Detection device for transferring mechanical arm and thin film deposition equipment thereof

Abstract

The utility model discloses a detection device used for a transfer mechanical arm and a thin film deposition device thereof, the detection device used for the transfer mechanical arm comprises a mechanical arm used for transferring wafers and a displacement detection assembly used for detecting the displacement of the mechanical arm, the displacement detection assembly comprises a first detection assembly and a second detection assembly, the first detection assembly and the second detection assembly are used for detecting Z-axis displacement data of two clamping arms of the mechanical arm correspondingly. According to the detection device for the transfer mechanical arm and the thin film deposition equipment thereof, the displacement detection assembly is additionally arranged in the wafer cooling buffer station so as to regularly detect the displacement change of the wafer transfer mechanical arm in the Z-axis direction, so that the wafer damage or collision risk caused by the displacement change of the mechanical arm is avoided. The thin film deposition equipment adopting the detection device can reduce the damage to the wafer and the wafer conveying collision probability, and improves the processing quality and efficiency.

Description

TECHNICAL FIELD

[0001] The utility model relates to thin film deposition equipment technical field especially, it is a kind of detection device and thin film deposition equipment for transfer mechanical arm. BACKGROUND

[0002] Wafer needs to be sent into wafer cooling buffer equipment to carry out cooling treatment after completing once thin film deposition process, wafer is transferred between thin film deposition equipment and cooling buffer equipment using mechanical hand.But the mechanical hand of the existing equipment front end module configuration due to assembly or debugging, abnormal change is prone to in Z axis direction after running for a period of time, if abnormal displacement change is too large, it will lead to wafer scratch or chip transmission abnormal collision etc.Problems, ultimately affect wafer processing quality and efficiency. SUMMARY

[0003] The utility model aims at overcoming the insufficient of prior art, provide a kind of detection device and thin film deposition equipment for transfer mechanical arm, to solve the technical problem that wafer scratch or chip collision caused by the displacement of existing wafer transfer mechanical arm.

[0004] To achieve the above object, the utility model adopts following technical scheme:

[0005] First, the embodiment of the utility model provides a kind of detection device for transfer mechanical arm, it includes: the mechanical arm for transferring wafer, and displacement detection component for detecting the displacement of the mechanical arm, the displacement detection component includes first detection component and second detection component, the first detection component and the second detection component are respectively used to detect the Z axis displacement data of two clamping arms of the mechanical arm.

[0006] Wherein, the first detection component and the second detection component all include at least two displacement sensors distributed along the length direction of the clamping arm of the mechanical arm.

[0007] Wherein, the detection device for transfer mechanical arm further includes: control unit and power supply unit electrically connected to the first detection component and second detection component.

[0008] Wherein, the displacement detection component is arranged at the top of wafer cooling buffer station.

[0009] Wherein, the detection period of the displacement detection component is 3 months.

[0010] Wherein, the deviation early warning threshold of the displacement detection component is 1mm.

[0011] Wherein, the detection device for transfer mechanical arm further includes base, wafer cooling buffer station connected to the base.

[0012] The top plate of the wafer cooling buffer station is provided with the displacement detection assembly, and the side wall of the cooling buffer cavity of the wafer cooling buffer station is further provided with a plurality of baffle plates for bearing wafers.

[0013] In the second aspect, the embodiments of the utility model provide a thin film deposition equipment, the thin film deposition equipment includes the detection device for transfer mechanical arm as any one of above.

[0014] The detection device for transfer mechanical arm and the thin film deposition equipment thereof of the utility model, through increasing displacement detection assembly in wafer cooling buffer station to detect displacement change of wafer transfer mechanical arm in Z axle direction periodically, thereby avoiding wafer damage or collision risk caused by displacement change of mechanical arm. The thin film deposition equipment using the detection device can reduce damage to wafers and wafer transfer collision probability, improve processing quality and efficiency.

[0015] The above description is only a summary of the technical scheme of the utility model, in order to more clearly understand the technical means of the utility model, can be implemented according to the content of the specification, and in order to let the above and other purposes, features and advantages of the utility model can be more obvious and easy to understand, the following preferred embodiments are described in detail as follows. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figures 1 to 4 It is the different view whole structure schematic diagram of the detection device for transfer mechanical arm of the utility model embodiment.

[0017] MARK NUMBER EXPLANATION:

[0018] The detection device for transfer mechanical arm 100, base 1, wafer cooling buffer station 2, baffle plate 21, top plate 22, mechanical arm 3, clamping arm 31 (32), displacement detection assembly 4, first detection assembly 41, second detection assembly 42, displacement sensor 411 (412, 421, 422), wafer 5. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical scheme and advantages of the utility model more clear and obvious, the utility model will be further described in detail below in combination with the drawings and specific implementation.

[0020] The technical scheme in the embodiments of the utility model will be described clearly and completely below in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only a part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0021] In the description of the utility model, it is understood that the directions or positional relationships indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like are the directions or positional relationships described based on the drawings, and are only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model.

[0022] In addition, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the utility model, the meaning of "multiple" is two or more than two, unless otherwise specifically limited.

[0023] In the utility model, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood broadly, for example, it can be connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0024] In the utility model, unless otherwise specifically defined and limited, the "upper" or "lower" of the first feature to the second feature can include that the first and second features are in direct contact, or the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the "upper", "upper" and "upper" of the first feature to the second feature include that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The "below", "below" and "below" of the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0025] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0026] After completing a thin film deposition process, the wafer needs to be sent into the wafer cooling buffer device for cooling treatment. The wafer is transferred between the thin film deposition device and the cooling buffer device by a mechanical hand. However, the mechanical hand configured in the existing front-end module of the device is prone to abnormal changes in the Z-axis direction after running for a period of time due to poor assembly or debugging. If the abnormal displacement change is too large, it will cause wafer scratches or abnormal collisions during wafer transfer, etc., ultimately affecting the wafer processing quality and efficiency. In order to solve the above problems, the embodiment discloses a detection device 100 for a transfer mechanical arm.

[0027] Please refer to Figures 1 to 4 In this embodiment, the detection device 100 for a transfer mechanical arm is applied to a thin film deposition device of a semiconductor, and is specifically applied to a transfer mechanical arm between a thin film deposition device and a wafer cooling buffer station.

[0028] The detection device 100 for a transfer mechanical arm includes a mechanical arm 3 for transferring a wafer, and a displacement detection assembly 4 for detecting the displacement of the mechanical arm 3. The displacement detection assembly 4 includes a first detection assembly 41 and a second detection assembly 42, and the first detection assembly 41 and the second detection assembly 42 are respectively used to detect the Z-axis displacement data of two clamping arms 31 and 32 of the mechanical arm 3.

[0029] In the prior art, the mechanical arm is generally detected periodically by manual and detection tool assisted methods. This detection method cannot give early warning of mechanical arm displacement overrun, so there is still a problem of wafer scratching or wafer transfer collision caused by mechanical arm overrun. The detection device 100 for a transfer mechanical arm of the embodiment actively stops and gives early warning when the displacement of the mechanical arm 3 changes beyond the limit, thereby avoiding damage to the wafer 5 and causing unnecessary losses.

[0030] The first detection assembly 41 and the second detection assembly 42 each include at least two displacement sensors distributed along the length direction of the clamping arms 31 and 32 of the mechanical arm 3, the first detection assembly 41 includes displacement sensors 411 and 412, and the second detection assembly 42 includes displacement sensors 421 and 422.

[0031] Since the clamping arms 31 and 32 of the mechanical arm 3 are generally long and narrow, in order to accurately detect the displacement information of each clamping arm 31 and 32, at least two displacement sensors of the same height are arranged in the length direction to detect the displacement, thereby avoiding detection errors caused by local point detection.

[0032] In the embodiment, the displacement sensors 411 (412, 421, 422) have a detection distance range of not less than 65 mm and a detection accuracy of 2 μm. It can be understood that in other embodiments, the displacement sensors 411 (412, 421, 422) can also be other types of sensors, as long as they meet the detection accuracy of the wafer transfer mechanical arm.

[0033] Specifically, the detection device 100 for the transfer mechanical arm further includes a control unit and a power supply unit electrically connected to the first detection assembly 41 and the second detection assembly 42. The control unit controls the start period of the first detection assembly 41 and the second detection assembly 42, and transmits the displacement data detected thereby to a computer of a front-end module of the equipment, and synchronously communicates with an industrial computer of the equipment, so as to control according to a preset execution strategy of the equipment.

[0034] Please refer again to Figure 4 , the displacement detection assembly 4 is arranged on the top of the wafer cooling buffer station 2.

[0035] In the embodiment, the detection period of the displacement detection assembly 4 is 3 months.

[0036] The displacement detection assembly 4 has a deviation warning threshold of 1 mm.

[0037] It can be understood that in other embodiments, the detection period and the warning threshold of the displacement detection assembly 4 can also be other values, which can be flexibly selected according to the actual process precision needs.

[0038] Further, the detection device 100 for the transfer mechanical arm further includes a base 1, and a wafer cooling buffer station 2 connected to the base 1.

[0039] The top plate 22 of the wafer cooling buffer station 2 is provided with the displacement detection assembly 4, and the side wall of the cooling buffer cavity of the wafer cooling buffer station 2 is further provided with a plurality of partition plates 21 for bearing wafers 5.

[0040] The embodiment of the utility model provides a kind of thin film deposition equipment, the detection device 100 for transfer mechanical arm described in any one of the above is included in the thin film deposition equipment.

[0041] The detection device for transfer mechanical arm and its thin film deposition equipment of the embodiment, by increasing displacement detection component in wafer cooling buffer station to detect the displacement change of wafer transfer mechanical arm in Z axis direction periodically, to avoid the risk of wafer damage or collision caused by displacement change of mechanical arm. Thin film deposition equipment using the detection device can reduce the damage to the wafer and the probability of wafer collision, improve the processing quality and efficiency.

[0042] The above is only to further illustrate the technical content of the utility model with examples, so that the reader is easier to understand, but not represent the embodiment of the utility model is limited to this, any technical extension or re-creation made according to the utility model is protected by the utility model. The protection scope of the utility model is subject to the claims.

Claims

1. A detection device for a transfer robot, characterized in that include: A robotic arm for transferring wafers, and a displacement detection component for detecting the displacement of the robotic arm, the displacement detection component including a first detection component and a second detection component, the first detection component and the second detection component being used to detect the Z-axis displacement data of the two grippers of the robotic arm respectively.

2. The detection device for a transfer robot according to claim 1, characterized in that, Both the first detection component and the second detection component include at least two displacement sensors distributed along the length of the gripper arm of the robotic arm.

3. The detection device for a transfer robot according to claim 1, wherein The detection device for transferring the robotic arm further includes a control unit and a power supply unit electrically connected to the first detection component and the second detection component.

4. The detection device for transferring a robotic arm according to any one of claims 1 to 3, characterized in that, The displacement detection component is located on top of the wafer cooling buffer station.

5. The detection device for transferring a robotic arm according to claim 4, characterized in that, The detection cycle of the displacement detection component is 3 months.

6. The detection device for transferring a robotic arm according to claim 4, characterized in that, The deviation warning threshold of the displacement detection component is 1 mm.

7. The detection device for transferring a robotic arm according to claim 4, characterized in that, The detection device for transferring the robotic arm also includes a base and a wafer cooling buffer station connected to the base.

8. The detection device for transferring a robotic arm according to claim 7, characterized in that, The top plate of the wafer cooling buffer station is equipped with the displacement detection component, and the side wall of the cooling buffer cavity of the wafer cooling buffer station is also equipped with several partitions for supporting the wafer.

9. A thin film deposition apparatus, characterized in that, The thin film deposition equipment includes a detection device for transferring a robotic arm as described in any one of claims 1 to 8.

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