Manual surface mounting jig

Abstract

The utility model provides a manual surface mounting jig, which comprises a base and a cover plate covered on the base, a first groove is arranged on the upper surface of the base, and an air hole is arranged in the first groove and is used for adsorbing a carrier plate; a second groove is formed in the lower surface of the cover plate, and air holes are formed in the second groove and used for adsorbing the chip; the first groove and the second groove are opposite up and down, so that the chip is attached to the carrier plate. A plurality of positioning columns are fixed on the lower surface of the cover plate, a plurality of positioning holes matched with the positioning columns are formed in the base, and when the cover plate and the base are buckled, the positioning columns are inserted into the positioning holes, so that the relative positions of the base and the cover plate are prevented from deviating. By adopting the jig to assist the chip laminating process, the laminating precision can be ensured, the difference of human vision is reduced, and meanwhile, the abnormities such as collision damage and corner chipping caused by human factors to the chip can be reduced as much as possible by optimizing details of the jig.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip patch technology field especially, and it relates to a manual patching fixture. BACKGROUND

[0002] In the prior art patching technology, a patching machine is usually used to automatically attach a chip to a carrier plate. The suction nozzle of the patching machine sucks and attaches the chip to the carrier plate. During the attachment, a mark point on a printed circuit board (PCBA) attached to the surface of the carrier plate is used as a reference to achieve accurate patching. However, this patching method has a disadvantage that large chips cannot be attached because the large chips will exceed the recognition range of the patching machine or even the size of the stage of the patching machine, so the large chips cannot be attached. In the case where the patching machine cannot be used to attach the chips, manual patching is required. However, the attachment accuracy of the manual patching cannot be guaranteed, and the manual patching is prone to misalignment. Therefore, the manual patching is time-consuming and laborious, and the product yield cannot be guaranteed.

[0003] Therefore, there is a need to develop a new patching scheme to reduce the difficulty of manual patching and improve the product yield. SUMMARY

[0004] In view of the above-mentioned disadvantages of the prior art, the utility model provides a manual patching fixture. The manual patching fixture comprises a base and a cover plate covering the base. The lower surface of the cover plate is fixed with a plurality of positioning columns. The base is provided with a plurality of positioning holes matched with the positioning columns.

[0005] The upper surface of the base and the cover plate is provided with a first recess. The first recess is provided with air holes for vacuum suction of the carrier plate placed in the first recess. The carrier plate protrudes from the upper surface of the base.

[0006] The lower surface of the cover plate and the base is provided with a second recess. The second recess is provided with air holes for vacuum suction of the chip placed in the second recess. The chip protrudes from the lower surface of the cover plate. The first recess and the second recess are opposite to each other to attach the chip and the carrier plate.

[0007] Optionally, the plurality of positioning columns on the lower surface of the cover plate are arranged in an asymmetric manner.

[0008] Optionally, rubber pads are arranged in the first recess and the second recess. The rubber pads are provided with openings which are in communication with the air holes in the recesses.

[0009] Optionally, the upper surface of the cover plate is provided with a handle.

[0010] Optionally, the edges of the first recess and the second recess are provided with notches.

[0011] Optionally, the sidewalls of the base and the cover plate are provided with communication openings which are in communication with the vacuum pipeline.

[0012] As described above, the utility model provides a kind of manual patching jig, the manual patching jig includes base and cover plate on the base, the upper surface of base is equipped with first recess, and the air hole for adsorbing carrier plate is equipped in first recess;The lower surface of cover plate is equipped with second recess, and the air hole for adsorbing chip is equipped in second recess;First recess and second recess are opposite to each other, so that chip and carrier plate are attached.Cover plate is fixed with multiple positioning posts on the lower surface, and base is equipped with multiple positioning holes matched with positioning post, when cover plate and base are buckled, positioning post is inserted into positioning hole, to prevent the relative position of base and cover plate from deviating.By using the jig to assist chip attaching process, it can guarantee the attaching precision, reduce the difference of human vision, and at the same time, through the optimization of details of the jig, it can minimize the human factors such as chip bruise, corner collapse and other abnormalities.The manual patching jig has certain adaptability to laminated product attaching, and is also applicable to all "hard to hard" attaching products, and has wide application prospect. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It shows the three-dimensional structure schematic diagram of the manual patching jig in the embodiment one of the utility model.

[0014] Figure 2 It shows the overhead structure schematic diagram of the base in the embodiment one of the utility model.

[0015] Figure 3 It shows the overhead structure schematic diagram of the cover plate in the embodiment one of the utility model.

[0016] Figure 4 It shows the structure schematic diagram of the carrier plate being placed into base in the embodiment one of the utility model.

[0017] Figure 5 It shows the structure schematic diagram of the chip being placed into cover plate in the embodiment one of the utility model.

[0018] Element number explanation

[0019] 11 base

[0020] 12 cover plate

[0021] 111 first recess

[0022] 112 positioning hole

[0023] 113 first rubber pad

[0024] 114 first communication port

[0025] 121 second recess

[0026] 122 positioning post

[0027] 123 second rubber pad

[0028] 124 second communication port

[0029] 100 carrier plate

[0030] 200 chip DETAILED DESCRIPTION

[0031] The above objectives and other advantages of the present application will become more apparent by describing in detail the only embodiment thereof, as illustrated in the drawings in which:

[0032] As will be realized, the application is capable of other and different embodiments and its details are capable of modifications in various obvious respects, all without departing from the spirit and the scope of the application. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.

[0033] To facilitate an understanding of this application, a number of terms are defined below. Terms defined herein have meanings as commonly understood by a person of ordinary skill in the areas relevant to the present application and are

[0034] In the context of the present application, a structure described as having a first feature "on" a second feature can include embodiments where the first and second features are formed directly contacting one another, or embodiments where additional features are formed between the first and second features such that the first and second features can not be directly contacting.

[0035] It should be noted that the drawings merely show typical aspects of the application and are therefore not to be considered limiting of its scope. The description herein of certain examples does not limit the application, but rather, the scope of the application is to be determined entirely by the appended claims, along with the full scope of equivalents to which such claims are entitled. The examples are presented solely for the purpose of illustrating aspects of the application and should not be construed as limiting the application.

[0036] Example 1

[0037] As Figures 1 to 5As shown, the embodiment provides a manual patching jig, comprising:

[0038] The base 11 and the cover plate 12 are combined, the upper surface of the base 11 and the cover plate 12 is provided with a first groove 111, the first groove 111 is provided with a gas hole for adsorbing the carrier plate 100 placed in the first groove 111, and the carrier plate 100 protrudes from the upper surface of the base 11.

[0039] The lower surface of the cover plate 12 and the base 11 is provided with a second groove 121, the second groove 121 is provided with a gas hole for adsorbing the chip 200 placed in the second groove 121, and the chip 200 protrudes from the lower surface of the cover plate 12; the first groove 111 and the second groove 121 are opposite to each other, so that the chip 200 and the carrier plate 100 are combined.

[0040] As a preferred solution, the first groove 111 and the second groove 121 are respectively located in the center area of the base 11 and the cover plate 12, and the specific slotting area can be determined according to the actual chip area. It should be understood that the areas of the first groove 111 and the second groove 121 are not completely the same, the area of the carrier plate 100 is usually larger than that of the chip 200, the carrier plate and the chip are combined to form a module by using the above jig, and then the circuit board (such as PCBA) is attached to the surface of the carrier plate, the chip and the circuit board are arranged side by side, and finally the bonding of the chip and the circuit board is realized by wire bonding. The carrier plate can be glass substrate, silicon substrate and other forms.

[0041] In addition, the number of the first groove 111 and the second groove 121 is not limited to one group, and can also be multiple groups to simultaneously press multiple groups of chip and carrier plate combined modules. The specific number and arrangement of the first groove and the second groove can be flexibly adjusted, which is not limited here.

[0042] Further, the lower surface of the cover plate 12 is fixed with a plurality of positioning columns 122, and the base 11 is provided with a plurality of positioning holes 112 matched with the positioning columns 122. When the cover plate 12 and the base 11 are buckled, the positioning columns 122 are inserted into the positioning holes 112 to prevent the relative position of the base 11 and the cover plate 12 from deviating. As a preferred solution, the positions of the plurality of positioning columns are designed as asymmetric to prevent the orientation from rotating when the cover is pressed. The positioning columns can be arranged at the four corners of the cover plate, or further positioning columns can be arranged at the frame, and corresponding positioning holes of the same number can be arranged on the cover plate.

[0043] Further, the first recess 111 is paved with a first rubber pad 113, which is provided with an opening; the second recess 121 is paved with a second rubber pad 123, which is provided with an opening, and the opening is communicated with the air hole of the recess 111 to adsorb the carrier plate or the chip by vacuumizing; here, the rubber pad plays a role of protection and buffering.

[0044] Further, the upper surface of the cover plate 12 is provided with a handle to facilitate taking and placing; the handle is preferably a plastic handle to prevent the metal handle from conducting electricity and causing electrostatic damage to the chip.

[0045] Further, the edge of the first recess 111 and the second recess 121 is provided with a notch to facilitate taking and placing.

[0046] Further, the sidewall of the base 11 and the cover plate 12 is provided with a communication port, which is a first communication port 114 and a second communication port 124, respectively; the communication port is communicated with the air hole through a channel arranged inside the base and the cover plate, and the communication port is communicated with the vacuum pipeline outwardly, so as to adsorb the carrier plate or the chip by vacuumizing. The communication port is arranged on the side surface, which is convenient for operation and can also avoid the risk of being pressed.

[0047] The use method of the manual patching jig is as follows:

[0048] 1. First, place the base 11 horizontally on the operation table, place the carrier plate 100 into the designed first recess 111, turn on the vacuum, and fix the carrier plate 100; the carrier plate 100 is padded with the first rubber pad 113, and the thickness of the carrier plate 100 is greater than the slot depth, so as to ensure that the upper surface of the carrier plate 100 is higher than the upper surface of the base 11.

[0049] 2. Place the cover plate 12 horizontally on the operation table, place the chip 200 into the designed second recess 121, turn on the vacuum to fix the chip, and the chip is padded with the second rubber pad 123; the thickness of the chip 200 is greater than the slot depth, so as to ensure that the chip protrudes from the plane of the cover plate, so that even if the edge is broken, it is on the back of the chip, which ensures the integrity of the front pattern of the chip;

[0050] 3. After both are completely fixed, double-sided tape or glue is applied on the surface to bond the chip 200 and the carrier plate 100;

[0051] 4. The cover plate 12 and the base 11 are provided with a positioning column 122, and after the chip and the carrier plate are fixed respectively, the positioning column is slowly lowered, the cover plate and the base are pressed tightly, the vacuum of the cover plate is turned off, the cover plate is taken away, and then the vacuum of the base is turned off, and the bonded module is taken down.

[0052] In summary, the utility model provides a kind of manual patching jig, the manual patching jig includes base and cover plate on the base, the upper surface of base is equipped with first recess, and it is equipped with air hole in first recess, for adsorbing carrier plate;The lower surface of cover plate is equipped with second recess, and it is equipped with air hole in second recess, for adsorbing chip;First recess and second recess are opposite to each other, so that chip and carrier plate are pasted.Cover plate is fixed with multiple positioning posts on the lower surface, and base is equipped with multiple positioning holes matched with positioning post, when cover plate and base are buckled, positioning post is inserted into positioning hole, prevent the relative position of base and cover plate from deviating.Adopt the jig auxiliary chip pasting process, can guarantee the precision of pasting, reduce the difference of human vision, simultaneously through the optimization of the details of jig can minimize the abnormality such as human factor to chip's knock injury, collapse angle.The manual patching jig has certain adaptability to laminar product pasting, also applicable to all "hard to hard" pasting product, with wide application prospect.

[0053] The above embodiments only illustrate the principles and effects of the utility model, and are not used to limit the utility model. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the utility model. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the utility model should be covered by the claims of the utility model.

Claims

1. A manual patch applicator, characterized in that, The manual patch fixture includes a base and a cover plate that fits onto the base. The lower surface of the cover plate is fixed with a plurality of positioning posts, and the base is provided with a plurality of positioning holes that match the positioning posts. The upper surface of the base that fits against the cover plate is provided with a first groove, and the first groove is provided with air holes for vacuum adsorption of the carrier plate placed in the first groove. The carrier plate protrudes from the upper surface of the base. The lower surface of the cover plate that fits into the base is provided with a second groove, and the second groove is provided with air holes for vacuum adsorption of the chip placed in the second groove. The chip protrudes from the lower surface of the cover plate; the first groove and the second groove are opposite each other to make the chip fit into the carrier plate.

2. The manual patch fitting fixture according to claim 1, characterized in that: The multiple positioning posts on the lower surface of the cover plate are arranged asymmetrically.

3. The manual patch fitting fixture according to claim 1, characterized in that: The area of ​​the first groove is greater than the area of ​​the second groove.

4. The manual patch fitting fixture according to claim 1, characterized in that: Both the first and second grooves are covered with rubber pads at the bottom, and the rubber pads have openings that are connected to the air holes in the grooves.

5. The manual patch fitting fixture according to claim 1, characterized in that: The cover plate has a handle on its upper surface.

6. The manual patch fitting fixture according to claim 1, characterized in that: The edges of the first groove and the second groove are provided with notches.

7. The manual patch fitting fixture according to claim 1, characterized in that: Both the base and the cover plate have connecting ports on their side walls, which are connected to the vacuum pipeline.

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