Electronic packaging device
By integrating the zero-crossing detection circuit with other components into the same electronic package using integrated circuit packaging technology, the problems of poor accuracy and high cost of discrete device circuits are solved, achieving high-precision and low-cost zero-crossing detection.
Patent Information
- Application Number
- CN202422642462.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-30
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2034-10-30
AI Technical Summary
In existing non-isolated AC-DC power supply systems, zero-crossing detection circuits using discrete components suffer from poor accuracy and high cost.
By employing integrated circuit packaging technology, components such as zero-crossing detection circuits, power switching transistors, and freewheeling diodes are integrated into the same electronic package device. Integrated circuits are formed through multi-wafer packaging processes, thereby improving system integration and optimizing circuit design.
It improves the accuracy of zero-crossing detection signals, reduces system costs and ease of use, and has a delay time of less than 25µs.
Smart Images
Figure CN223584021U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to electronic field, specifically but not limited to an electronic packaging device. BACKGROUND
[0002] In the application fields such as kitchen appliances, environmental appliances and nursing appliances, a non-isolated ACDC power supply is generally adopted to provide auxiliary power for system board cards, and the non-isolated ACDC power supply is usually a Buck topology or a Buck-Boost topology. Figure 1 A typical Buck non-isolated ACDC power supply system is shown, which adopts an integrated circuit 10 to form a Buck topology. Among them, the rectifier circuit 11 rectifies the grid AC voltage VAC into a DC voltage source. The power switch and the rectifier tube D1, the inductor L in the integrated circuit 10 form a Buck circuit, which is used to convert the DC voltage source into a target output voltage Vo.
[0003] Among them, the zero-crossing detection of the grid AC voltage VAC has important application value, including but not limited to silicon-controlled on-off control, relay on-off control, grid voltage frequency detection, MCU timing, etc.
[0004] The grid voltage zero-crossing detection circuit can be completed by discrete devices, Figure 2 A zero-crossing detection circuit composed of discrete devices is shown. The zero-crossing detection circuit built by discrete devices is affected by the errors of each component, and the precision of the zero-crossing detection signal is poor. The poor precision mainly reflects that there is a large time delay between the level jump edge of the zero-crossing detection signal and the zero-crossing point of the grid voltage, such as Figure 3 As shown, the time delay Tzero_de l ay of the zero-crossing detection signal is usually greater than +-50us. In addition, due to the low integration of discrete devices, the material cost and the processing cost such as patching of the circuit are high.
[0005] Therefore, it is necessary to provide a new structure or control method to solve at least part of the above problems. UTILITY MODEL CONTENT
[0006] The electronic packaging device provided by the utility model is characterized in that the electronic packaging device comprises a first wafer containing a zero-crossing detection circuit, a first base island, a part of the first base island extending outward to expose the electronic packaging device to form a reference ground pin, a zero-crossing signal output pin coupled with the first wafer through an electric lead, a second wafer comprising a power switch tube, a third wafer comprising a freewheeling diode, and a second base island, a part of the second base island extending outward to expose the electronic packaging device to form a switch node pin.
[0007] Optionally, the electronic packaging device further comprises: a fourth wafer comprising a first rectifier diode; and a third base island, the fourth wafer is arranged on the third base island, a part of the third base island extends outward to expose the electronic packaging device to form a power grid input pin, an anode of the first rectifier diode is attached to and coupled to the third base island, and a cathode of the first rectifier diode is coupled to the first wafer through a lead wire.
[0008] Optionally, the electronic packaging device further comprises: a fifth wafer comprising a second rectifier diode; and a fourth base island, the fifth wafer is arranged on the fourth base island, a part of the fourth base island extends outward to expose the electronic packaging device to form a bus pin, an anode of the second rectifier diode is coupled to a cathode of the first rectifier diode through a lead wire, and a cathode of the second rectifier diode is attached to and coupled to the fourth base island.
[0009] Optionally, the fourth base island is coupled to an input end of the power switch tube on the second wafer through a lead wire.
[0010] Optionally, the electronic packaging device further comprises: a sixth wafer comprising a power supply diode; a fifth base island, the sixth wafer is arranged on the fifth base island, wherein a part of the fifth base island extends outward to expose the electronic packaging device to form an output feedback pin; and a power supply pin coupled to the sixth wafer and the second wafer through a lead wire; wherein an anode of the power supply diode is attached to and coupled to the fifth base island, and a cathode of the power supply diode is coupled to the power supply pin through a conductive lead wire.
[0011] Optionally, the fifth base island is further coupled to a power supply end of the first wafer through a lead wire.
[0012] Optionally, the first wafer comprises: a control signal generation circuit configured to obtain a signal representing a power grid voltage value and generate a zero-crossing detection control signal; a pull-up resistor having a first end coupled to a voltage source; and an open switch tube having a control end coupled to an output end of the control signal generation circuit, a first end of the open switch tube coupled to a second end of the pull-up resistor and the zero-crossing signal output pin, and a second end of the open switch tube grounded.
[0013] Optionally, the open switch tube comprises an N-type metal oxide semiconductor field effect transistor (MOSFET), a drain of the MOSFET is coupled to the pull-up resistor and outputs the zero-crossing detection signal, and a source of the MOSFET is grounded.
[0014] Optionally, the open switch tube comprises an NPN triode, wherein a collector of the triode is coupled to the pull-up resistor and outputs the zero-crossing detection signal, and an emitter of the triode is grounded.
[0015] The electronic packaging device provided by the utility model can greatly improve system integration, improve zero-crossing detection precision, and reduce system cost and use difficulty. BRIEF DESCRIPTION OF DRAWINGS
[0016] The accompanying drawings are used to provide further understanding of the present application, and together with the description, serve to explain embodiments of the present application, and do not constitute limitations to the present application. In the drawings:
[0017] Figure 1 A typical Buck non-isolated ACDC power supply system is shown;
[0018] Figure 2 A zero-crossing detection circuit composed of discrete devices is shown;
[0019] Figure 3 A zero-crossing detection signal waveform diagram in the prior art is shown;
[0020] Figure 4 A switching power supply integrated circuit integrated with grid voltage zero-crossing detection function according to an embodiment of the present application is shown;
[0021] Figure 5 A Buck switching power supply system according to an embodiment of the present application is shown;
[0022] Figure 6 A Buck-Boost switching power supply system according to an embodiment of the present application is shown;
[0023] Figure 7 A structure schematic diagram of an electronic packaging device according to an embodiment of the present application is shown;
[0024] Figure 8 A switching power supply integrated circuit according to another embodiment of the present application is shown;
[0025] Figure 9 A structure schematic diagram of an electronic packaging device according to another embodiment of the present application is shown;
[0026] Figure 10 A zero-crossing detection circuit according to an embodiment of the present application is shown;
[0027] Figure 11 A zero-crossing detection circuit according to an embodiment of the present application is shown;
[0028] Figure 12 A structure schematic diagram of an electronic packaging device according to another embodiment of the present application is shown. DETAILED DESCRIPTION
[0029] In order to further understand the present application, the preferred embodiments of the present application are described below in combination with embodiments, but it should be understood that these descriptions are only for further illustrating features and advantages of the present application, and are not limitations to the claims of the present application.
[0030] The description of this part is only for several typical embodiments, and the utility model is not limited to the range of embodiment description. The combination of different embodiments, the mutual replacement of some technical features in different embodiments, and the mutual replacement of some technical features in the same or similar prior art means and embodiments are also within the range of the utility model description and protection.
[0031] "coupling" or "connection" in the specification includes both direct connection and indirect connection. Indirect connection is the connection through intermediate medium, such as the connection through electrically conductive medium such as conductor, wherein the electrically conductive medium can contain parasitic inductance or parasitic capacitance, and can also be connected through intermediate circuit or component described in the embodiments of the specification; Indirect connection can also include the connection through other active devices or passive devices on the basis of realizing the same or similar functions. "Multiple" or "many" means two or more than two.
[0032] Figure 4 The switching power supply integrated circuit 100 integrated with grid voltage zero-crossing detection function according to an embodiment of the utility model is shown. The switching power supply integrated circuit 100 includes rectifier circuit 41, zero-crossing detection circuit 42, power switch tube 43, control circuit 44 and freewheeling diode 45. The rectifier circuit 41 includes first rectifier diode M1 and second rectifier diode M2 in series. Wherein the anode of the first rectifier diode M1 is coupled with the grid input pin L of the switching power supply integrated circuit 100, the cathode of the first rectifier diode M1 is coupled with the anode of the second rectifier diode M2, and the cathode of the second rectifier diode M2 is coupled with the bus pin BUS. The zero-crossing detection circuit 42 is coupled with the cathode of the first rectifier diode M1 for detecting the zero-crossing point of the grid AC voltage, and outputs the zero-crossing detection signal at the zero-crossing signal output pin Zero of the switching power supply integrated circuit 100. In another embodiment, the rectifier circuit can have other forms, for example, as shown in Figure 1The rectifier circuit shown, or the rectifier circuit only includes a diode M1 without a second diode. In another embodiment, the switching power supply integrated circuit can not include a rectifier circuit, and is directly coupled to an external circuit by the bus pin BUS and / or the zero-crossing detection pin. In this way, the switching power supply integrated circuit does not contain a power grid input pin L. The input end of the power switch tube 43 is coupled to the bus pin BUS. The control circuit 44 obtains the output voltage Vout of the switching circuit from the output feedback pin Vo of the switching power supply integrated circuit 100, and controls the conduction and turn-off of the power switch tube 43 based on the output voltage Vout. The cathode of the freewheeling diode is coupled to the source of the power switch tube 43 and forms a switching node pin ICG of the switching power supply integrated circuit 100 at the coupling point. The anode of the freewheeling diode is coupled to the reference ground pin GND of the switching power supply integrated circuit 100. Preferably, the rectifier circuit 41, the zero-crossing detection circuit 42, the power switch tube 43 and the freewheeling diode 45 are made on different semiconductor substrates, that is, in different semiconductor wafers, and multiple wafers are made in the same electronic package through a multi-wafer packaging process to form an electronic package device or an integrated circuit. Among them, the zero-crossing detection circuit 42 is made in the first wafer, the power switch tube 43 is made in the second wafer, and the freewheeling diode 45 is made in the third wafer. The control circuit 44 can also be further made in the second wafer for controlling the conduction and turn-off of the power switch tube 43.
[0033] Figure 5 A Buck switching power supply system 200 according to an embodiment of the present application is shown. The switching power supply integrated circuit 50 in the switching power supply system 200 can adopt Figure 4 The switching power supply integrated circuit shown with the integrated grid voltage zero-crossing detection function and configured as a Buck topology is used to convert the grid voltage VAC into a stable DC output voltage Vout. The DC output voltage can be 3.3V, 5V, 12V, 15V or 18V, etc. The switching power supply system 200 includes an input capacitor Cin, a switching power supply integrated circuit 50, an inductor L1 and an output capacitor Cout. Among them, the grid input pin L of the switching power supply integrated circuit 50 is coupled to the first input end L of the alternating current grid, the reference ground pin GND is coupled to the second input end N of the alternating current grid, and the grid input pin L and the reference ground pin GND are connected between the alternating current input power VAC. The bus pin is coupled to the input capacitor Cin for stabilizing the input voltage. The switching node pin ICG is coupled to the first end of the inductor L1, and the second end of the inductor L1 is the output end of the Buck circuit for providing the output voltage Vout and is coupled to the output feedback pin Vo.
[0034] Figure 6 A Buck-Boost switching power supply system 300 according to an embodiment of the present application is shown. The switching power supply integrated circuit 60 in the switching power supply system 300 can adopt Figure 4The illustrated switching power supply integrated circuit 100 integrating grid voltage zero-crossing detection function is configured as a Buck-Boost topology for converting grid voltage VAC into a stable DC output voltage Vout. The DC output voltage Vout can be less than the average value of the DC rectified voltage of VAC, or can be higher than the average value of the DC rectified voltage of VAC. Compared with Figure 5 In contrast, the output feedback pin Vo of the switching power supply integrated circuit 60 is coupled to the second input terminal N of the AC grid, and the AC input power VAC is connected between the grid input pin L and the output feedback pin Vo. The input capacitor Cin is coupled between the bus pin BUS and the output feedback pin Vo for stabilizing the input voltage. The switching node pin ICG is coupled to the first terminal of the inductor L1, the second terminal of the inductor L1 is the first output terminal of the Buck-Boost circuit, and the reference ground pin GND is the second output terminal of the Buck-Boost circuit for providing the output voltage Vout.
[0035] Figure 7An internal structure diagram of the electronic packaging device 700 for the switching power supply integrated circuit according to an embodiment of the present application is shown. The electronic packaging device 700 comprises five wafers 71-75 and four base islands 701-704, and has six pins. The pins are used for connection with the outside, including a power grid input pin L, a bus pin BUS, a reference ground pin GND, a switching node pin ICG, a zero-crossing signal output pin Zero, and an output feedback pin Vo. The first wafer 71 contains a zero-crossing detection circuit, and is arranged on the first base island 701. A part of the first base island 701 extends outward to expose the electronic packaging device to form the reference ground pin GND. The zero-crossing signal output pin Zero and the first wafer 71 are coupled by conductive wires for outputting a zero-crossing detection signal. A power switch tube is made on the second wafer 72, and a freewheeling diode is made on the third wafer 73. The second wafer 72 and the third wafer 73 are arranged on the second base island 702. A part of the second base island 702 extends outward to expose the electronic packaging device to form the switching node pin ICG. The anode of the freewheeling diode on the third wafer 73 is coupled to the first base island 702 through a conductive wire for coupling to the reference ground pin GND. The cathode of the freewheeling diode is located on the back of the third wafer 73 and is coupled by being attached to the second base island 702 and the switching node pin ICG. In the illustrated embodiment, the second wafer 72 includes a power switch tube and a control circuit for controlling the power switch tube. The output end of the power switch tube is coupled to the second base island through a conductive wire. The fourth wafer 74 is provided with a first rectifier diode and is arranged on the third base island 703. A part of the third base island 703 extends outward to expose the electronic packaging device to form the power grid input pin L. The anode of the first rectifier diode (the back of the fourth wafer 74) is attached to and coupled to the third base island 703 for coupling to the power grid input pin L to receive an alternating current power grid input signal. The cathode of the first rectifier diode is coupled to the input end of the zero-crossing detection circuit in the first wafer 71 through a conductive wire. The fifth wafer 75 is provided with a second rectifier diode and is arranged on the fourth base island 704. A part of the fourth base island 704 extends outward to expose the electronic packaging device to form the bus pin BUS. The anode of the second rectifier diode is coupled to the cathode of the first rectifier diode through a conductive wire. The cathode of the second rectifier diode is attached to and coupled to the fourth base island 704 for coupling to the bus pin BUS.
[0036] In another embodiment, the power switch tube is made in another power wafer and is placed on the fourth base island 704. The power wafer is attached to the fourth base island 704 for coupling to the bus pin BUS, and is coupled to the second wafer 72 containing the control circuit through a conductive wire for obtaining a control signal and to the second base island 702 for coupling to the switching node pin ICG. The fourth base island 704 is coupled to the input end of the power switch tube on the second wafer 72 through a conductive wire.
[0037] Figure 8 A switching power supply integrated circuit 80 according to another embodiment of the present application is shown. Compared with the switching power supply integrated circuit 100 in Figure 4 The switching power supply integrated circuit 80 further has a power supply pin VDD and includes a power supply diode M3. The anode of the power supply diode M3 is coupled to the output feedback pin Vo, and the cathode of the power supply diode M3 is coupled to the power supply pin VDD. In this way, the switching power supply system can supply power to the chips in the integrated circuit through the output voltage Vout.
[0038] Figure 9 An electronic packaging device 900 according to an embodiment of the present application is shown, which integrates a power supply diode. Compared with the electronic packaging device 700 in Figure 7 The electronic packaging device 900 further includes a sixth chip 96, a fifth base island 905, and a power supply pin VDD. The power supply diode is fabricated on the sixth chip 96 and is disposed on the fifth base island 905. A portion of the fifth base island extends outward to expose the electronic packaging device to form an output feedback pin Vo. The anode of the power supply diode is attached to and coupled to the fifth base island for obtaining the output voltage from the output end of the switching power supply system through the output feedback pin Vo. The cathode of the power supply diode on the sixth chip 96 is coupled to the power supply pin VDD through a conductive lead for providing a power supply to the chips in the electronic packaging device 700. In one embodiment, the power supply pin VDD is externally connected to a capacitor. In another embodiment, the capacitor is built inside the electronic packaging device, and the electronic packaging device can not have the power supply pin. The power supply pin VDD is coupled to the second chip 72 through a conductive lead for supplying power to the second chip 72. The fifth base island 905 is further coupled to the power supply end of the first chip 71 through a conductive lead for directly supplying the output voltage to the zero-crossing detection chip. In another embodiment, the power supply pin VDD is further coupled to the first chip 71 through a conductive lead for supplying power to the first chip.
[0039] Figure 10 A zero-crossing detection circuit according to an embodiment of the present application is shown. The output end of the zero-crossing detection circuit can be open circuit control. The zero-crossing detection circuit includes a control signal generation circuit 101 for performing zero-crossing detection, a pull-up resistor R1, and an open circuit switch K1. The control signal generation circuit 101 is used to obtain a signal representing the voltage value of the power grid and generate a zero-crossing detection control signal Vzt. The first end of the pull-up resistor R1 is coupled to a voltage source Vcc, the control end of the open circuit switch K1 is coupled to the output end of the control signal generation circuit 101, the first end of the open circuit switch K1 is coupled to the second end of the pull-up resistor R1 and a zero-crossing signal output pin Zero, and the second end of the open circuit switch K1 is grounded. Preferably, the open circuit switch K1 includes an N-type metal oxide semiconductor field effect transistor (MOSFET), the drain of the MOSFET is coupled to the pull-up resistor R1 and outputs a zero-crossing detection signal, and the source of the MOSFET is grounded.
[0040] Figure 11 The zero-crossing detection circuit according to an embodiment of the present application is shown. Figure 10 Compared with the zero-crossing detection circuit shown in the figure, the open-circuit switch tube in the zero-crossing detection circuit can adopt NPN type transistor K2, wherein the collector of the transistor K2 is coupled with pull-up resistor R2 and outputs a zero-crossing detection signal, and the emitter of the transistor K2 is grounded.
[0041] In one embodiment, the zero-crossing detection signal obtained by the switching power supply integrated circuit and the electronic package provided by the present application has good consistency, the delay time is less than 25us, and the precision is greatly improved.
[0042] Figure 12 The electronic packaging device 1000 according to another embodiment of the present application is shown, and Figure 7 Compared with the electronic packaging device 700 in the figure, the electronic packaging device 1000 only does not include the first rectifier diode and the second rectifier diode, and the bus pin BUS directly obtains the bus voltage from the external circuit. Therefore, the electronic packaging device does not include the corresponding fourth wafer 74 and the fifth wafer 75, and does not include the third base island 703 and the fourth base island 704. The electronic packaging device 1000 can simultaneously include Figure 9 The sixth wafer 96 and the fifth base island 906 shown in the figure are used to obtain the power supply voltage VDD from the output feedback pin Vo.
[0043] The description and application of the present application herein are illustrative, and are not intended to limit the scope of the present application in the above embodiments. The effects or advantages related descriptions involved in the specification may not be embodied in actual experimental examples due to the uncertainty of specific conditions or other factors, and the effects or advantages related descriptions are not used to limit the scope of the present application. The variations and changes of the embodiments disclosed herein are possible, and the alternatives and equivalent components of the embodiments are known to those skilled in the art. It should be clear to those skilled in the art that the present application can be realized in other forms, structures, arrangements, proportions, and with other components, materials and parts without departing from the spirit or essential characteristics of the present application. Other variations and changes of the embodiments disclosed herein can be made without departing from the scope and spirit of the present application.
Claims
1. An electronic packaging device, characterized in that, The electronic packaging device includes: The first chip includes a zero-crossing detection circuit; The first base island, the first chip is disposed on the first base island, and a portion of the first base island extends outward to expose electronic packaging devices to form reference ground pins; The zero-crossing signal output pin is coupled to the first chip via electrical leads; The second chip includes a power switching transistor; The third chip includes a freewheeling diode; and The second base island, the second chip and the third chip are disposed on the second base island, and a portion of the second base island extends outward to expose the electronic packaged device forming the switch node pins.
2. The electronic packaging device as described in claim 1, characterized in that, The electronic packaging device further includes: The fourth chip includes the first rectifier diode; and The third base island and the fourth chip are disposed on the third base island. A part of the third base island extends outward to expose the electronic packaged device to form the power grid input pin. The anode of the first rectifier diode is attached and coupled to the third base island, and the cathode of the first rectifier diode is coupled to the first chip through a lead.
3. The electronic packaging device as described in claim 2, characterized in that, Electronic packaging devices further include: The fifth chip includes a second rectifier diode; and The fourth base island and the fifth chip are set on the fourth base island. A part of the fourth base island extends outward to expose the electronic packaging device to form bus pins. The anode of the second rectifier diode is coupled to the cathode of the first rectifier diode through a lead. The cathode of the second rectifier diode is attached to and coupled to the fourth base island.
4. The electronic packaging device as described in claim 3, characterized in that, The fourth base island is coupled to the input terminal of the power switch on the second chip via a lead.
5. The electronic packaging device as described in claim 1, characterized in that, The electronic packaging device further includes: The sixth chip includes a power supply diode; The fifth base island and the sixth chip are disposed on the fifth base island, with a portion of the fifth base island extending outward to expose electronic packaging devices forming output feedback pins; and The power supply pins are coupled to the sixth and second chips via leads. The anode of the power supply diode is attached and coupled to the fifth base island, and the cathode of the power supply diode is coupled to the power supply pin through a conductive lead.
6. The electronic packaging device as described in claim 5, characterized in that, The fifth base island is further coupled to the power supply terminal of the first chip via leads.
7. The electronic packaging device of claim 1, wherein the first wafer comprises: The control signal generation circuit is used to acquire a signal characterizing the grid voltage value and generate a zero-crossing detection control signal; A pull-up resistor, the first end of which is coupled to a voltage source; as well as The open-circuit switch transistor has its control terminal coupled to the output terminal of the control signal generation circuit. The first terminal of the open-circuit switch transistor is coupled to the second terminal of the pull-up resistor and the zero-crossing signal output pin. The second terminal of the open-circuit switch transistor is grounded.
8. The electronic packaging device as described in claim 7, characterized in that, The open-circuit switching transistor includes an N-type MOSFET. The drain of the MOSFET is coupled to a pull-up resistor and outputs a zero-crossing detection signal, while the source of the MOSFET is grounded.
9. The electronic packaging device as described in claim 7, characterized in that, The open-circuit switching transistor includes an NPN transistor, in which the collector of the transistor is coupled to a pull-up resistor and outputs a zero-crossing detection signal, and the emitter of the transistor is grounded.