Layout structure suitable for long circuit board

Abstract

The utility model discloses a layout structure suitable for a long-size circuit board, which comprises a circuit board body, the surface of the circuit board body is provided with a plurality of bonding pads extending along the length direction of the circuit board body, each bonding pad is provided with a plurality of patch areas, and an element is welded in each patch area, each element is perpendicular to the length direction of the circuit board body, and two welding points between the two short edges of each element and the patch area extend in the direction perpendicular to the length direction of the circuit board body; therefore, all the elements are transversely arranged on the circuit board, the stress span of the welding point positions when the circuit board is bent and deformed is greatly reduced, the welding point positions are prevented from being broken, and the number of defective products caused by bending and deformation of the circuit board is greatly reduced.

Description

Technical Field

[0001] This utility model relates to the field of electronic product design and manufacturing technology, and in particular to a layout structure suitable for long circuit boards. Background Technology

[0002] Most LED strip circuit boards on the market are long, sometimes reaching three meters in length. During production or transportation, the long side is easily bent under stress, and the bend can be significant, leading to deformation and unevenness of the long side. Meanwhile, most surface-mount components, such as resistors and capacitors, are rectangular, with their leads located on the short side. When components like... Figure 1 When components are arranged vertically on a circuit board, the solder joints formed by welding the component leads to the circuit board surface are subjected to high stress. If the long side of the circuit board is slightly deformed, it will cause the solder joints to break, tombstoning, or poor contact or damage to the components located at the deformation points. The components cannot fully adhere to the circuit board surface, resulting in a large number of defective products, serious waste of resources, and excessively high production costs for enterprises. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a layout structure suitable for long circuit boards. By arranging the two solder joints between the two short sides of each component and the surface mount area to extend along the direction perpendicular to the length of the circuit board body, the components are arranged laterally on the circuit board. This greatly reduces the stress span of the solder joints when the circuit board is bent or deformed, avoids solder joint breakage, tombstoning, or poor contact or damage to components located at the deformation point, ensures full adhesion between the components and the circuit board surface, significantly reduces the number of defective products caused by the bending or deformation of the circuit board, and reduces production losses.

[0004] To achieve the above objectives, the present invention provides a layout structure suitable for long circuit boards, comprising a circuit board body, wherein the surface of the circuit board body is provided with a plurality of pads extending along the length direction of the circuit board body, each pad is provided with a plurality of surface mount areas and each surface mount area is soldered with a component, wherein each component is arranged perpendicular to the length direction of the circuit board body, and the two solder joints between the two short sides of each component and the surface mount area are arranged along the length direction perpendicular to the length direction of the circuit board body.

[0005] Furthermore, a circuit diagram is pre-set on the surface of the circuit board body.

[0006] Furthermore, each of the pads is arranged at equal intervals on the surface of the circuit board body.

[0007] Furthermore, each of the patch areas is rectangular.

[0008] Furthermore, the patch areas described herein are parallel to each other.

[0009] Further, each of the elements is a patch type resistance-capacitance element.

[0010] Further, each of the elements is cuboid.

[0011] The utility model discloses the above-mentioned scheme, its beneficial effect lies in, realizes each element transverse arrangement on the circuit board, compared with the original element longitudinal arrangement on the layout structure of circuit board, can greatly reduce the stress span of soldering point position when the circuit board long side appears bending deformation, reduces the soldering point position stress, avoids soldering point position fracture, stele phenomenon or the element contact of being located at the deformation place is not good or is damaged, effectively guarantee element and circuit board surface between full adhesion, reduce the quantity of defective product, reduce production cost. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 It is the layout structure schematic diagram of the existing long size circuit board.

[0013] Figure 2 It is the overall schematic diagram of the layout structure of the existing long size circuit board.

[0014] Figure 3 It is the layout structure schematic diagram suitable for long size circuit board of the utility model.

[0015] Figure 4 It is Figure 3 It is the partial close-up view of A.

[0016] Figure 5 It is the front view of the layout structure suitable for long size circuit board of the utility model.

[0017] Wherein, 1-circuit board body, 11-soldering pad, 111-patch area, 12-element, 13-soldering point position. DETAILED DESCRIPTION

[0018] In order to facilitate understanding the utility model, below referring to the drawings carries out more comprehensive description to the utility model. The preferred embodiment of the utility model is given in the drawings. However, the utility model can be realized in many different forms, and is not limited to the embodiment described herein. The purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive.

[0019] Referring to the drawings Figures 3 to 5As shown, the embodiment provides a layout structure suitable for long-size circuit board, which comprises a long strip-shaped circuit board body 1, and X in the figure represents the direction of the arrow as the length direction of the circuit board body 1. Since the long-size circuit board body 1 has large specifications, more circuit modules can be configured, and the production of the light bar can be batched. Specifically, a circuit diagram is printed on the surface of the circuit board body 1, and according to the different functional positions of each part in the circuit diagram, a plurality of pads 11 extending along the length direction of the circuit board body 1 can be divided on the surface of the circuit board body 1; and according to the actual production needs, each pad 11 can be arranged equidistantly on the surface of the circuit board body 1.

[0020] More specifically, each pad 11 is provided with a plurality of patch areas 111, and each patch area 111 is welded with an element 12 to connect the circuit printed on the surface of the circuit board body 1, and each element 12 forms a solder point 13 at the short side welding position in contact with the corresponding patch area 111. Among them, the types of elements 12 welded in different patch areas 111 are set according to the specific functions of the printed circuit, and further, the shapes and sizes of different patch areas 111 should be adapted to the elements 12 welded therein, for example, in this embodiment, since the patch type resistance and capacitance elements 12 are used, each resistance and capacitance element 12 is in the shape of a cuboid, so each patch area 111 can be set to be a rectangle matching the shape of the resistance and capacitance element 12 to make the resistance and capacitance element 12 and the surface of the circuit board more fully adhere. Further, each patch area 111 can be parallel to each other, so that the current flowing is more stable and the distance between each connection point is optimized.

[0021] In this embodiment, continue to refer to the accompanying Figure 5As shown, in order to facilitate the understanding of those skilled in the art, the asymmetric scale adopted in the figure is expressed and illustrated by taking the bending of two elements 12 and the circuit board body 1 as an example. Specifically, each element 12 is arranged perpendicular to the length direction of the circuit board body 1, that is, each element 12 is arranged transversely on the circuit board, at this time, the short side of each element 12 is parallel to the long side of the circuit board (that is, the side of the circuit board which is easy to bend), and the two short sides of each element 12 and the two soldering point positions 13 between the patch area 111 are arranged along the length direction of the circuit board body 1. In this way, on the one hand, the stress span of the soldering point position 13 when the long side of the circuit board is bent is greatly reduced, and the circuit board has stronger anti-distortion ability; at the same time, the soldering point position 13 is changed from longitudinal stress to transverse stress, reducing the stress of the soldering point position 13, avoiding the fracture of the soldering point position 13, the monument phenomenon or the poor contact or damage of the element 12 located at the deformation position, reducing the number of defective products and reducing production cost; on the other hand, it effectively ensures the full adhesion between the element 12 and the surface of the circuit board body 1, so that the element 12 can be stably adhered to the surface of the circuit board body 1, and therefore the use of fixing adhesive can be reduced, saving cost; further, if the fixing adhesive is not used, when the position of the element 12 needs to be changed or a certain element 12 needs to be replaced in subsequent production, it can be more convenient to operate and correct.

[0022] The above-described embodiments are only preferred embodiments of the present application, and do not limit the present application in any form. Any skilled person in the art, without departing from the technical solution of the present application, can make more possible changes and modifications to the technical solution of the present application by using the above-mentioned disclosed technical content, or make modifications, which are all equivalent embodiments of the present application. Therefore, any content not departing from the technical solution of the present application, according to the idea of the present application, the equivalent changes should be covered in the protection scope of the present application.

Claims

1. A layout structure suitable for long circuit boards, characterized in that: The circuit board includes a circuit board body (1), and the surface of the circuit board body (1) is provided with a plurality of pads (11) extending along the length direction of the circuit board body (1). Each pad (11) is provided with a plurality of surface mount areas (111) and each surface mount area (111) is soldered with a component (12). Each component (12) is arranged perpendicular to the length direction of the circuit board body (1), and the two short sides of each component (12) and the two solder points (13) between the surface mount area (111) are arranged along the length direction perpendicular to the length direction of the circuit board body (1).

2. The layout structure suitable for long circuit boards according to claim 1, characterized in that: The circuit diagram is also pre-set on the surface of the circuit board body (1).

3. The layout structure suitable for long circuit boards according to claim 1, characterized in that: Each of the pads (11) is arranged at equal intervals on the surface of the circuit board body (1).

4. The layout structure suitable for long circuit boards according to claim 1, characterized in that: Each of the patch areas (111) is rectangular.

5. A layout structure suitable for long circuit boards according to claim 1, characterized in that: The patch areas (111) are parallel to each other.

6. A layout structure suitable for long circuit boards according to claim 1, characterized in that: Each of the components (12) is a surface-mount resistor-capacitor component.

7. A layout structure suitable for long circuit boards according to claim 1, characterized in that: Each of the elements (12) is rectangular parallelepiped in shape.

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