Combined wafer structure

Abstract

The utility model provides a combined wafer structure, which comprises a first wafer unit and a second wafer unit, the first wafer unit and the second wafer unit are arranged oppositely, and the first wafer unit and the second wafer unit are connected together in a clamping mode. Wherein each of the first wafer unit and the second wafer unit comprises a wafer piece and a high-speed terminal fixedly arranged on the wafer piece; each of the wafer sheets in the first wafer unit and the second wafer unit comprises an L-shaped connecting part, and the L-shaped connecting parts are clamped together to form a U-shaped structure. The wafer of the first wafer unit is provided with a first extension portion, the first extension portion and the upper end face of the wafer form a first step face, and the upper end of the high-speed terminal of the first wafer unit is located on the first step face. According to the utility model, a buckling mode is adopted for connection in actual use, and the technical problem that the high-speed terminal is not easy to position in the production process can be reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to a connector technical field, concretely relates to a combined wafer piece structure. BACKGROUND

[0002] The wire connector is an electric connector used for data transmission between different electronic devices. The chip technology connects all interface modules (including control modules) to a matrix backboard, and through direct forwarding from chip to chip, communication between multiple modules can be carried out at the same time. The chip technology has the characteristics of high access efficiency, suitable for simultaneous multi-point access, easy to provide very high bandwidth, and convenient performance expansion, and is not easily limited by CPU bus and memory technology.

[0003] The wafer piece structure in the prior art is generally fixed together with the wafer piece and the high-speed terminal, and generally adopts a plastic sealing mode to form an integrated structure, which makes it difficult to position the high-speed terminal on both sides of the wafer piece when the high-speed terminal is simultaneously plastic sealed, thereby increasing the positioning difficulty of the high-speed terminal. At the same time, the wire sealing structure in the prior art has a size higher than the outer surface of the PCB, so that the overall assembly size is large and the installation size adaptability is poor. The internal structure is straight out of the terminal wire position, and after wire bonding, the wire is bent and then wire sealing is performed. The wire near the wire bonding point needs to be stripped, and the consistency of the thick stripped wire after bending is difficult to guarantee, which finally leads to unstable impedance and shielding structure of the bending point, and makes the overall size of the connector large. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a combined wafer piece structure which is connected in a buckling mode in actual use, thereby reducing the technical problem that the high-speed terminal is not easy to position in the production process.

[0005] To solve the above technical problems, the utility model adopts the following technical scheme:

[0006] A combined wafer piece structure includes a first wafer unit and a second wafer unit,

[0007] The first wafer unit and the second wafer unit are oppositely arranged and connected together through clamping.

[0008] The first wafer unit and the second wafer unit each include a wafer piece and a high-speed terminal fixedly arranged on the wafer piece. The wafer piece in the first wafer unit and the second wafer unit each includes an L-shaped connecting part, and the L-shaped connecting parts are clamped together to form a U-shaped structure.

[0009] Further, in some preferred embodiments, the wafer sheet of the first wafer unit is provided with a first extension, the first extension forms a first stepped surface with the upper end surface of the wafer sheet, and the upper end of the high-speed terminal of the first wafer unit is located on the first stepped surface;

[0010] The wafer side surface of the second wafer unit is provided with a second extension, the second extension forms a second stepped surface with the wafer side surface, and the upper end of the high-speed terminal of the second wafer unit is located on the second stepped surface.

[0011] Further, the height of the first stepped surface is higher than the height of the second stepped surface.

[0012] Further, the wafer sheet of the first wafer unit and the wafer sheet of the second wafer unit are respectively provided with a clamping block and a clamping groove on the side close to each other, and are clamped and fixed through the clamping block and the clamping groove.

[0013] Further, the high-speed terminal is connected to the wire through welding.

[0014] Further, the upper end of the high-speed terminal of the first wafer unit and the upper end of the high-speed terminal of the second wafer unit are both bent at right angles, so that the formed bending parts are located on the first stepped surface and the second stepped surface.

[0015] Further, the clamping block and the clamping groove are circular structures or dovetail structures.

[0016] Further, the clamping block and the clamping groove are dovetail structures.

[0017] Compared with the prior art, the utility model has the following beneficial effects:

[0018] In actual use, the first wafer unit and the second wafer unit are oppositely arranged, and the first wafer unit and the second wafer unit are connected together through clamping.

[0019] Meanwhile, the utility model discloses in actual use through the first step surface and second step surface set up on wafer piece, and make the height of first step surface higher than the height of second step surface, and the high speed terminal on first step surface and second step surface is connected with the wire, and the wire is drawn from the direction parallel to first step surface and second step surface, effectively reduce the structure size of tail part package line plastic package, simultaneously, tail part soldering position does not need to bend, guarantee the impedance of wire soldering position and the stability of shielding structure, further guarantee the high speed transmission performance of whole wire, improve transmission rate, greatly reduce the volume of connector simultaneously. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the following will be briefly introduced the drawings needed to be used in the embodiment, should understand, the following drawings only shows some embodiments of the utility model, therefore should not be regarded as the limitation to the scope, for ordinary skilled person in the art, under the premise of not paying the creative labor, can also obtain other related drawings according to these drawings.

[0021] Figure 1 It is the overall structure schematic diagram of the utility model.

[0022] Figure 2 It is the front view of the utility model. Figure 1

[0023] Figure 3 It is the connection relationship schematic diagram of the utility model and wire.

[0024] Figure 4 It is the front view of the utility model. Figure 3

[0025] Figure 5 It is the structure schematic diagram of high speed terminal of the utility model.

[0026] Reference signs:

[0027] 101 first wafer unit, 102 second wafer unit, 103 wafer piece, 104 high speed terminal, 105 L type connecting portion, 106 first extension, 107 first step surface, 108 second extension, 109 second step surface, 110 clamping block, 111 clamping slot, 112 wire, 113 bending portion. DETAILED DESCRIPTION

[0028] In the following, only some exemplary embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the embodiments of the utility model. Therefore, the drawings and the description are considered to be exemplary in nature rather than limiting.​​

[0029] In the description of the embodiments of the present application, it should be understood that the terms "length", "vertical", "horizontal", "top", "bottom" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0030] In addition, the terms "first" and "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0031] In the embodiments of the present application, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected, or it can be communicated; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0032] In the embodiments of the present application, unless otherwise specifically defined and limited, the "upper" or "lower" of the first feature with respect to the second feature can include the direct contact of the first and second features, or can include the contact of the first and second features through another feature between them. Moreover, the "upper", "upper" and "upper" of the first feature with respect to the second feature include the first feature above and obliquely above the second feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The "below", "below" and "below" of the first feature with respect to the second feature include the first feature above and obliquely above the second feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0033] The following disclosure provides many different embodiments or examples for implementing different structures of the embodiments of the present application. In order to simplify the disclosure of the embodiments of the present application, the components and settings of specific examples are described below. Of course, they are only examples and the purpose is not to limit the embodiments of the present application. In addition, the embodiments of the present application can refer to the same reference numerals and / or reference letters in different examples, and such repetition is for the purpose of simplification and clarity, and does not indicate the relationship between the various embodiments and / or settings discussed.

[0034] The embodiments of the utility model will be described in detail below with reference to the drawings.

[0035] Referring to Figures 1-5 The embodiment discloses a combined wafer structure, which comprises a first wafer unit 101 and a second wafer unit 102,

[0036] The first wafer unit 101 and the second wafer unit 102 are oppositely arranged, and the first wafer unit 101 and the second wafer unit 102 are connected together through clamping.

[0037] The first wafer unit 101 and the second wafer unit 102 both comprise a wafer sheet 103 and a high-speed terminal 104 fixedly arranged on the wafer sheet 103; the wafer sheet 103 in the first wafer unit 101 and the second wafer unit 102 both comprises an L-shaped connecting part 105, and the L-shaped connecting parts 105 are clamped together to form a U-shaped structure.

[0038] In actual use, the first wafer unit 101 and the second wafer unit 102 are oppositely arranged, and the first wafer unit 101 and the second wafer unit 102 are connected together through clamping; the wafer sheet 103 in the first wafer unit 101 and the second wafer unit 102 both comprises an L-shaped connecting part 105, and the L-shaped connecting parts 105 are clamped together to form a U-shaped structure, so that the wafer sheet 103 forms a combined structure as a whole, the preparation difficulty of the wafer sheet 103 can be reduced by assembling, and only one row of high-speed terminals 104 needs to be positioned each time, so that the technical problem that the high-speed terminals 104 are not easy to position in the production process can be solved.

[0039] Further, in some preferred embodiments, the wafer sheet 103 of the first wafer unit 101 is provided with a first extension 106, the first extension 106 forms a first stepped surface 107 with the upper end surface of the wafer sheet 103, and the high-speed terminals 104 of the first wafer unit 101 are located on the first stepped surface 107;

[0040] The wafer side of the second wafer unit 102 is provided with a second extension 108, the second extension 108 forms a second stepped surface 109 with the wafer side, the upper end of the high-speed terminal 104 in the second wafer unit 102 is located at the second stepped surface 109, the high-speed terminal 104 located on the first stepped surface 107 and the second stepped surface 109 is connected with a wire 112, and the wire 112 is led out from the direction parallel to the first stepped surface 107 and the second stepped surface 109.

[0041] In actual use, the first stepped surface 107 and the second stepped surface 109 are arranged on the wafer sheet 103, the height of the first stepped surface 107 is higher than the height of the second stepped surface 109, the high-speed terminal 104 located on the first stepped surface 107 and the second stepped surface 109 is connected with the wire 112, and the wire 112 is led out from the direction parallel to the first stepped surface 107 and the second stepped surface 109, so that the structure size of the tail part wire plastic package is effectively reduced; meanwhile, the tail part welding position does not need to be bent, the impedance of the welding position of the wire 112 and the stability of the shielding structure are ensured, and then the high-speed transmission performance of the whole wire 112 is ensured, the transmission rate is improved, and the volume of the connector is greatly reduced.

[0042] Further, in some preferred embodiments, the height of the first stepped surface 107 is higher than the height of the second stepped surface 109, so that the wire 112 can be misaligned to facilitate the leading out of the wire 112, and the thickness increase caused by the bending mode is avoided.

[0043] The wafer sheet 103 in the first wafer unit 101 and the second wafer unit 102 is provided with a clamping block 110 and a clamping groove 111 on the side close to each other, and the clamping block 110 and the clamping groove 111 are used for clamping and fixing.

[0044] Further, the high-speed terminal 104 is connected with the wire 112 by welding.

[0045] Further, the upper end of the high-speed terminal 104 in the first wafer unit 101 and the second wafer unit 102 is bent at right angles, so that the formed bending part 113 is located on the first stepped surface 107 and the second stepped surface 109, so as to ensure the horizontal appearance of the wire 112.

[0046] In actual use, the clamping block 110 and the clamping groove 111 are circular structures or dovetail structures.

[0047] As an option, the clamping block 110 and the clamping groove 111 are dovetail structures.

[0048] The clamping of the clamping block 110 and the clamping groove 111 can make the wafer pieces have a certain relative fixing force, and can provide fixing force for the first wafer unit 101 and the second wafer unit 102 and the inner shielding piece arranged between the first wafer unit 101 and the second wafer unit 102, and can also ensure the mechanical balance of the contact pieces on both sides of the finished product.

[0049] Although the preferred embodiments of the present application have been described, those skilled in the art who have the basic inventive concept can make further changes and modifications to the embodiments. Therefore, the appended claims are intended to include the preferred embodiments and all changes and modifications falling within the scope of the present application.

[0050] The above description is only the preferred embodiment of the present application, and is not intended to limit the present application. It should be pointed out that any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A combined wafer structure, comprising a first wafer unit and a second wafer unit, characterized in that: the first wafer unit and the second wafer unit are oppositely arranged, and the first wafer unit and the second wafer unit are connected together by clamping; wherein the first wafer unit and the second wafer unit each comprise a wafer and a high-speed terminal fixedly arranged on the wafer; the wafer in the first wafer unit and the wafer in the second wafer unit each comprise an L-shaped connecting portion, and the L-shaped connecting portions are clamped together to form a U-shaped structure.

2. The combined wafer structure according to claim 1, characterized in that: the wafer in the first wafer unit is provided with a first extension, the first extension and an upper end surface of the wafer form a first stepped surface, and an upper end of the high-speed terminal in the first wafer unit is located on the first stepped surface; the wafer in the second wafer unit is provided with a second extension on a side surface of the wafer, the second extension and the side surface of the wafer form a second stepped surface, an upper end of the high-speed terminal in the second wafer unit is located on the second stepped surface, the high-speed terminals on the first stepped surface and the second stepped surface are connected with wires, and the wires are led out in a direction parallel to the first stepped surface and the second stepped surface.

3. A modular wafer sheet structure according to claim 2, wherein: The height of the first stepped surface is higher than the height of the second stepped surface.

4. The modular wafer structure of claim 2 wherein: The wafer in the first wafer unit and the wafer in the second wafer unit are respectively provided with a clamping block and a clamping groove on a side close to each other, and are clamped and fixed by the clamping block and the clamping groove.

5. The modular wafer structure of claim 2 wherein: The high-speed terminal and the wire are connected together by welding.

6. The modular wafer structure of claim 2, wherein: The upper end of the high-speed terminal in the first wafer unit and the upper end of the high-speed terminal in the second wafer unit are each bent at right angles, so that the formed bent portions are located on the first stepped surface and the second stepped surface.

7. The modular wafer structure of claim 4 wherein: The clamping block and the clamping groove are circular structures, or are dovetail structures.

8. The modular wafer structure of claim 4 wherein: The clamping block and the clamping groove are dovetail structures.

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