Semiconductor silicon optical wafer multichannel photoelectric performance test equipment

Abstract

The utility model discloses semiconductor silicon optical wafer multichannel photoelectric performance test equipment, which comprises a base, a fixed plate is fixedly connected to the middle of the base, a probe station host is arranged at the top of the base and located on one side of the fixed plate, and a material storage assembly is arranged on one side, opposite to the probe station host, of the fixed plate. A transfer assembly for transferring the silicon optical wafer is arranged between the probe station host and the storage assembly and is positioned at the top of the fixed plate; the transferring assembly comprises a movable plate movably connected into the fixed plate, a rotating plate arranged at the top of the movable plate, a first electric push rod fixedly connected to the top of the rotating plate, an extension plate slidably connected to the top of the rotating plate and located on one side of the first electric push rod, and a mounting plate arranged at the end, away from the rotating plate, of the extension plate. And the vacuum chucks are fixedly connected to the top of the mounting plate. Through the above structure, the test work of a plurality of silicon optical wafers can be carried out synchronously, the automation degree of the test process is improved, the efficient and accurate test of the silicon optical wafers is realized, and the test efficiency and accuracy are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of silicon light wafer testing equipment, especially to a semiconductor silicon light wafer multichannel photoelectric performance testing equipment. BACKGROUND

[0002] The test of silicon light wafer mainly includes the test of its light and electric performance, and the test is mainly divided into two stages: wafer level test and module level performance test after packaging.

[0003] In the prior art, through retrieval, it is found that Chinese patent discloses a semiconductor wafer multi-channel testing method and multi-channel testing probe station, and the application number is 200510102170.1, the patent mainly controls the multi-channel switcher by the probe station host computer, makes the test head of the testing machine connected with each group of test probes in turn, and the probe station host computer is embedded with multi-channel testing and communication software; the test probe head is a multi-chip test probe head, and a plurality of groups of test probes capable of being connected with a plurality of chips simultaneously are arranged on the test probe head; the marking device is a multi-channel marking device, and the probe station host computer controls the marking of the unqualified chips tested; a multi-channel switcher with the same number of test probes as the multi-chip test probe head is further arranged, the multi-channel switcher is connected with the test probe head through another control line, and the test head of the testing machine and a group of test probes of the multi-chip test probe head corresponding to each channel are communicated respectively. The above-mentioned patent can complete the test of at least two semiconductor chips to be tested in one movement cycle of the probe station host computer, and the test speed and efficiency are improved obviously. However, the above-mentioned equipment has defects in automatic feeding and discharging, and may still rely on manual operation to realize the feeding and discharging of the wafer, which not only increases the labor cost, but also makes the test process time-consuming, and the detection efficiency still needs to be improved. Therefore, the technical personnel in the art provide a semiconductor silicon light wafer multichannel photoelectric performance testing equipment to solve the problems in the above background art. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a semiconductor silicon light wafer multichannel photoelectric performance testing equipment, setting up transfer assembly, storage assembly and a plurality of probe stations cooperate, can carry out the test work of a plurality of silicon light wafers simultaneously, benefit to improve the degree of automation of the test process, realize the efficient and accurate test of silicon light wafer, improve the test efficiency and accuracy.

[0005] In order to achieve the above object, a semiconductor silicon light wafer multi-channel photoelectric performance testing equipment is provided, which comprises a base, a fixed plate is fixedly connected to the middle of the base, a probe station main machine is arranged on the top of the base and located on one side of the fixed plate, a storage assembly is arranged on the side of the fixed plate opposite to the probe station main machine, a transfer assembly for transferring silicon light wafers is arranged between the probe station main machine and the storage assembly and located on the top of the fixed plate, the transfer assembly comprises a movable plate movably connected to the inside of the fixed plate, a rotating plate arranged on the top of the movable plate, a first electric push rod fixedly connected to the top of the rotating plate, an extension plate slidably connected to the top of the rotating plate and located on one side of the first electric push rod, a mounting plate arranged on the end of the extension plate away from the rotating plate, a plurality of vacuum suction cups fixedly connected to the top of the mounting plate, a second electric push rod arranged on the bottom of the mounting plate, a control assembly arranged in the inside of the fixed plate and used for driving the movable plate to move horizontally, and a driving assembly arranged between the top of the movable plate and the bottom of the rotating plate and used for driving the rotating plate to rotate, the piston rod of the first electric push rod is fixedly connected with the extension plate, the side of the extension plate close to the mounting plate is arranged in L-shaped structure, the second electric push rod is fixedly connected to the top of the folded edge of the L-shaped structure, and the mounting plate is fixedly connected to the top end of the piston rod of the second electric push rod.

[0006] The storage assembly comprises a feeding rack and a lifting assembly for driving the feeding rack to move up and down.

[0007] According to the semiconductor silicon light wafer multi-channel photoelectric performance testing equipment, a plurality of probe stations are uniformly arranged on one side of the probe station main machine, a test probe head is arranged on the top of the probe station main machine and located above the probe stations, and U-shaped grooves are arranged on the top of each probe station.

[0008] According to the semiconductor silicon light wafer multi-channel photoelectric performance testing equipment, the storage assembly further comprises a lifting plate, two feeding racks are symmetrically fixedly connected to the top of the lifting plate, and a plurality of positioning plates are fixedly connected to the sides of the feeding racks in equal distance.

[0009] According to the semiconductor silicon light wafer multi-channel photoelectric performance testing equipment, the control assembly comprises a first lead screw rotatably connected to the inside of the fixed plate and a first motor fixedly connected to one side of the fixed plate, one end of the first lead screw close to the first motor is fixedly connected with the output shaft of the first motor penetrating through the fixed plate, and the movable plate is slidably connected to the inside of the fixed plate and threadedly connected with the first lead screw.

[0010] According to the semiconductor silicon light wafer multi-channel photoelectric performance testing equipment, the driving assembly comprises a mounting bracket fixedly connected to the top of the movable plate and arranged in U-shaped structure, a rotating shaft rotatably connected to the top of the mounting bracket, and a second motor fixedly connected to the top of the movable plate, the bottom end of the rotating shaft is fixedly connected with the output shaft of the second motor, and the rotating plate is fixedly connected to the top end of the rotating shaft.

[0011] According to the semiconductor silicon light wafer multi-channel photoelectric performance test equipment, the lifting assembly comprises two fixed frames which are fixedly connected to the top of the base and are L-shaped structures, a second lead screw which is rotationally connected to the top of one of the fixed frames, a guide rod which is fixedly connected to the top of the other fixed frame, and a third motor which is fixedly connected to the top of the fixed frame and is located above the second lead screw, the bottom end of the second lead screw is rotationally connected with the base, the bottom end of the guide rod is fixedly connected with the base, the top end of the second lead screw is fixedly connected with the output shaft of the third motor in a penetrating mode, and the side of the lifting plate close to the second lead screw is threadedly connected with the second lead screw.

[0012] According to the semiconductor silicon light wafer multi-channel photoelectric performance test equipment, the bottom of the rotating plate and the two sides of the first electric push rod are fixedly connected with guide rails in trapezoidal structures, and the extension plate is slidably connected to the outer side of the guide rails.

[0013] The semiconductor silicon light wafer multi-channel photoelectric performance test equipment has the following beneficial effects:

[0014] Compared with the prior art, the semiconductor silicon light wafer multi-channel photoelectric performance test equipment can simultaneously perform test work on multiple silicon light wafers through the cooperation of the transfer assembly, the storage assembly and the multiple probe tables, thereby improving the automation degree of the test process, realizing efficient and accurate test of the silicon light wafer, and improving the test efficiency and accuracy.

[0015] Additional aspects and advantages of the present application will be given in part in the following description, and will become apparent from the following description, or will be learned by practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0016] The present application will be further described below in combination with the drawings and embodiments.

[0017] Figure 1 It is a first overall structure schematic view of the semiconductor silicon light wafer multi-channel photoelectric performance test equipment.

[0018] Figure 2 It is a second overall structure schematic view of the semiconductor silicon light wafer multi-channel photoelectric performance test equipment.

[0019] Figure 3 It is a structure schematic view of the transfer assembly and the storage assembly of the semiconductor silicon light wafer multi-channel photoelectric performance test equipment.

[0020] Figure 4 It is a structure schematic view of the transfer assembly of the semiconductor silicon light wafer multi-channel photoelectric performance test equipment.

[0021] Figure 5The utility model relates to a semiconductor silicon light wafer multichannel photoelectric performance test equipment's removal subassembly main view structure schematic drawing.

[0022] Legend:

[0023] 1, base; 2, probe station; 3, probe station host computer; 4, test probe head; 5, fixed plate; 6, first screw rod; 7, first motor; 8, movable plate; 9, mounting bracket; 10, rotating shaft; 11, second motor; 12, rotating plate; 13, first electric push rod; 14, extension plate; 15, guide rail; 16, fixed frame; 17, second screw rod; 18, lifting plate; 19, third motor; 20, guide rod; 21, discharging frame; 22, positioning plate; 23, vacuum chuck; 24, mounting plate; 25, second electric push rod. DETAILED DESCRIPTION

[0024] This part will describe the specific embodiments of the utility model in detail, and the preferred embodiments of the utility model are shown in the drawings, and the drawings are used to supplement the description of the text part, so that people can intuitively and visually understand each technical feature and the overall technical scheme of the utility model, but it cannot be understood as the limitation of the protection scope of the utility model.

[0025] Reference Figure 1 - Figure 5 The utility model discloses a semiconductor silicon light wafer multichannel photoelectric performance test equipment, it includes base 1, the fixed plate 5 is fixedly connected in the middle part of base 1, the top of base 1 and the one side of fixed plate 5 are equipped with probe station host computer 3, the one side of probe station host computer 3 is evenly equipped with a plurality of probe stations 2, the top of probe station host computer 3 and the above of probe station 2 are equipped with test probe head 4, and the top of probe station 2 is equipped with U groove.

[0026] When the wafer to be tested is positioned on the top of probe station 2, test probe head 4 can contact with the wafer, and the test work is controlled through probe station host computer 3.

[0027] The side opposite to the probe station main machine 3 of the fixed plate 5 is provided with a storage assembly, a transfer assembly for transferring the silicon wafer is arranged between the probe station main machine 3 and the storage assembly and at the top of the fixed plate 5, the transfer assembly comprises a movable plate 8 movably connected to the inside of the fixed plate 5, a rotating plate 12 arranged at the top of the movable plate 8, a first electric push rod 13 fixedly connected to the top of the rotating plate 12, an extension plate 14 slidably connected to the top of the rotating plate 12 and located on one side of the first electric push rod 13, a mounting plate 24 arranged at the end of the extension plate 14 away from the rotating plate 12, a plurality of vacuum suction cups 23 fixedly connected to the top of the mounting plate 24, a second electric push rod 25 arranged at the bottom of the mounting plate 24, a control assembly arranged in the inside of the fixed plate 5 and used for driving the movable plate 8 to move horizontally, and a driving assembly arranged between the top of the movable plate 8 and the bottom of the rotating plate 12 and used for driving the rotating plate 12 to rotate, the vacuum suction cups 23 are used for adsorbing the silicon wafer, the piston rod of the first electric push rod 13 is fixedly connected with the extension plate 14, the side close to the mounting plate 24 of the extension plate 14 is arranged in an L-shaped structure, the second electric push rod 25 is fixedly connected to the top of the folded edge of the L-shaped structure, and the mounting plate 24 is fixedly connected to the top end of the piston rod of the second electric push rod 25.

[0028] When loading on one side of the probe station 2, the rotating plate 12 moves to one side of the loading rack 21, and the first electric push rod 13 pushes the extension plate 14 to move below the silicon wafer. The second electric push rod 25 drives the vacuum suction cups 23 to move upward for adsorption, and the extension plate 14 moves to one side of the loading rack 21 through the contraction of the piston rod of the first electric push rod 13, and the silicon wafer can be rotated to one side of the probe station 2 through the rotation of the rotating plate 12. The extension plate 14, the vacuum suction cups 23 thereon and the silicon wafer move to the top of the probe station 2, and the silicon wafer can be lowered to the top of the probe station 2 for subsequent testing work through the operation of the second electric push rod 25. The loading and unloading work is simple and efficient. Multiple probe stations 2 are arranged to cooperate with the transfer assembly, and the testing work of multiple silicon wafers can be carried out synchronously, which is beneficial to improving the automation degree of the testing process, realizing efficient and accurate testing of the silicon wafer, and improving the testing efficiency and accuracy.

[0029] The storage assembly comprises the material placing racks 21, a lifting assembly for driving the material placing racks 21 to move up and down, and a lifting plate 18. The two symmetrical material placing racks 21 are fixedly connected to the top of the lifting plate 18. The opposite sides of the material placing racks 21 are fixedly connected with a plurality of positioning plates 22 at equal intervals for supporting the wafers. The lifting assembly comprises two fixed racks 16 fixedly connected to the top of the base 1 and having an L-shaped structure, a second lead screw 17 rotatably connected to the top of one of the fixed racks 16, a guide rod 20 fixedly connected to the top of the other fixed rack 16, and a third motor 19 fixedly connected to the top of the fixed rack 16 and located above the second lead screw 17. The bottom end of the second lead screw 17 is rotatably connected to the base 1. The bottom end of the guide rod 20 is fixedly connected to the base 1. The top end of the second lead screw 17 is fixedly connected with the output shaft of the third motor 19 through the fixed rack 16. The side of the lifting plate 18 close to the second lead screw 17 is threadedly connected with the second lead screw 17. The side of the lifting plate 18 close to the guide rod 20 is slidably connected with the guide rod 20.

[0030] When the third motor 19 operates, the second lead screw 17 can be driven to rotate, and the lifting plate 18 can be driven to move up and down by the second lead screw 17. When the lifting plate 18 moves up and down, the material placing racks 21 are synchronously driven to move, so that the position adjustment of the positioning plates 22 can be realized, thereby facilitating the wafer suction by the vacuum chuck 23 at different positions.

[0031] The control assembly comprises a first lead screw 6 rotatably connected to the inner side of the fixed plate 5 and a first motor 7 fixedly connected to one side of the fixed plate 5. The end of the first lead screw 6 close to the first motor 7 is fixedly connected with the output shaft of the first motor 7 through the fixed plate 5. The movable plate 8 is slidably connected to the inside of the fixed plate 5 and threadedly connected with the first lead screw 6.

[0032] When the first motor 7 operates, the first lead screw 6 can be driven to rotate, and the movable plate 8 can be driven to move by the rotating first lead screw 6, so that the transfer assembly can be driven to move, thereby facilitating the feeding work at the probe stations 2 at different positions.

[0033] The driving assembly comprises a mounting rack 9 fixedly connected to the top of the movable plate 8 and having a U-shaped structure, a rotating shaft 10 rotatably connected to the top of the mounting rack 9, and a second motor 11 fixedly connected to the top of the movable plate 8. The bottom end of the rotating shaft 10 is fixedly connected with the output shaft of the second motor 11. The rotating plate 12 is fixedly connected to the top end of the rotating shaft 10.

[0034] When the second motor 11 starts, the rotating plate 12 can be driven to rotate by the rotating shaft 10, and the rotating rotating plate 12 can reciprocate between the detection area and the storage area, so as to complete the wafer taking, feeding and discharging work.

[0035] The guide rails 15 in a trapezoidal structure are fixedly connected to the bottom of the rotating plate 12 and located on both sides of the first electric push rod 13. The extension plates 14 are slidably connected to the outer sides of the guide rails 15, so as to ensure the stability and accuracy of the extension plates 14 during the movement.

[0036] Working principle: when feeding to one side of the probe station 2, the rotating plate 12 moves to one side of the feeding rack 21, the first electric push rod 13 pushes the extension plate 14 to move below the silicon wafer, the second electric push rod 25 drives the vacuum chuck 23 to move upward for adsorption, the extension plate 14 moves to one side of the feeding rack 21 through the contraction of the piston rod of the first electric push rod 13, and the silicon wafer can be rotated to one side of the probe station 2 through the rotation of the rotating plate 12. The extension plate 14, the vacuum chuck 23 and the silicon wafer move to the top of the probe station 2, and the silicon wafer can be lowered to the top of the probe station 2 for subsequent testing work through the operation of the second electric push rod 25. The feeding and discharging work is simple and efficient. Multiple probe stations 2 are arranged to cooperate with the transfer assembly, so that multiple silicon wafers can be tested synchronously, which is beneficial to improve the automation degree of the testing process, realize efficient and accurate testing of the silicon wafer, and improve the testing efficiency and accuracy.

[0037] The embodiments of the utility model are described in detail above combined with the drawings, but the utility model is not limited to the above-mentioned embodiments, and various changes can be made within the knowledge range of ordinary skilled in the art without departing from the purpose of the utility model.

Claims

1. A multi-channel optoelectronic performance testing device for semiconductor silicon photonic wafers, characterized in that, The device includes a base (1), a fixing plate (5) fixedly connected to the middle of the base (1), a probe station host (3) located on the top of the base (1) and on one side of the fixing plate (5), a storage component located on the side of the fixing plate (5) opposite to the probe station host (3), and a transfer component for transferring silicon photonic wafers located between the probe station host (3) and the storage component and on the top of the fixing plate (5). The transfer component includes a movable plate (8) movably connected inside the fixing plate (5), a rotating plate (12) located on the top of the movable plate (8), a first electric push rod (13) fixedly connected to the top of the rotating plate (12), an extension plate (14) slidably connected to the top of the rotating plate (12) and located on one side of the first electric push rod (13), and a component located on the extension plate (14). The mounting plate (24) is located away from the rotating plate (12). A plurality of vacuum suction cups (23) are fixedly connected to the top of the mounting plate (24). A second electric push rod (25) is located at the bottom of the mounting plate (24). A control component is located inside the fixed plate (5) and is used to drive the movable plate (8) to move horizontally. A drive component is located between the top of the movable plate (8) and the bottom of the rotating plate (12) and is used to drive the rotating plate (12) to rotate. The piston rod of the first electric push rod (13) is fixedly connected to the extension plate (14). The side of the extension plate (14) near the mounting plate (24) is set as an L-shaped structure. The second electric push rod (25) is fixedly connected to the top of the folded edge of the L-shaped structure. The mounting plate (24) is fixedly connected to the top of the piston rod of the second electric push rod (25). The storage assembly includes a feeding rack (21) and a lifting assembly for moving the feeding rack (21) up and down.

2. The semiconductor silicon photonic wafer multi-channel photoelectric performance testing equipment according to claim 1, characterized in that, Multiple probe stations (2) are evenly arranged on one side of the probe station host (3). Test probe heads (4) are provided on the top of the probe station host (3) and above the probe stations (2). Each probe station (2) has a U-shaped groove on its top.

3. The semiconductor silicon photonic wafer multichannel photoelectric performance testing equipment according to claim 2, characterized in that, The storage assembly also includes a lifting plate (18), and two feeding racks (21) are symmetrically fixedly connected to the top of the lifting plate (18). Multiple positioning plates (22) are fixedly connected at equal intervals on opposite sides of the feeding racks (21).

4. The semiconductor silicon photonic wafer multichannel photoelectric performance testing equipment according to claim 3, characterized in that, The control assembly includes a first lead screw (6) rotatably connected to the inside of the fixed plate (5) and a first motor (7) fixedly connected to one side of the fixed plate (5). The end of the first lead screw (6) near the first motor (7) passes through the fixed plate (5) and is fixedly connected to the output shaft of the first motor (7). The movable plate (8) is slidably connected inside the fixed plate (5) and threadedly connected to the first lead screw (6).

5. The semiconductor silicon photonic wafer multi-channel photoelectric performance testing equipment according to claim 4, characterized in that, The drive assembly includes a U-shaped mounting bracket (9) fixedly connected to the top of the movable plate (8), a rotating shaft (10) rotatably connected to the top of the mounting bracket (9), and a second motor (11) fixedly connected to the top of the movable plate (8). The bottom end of the rotating shaft (10) is fixedly connected to the output shaft of the second motor (11), and the rotating plate (12) is fixedly connected to the top end of the rotating shaft (10).

6. The semiconductor silicon photonic wafer multichannel photoelectric performance testing equipment according to claim 5, characterized in that, The lifting assembly includes two fixed frames (16) fixedly connected to the top of the base (1) and having an L-shaped structure, a second lead screw (17) rotatably connected to the top of one of the fixed frames (16), a guide rod (20) fixedly connected to the top of the other fixed frame (16), and a third motor (19) fixedly connected to the top of the fixed frame (16) and located above the second lead screw (17). The bottom end of the second lead screw (17) is rotatably connected to the base (1), the bottom end of the guide rod (20) is fixedly connected to the base (1), the top end of the second lead screw (17) passes through the fixed frame (16) and is fixedly connected to the output shaft of the third motor (19), the lifting plate (18) is threadedly connected to the second lead screw (17) on the side near the second lead screw (17), and the lifting plate (18) is slidably connected to the guide rod (20) on the side near the guide rod (20).

7. The semiconductor silicon photonic wafer multi-channel photoelectric performance testing equipment according to claim 1, characterized in that, The bottom of the rotating plate (12) and the sides of the first electric push rod (13) are fixedly connected to a trapezoidal guide rail (15), and the extension plate (14) is slidably connected to the outside of the guide rail (15).

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