Circuit board and optical module

Abstract

The utility model discloses a circuit board and an optical module, and relates to the field of optical communication. The circuit board is provided with a golden finger end part, a power bus and a grounding trace. In the golden finger end part, the power supply pin comprises at least three power supply bonding pads, and a first gap exists between every two adjacent power supply bonding pads in the first direction; each power supply bonding pad of the at least one power supply pin is electrically connected with the power supply bus; the grounding pin comprises at least three grounding bonding pads, and a second gap exists between every two adjacent grounding bonding pads in the first direction; each ground pad of the at least one ground pin is connected with the ground trace, and the first gap and the second gap are both smaller than a preset value. When the optical module is plugged with the external equipment, the power bus can be always kept in a power-on state through the power pin, and the grounding trace is always kept in a power-on state through the grounding pin, so that the condition of repeated power-on and power-off is avoided, and impact current is prevented from being generated during plugging.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of optical communication, in particular to a circuit board and an optical module. BACKGROUND

[0002] The optical module is a core device in an optical communication system, which completes the mutual conversion of optical and electrical signals.

[0003] The optical module generally comprises a shell, a circuit board and an optical assembly arranged in the shell, and the circuit board has a gold finger at one end which is exposed outside the shell to realize pluggable connection with an external device. When the optical module is inserted into the external device such as an optical switch / server, the gold finger end of the circuit board is inserted into the connector slot of the external device to be electrically connected with the external device, and the surface of the gold finger end of the circuit board has multiple rows of gold finger pins along the plugging direction. The industry standard for the optical module specifies the functions of the gold finger pins one by one, so that they can meet the power supply communication requirements of the processor and optical chip on the optical module, forming a matching relationship between the gold finger pins, the processor and the optical chip. In the process of plugging and power-on, due to the gaps between the multiple rows of gold finger pins or some pre-suspended gold finger pins, repeated power-on and power-off may occur, which may cause current impact on the power supply of the internal and external devices of the optical module. CONTENT OF THE UTILITY MODEL

[0004] The purpose of the present application is to provide a circuit board and an optical module to solve the technical problem of repeated power-on and power-off of the optical module and the external device during plugging.

[0005] In a first aspect, a circuit board is provided, which has opposite first and second surfaces, the first surface having first and second edges perpendicular to each other, the extension direction of the first edge being the first direction and the extension direction of the second edge being the second direction. The circuit board is provided with a gold finger end, a power bus, a signal trace and a ground trace. The gold finger end includes power pins, signal pins and ground pins, the power pins, signal pins and ground pins all extending along the first direction, and the power pins, signal pins and ground pins being arranged side by side and spaced apart in the second direction. The power bus is electrically connected to the power pins. The signal trace is electrically connected to the signal pins. The ground trace is electrically connected to the ground pins. The power pins include at least three power pads arranged along the first direction, and there is a first gap between each two adjacent power pads in the first direction. Each power pad of at least one power pin is electrically connected to the power bus. The ground pins include at least three ground pads arranged along the first direction, and there is a second gap between each two adjacent ground pads in the first direction. Each ground pad of at least one ground pin is electrically connected to the ground trace. The first and second gaps are each less than or equal to a predetermined value.

[0006] In some embodiments, each power pad of each power pin is electrically connected with the power bus.

[0007] In some embodiments, the circuit board comprises a plurality of stacked layers of dielectric layers, inner layer conductive patterns between the dielectric layers, and surface layer conductive patterns on the first surface and the second surface; the power bus, the power pins, the signal pins, and the ground pins are located in the surface layer conductive patterns; the inner layer conductive patterns are provided with a power trace, the power trace is electrically connected with the power bus through a first conductive via; in the same power pin, the power pads that are relatively close to the power bus in the first direction are directly connected with the power bus or electrically connected with the power trace through the first conductive via, and the rest of the power pads are electrically connected with the power trace through the first conductive via.

[0008] In some embodiments, each ground pad of each ground pin is electrically connected with the ground trace.

[0009] In some embodiments, the ground trace is provided in the inner layer conductive pattern in a layer different from the layer in which the power trace is provided, and each ground pad is electrically connected with the ground trace through a second conductive via.

[0010] In some embodiments, the plurality of power pins are respectively distributed on the first surface and the second surface of the circuit board; the plurality of signal pins are respectively distributed on the first surface and the second surface of the circuit board; and the plurality of ground pins are respectively distributed on the first surface and the second surface of the circuit board.

[0011] In some embodiments, the end of the gold finger is configured to be plugged into a slot of an external device to electrically connect the external device, the slot has a plurality of contact springs corresponding to the power pins, the signal pins, and the ground pins respectively, and the preset value is less than or equal to the contact length of the contact springs.

[0012] In some embodiments, the preset value is less than or equal to 0.18mm.

[0013] In a second aspect, the application provides an optical module, comprising: the above-mentioned circuit board; and a power chip, which is provided on the first surface or the second surface of the circuit board and is electrically connected with the power bus and the ground trace of the circuit board respectively.

[0014] The technical effect of the application is that each power pad of at least one power pin of the gold finger of the optical module circuit board is electrically connected with the power bus, and each ground pad of at least one ground pin is electrically connected with the ground trace, so that when the optical module is plugged in and out of an external device, the power bus can always be powered on through the power pin, and the ground trace can always be powered on through the ground pin, thereby avoiding repeated power-on and power-off during plugging in and out of the optical module and the external device, and avoiding the generation of impact current during plugging in and out. BRIEF DESCRIPTION OF DRAWINGS

[0015] The technical solutions and other beneficial effects of the present application will be apparent from the following detailed description of the embodiments of the present application, taken in conjunction with the accompanying drawings.

[0016] Figure 1 A structural schematic diagram of the optical module provided by the embodiment of the present application.

[0017] Figure 2 A schematic diagram of the optical cage profile in the external device.

[0018] Figure 3 A structural schematic diagram of the conventional circuit board.

[0019] Figure 4 A structural schematic diagram of the circuit board provided by the embodiment of the present application.

[0020] Figure 5 A longitudinal sectional schematic diagram of the circuit board provided by the embodiment of the present application with respect to the power supply pin;

[0021] Figure 6 A longitudinal sectional schematic diagram of the circuit board provided by the embodiment of the present application with respect to the ground pin.

[0022] The components in the drawings are identified as follows:

[0023] 100 optical module; 200 external device; 10 upper shell; 20 lower shell; 30 circuit board; 40 power supply chip; 101 optical interface; 102 electrical interface; 103 cavity; 50 slot; 60 contact spring; 301 first surface; 302 second surface; 3011 first edge; 3012 second edge; 1 gold finger end; 11 power supply pin; 111 power supply pad; 12 signal pin; 121 signal pad; 13 ground pin; 131 ground pad; 2 power supply bus; 3 ground trace; 4 signal trace; 41 first gap; 42 second gap; 31 dielectric layer; 311 inner layer conductive pattern; 21 power supply trace; 312 surface layer conductive pattern; 51 first conductive via; 52 second conductive via; X first direction; Y second direction; Z third direction. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0025] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0026] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0027] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0028] The following disclosure provides many different embodiments, or examples, for implementing different structures of the present application. For the purpose of simplifying the present application, the components and arrangements of specific examples are described in the following. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeatedly refer to the same reference numerals and / or reference letters in different examples, and such repetition is for the purpose of simplification and clarity, which does not indicate the relationship between the various embodiments and / or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art can realize the application of other processes and / or the use of other materials.

[0029] As shown in Figure 1 and Figure 2 The optical module 100 includes an upper shell 10, a lower shell 20, an optical assembly (not shown in the figure) and a circuit board 30, the optical assembly is electrically connected with the circuit board 30, the upper shell 10 and the lower shell 20 form a cavity wrapping the optical assembly and the circuit board 30, one end of the optical assembly is located at the optical interface 101 of the optical module 100 for connecting the external optical fiber, one end of the circuit board 30 is the gold finger electrical connection end extending out of the electrical interface 102 of the optical module 100 for electrical connection with the external device 200 such as the upper computer of the switch or the server.

[0030] Specifically, the surface of the circuit board has a gold finger, a power bus, a power chip / soft start chip, a processor, an optical chip, etc., the pins of the processor and the pins of the optical chip are respectively connected with the pins of the gold finger and the power chip through the conductive traces of the circuit board. The gold finger contains multiple pins such as ground pins, power pins and signal pins.

[0031] The connector slot 50 of the external device 200 has contact springs 60 corresponding to the pins of the gold finger one by one, realizing the pluggable connection between the optical module 100 and the external device 200. When the optical module 100 is inserted into the cavity 103 of the external device 200, the gold finger of the circuit board 30 is inserted into the slot 50, the contact springs 60 of the slot 50 hold the circuit board 30 and electrically contact the corresponding pins of the gold finger. Among them, the power spring contacts the power pin 11, the signal spring contacts the signal pin 12, and the ground spring contacts the ground pin 13, so that the optical module 100 is electrically connected with the external device 200. The external device 200 supplies power to the processor and the optical chip through the power pin 11 of the gold finger, realizes data interaction with the processor and the optical chip through the signal pin 12, and realizes the grounding connection of the processor and the optical chip through the ground pin 13.

[0032] The industry standard of the optical module specifies the functions of the pins of the gold finger one by one, so that it can meet the power supply and communication requirements of the processor and the optical chip on the optical module, forming a matching relationship between the pins of the gold finger, the processor and the optical chip.

[0033] With the increasing of optical module rate, the number of channels doubles, and the number of gold finger pins also needs to double or arrange more pins. Since the size of the optical module is limited by the standard, the size of the circuit board is also limited, and the gold finger pins cannot be increased in the transverse direction, so one or more rows of similar arranged pins are added in the longitudinal direction to meet the growth of the number of channels. For example, the QSFP-DD MSA standard QSFP-DD800 / QSFP-DD1600 Hardware Specification provides that the power pins of the gold finger along the optical module circuit board in the longitudinal direction, that is, in the first direction X, which is also the plug-in direction of the optical module into the external device 200, have three rows of power pads, that is, each power pin includes three power pads. For example, as shown in Figure 3 the front and rear two power pads 111 of each power pin are electrically connected to the power bus, used to contact the contact spring 60 of the external device 200 to connect the power supply of the external device 200. The middle power pad 111 is a reserved power pad 112, that is, a rectangle dotted line box is arranged between the front and rear two power pads 111, and the reserved pad is suspended and not connected to any circuit. The ground pin 13 also has the same arrangement. Figure 3

[0034] The connector slot of the external device 200 correspondingly provides the first row of contact springs and the second row of contact springs, and each row of contact springs 60 has a power spring and a ground spring, which matches the front and rear two rows of power pads and ground pads of the gold finger of the optical module.

[0035] ​However, in the process of inserting the gold finger into the corresponding contact spring 60 along the first direction X, the power supply pad at the front end of the power supply pin in the gold finger first contacts the first row of power supply springs, powering the power supply bus. Then the middle power supply pad contacts the first row of power supply springs, at this time, the front end of the power supply pad is between the first row of power supply springs and the second row of power supply springs, and is disconnected from the power supply spring, and the rear end of the power supply pad is also not in contact with the power supply spring, only the middle suspended power supply pad is in contact with the power supply spring, and the power supply bus is in a power-off state. After that, the front end of the power supply pad contacts the second row of power supply springs, the rear end of the power supply pad contacts the first row of power supply springs, and the power supply bus is powered, and the middle power supply pad is between the two rows of power supply springs and is disconnected from the power supply spring. At this time, the gold finger is fully inserted into the slot, and the power supply of the optical module is completed. In the above insertion and extraction process, the front end of the power supply pad experiences power supply jump from power-on to disconnection and then to power-on, causing the optical module to experience power-on, power-off, and then power-on. When the optical module is extracted, it will also cause power-off, power-on, and then power-off. In the above process, the current is easy to resonate with the capacitance, inductance, etc. in the circuit to generate an impact current, which affects the system power supply of the optical module and the external device 200, etc. and causes the processor to be in a power-on reset state and unable to start normally, or the program to be lost.

[0036] To solve the above problems, as shown in Figures 4 to 6 The circuit board 30 provided by the application and the optical module 100 comprising the same can keep the power supply bus 2 in a powered state through the power supply pin 11 and keep the ground trace 3 in a powered state through the ground pin 13 at all times when the optical module 100 and the external device 200 are inserted and extracted, avoiding the repeated power-on and power-off of the optical module 100 and the external device 200 during the insertion and extraction process, thereby avoiding the generation of an impact current during insertion and extraction. The following will be described in detail with reference to the accompanying drawings.

[0037] Specifically, as shown in the embodiment shown in Figure 4 The circuit board 30 provided by the application has opposite first and second surfaces 301 and 302, the first surface 301 has first and second edges 3011 and 3012 perpendicular to each other, the extension direction of the first edge 3011 is the first direction X, and the extension direction of the second edge 3012 is the second direction Y.

[0038] The circuit board 30 is provided with a gold finger end 1, a power supply bus 2, a signal trace 4, and a ground trace 3. The gold finger end 1 includes a power supply pin 11, a signal pin 12, and a ground pin 13, the power supply pin 11, the signal pin 12, and the ground pin 13 all extend along the first direction X and are arranged side by side and spaced apart in the second direction Y. The power supply bus 2 is electrically connected to the power supply pin 11, the signal trace is electrically connected to the signal pin 12, and the ground trace 3 is electrically connected to the ground pin 13.Figure 4 The ground trace 3 and the signal trace 4 in FIG. 1 are shown on the surface of the circuit board for the purpose of showing the connection relationship. It can be understood that the ground trace and the signal trace can be arranged in the inner layer conductive pattern. Figure 5 and 6 as shown in FIG. 1.

[0039] As shown in FIG. 1, in this embodiment, the power pin 11 includes three power pads 111 arranged along the first direction X, and each power pad 111 of all the power pins 11 is electrically connected to the power bus 2. The ground pin 13 includes three ground pads 131 arranged along the first direction X, and each ground pad 131 of all the ground pins 13 is electrically connected to the ground trace 3. Moreover, in the first direction X, there is a first gap 41 between each two adjacent power pads 111, and the first gap 41 between any two adjacent power pads 111 is less than a preset value, and there is a second gap 42 between each two adjacent ground pads 131, and the second gap 42 between any two adjacent ground pads 131 is less than a preset value. Figure 4 In other words, compared with the conventional circuit board shown in FIG. 1,

[0040] the embodiment shown in FIG. 1 is equivalent to that the reserved pads between the front and rear two power pads 111 of the same power pin 11 in the circuit board shown in FIG. 1 are also electrically connected to the power bus 2 as power pads, so that the three power pads 111 of the power pin 11 are all electrically connected to the power bus 2. Similarly, the reserved pads between the front and rear two ground pads 131 of the same ground pin 13 are also electrically connected to the ground trace 3 as ground pads 131, so that the three ground pads 131 of the ground pin 13 are all electrically connected to the ground trace 3. Therefore, during the entire plugging process of the optical module 100 and the external device 200, the spring in the connector of the external device 200 corresponding to the power pin 11 is always in contact with at least one pad of the power pin 11, and the three pads of the power pin 11 are all electrically connected to the power bus 2, so that the power bus 2 always maintains the powered-on state through the power pin 11 during the plugging process. Similarly, the spring in the connector of the external device 200 corresponding to the ground pin 13 is always in contact with at least one pad of the ground pin 13, and the three pads of the ground pin 13 are all electrically connected to the power bus 2, so that the ground trace 3 always maintains the powered-on state through the ground pin 13 during the plugging process. It is ensured that the optical module 100 will not appear repeatedly power-on and power-off during the plugging process, thereby avoiding the generation of inrush current. Figure 3 Figure 4 Figure 3

[0041] ​​​In some embodiments, each power pad of the power pins 11 can also be electrically connected with the power bus 2, and the power bus 2 can be kept powered through the power pin 11 during the plugging of the optical module 100. Similarly, each ground pad 131 of the ground pins 13 can also be electrically connected with the ground trace 3, and the ground trace 3 can be kept powered through the ground pin 13 during the plugging of the optical module 100. In this way, the complexity of the circuit board 30 can be avoided. Of course, a part of the power pins 11 can be electrically connected with the power bus 2, and a part of the ground pins 13 can be electrically connected with the ground trace 3, and the specific number is not limited herein.

[0042] In some embodiments, each power pin 11 can also include four or more power pads arranged along the first direction X, and each power pad 111 of at least one power pin 11 is electrically connected with the power bus 2. Similarly, each ground pin 13 can also include four or more ground pads 131 arranged along the first direction X, and each ground pad 131 of at least one ground pin 13 is electrically connected with the ground trace 3.

[0043] In this embodiment, the signal pin 12 includes at least two signal pads 121 arranged along the first direction X.

[0044] Specifically, Figure 4 It is shown that the signal pin 12 includes four signal pads 121 arranged along the first direction X, and the four signal pads 121 can be connected to the same signal terminal or four different signal terminals.

[0045] The gold finger end 1 of the circuit board 30 of the present application is configured to be plugged into the connector slot 50 of the external device 200 to electrically connect the external device 200, and the slot 50 has a plurality of contact springs 60 corresponding to the power pin 11, the signal pin 12 and the ground pin 13 respectively. When the optical module 100 is inserted into the external device 200, the gold finger end of the circuit board of the optical module 100 is inserted into the connector slot in the process, the power pin 11 slides relative to the contact spring 60 corresponding to the power pin 11, and the ground pin 13 slides relative to the contact spring 60 corresponding to the ground pin 13, and in the process of sliding, the contact spring 60 abuts against the corresponding power pin 11 and ground pin 13, realizing the electrical connection between the optical module 100 and the external device 200, and the external device 200 powers on the optical module 100 through the contact spring 60. The above-mentioned preset value is less than or equal to the contact length of the contact spring 60, that is, the first gap between the power pads is less than or equal to the contact length of the contact spring 60, and the second gap 42 between the ground pads 131 is less than or equal to the contact length of the contact spring 60. Here, the contact length refers to the length of the part of the contact spring 60 abutting against the power pin 11, the ground pin 13 and the signal pin 12 along the first direction X.

[0046] In this way, during the plugging and unplugging process of the optical module 100 and the external device 200, the contact spring 60 of the connector of the external device 200 is prevented from falling into the gap of the power pad 11 or the gap of the ground pad 131 to be disconnected from the pads before and after the gap, ensuring that the contact spring 60 can at least partially contact the pads before or after the gap when sliding to the gap, or completely cover the gap between the two adjacent pads and contact the two adjacent pads, so that the contact spring 60 always contacts the power pin 11 and the ground pin 13 during the plugging and unplugging process, ensuring that the optical module 100 always maintains a powered state during the plugging and unplugging process, to further avoid the generation of inrush current during plugging and unplugging.

[0047] In some embodiments, the contact length of the above-mentioned contact spring 60 is greater than 0.18mm, and therefore, the above-mentioned preset value is less than or equal to 0.18mm, that is, the first gap 41 between the power pads 111 is less than or equal to 0.18mm, and the second gap 42 between the ground pads 131 is less than or equal to 0.18mm, to ensure that the contact spring 60 always contacts the power pin 11 and the ground pin 13 during the plugging and unplugging process. For example, the above-mentioned preset value (unit: mm) can be any one of 0.001, 0.005, 0.01, 0.05, 0.1, 0.12, 0.14, 0.16, 0.18 or a value between any two values, which is not particularly limited here.

[0048] As Figure 5 and Figure 6As shown, in one embodiment, the circuit board 30 includes multiple layers of dielectric layers 31, inner conductive patterns 311 located between the dielectric layers 31, and surface conductive patterns 312 located on the first surface 301 and the second surface 302. The power bus 2, power pin 11, signal pin 12, and ground pin 13 are located in the surface conductive pattern 312.

[0049] like Figure 5 As shown, one of the inner conductive patterns 311 has a power trace 21, which is electrically connected to the power bus 2 through the first conductive via 51. It can be understood that the power trace 21 can also be distributed in multiple inner conductive patterns of different layers.

[0050] In the aforementioned power pin 11, the power pad 111 adjacent to the power bus 2 in the first direction X is directly connected to the power bus 2, while the remaining power pads 111 are electrically connected to the power trace 21 through the first via. In this way, the preceding power pad 111 is directly electrically connected to the power bus 2, and the following power pads 111 are electrically connected to the power bus 2 through conductive vias and the power trace 21, optimizing the routing of the circuit board 30. In some embodiments, each power pad 111 may also be electrically connected to the power trace 21 through the first conductive via 51, and then electrically connected to the power bus 2 through the power trace 21.

[0051] like Figure 6 As shown, the ground trace 3 is located in an inner conductive pattern 311 on a different layer than the power trace 21. This avoids the short circuit that could easily occur if the ground trace 3 and the power trace 21 are on the same layer, and also facilitates the fabrication of both the ground trace 3 and the power trace 21. The ground pads 131 are all electrically connected to the ground trace 3 through the second conductive via 52. It can be understood that the ground trace 3 here can be distributed in the same inner conductive pattern as the signal trace 4 to form electromagnetic shielding for the signal trace 4. Alternatively, the ground trace 3 can also be a ground layer, located in a different inner conductive pattern than the signal trace 4.

[0052] like Figures 4-6 As shown, multiple power supply pins 11 are distributed on the first surface 301 and the second surface 302 of the circuit board 30, multiple signal pins 12 are distributed on the first surface 301 and the second surface 302 of the circuit board 30, and multiple ground pins 13 are distributed on the first surface 301 and the second surface 302 of the circuit board 30.

[0053] like Figure 5As shown, the optical module 100 provided by the present application includes the power supply chip 40 and the circuit board 30 of any of the above embodiments, the power supply chip 40 is arranged on the first surface 301 or the second surface 302 of the circuit board 30, and is electrically connected with the power supply bus 2 and the ground trace 3 of the circuit board 30 respectively, for providing power supply for the circuit board 30. In some embodiments, the optical module 100 can also include a soft-start circuit, or a soft-start chip, or the above power supply chip includes a soft-start circuit unit.

[0054] The optical module 100 described above can also include circuit traces, electronic components (such as capacitors, resistors, transistors, MOS tubes), and chips (such as MCUs, laser drive chips, limiting amplification chips, clock data recovery CDRs, data processing chips DSPs), etc. The circuit board 30 connects the above-mentioned devices in the optical module 100 together according to the circuit design through the circuit traces, to realize the functions of power supply, electrical signal transmission, and grounding, etc.

[0055] The circuit board 30 is generally a hard circuit board. Due to its relatively hard material, the hard circuit board can also realize the bearing function, such as the hard circuit board can stably bear the chip; the hard circuit board can also be inserted into the electrical connector in the host computer cage.

[0056] Flexible circuit boards are also used in some optical modules 100; flexible circuit boards are generally used in cooperation with hard circuit boards, such as flexible circuit boards can be used between the hard circuit board and the optical transceiver assembly, as a supplement to the hard circuit board.

[0057] In the above embodiments, the description of each embodiment has its own focus, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0058] The circuit board and the optical module provided by the embodiments of the present application are described in detail above, and specific examples are applied in this paper to describe the principles and implementation modes of the present application; the above description of the embodiments is only used to help understand the technical solutions and core ideas of the present application; those skilled in the art should understand that: they can still modify the technical solutions recorded in the above embodiments, or make equivalent replacement for some technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A circuit board, characterized in that, The circuit board has a first surface and a second surface opposite to each other. The first surface has a first side and a second side that are perpendicular to each other. The direction extending along the first side is a first direction, and the direction extending along the second side is a second direction. The circuit board is provided with: The gold finger tip includes a power pin, a signal pin, and a ground pin. The power pin, signal pin, and ground pin all extend along a first direction, and the power pin, the signal pin, and the ground pin are arranged side by side and spaced apart in a second direction. A power bus, which is electrically connected to the power pin; A signal trace, which is electrically connected to the signal pin; as well as A grounding trace, which is electrically connected to the grounding pin; The power pin includes at least three power pads arranged along a first direction, and there is a first gap between every two adjacent power pads in the first direction; each power pad of at least one power pin is electrically connected to the power bus. The grounding pin includes at least three ground pads arranged along a first direction, and a second gap exists between every two adjacent ground pads in the first direction; each ground pad of at least one of the grounding pins is electrically connected to the grounding trace. Wherein, both the first gap and the second gap are less than or equal to a preset value.

2. The circuit board according to claim 1, characterized in that, Each power pad of each power pin is electrically connected to the power bus.

3. The circuit board according to claim 2, characterized in that, The circuit board includes multiple layers of dielectric layers, inner conductive patterns between the dielectric layers, and surface conductive patterns on a first surface and a second surface; the power bus, the power pin, the signal pin, and the ground pin are located in the surface conductive patterns. The inner conductive pattern is provided with power traces, and the power traces are electrically connected to the power bus through a first conductive via. In the same power supply pin, the power pad that is relatively close to the power bus in the first direction is directly connected to the power bus or electrically connected to the power trace through the first conductive via, and the remaining power pads are all electrically connected to the power trace through the first via.

4. The circuit board according to claim 3, characterized in that, Each ground pad of each of the ground pins is electrically connected to the ground trace.

5. The circuit board according to claim 4, characterized in that, The grounding trace is located in the inner conductive pattern on a different layer than the power trace, and the grounding pads are all electrically connected to the grounding trace through the second conductive via.

6. The circuit board according to claim 5, characterized in that, The power supply pins are respectively distributed on the first surface and the second surface of the circuit board; The signal pins are respectively distributed on the first surface and the second surface of the circuit board; The multiple grounding pins are respectively distributed on the first surface and the second surface of the circuit board.

7. The circuit board according to claim 1, characterized in that, The gold finger tip is configured to be inserted into a slot of an external device for electrical connection to the external device. The slot has a plurality of contact springs corresponding to the power pin, signal pin and ground pin respectively. The preset value is less than or equal to the contact length of the contact springs.

8. The circuit board according to claim 7, characterized in that, The preset value is less than or equal to 0.18 mm.

9. An optical module, characterized in that, include: The circuit board as described in any one of claims 1 to 8; A power chip is disposed on a first surface or a second surface of the circuit board and is electrically connected to the power bus and the ground trace of the circuit board, respectively.

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