Chip structure of MINI LED

Abstract

The utility model discloses a chip structure of a MINI LED, which relates to the technical field of chip structures and comprises a mounting plate, a positioning column is fixedly connected to the surface of the mounting plate, a chip body is mounted on the surface of the mounting plate, a positioning hole is formed in the surface of the chip body, the positioning column is clamped in the positioning hole, a fixing block is fixedly connected to the surface of the mounting plate, and the fixing block is fixedly connected to the surface of the mounting plate. The surface, close to the mounting plate, of the fixing block is provided with a through hole, the surface of the through hole is rotationally connected with a rotating shaft through a bearing, the surface of the rotating shaft is fixedly connected with a special-shaped rotating block, the upper surface and the lower surface of the special-shaped rotating block are provided with grooves, the surfaces of the grooves are slidably connected with movable blocks, and the surfaces of the movable blocks are fixedly connected with hemispherical clamping blocks. A clamping groove is formed in the inner side face of the fixing block, the surface of the clamping groove is connected with an ejector rod in a sliding mode, and a pressing block is arranged on the face, close to the chip body, of the special-shaped rotating block.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip structure technical field, concretely is a chip structure of MINI LED. BACKGROUND

[0002] A MINI LED chip is usually composed of the following main parts: 1. LED chip: this is the light source part of the MINI LED, which is usually made of semiconductor material. The structure of the LED chip includes a p-type semiconductor layer, an n-type semiconductor layer, and an active light-emitting layer. 2. Encapsulation material: the encapsulation material is usually a transparent material that protects the LED chip and provides heat dissipation and optical performance. 3. Metal electrode: the metal electrode connects the LED chip with the external circuit, providing power supply. 4. Transparent conductive layer: the transparent conductive layer is used to provide electrical connection of the LED chip and allow light to be transmitted from the LED chip to the outside world. 5. Measurement electrode: the measurement electrode is used to monitor the light-emitting performance and electrical performance of the LED chip. In general, the structure of the MINI LED chip is smaller than that of the traditional LED chip, so it can achieve higher pixel density and higher resolution, suitable for high-definition display and lighting applications.

[0003] A chip structure is disclosed in the Chinese utility model patent application publication CN203895431U Although the chip structure provided by the utility model improves the mechanical strength of the corners of the chip structure by setting corner protection structures at the corner positions of the integrated circuit structure, avoids corner cracks of the integrated circuit structure during chip cutting, protects the integrated circuit structure inside the chip structure from damage, and thus improves the yield and reliability of the chip, the light decay phenomenon of the Mini LED chip will gradually appear as the service time increases, i.e. the brightness gradually decreases, resulting in poor display effect. In order to maintain the stability and consistency of the display effect, it is necessary to replace the Mini LED chip regularly. At the same time, with the continuous development and progress of technology, the performance and function of the Mini LED chip will also be continuously improved. In order to keep up with the pace of technological development, it may be necessary to replace the old Mini LED chip to obtain better display effect and performance. However, the existing Mini LED chip is usually installed by screws, and the process of replacing the chip is relatively complex when the chip needs to be updated or the light decay phenomenon is serious, which has the disadvantage of poor convenience. The above problems have not been solved, and a new type of Mini LED chip structure is urgently needed. UTILITY MODEL CONTENTS

[0004] In view of the deficiencies of the prior art, the utility model provides a chip structure of MINI LED, which solves the problems raised in the background art.

[0005] To achieve the above object, the utility model discloses a chip structure of MINILED, including mounting plate, the surface fixedly connected with the locating column of mounting plate, the surface installation of mounting plate has chip main body, the surface of chip main body is equipped with the locating hole, and the locating column is clamped in the locating hole, the surface fixedly connected with fixed block of mounting plate, the surface of fixed block is equipped with the through -hole close to the surface of mounting plate, and the surface of through -hole is rotatably connected with the pivot of bearing, and the surface fixedly connected with the special-shaped rotating block of pivot, the upper and lower surfaces of special-shaped rotating block are equipped with the recess, and the surface of recess is slidably connected with movable block, and the surface fixedly connected with the hemisphere card block of movable block, the inner side of fixed block is equipped with the clamping slot, and the surface of clamping slot is slidably connected with the top rod, and one side of special-shaped rotating block close to chip main body is provided with the compression block.

[0006] Optionally, the number of the positioning column and the positioning hole is four, and they are distributed in a rectangular array, and the size of the positioning column and the positioning hole is matched.

[0007] Optionally, the inner side of the recess is fixedly connected with the first spring, the other end of the first spring is fixedly connected with the movable block, and the size and position of the hemisphere card block and the clamping slot are matched.

[0008] Optionally, the end of the top rod away from the clamping slot is fixedly connected with the pressing block, the outer side of the fixed block is fixedly connected with the second spring, and the other end of the second spring is fixedly connected to the inner side of the pressing block.

[0009] Optionally, the number of the recess, the first spring, the movable block and the hemisphere card block on each special-shaped rotating block is two, and they are symmetrically distributed on the two sides of the special-shaped rotating block.

[0010] Optionally, the inner side of the compression block abuts on the surface of the chip main body, and the material of the compression block is rubber.

[0011] The utility model discloses a chip structure of MINI LED, has the following beneficial effects:

[0012] 1. The MINI LED chip structure, through the setting of the positioning column, the positioning hole, the fixing block, the rotating shaft, the special-shaped rotating block, the hemispherical clamping block, the clamping groove and the pressing block, the MINI LED chip structure has the effect of improving the convenience of replacing the chip, when the chip body is installed, the positioning hole is opened on the surface of the chip body and the positioning column on the surface of the mounting plate is aligned, then the positioning column is clamped into the positioning hole, the chip body is positioned, after completion, the special-shaped rotating block is rotated inward, the special-shaped rotating block rotates on the inner side of the fixing block, in the rotating process of the special-shaped rotating block, the hemispherical clamping block protruding on the outer side of the special-shaped rotating block is extruded by the edge of the fixing block, so that the hemispherical clamping block and the movable block are forced to enter the groove, when the special-shaped rotating block is rotated to the highest position, the position of the hemispherical clamping block and the clamping groove is compared at this time, the pressing block is in contact with the surface of the chip body and extrusion is formed, the fixing of the chip body is completed, the hemispherical clamping block is under the action of the first spring, the movable block and the hemispherical clamping block are popped out, the hemispherical clamping block is clamped into the clamping groove, the special-shaped rotating block is limited and fixed, the installation of the chip body is completed, when the chip body is replaced due to damage or serious light decay, the staff simultaneously presses the pressing block inward, drives the ejector rod to move inward in the clamping groove, the hemispherical clamping block clamped in the clamping groove is pushed out through the ejector rod, at this time, the special-shaped rotating block is rotated to the other side, the chip body lacks pressing and fixing at this time, the chip body can be taken off from the mounting plate, the structure of the chip installation is simple and convenient, the purpose of improving the convenience of replacing the chip is achieved. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is a three-dimensional structure schematic diagram of the utility model;

[0014] Figure 2 It is a three-dimensional structure schematic diagram of the utility model Figure 1 It is a structure schematic diagram of A place in the utility model;

[0015] Figure 3 It is a structure schematic diagram of the special-shaped rotating block in the utility model;

[0016] Figure 4 It is a structure schematic diagram of the special-shaped rotating block in the utility model;

[0017] Figure 5 It is a structure schematic diagram of A place in the utility model; Figure 4 It is a structure schematic diagram of B place in the utility model;

[0018] Figure 6 It is a structure schematic diagram of the moving rotating block in the utility model.

[0019] In the figure: 1, mounting plate; 2, positioning column; 3, chip main body; 4, positioning hole; 5, through hole; 6, fixed block; 7, rotating shaft; 8, special-shaped rotating block; 9, groove; 10, first spring; 11, movable block; 12, hemispherical clamping block; 13, clamping groove; 14, ejector rod; 15, pressing block; 16, second spring; 17, pressing block. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. EMBODIMENT

[0021] Please refer to Figures 1 to 6 The utility model provides technical scheme: a MINILED's chip structure, including mounting plate 1, the surface fixed connection of mounting plate 1 has positioning column 2, the surface installation of mounting plate 1 has chip main body 3, the surface of chip main body 3 is set with positioning hole 4, positioning column 2 clamps in positioning hole 4, the number of positioning column 2 and positioning hole 4 is four, and it is rectangular array distribution, positioning column 2 and positioning hole 4 size are adapted, the surface fixed connection of mounting plate 1 has fixed block 6, the surface of fixed block 6 close to mounting plate 1 is set with through hole 5, the surface of through hole 5 is connected with rotating shaft 7 through bearing rotation, the surface fixed connection of rotating shaft 7 has special-shaped rotating block 8, the upper and lower surface of special-shaped rotating block 8 is set with groove 9, the surface of groove 9 is connected with movable block 11 sliding, the surface fixed connection of movable block 11 has hemispherical clamping block 12, the inside of fixed block 6 is set with clamping groove 13, the surface of clamping groove 13 is connected with ejector rod 14 sliding, the side close to chip main body 3 of special-shaped rotating block 8 is provided with pressing block 17, the inside of groove 9 is fixedly connected with first spring 10, the other end of first spring 10 is fixedly connected with movable block 11, the size and position of hemispherical clamping block 12 and clamping groove 13 are adapted, the end away from clamping groove 13 of ejector rod 14 is fixedly connected with pressing block 15, the outside of fixed block 6 is fixedly connected with second spring 16, the other end of second spring 16 is fixedly connected in the inside of pressing block 15, the number of groove 9, first spring 10, movable block 11 and hemispherical clamping block 12 on each special-shaped rotating block 8 is two, and it is symmetrical distribution on the both sides of special-shaped rotating block 8, the inside of pressing block 17 is abutted on the surface of chip main body 3, and the material of pressing block 17 is rubber.

[0022] In order to achieve the purpose of improving the convenience of replacing the chip, when in use, through the setting of the positioning column 2, the positioning hole 4, the fixing block 6, the rotating shaft 7, the special-shaped rotating block 8, the hemispherical clamping block 12, the clamping groove 13 and the pressing block 17, the chip structure of the MINI LED has the effect of improving the convenience of replacing the chip, when in use, when the chip main body 3 is installed, the positioning hole 4 is opened on the surface of the chip main body 3, and the positioning column 2 on the surface of the mounting plate 1 is aligned, then the positioning column 2 is clamped into the positioning hole 4, the chip main body 3 is positioned, after completion, the special-shaped rotating block 8 is rotated inward, the special-shaped rotating block 8 rotates on the inner side of the fixing block 6, in the process of rotating, the hemispherical clamping block 12 on the outer side of the special-shaped rotating block 8 is extruded by the edge of the fixing block 6, so that the hemispherical clamping block 12 and the movable block 11 are forced to enter the groove 9, when the special-shaped rotating block 8 is rotated to the highest position, at this time, the position of the hemispherical clamping block 12 and the clamping groove 13 is compared, at the same time, the pressing block 17 contacts with the surface of the chip main body 3 and forms extrusion, the fixing of the chip main body 3 is completed, the hemispherical clamping block 12 is under the action of the first spring 10, the movable block 11 and the hemispherical clamping block 12 are popped out, the hemispherical clamping block 12 is clamped into the clamping groove 13, the special-shaped rotating block 8 is limited and fixed, the installation of the chip main body 3 is completed, when the chip is damaged or the light decay is serious, the chip main body 3 is replaced, the staff simultaneously presses the pressing block 15 inward, drives the jack 14 to move inward in the clamping groove 13, the hemispherical clamping block 12 clamped in the clamping groove 13 is pushed out by the jack 14, at this time, the special-shaped rotating block 8 is rotated to the other side, the chip main body 3 lacks pressing and fixing at this time, the chip main body 3 can be taken off from the mounting plate 1, the structure of the chip is simple and convenient, and the purpose of improving the convenience of replacing the chip is achieved.

[0023] The above merely describes a preferred embodiment of the present application, and the protection scope of the present application is not limited thereto, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A chip structure of a MINI LED, comprising a mounting plate (1), characterized in that: The surface of the mounting plate (1) is fixedly connected with positioning columns (2), the surface of the mounting plate (1) is provided with a chip body (3), the surface of the chip body (3) is provided with positioning holes (4), the positioning columns (2) are clamped in the positioning holes (4), the surface of the mounting plate (1) is fixedly connected with a fixed block (6), the surface of the fixed block (6) close to the surface of the mounting plate (1) is provided with a through hole (5), the surface of the through hole (5) is rotatably connected with a rotating shaft (7) through a bearing, the surface of the rotating shaft (7) is fixedly connected with a special-shaped rotating block (8), the upper and lower surfaces of the special-shaped rotating block (8) are provided with grooves (9), the surface of the groove (9) is slidably connected with a movable block (11), the surface of the movable block (11) is fixedly connected with a hemispherical clamping block (12), the inner side of the fixed block (6) is provided with a clamping groove (13), the surface of the clamping groove (13) is slidably connected with a top rod (14), one side of the special-shaped rotating block (8) close to the chip body (3) is provided with a pressing block (17).

2. The chip structure of claim 1, wherein: The positioning columns (2) and the positioning holes (4) are both four in number and are arranged in a rectangular array, and the positioning columns (2) and the positioning holes (4) are appropriately sized.

3. The chip structure of claim 1, wherein: The inner side of the groove (9) is fixedly connected with a first spring (10), the other end of the first spring (10) is fixedly connected with the movable block (11), and the hemispherical clamping block (12) and the clamping groove (13) are appropriately sized and positioned.

4. The chip structure of claim 1, wherein: The end of the top rod (14) away from the clamping groove (13) is fixedly connected with a pressing block (15), the outer side of the fixed block (6) is fixedly connected with a second spring (16), and the other end of the second spring (16) is fixedly connected to the inner side of the pressing block (15).

5. The chip structure of claim 3, wherein: The number of the groove (9), the first spring (10), the movable block (11) and the hemispherical clamping block (12) on each special-shaped rotating block (8) is two, and they are symmetrically distributed on the two sides of the special-shaped rotating block (8).

6. The chip structure of claim 1, wherein: The inner side of the pressing block (17) abuts against the surface of the chip body (3), and the material of the pressing block (17) is rubber.

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