High-stability KU wave band tuner structure
By using a separate PCB-A and PCB-B board design and a waterproof and dustproof structure, the shortcomings of the high-frequency head structure in terms of phase noise and frequency stability are solved, and the frequency drift of the high-stability Ku-band high-frequency head is controlled within ±10kHz, meeting the needs of demanding customers.
Patent Information
- Application Number
- CN202423161643.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2034-12-20
AI Technical Summary
Existing high-frequency head structures cannot meet the high requirements of customers in terms of phase noise and frequency stability, especially the frequency drift within ±1MHz.
The design employs separate PCB-A and PCB-B boards, incorporating components such as a first-stage low-noise amplifier LNA01, a second-stage low-noise amplifier LNA02, a third-stage low-noise amplifier LNA03, a comb bandpass filter BPF1, an active mixer, a first-stage intermediate frequency amplifier AMP1, and a second-stage intermediate frequency amplifier AMP2. These components are connected to the intermediate waveguide via pins, and the waterproof and dustproof design of the housing enhances the stability of signal processing.
It achieves high phase noise control and frequency stability improvement, keeping frequency drift within ±10kHz, thus meeting high stability requirements.
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Figure CN223584242U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the field of amplifier technology, in particular to a low-noise down-conversion amplifier, and more particularly to a high-stability KU-band high-frequency head structure. BACKGROUND
[0002] The LNB (low noise block downconverter) is a low-noise down-conversion amplifier, which is composed of a mixer and a local oscillator. The LNB can be generally divided into a KU-band LNB (3.4 GHZ-4.2 GHZ) and a KU-band LNB (10.7 GHZ-12.75 GHZ). Since all satellite signals are quite weak before reaching the antenna and the signal loss is larger with a higher frequency in coaxial cable transmission, the LNB is needed to amplify the signals, and the signal-to-noise ratio should not be deteriorated too much. The working process of the LNB is to amplify the satellite high-frequency signals first, and then convert the high-frequency satellite signals to the intermediate frequency (950 MHZ-2150 MHZ) according to the LNB type by using a local oscillation circuit, and amplify the signals again, so as to facilitate the transmission of the coaxial cable and the demodulation and working of the satellite receiver.
[0003] At present, the common high-frequency head (low-noise down-conversion amplifier) for receiving satellite television signals has the local oscillator, the mixer and the intermediate frequency amplifier integrated in one chip, the phase noise is slightly poor, the frequency drift is within ±1 MHZ, and the requirements of customers for high phase noise and high frequency stability cannot be met. CONTENT OF THE INVENTION
[0004] The application aims to provide a high-stability KU-band high-frequency head structure to solve the technical problems in the background technology.
[0005] To achieve the above object, the application discloses the following technical scheme: a high-stability KU-band high-frequency head structure, which comprises a structure main body, an outer shell, a PCB-A board, a PCB-B board, an A compartment, a B compartment and an F head.
[0006] The structure main body comprises a front-end waveguide access block, a middle-end waveguide body and a tail-end output mounting block arranged in sequence; the front end and the rear end of the middle-end waveguide body are arranged at the middle parts of the front-end waveguide access block and the tail-end output mounting block, respectively.
[0007] The bottom of the PCB-A board is connected with the top side of the middle-end waveguide body, the bottom of the A compartment is connected with the top of the PCB-A board, the top of the PCB-B board is connected with the bottom side of the middle-end waveguide body, and the top of the B compartment is connected with the bottom of the PCB-B board; the PCB-A board and the PCB-B board are connected with the waveguide cavity of the middle-end waveguide body through PIN pins respectively; and the setting height of the top of the A compartment is less than the setting height of the top side of the front-end waveguide access block and the tail-end output mounting block, and the setting height of the bottom of the B compartment is less than the setting height of the bottom of the front-end waveguide access block and the tail-end output mounting block;
[0008] The shell is sleeved on the structural body, and the inner wall of the shell is attached to the outer edges of the front-end waveguide access block and the tail-end output mounting block;
[0009] The front end of the F head extends to the outside of the shell, and the F head is fixedly connected with the shell; the tail end of the F head is connected with the PCB-A board and the PCB-B board through PIN pins;
[0010] The PCB-A board comprises a substrate A and a device group A arranged on the substrate A; and the PCB-B board comprises a substrate B and a device group B arranged on the substrate B;
[0011] The device group A comprises an antenna, a first-stage low-noise amplifier LNA01, a second-stage low-noise amplifier LNA02, a third-stage low-noise amplifier LNA03, a comb-shaped band-pass filter BPF1, an active mixer, a first-stage intermediate-frequency amplifier AMP1, and a second-stage intermediate-frequency amplifier AMP2; the antenna, the first-stage low-noise amplifier LNA01, the second-stage low-noise amplifier LNA02, the third-stage low-noise amplifier LNA03, the comb-shaped band-pass filter BPF1, the active mixer, the first-stage intermediate-frequency amplifier AMP1, and the second-stage intermediate-frequency amplifier AMP2 are connected in sequence, and the second-stage intermediate-frequency amplifier AMP2 is connected with the F head through a PIN pin;
[0012] The device group B comprises a crystal oscillator connection end F ref , a phase detector, a low-pass filter, a voltage-controlled oscillator, an N frequency division counter, a frequency multiplier FX2, and a low-noise amplifier LNA11; the crystal oscillator connection end F refThe phase detector Phase Detector, the low-pass filter Low-pass Filter, the voltage-controlled oscillator VCO, the frequency multiplier FX2 and the low noise amplifier LNA11 are sequentially connected, an input end of the N frequency division counter NCounter is connected with the voltage-controlled oscillator VCO, and an output end of the N frequency division counter NCounter is connected with the phase detector Phase Detector.
[0013] As preferred, a square slot is arranged on the front-end waveguide access block, and a square rubber ring for sealing and waterproofing is arranged in the square slot, and the square rubber ring is arranged between the square slot and the shell.
[0014] As preferred, the F head is locked with the shell through a nut, and an F head rubber ring for waterproofing is arranged between the nut and the shell.
[0015] As preferred, a wiring hole for connecting an external cable of a waveguide cavity of the middle-end waveguide body is arranged on the front-end waveguide access block, and an O-shaped slot is arranged on the outer side of the wiring hole on the front-end waveguide access block, and an O-shaped rubber ring for waterproofing is arranged in the O-shaped slot.
[0016] Beneficial effects: the high-stability KU-band high-frequency head structure of the application can achieve high phase noise and improve frequency stability through cooperation of the PCB-A board and the PCB-B board, so that frequency drift is controlled within ±10 KHZ, so as to meet the use requirements of users with high needs. BRIEF DESCRIPTION OF DRAWINGS
[0017] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.
[0018] Figure 1 A perspective view of the high-stability KU-band high-frequency head structure provided by the embodiments of the application is shown.
[0019] Figure 2 A component split schematic view of the high-stability KU-band high-frequency head structure provided by the embodiments of the application is shown.
[0020] Figure 3 A device component schematic view of the PCB-A board and the PCB-B board provided by the embodiments of the application is shown.
[0021] Reference numerals: 1. F-head rubber ring; 2. O-ring rubber ring; 3. Square rubber ring; 4. F-head; 5. A compartment; 6. B compartment; 7. Outer shell; 8. Main structure; 9. Nut; 10. PCB-B board; 11. PCB-A board. Detailed Implementation
[0022] The technical solutions in the embodiments of this application will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0023] In this document, the term "comprising" is intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.
[0024] This embodiment discloses a method such as Figure 1 The high-stability Ku-band LNB structure shown is illustrated.
[0025] Specifically, such as Figure 2 As shown, this high-stability KU-band high-frequency head structure includes a main body 8, a shell 7, a PCB-A board 11, a PCB-B board 10, an A compartment 5, a B compartment 6, an F head 4, an F head rubber ring 1, an O-ring rubber ring 2, a square rubber ring 3, and a nut 9.
[0026] The structure main body 8 comprises a front end waveguide access block 81, a middle end waveguide body 82 and a tail end output mounting block 83 arranged in sequence. It should be noted that the middle end waveguide body 82 is any one of the structures in the prior art in which a waveguide cavity is arranged inside the middle position of the entire structure main body 8; the front end waveguide access block 81 is a square block mounted at the front end position of the middle end waveguide body 82, which is used to connect with the connector (such as a plug) of the external cable, so that the satellite television signal is input into the waveguide cavity of the middle end waveguide body 82, and is connected with the shell 7; the tail end output mounting block 83 is a square block mounted at the tail end position of the middle end waveguide body 82, which is used to mount and fix the F head 4, and is connected with the shell 7. The front end and the rear end of the middle end waveguide body 82 are arranged at the middle part of the front end waveguide access block 81 and the tail end output mounting block 83 respectively, and here it should be noted that the thickness of the middle end waveguide body 82 is less than the height of the front end waveguide access block 81 and the tail end output mounting block 83, thereby providing mounting space for the PCB-A board 11, the PCB-B board 10, the A compartment 5 and the B compartment 6. At the same time, the shell 7 is made of metal material, which plays a role of shielding signal and protection.
[0027] The bottom of the PCB-A board 11 is connected with the top side of the middle end waveguide body 82, the bottom of the A compartment 5 is connected with the top of the PCB-A board 11, the top of the PCB-B board 10 is connected with the bottom side of the middle end waveguide body 82, and the top of the B compartment 6 is connected with the bottom of the PCB-B board 10; the PCB-A board 11 and the PCB-B board 10 are connected with the waveguide cavity of the middle end waveguide body 82 through PIN pins; and the setting height of the top of the A compartment 5 is less than the setting height of the top side of the front end waveguide access block 81 and the tail end output mounting block 83, and the setting height of the bottom of the B compartment 6 is less than the setting height of the bottom of the front end waveguide access block 81 and the tail end output mounting block 83, that is, to ensure that the PCB-A board 11, the PCB-B board 10, the A compartment 5 and the B compartment 6 can be mounted in the space between the shell 7 and the structure main body 8.
[0028] The shell 7 is sleeved on the structure main body 8, and the inner wall of the shell 7 is fitted with the outer edge of the front end waveguide access block 81 and the tail end output mounting block 83. In order to ensure that the shell 7 can play a waterproof and dustproof effect on the inside, in this embodiment, a square groove is arranged on the front end waveguide access block 81, a square rubber ring 3 for sealing and waterproofing is arranged in the square groove, and the square rubber ring 3 is arranged between the square groove and the shell 7, thereby avoiding dust or water vapor from entering the inside of the shell through the gap between the shell 7 and the front end waveguide access block 81. In addition, a wiring hole for connecting the external cable of the waveguide cavity of the middle end waveguide body 82 is arranged on the front end waveguide access block 81, an O-shaped groove is arranged on the outer side of the wiring hole of the front end waveguide access block 81, and an O-shaped rubber ring 2 for waterproofing is arranged in the O-shaped groove, thereby avoiding dust or water vapor from entering the inside of the shell at the connection position with the external cable (i.e. the connection position between the plug).
[0029] In this high-frequency head structure, the front end of the F-head 4 extends to the outside of the housing 7 and is fixedly connected to the housing 7; the tail end of the F-head 4 is connected to the PCB-A board 11 and the PCB-B board 10 via a PIN pin. Therefore, in order to ensure that the housing 7 can provide waterproof and dustproof protection for the interior, in this embodiment, the F-head 4 is locked to the housing 7 by a nut 9, and a waterproof F-head rubber ring 1 is provided between the nut 9 and the housing 7 to prevent dust or moisture from entering the interior of the housing through the gap between the F-head 4 and the housing 7.
[0030] In this embodiment, PCB-A board 11 includes substrate A and device group A disposed on substrate A; PCB-B board 10 includes substrate B and device group B disposed on substrate B; substrate A and substrate B are any type of PCB substrate in the prior art, which can be fixedly connected to the outer shell of the middle waveguide 82 by means of screw fixing, and the relevant components of device group A and device group B can be connected to the waveguide cavity of the middle waveguide 82 by means of pin pins, but are not limited to.
[0031] Specifically, such as Figure 3 As shown, device group A includes an antenna, a first-stage low-noise amplifier LNA01, a second-stage low-noise amplifier LNA02, a third-stage low-noise amplifier LNA03, a comb bandpass filter BPF1, an active mixer, a first-stage intermediate frequency amplifier AMP1, and a second-stage intermediate frequency amplifier AMP2. The antenna, the first-stage low-noise amplifier LNA01, the second-stage low-noise amplifier LNA02, the third-stage low-noise amplifier LNA03, the comb bandpass filter BPF1, the active mixer, the first-stage intermediate frequency amplifier AMP1, and the second-stage intermediate frequency amplifier AMP2 are connected in sequence, and the second-stage intermediate frequency amplifier AMP2 is connected to the F-head 4 via a PIN pin.
[0032] Device group B includes crystal oscillator connection terminal F ref Phase Detector, Low-pass Filter, Voltage-Controlled Oscillator (VCO), N-counter, FX2 frequency multiplier, and LNA11 low-noise amplifier; Crystal connection terminal F ref The phase detector, low-pass filter, voltage-controlled oscillator (VCO), frequency multiplier (FX2), and low-noise amplifier (LNA11) are connected in sequence. The input of the N-counter is connected to the VCO, and the output of the N-counter is connected to the phase detector. The low-noise amplifier (LNA11) is connected to the active mixer via a comb bandpass filter (BPF3).
[0033] In the high frequency head structure, the signal is transmitted to the active mixer of the device group A through the connection PIN after being processed by each component in the device group B. The waveguide cavity of the middle end waveguide body 82 receives the satellite television signal which is input to the device group A through the PIN to perform high frequency amplification, mixing, intermediate frequency amplification and other processes, and finally output to the F head 4 for output.
[0034] Finally, it should be noted that: the above only for the preferred embodiments of the application, and not for the purpose of limiting the application, although the application is described in detail with reference to the foregoing embodiments, for those skilled in the art, it still can be modified to the technical solution recorded in the foregoing embodiments, or to the equivalent replacement of some technical features, any modification, equivalent replacement, improvement, etc. within the spirit and principles of the application, should be included in the protection scope of the application.
Claims
1. A high-stability KU-band high-frequency head structure, characterized in that, The structure body (8) comprises a front end waveguide access block (81), a middle end waveguide body (82) and a tail end output mounting block (83) arranged in sequence; the front end and the rear end of the middle end waveguide body (82) are arranged in the middle part of the front end waveguide access block (81) and the tail end output mounting block (83) respectively; The bottom of the PCB-A board (11) is connected with the top side of the middle end waveguide body (82), the bottom of the A compartment (5) is connected with the top of the PCB-A board (11), the top of the PCB-B board (10) is connected with the bottom side of the middle end waveguide body (82), and the top of the B compartment (6) is connected with the bottom of the PCB-B board (10); the PCB-A board (11) and the PCB-B board (10) are connected with the waveguide cavity of the middle end waveguide body (82) through PIN pins respectively; and the setting height of the top of the A compartment (5) is less than that of the top side of the front end waveguide access block (81) and the tail end output mounting block (83), and the setting height of the bottom of the B compartment (6) is less than that of the bottom of the front end waveguide access block (81) and the tail end output mounting block (83); The shell (7) is sleeved on the structure body (8), and the inner wall of the shell (7) is attached to the outer edge of the front end waveguide access block (81) and the tail end output mounting block (83); The front end of the F head (4) extends to the outside of the shell (7), and the F head (4) is fixedly connected with the shell (7); the tail end of the F head (4) is connected with the PCB-A board (11) and the PCB-B board (10) through PIN pins; The PCB-A board (11) comprises a substrate A and a device group A arranged on the substrate A; the PCB-B board (10) comprises a substrate B and a device group B arranged on the substrate B; The device group A comprises an antenna, a first-stage low-noise amplifier LNA01, a second-stage low-noise amplifier LNA02, a third-stage low-noise amplifier LNA03, a comb-shaped band-pass filter BPF1, an active mixer, a first-stage intermediate frequency amplifier AMP1 and a second-stage intermediate frequency amplifier AMP2; the antenna, the first-stage low-noise amplifier LNA01, the second-stage low-noise amplifier LNA02, the third-stage low-noise amplifier LNA03, the comb-shaped band-pass filter BPF1, the active mixer, the first-stage intermediate frequency amplifier AMP1 and the second-stage intermediate frequency amplifier AMP2 are connected in sequence, and the second-stage intermediate frequency amplifier AMP2 is connected with the F head (4) through a PIN pin; A square slot is arranged on the front end waveguide access block (81), and a square rubber ring (3) for sealing and waterproofing is arranged in the square slot, and the square rubber ring (3) is arranged between the square slot and the shell (7). The device group B includes a crystal oscillator connection end F ref , a phase detector, a low-pass filter, a voltage-controlled oscillator, an N counter, a frequency multiplier FX2 and a low noise amplifier LNA11; the crystal oscillator connection end F ref , the phase detector, the low-pass filter, the voltage-controlled oscillator, the frequency multiplier FX2 and the low noise amplifier LNA11 are sequentially connected, an input end of the N counter is connected with the voltage-controlled oscillator, an output end of the N counter is connected with the phase detector; the low noise amplifier LNA11 is connected with the active mixer through a comb-shaped band-pass filter BPF3.
2. The high-stability KU-band high-frequency head structure of claim 1, wherein, 3. The high-stability KU-band high-frequency head structure of claim 1, wherein, The F head (4) is locked with the shell (7) through a nut (9), and an F head rubber ring (1) for waterproofing is arranged between the nut (9) and the shell (7).
4. The high-stability KU-band high-frequency head structure according to claim 1, characterized in that, An O-shaped groove is arranged on the front end waveguide access block (81) along the outside of the wiring hole, and an O-shaped rubber ring (2) for waterproofing is arranged in the O-shaped groove.