hard disk inner frame 2, facilitating the installation of the heat dissipation base plate 51.

[0042] The bottom of the hard disk inner frame 2 extends an extension 23 towards the rear end of the shell 1, and the extension 23 is provided with a first opening 231, and the heat conduction pipe 52 passes through the first opening 231 at the bottom of the hard disk inner frame 2 and is connected with the heat dissipation fin 53. The first opening 231 can facilitate the leading out of the heat conduction pipe 52 from the rear end of the hard disk inner frame 2 and the connection with the heat dissipation fin 53.

[0043] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them. For those skilled in the art, the technical solutions described in the above embodiments can be modified, or some technical features can be replaced by equivalents; all these modifications and replacements shall belong to the protection scope of the claims of the present application.

Claims

1. A network-attached storage device, characterized in that, The device includes a housing, and a hard drive rack, circuit board, fan, and heat dissipation assembly disposed within the housing; the hard drive rack is used to mount the hard drive of the network-attached storage; the heat dissipation assembly includes a heat dissipation substrate, heat pipes, and heat dissipation fins, and the circuit board is provided with heat source components; The fan is mounted at the rear end of the housing and electrically connected to the circuit board. The heat sink fins are mounted between the fan and the rear end of the hard drive inner frame. The heat sink substrate is disposed close to or attached to the heat source components and is connected to the heat sink fins through the heat pipe.

2. The network-attached storage according to claim 1, characterized in that, The circuit board is mounted below the hard drive enclosure.

3. The network-attached storage according to claim 2, characterized in that, The bottom of the hard drive inner frame is equipped with a first mounting post extending toward the circuit board, and the heat dissipation substrate is mounted on the first mounting post.

4. The network-attached storage according to claim 3, characterized in that, The heat dissipation substrate includes a main body and side wing connecting portions disposed on both sides of the main body; the thickness of the main body is greater than the thickness of the side wing connecting portions; the side wing connecting portions are mounted on the first mounting post.

5. The network-attached storage according to claim 4, characterized in that, The main body has a mounting groove on the side facing the circuit board, and one end of the heat pipe is installed in the mounting groove.

6. The network-attached storage according to claim 5, characterized in that, The heat dissipation substrate has an outlet notch on the side facing the heat dissipation fins, and the heat pipe extends out from the outlet notch and connects to the heat dissipation fins.

7. The network-attached storage according to claim 3, characterized in that, The heat dissipation substrate is connected to a stud on the side facing the circuit board, and the stud is screwed onto the circuit board.

8. The network-attached storage according to claim 2, characterized in that, The bottom of the hard drive inner frame is equipped with a second mounting post extending toward the circuit board, and the circuit board is mounted on the second mounting post.

9. The network-attached storage according to claim 2, characterized in that, The bottom of the hard drive inner frame extends toward the rear end of the housing, and a first opening is provided on the extension. The heat pipe passes through the first opening from the bottom of the hard drive inner frame and connects to the heat dissipation fins.

10. The network-attached storage according to claim 1, characterized in that, The heat dissipation substrate is a copper plate or an aluminum plate, the heat dissipation fins are made of copper or aluminum, and the heat pipe is a solid copper pipe.

Images