Turret type multi-nozzle ball mounting device

Abstract

The utility model relates to a turret type multi-nozzle ball planting device which comprises a soldering flux spraying mechanism and a solder ball spraying and planting mechanism. The soldering flux spraying mechanism comprises a soldering flux box, a first connecting piece, a soldering flux connecting pipe and a soldering flux spraying turntable; the solder ball spraying and planting mechanism comprises a solder ball material box, a second connecting piece, a solder ball connecting pipe and a solder ball spraying turntable; and the solder ball box is provided with a plurality of storage sub-boxes. Compared with a traditional single-nozzle ball mounting device structure and a turret type multi-nozzle structure, the turret type multi-nozzle ball mounting device has the advantages that the reaction time can be shortened, the continuity is better, and the requirement for automatic batch online ball mounting is met; and (2) an independent storage sub-box structure is adopted, so that solder balls of various different specifications can be preloaded, the selection is flexible, the ball replacement downtime is shortened, and the ball mixing phenomenon is effectively prevented.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging, especially a turret type multi-nozzle ball mounting device. BACKGROUND

[0002] In the field of semiconductor packaging technology that changes with each passing day, 2.5D and 3D packaging technology are undoubtedly the two most remarkable development directions. They not only provide strong support for the performance improvement, power consumption reduction and volume reduction of integrated circuits, but also play a key role in promoting electronic products to higher integration, smaller size and lower cost. 2.5D and 3D integrated forms are very suitable for scenarios with larger chip sizes and higher pin density, so the overall thickness and size of the carrier substrate are also relatively large. Large-size substrates have high warping, so a single ball spraying device is used. However, the single ball spraying device sprays flux and then sprays balls one by one, which is not good in continuity, slow in speed, long in time, and requires machine changes for different products, resulting in long time consumption.

[0003] In order to meet the high efficiency requirement of automatic batch online ball spraying, the improvement of the ball spraying device for the substrate needs to be solved urgently. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a turret type multi-nozzle ball mounting device, which can greatly improve the ball spraying efficiency through the turret type operation of the nozzle.

[0005] In order to achieve the above utility model purposes, the utility model provides a turret type multi-nozzle ball mounting device, which comprises a flux spraying mechanism and a solder ball spraying and mounting mechanism, and the flux spraying mechanism and the solder ball spraying and mounting mechanism are arranged side by side above the substrate.

[0006] The flux spraying mechanism comprises a flux box, a first connecting piece, a flux connecting pipe and a flux spraying turntable. The bottom of the flux box is provided with a flux discharge port. First shafts and flux transmission pipelines are respectively arranged between the flux box and the first connecting piece. The flux transmission pipeline is in communication with the flux discharge port. The first connecting piece is provided with a plurality of flux butt joint pipelines. The top of the flux spraying turntable is provided with a plurality of flux connecting pipes in a ring array. The bottom of the flux spraying turntable is provided with flux nozzles. Each flux nozzle is in communication with the corresponding flux butt joint pipeline through the corresponding flux connecting pipe.

[0007] The tin ball spraying mechanism comprises a tin ball hopper, a second connecting piece, a tin ball connecting pipe and a spraying ball rotary disc, the bottom of the tin ball hopper is provided with a tin ball discharge port, the tin ball hopper and the second connecting piece are respectively provided with a second rotary shaft and a tin ball transmission pipe, and the tin ball transmission pipe is communicated with the tin ball discharge port; the second connecting piece is provided with a plurality of tin ball butt joint pipes, the top of the spraying ball rotary disc is provided with a plurality of tin ball connecting pipes in an annular array, the bottom of the spraying ball rotary disc is provided with tin ball nozzles, and each tin ball nozzle is communicated with the corresponding tin ball butt joint pipe through the corresponding tin ball connecting pipe.

[0008] The tin ball hopper is provided with a plurality of storage sub-hoppers.

[0009] Preferably, the top of the tin ball hopper is provided with an easily opened protective cover.

[0010] As a further improvement of the utility model, the bottom opening of the tin ball nozzle is sleeved with a ball planting nozzle sleeve, the two ends of the ball planting nozzle sleeve are respectively provided with a conical bayonet and a conical nozzle, the conical bayonet and the conical nozzle are communicated, and the conical bayonet is clamped at the bottom opening of the tin ball nozzle.

[0011] The turret type multi-nozzle ball planting device of the utility model transmits the substrate below the flux spraying mechanism and the tin ball spraying mechanism, the flux spraying mechanism sprays flux at the target position through the flux nozzle first, and after the flux spraying area is transmitted below the tin ball spraying mechanism, the tin ball spraying mechanism sprays balls at the corresponding position through the tin ball nozzle.

[0012] Compared with the prior art, the turret type multi-nozzle ball planting device has the following advantages:

[0013] (1) Compared with the structure of the traditional single-nozzle ball planting device, the turret type multi-nozzle structure can accelerate the reaction time, has better continuity and meets the demand of automatic batch online ball planting;

[0014] (2) The independent storage sub-hopper structure can preinstall a plurality of tin balls of different specifications and flexibly select, reduces the ball replacement downtime and effectively prevents the ball mixing phenomenon. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a structural schematic view of the turret type multi-nozzle ball planting device of the utility model;

[0016] Figure 2 It is a structural schematic view of the flux spraying mechanism;

[0017] Figure 3 It is a structural schematic view of the tin ball spraying mechanism;

[0018] Figure 4 It is a structural schematic view of the ball planting nozzle sleeve. DETAILED DESCRIPTION

[0019] The specific embodiments of the utility model will be further explained in detail below in combination with the drawings.

[0020] As Figure 1 shown, the turret type multi-nozzle ball planting device of the utility model, including flux spraying mechanism 1 and tin ball spraying mechanism 2, flux spraying mechanism 1 and tin ball spraying mechanism 2 are arranged side by side above substrate 3;

[0021] As Figure 2 shown, flux spraying mechanism 1 includes flux box 11, first connecting piece 12, flux connecting pipe 15 and flux spraying turntable 16, the bottom of flux box 11 is equipped with flux discharge port 111, and first connecting piece 12 is arranged with first rotating shaft 13 and flux transmission pipeline 14 between flux box 11, and flux transmission pipeline 14 is communicated with flux discharge port 111;First connecting piece 12 is equipped with several flux butt joint pipelines 121, and the top of flux spraying turntable 16 is equipped with several flux connecting pipes 15 in the form of annular array, and the bottom of flux spraying turntable 16 is equipped with flux nozzle 17, and each flux nozzle 17 is communicated with corresponding flux butt joint pipeline 121 through corresponding flux connecting pipe 15;

[0022] The flux in flux box 11 is inputted into flux transmission pipeline 14 from flux discharge port 111, and first rotating shaft 13 is connected with existing driving element, such as motor, and the motor drives first rotating shaft 13 to rotate, so that first connecting piece 12 carries flux connecting pipe 15 and flux spraying turntable 16 to rotate together, when one flux butt joint pipeline 121 of first connecting piece 12 is butt jointed with the flux transmission pipeline 14 above, the flux in flux transmission pipeline 14 is inputted into the flux butt joint pipeline 121 butt jointed therewith, in the process of continuous rotation, flux butt joint pipeline 121 is butt jointed with flux transmission pipeline 14 one by one, and the flux is sequentially inputted into flux nozzle 17 along each flux connecting pipe 15.

[0023] As Figure 3 shown, tin ball spraying mechanism 2 includes tin ball box 21, second connecting piece 22, tin ball connecting pipe 25 and ball spraying turntable 26, the bottom of tin ball box 21 is equipped with tin ball discharge port 211, and second connecting piece 22 is arranged with second rotating shaft 23 and tin ball transmission pipeline 24 between tin ball box 21, and tin ball transmission pipeline 24 is communicated with tin ball discharge port 211;Second connecting piece 22 is equipped with several tin ball butt joint pipelines 221, and the top of ball spraying turntable 26 is equipped with several tin ball connecting pipes 25 in the form of annular array, and the bottom of ball spraying turntable 26 is equipped with tin ball nozzle 27, and each tin ball nozzle 27 is communicated with corresponding tin ball butt joint pipeline 221 through corresponding tin ball connecting pipe 25;

[0024] The tin ball hopper 21 is provided with a plurality of storage sub-hoppers 212.

[0025] The tin ball hopper 21 is provided with a plurality of storage sub-hoppers 212.

[0026] The top of the tin ball hopper 21 is provided with an easily opened protective cover 213, which facilitates feeding while preventing dust from entering the tin ball hopper 21 and contaminating the tin balls.

[0027] In order to meet the ball planting requirements of different specifications of tin balls, the bottom of the ball spraying disc 26 can be replaced with different specifications of tin ball nozzles 27, reducing the machine modification time and improving the work efficiency.

[0028] As shown in Figure 4 The bottom opening of the tin ball nozzle 27 is sleeved with a ball planting nozzle sleeve 28, the both ends of which are respectively provided with a conical bayonet 281 and a conical nozzle 282, the conical bayonet 281 and the conical nozzle 282 are communicated, and the conical bayonet 281 is clamped at the bottom opening of the tin ball nozzle 27.

[0029] The tin balls in the tin ball nozzle 27 fall from the bottom opening of the tin ball nozzle 27 along the conical nozzle 282, and the ball planting nozzle sleeve 28 with the conical nozzle 282 can be selected according to different specifications of tin balls. The conical structure of the conical nozzle 282 has a guiding effect on the transmission of the tin balls, guiding the tin balls to fall to the target position, and compared with the cylindrical or square cylindrical buckle, the conical structure of the conical bayonet 281 can make the ball planting nozzle sleeve 28 more firmly clamped on the tin ball nozzle 27.

[0030] The turret type multi-nozzle ball planting device of the utility model transmits the substrate 3 below the flux spraying mechanism 1 and the tin ball spraying mechanism 2, the flux spraying mechanism 1 sprays the flux 4 at the target position through the flux nozzle 17 first, after the flux spraying area is transmitted below the tin ball spraying mechanism 2, the tin ball spraying mechanism 2 sprays the tin ball 5 at the corresponding position through the tin ball nozzle 27.

[0031] The preferred embodiments of the present application have been specifically described above, but the present application is not limited to the embodiments described above, and those skilled in the art can make various equivalent modifications or replacements without departing from the spirit of the present application. These equivalent modifications or replacements are all included in the scope defined by the claims of the present application.

Claims

1. A turret-type multi-nozzle ball-planting device, characterized in that, It includes a flux spraying mechanism and a solder ball spraying mechanism, which are arranged side by side above the substrate; The flux spraying mechanism includes a flux box, a first connector, a flux connecting pipe, and a flux spraying turntable. The bottom of the flux box has a flux outlet. A first rotating shaft and a flux transmission pipe are respectively provided between the flux box and the first connector. The flux transmission pipe is connected to the flux outlet. The first connector has several flux docking pipes. The top of the flux spraying turntable has several flux connecting pipes arranged in a circular array. The bottom of the flux spraying turntable has flux nozzles. Each flux nozzle is connected to the corresponding flux docking pipe through the corresponding flux connecting pipe. The solder ball spraying mechanism includes a solder ball box, a second connector, solder ball connecting pipes, and a spraying turntable. The bottom of the solder ball box has a solder ball outlet. A second rotating shaft and a solder ball transport pipe are respectively provided between the solder ball box and the second connector. The solder ball transport pipe is connected to the solder ball outlet. The second connector has a plurality of solder ball docking pipes. The top of the spraying turntable has a plurality of solder ball connecting pipes arranged in a circular array. The bottom of the spraying turntable has solder ball nozzles. Each solder ball nozzle is connected to the corresponding solder ball docking pipe through the corresponding solder ball connecting pipe. The solder ball box is equipped with several storage compartments.

2. The turret-type multi-nozzle ball-planting device as described in claim 1, characterized in that, The top of the solder ball box is equipped with an easy-to-open protective cover.

3. The turret-type multi-nozzle ball-planting device as described in claim 1, characterized in that, The bottom opening of the solder ball nozzle is fitted with a ball-planting nozzle sleeve. The two ends of the ball-planting nozzle sleeve are respectively provided with a conical notch and a conical nozzle. The conical notch and the conical nozzle are connected. The conical notch is locked at the bottom opening of the solder ball nozzle.

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